axs6n/6s 163 sop ic sockets (600 mil 44 contacts 1.27mm pitch) ssop ic sockets (600 mil 70 contacts 0.8mm pitch) excellent for mass production these sop ic sockets resist vibration and shock features 1. suited for mass production two-piece socket that features simple assembly to facilitate mass production. 2. easy ic attachment and detachment owing to a structure that keeps stress from being applied to the ic leads when attaching and detaching, there will be no loss of contact reliability. 3. automated mounting compatible the socket has an open ?t construction on its top surface so that it can be picked up by an automated mounting machine using suction for automated mounting. 4. resistant against vibration and shock (edge contact structure) applications amusement-related applications, etc. product types 1. chracteristics note: *please consult one of our sales of?es regarding suitable ic packages. no. of contacts nominal dimension emboss tape package plastic bag packaging body packing quantity frame packing quantity part no. of frame 1 reel outer carton part no. of frame 1 bag outer carton 44 600mil AXS6N44A149P 450 pcs. 2,250 pcs. axs6s7024v 450 pcs. 2,250 pcs. 70 axs6s70a149p item speci?ations conditions 44 contacts 70 contacts electrical characteristics rated current 0.5a 0.5a insulation resistance min. 1,000m ? min. 1,000m ? using 500v dc megger breakdown voltage 500v ac for 1 minute 250v ac for 1 minute detection current: 1ma contact resistance max. 40m ? max. 50m ? measured based on the hp4338b measurement method of jis c 5402. does not include conductor resistance of ic leads. mechanical characteristics shock resistance 981m/s 2 (3-axis) 981m/s 2 (3-axis) no interruption of current longer than 1 s environmental characteristics h 2 s contact resistance max. 40m ? contact resistance max. 50m ? after 48 hours of exposure to humidity 75 to 80% r.h., temperature 40 c 2 c, concentration 3 1ppm so 2 contact resistance max. 40m ? contact resistance max. 50m ? after 48 hours of exposure to humidity 90 to 95% r.h., temperature 40 c 2 c, concentration 10 3ppm humidity contact resistance max. 40m ? , insulation resistance min. 100m ? contact resistance max. 50m ? , insulation resistance min. 100m ? after 96 hours of exposure to humidity 90 to 95% r.h., temperature 40 c 2 c thermal shock resistance contact resistance max. 40m ? , insulation resistance min. 100m ? contact resistance max. 50m ? , insulation resistance min. 100m ? after 5 cycles where 1 cycle consists of steps 1 to 4 steps 1. ?5 c, 30 minutes 2. 25 c, max.5 minutes 3. 85 c, 30 minutes 4. 25 c, max.5 minutes ambient temperature ?5 c to +85 c ?5 c to +85 c no freezing at low temperatures soldering heat resistance peak temperature: max. 245 c peak temperature: max. 245 c infrared re?w soldering 300 c within 5 seconds 300 c within 5 seconds soldering iron suitable ic package* 44 contacts: sop ic with nominal dimension 600 mil and 1.27mm pitch 70 contacts: ssop ic with nominal dimension 600 mil and 0.8mm pitch 0 ? 3 + 10 ? 5 + 3 0 + 10 ? 5 new sopssop.fm 163 ?y?[?w ?q?o?o?r?n?p?q???q?q??@???j??@?????p?q???p?p?a
axs6n/6s 164 2. materials and surface treatment mm general tolerance 0.3 dimensions socket body ?nominal dimension: 600 mil 44 contacts part name material surface treatment molded plastic part body glass ?er reinforced polyamide (ul94v-0) frame glass ?er reinforced pps resin (ul94v-0) contact copper alloy contact portion: sn plating over ni, terminal portion: sn plating over ni (except for top of the terminal) recommended pc board pattern (top view) 0.15 1.27 0.1 (top of the terminal) 26.7 0.15 (top of the terminal) 0.35 0.1 18.2 15.2 33.6 0.6 0.6 17.8 20.0 7.0 0.75 0.05 1.5 0.05 1.27 0.05 14.7 0.1 19.2 0.1 0.375 0.05 26.67 0.1 ic chip and frame mounted on socket body (20.0) (37.0) (8.0) contact portion holding part of frame and main unit (frame claw) frame set direction sopssop.fm 164 ?y?[?w ?q?o?o?r?n?p?q???q?q??@???j??@?????p?q???p?p?a
axs6n/6s 165 mm general tolerance 0.3 socket body nominal dimension: 600 mil 70 contacts recommended pc board pattern (top view) 0.15 0.8 0.1 (top of the terminal) 0.8 0.1 (top of the terminal) 27.2 0.15 (top of the terminal) 0.3 0.1 18.2 14.95 33.6 0.6 0.6 17.8 20.0 7.0 0.50 0.05 1.00 0.05 0.80 0.05 0.80 0.05 14.7 0.1 19.2 0.1 0.25 0.05 27.2 0.1 ic chip and frame mounted on socket body (20.0) (37.0) (8.0) contact portion frame set direction holding part of frame and main unit (frame claw) sopssop.fm 165 ?y?[?w ?q?o?o?r?n?p?q???q?q??@???j??@?????p?q???p?p?a
axs6n/6s 166 mm embossed tape and reel 1. nominal dimension: 600 mil 44 contacts 1) tape dimensions notch oriented on this side. b (1.75) pull-out direction a a (2.0) 24.0 24.0 (4.0) b (26.2) (52.4) (56.0) (1.55 dia.) emboss carrier tape sop ic socket top cover tape (note 1) 165 to 180 2) reel dimensions top cover tape taping reel label emboss carrier tape (370 dia.) (56.4 ) +2 0 2. nominal dimension: 600 mil 70 contacts 1) tape dimensions ssop ic socket emboss carrier tape (note 1) top cover tape 165 to 180 pull-out direction notch oriented on this side. a b b a (1.75) (2.0) (26.2) (52.4) (56.0) 24.0 (1.55 dia.) 24.0 (4.0) 2) reel dimensions taping reel label top cover tape emboss carrier tape (370 dia.) (56.4 ) +2 0 notes 1. as this construction stresses the pc board s contact ability, you should take the pc board thickness into account when studying creating a socket. the recommended pc board (made from fr-4) thickness is at least 1.0 mm for an sop ic socket. 2. re?w soldering in order to ensure solder strength, cream solder used should have a strength equivalent to sparkle solder paste 63- 101f (senju metal industry co., ltd.). 3. manual soldering the so packages (1) soldering iron and solder use a small capacity soldering iron with a narrow tip and thin wire solder. example) capacity: 100v ac 15w tip diameter: 1.0 to 1.2mm wire solder diameter: 0.6 to 0.8mm (2) soldering time perform soldering quickly. solder within 5 seconds using the soldering iron speci ed above. 4. if the ic s pin pitch is uneven, it might not ? into the socket or the ic may become damaged. check the ic s pin pitch before insertion. 5. when setting the frame, please use one of our specialized tools, and make sure that all frame tabs are securely inserted. if setting an ic embedded in a frame on the main unit, press in the frame until both tabs are rmly snapped into the main unit. when the frame is full inserted, there will be an audible snapping sound. 6. when setting the frame by hand, lock all arms (44 and 70 contacts: 4 points) to the socket body at the same time. 7. when removing the frame, use the special tool available from us designed for that purpose. when replacing an ic, be sure to use the special frame removal tool available from us. do not apply excessive displacement to the arms on the frame. doing so may result in damage. 8. do not bend the pins. doing so may result in damage. 9. do not pull the pins with excessive force. doing so may cause them to come off. same time (good) (no good) sopssop.fm 166 ?y?[?w ?q?o?o?r?n?p?q???q?q??@???j??@?????p?q???p?p?a
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