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  features ? improved brightness ? improved color performance ? available in popular t-1 and t-1 3 / 4 packages ? new sturdy leads ? ic compatible/low current capability ? reliable and rugged ? choice of 3 bright colors high efciency red high brightness yellow high performance green applications ? lighted switches ? backlighting front panels ? light pipe sources ? keyboard indicators description these non-difused lamps out-perform conventional led lamps. by utilizing new higher intensity material, we achieve superior product performance. the hlmp -3750/-3390/-1340 series lamps are gallium ar - senide phosphide on gallium phosphide red light emitting diodes. the hlmp -3850/-3490/-1440 series are gallium arsenide phosphide on gallium phosphide yellow light emitting diodes. the hlmp -3950/-3590/-3960/-1540/- d640/-k640 series lamps are gallium phosphide green light emitting diodes. hlmp-3707, hlmp-3807, hlmp-3907, hlmp-3750, hlmp-3850, hlmp-3950, hlmp-3960, hlmp-3390, hlmp-3490, hlmp-3590, hlmp-1340, hlmp-1440, hlmp-1540, hlmp-d640, hlmp-k640 t-13/4 (5 mm), t-1 (3 mm), ultra - bright led lamps data sheet
 selection guide luminous intensity iv (mcd) @ 20ma package device package description color hlmp- min. typ. max. 2 q 1/2 degree outline t-1 3 / 4 red 3707-l00xx 90.  - - 4 f 3750 90. 1 5.0 - 4 a 3750-l00xx 90.  1 5.0 - 4 a yellow 3807-k00xx 96.  - - 4 f 3850 96. 140.0 - 4 a 3850-k00xx 96.  140.0 - 4 a 3850-kl0xx 96.  150.0 94.0 4 a green 3907-k00xx 111.7 - - 4 f 3914-k00xx 111.7 - - 4 d 3950 111.7  65.0 - 4 a 3950-k00xx 111.7  65.0 - 4 a 3950-lm0xx 170.0 300.0 490.0 4 a 3960-k0xxx 111.7  65.0 - 4 e emerald green d640-e00xx 6.7  1.0 - 4 d t-1 3 / 4 low profle red 3390 35. 55.0 - 3 b yellow 3490 37.6 55.0 - 3  b 3490-i00xx 37.6 55.0 - 3  b green 3590 43.6 55.0 - 3  b 3590-i00xx 43.6 55.0 - 3  b t-1 red 1340 35. 55.0 - 45 c 1340-h00xx 8.6 15.0  7.6 45 c 1340-j00xx 35.  55.0 - 45 c 1340-jk0xx 35.  55.0 11 .8 45 c yellow 1440  3.5 45.0 - 45 c 1440-h00xx  3.5 45.0 - 45 c 1440-hi0xx  3.5 - 75. 45 c 1440-hib00  3.5 - 75. 45 c green 1540  7.3 45.0 - 45 c 1540-h00xx  7.3 45.0 - 45 c 1540-ij0xx 43.6 60.0 139.6 45 c emerald green k640 4.  1.0 - 45 c k640-d00xx 4.   1.0 - 45 c k640-fgnxx 10.6  0.0 34.0 45 c
3 package dimensions 25.40 (1.00) min. 6.10 (0.240) 5.59 (0.220) 2.54 (0.100) nom. 9.19 (0.362) 8.43 (0.332) 5.08 (0.200) 4.57 (0.180) cathode lea d (note 1) 0.89 (0.035) 0.64 (0.025) 1.27 (0.050) nom. 0.102 (0.004) max. typ. 0.46 (0.018) square nominal package outline "d" hlmp-d640 22.86 (0.900) min. 6.10 (0.240 ) 5.60 (0.220 ) 2.54 (0.100 ) nom. 9.07 (0.357 ) 8.56 (0.337 ) 5.08 (0.200 ) 4.78 (0.188 ) 0.89 (0.035 ) 0.64 (0.025 ) 1.52 (0.060) 1.02 (0.040) 0.10 (0.004 ) max. 0.74 (0.029 ) 0.58 (0.023 ) squar e 12.47 (0.491) 11.71 (0.461) 1.02 (0.040 ) max. cathode flat ? package outline "e " hlmp-3960 23.0 (0.900) min . 6.10 (0.240 ) 5.60 (0.220 ) 9.07 (0.357 ) 8.56 (0.337 ) 5.08 (0.200 ) 4.78 (0.188 ) 0.89 (0.035 ) 0.64 (0.025 ) 1.52 (0.060 ) 1.02 (0.040 ) 0.53 (0.021 ) 0.43 (0.017 ) 13.11 (0.516) 12.34 (0.486) 1.02 (0.040) max. epoxy meniscu s cathod e fla t package outline "f" hlmp-3707/-3807/-390 7 sq. 2.79 (0.110) 2.29 (0.090) 1.32 (0.052) 1.02 (0.040)
4 absolute maximum ratings at t a = 25c parameter red yellow green/emerald green units peak forward current 90 60 90 ma average forward current [1] 5 0 5 ma dc current [] 30 0 30 ma transient forward current [3] 500 500 500 ma (10 s pulse) reverse voltage (i r = 100 a) 5 5 5 v led junction temperature 110 110 110 c operating temperature range -40 to +100 -40 to +100 -0 to +100 c storage temperature range -40 to +100 -40 to +100 -40 to +100 c notes: 1. see figure  to establish pulsed operating conditions. . for red and green series derate linearly from 50c at 0.5 ma/c. for yellow series derate linearly from 50c at 0. ma/c. 3. the transient peak current is the maximum non-recurring peak current the devices can withstand without damaging the led die and wire bonds. it is not recommended that the device be operated at peak currents beyond the absolute maximum peak forward current. hlmp - x x xx - x x x xx mechanical options 00: bulk 01: tape & reel, crimped leads 0, bx: tape & reel, straight leads a1, b1: right angle housing, uneven leads a, b: right angle housing, even leads dx, ex: ammo pack, straight leads fh:  iv bin select with inventory control vx: ammo pack, crimped leads color bin options 0: full color bin distribution b: color bin  & 3 only n: color bin 6 & 7 only maximum iv bin options 0: open (no. max. limit) others: please refer to the iv bin tabl e minimum iv bin options please refer to the iv bin table color options 3, 7: gap her 4, 8: gap yellow (except k4xx series) 5, 9: gap green 6: gap emerald green package option 1, k: t-1 (3 mm) 3, d: t-1 3 / 4 (5 mm) part numbering system
5 electrical/optical characteristics at t a = 25c t-1 3 / 4 test symbol description t-1 3 / 4 low dome t-1 min. typ. max. units conditions peak peak 37xx 3390 1340 635 nm measurement wavelength 38xx 3490 1440 583 at peak 39xx 3590 1540 565 d640 k640 558 d dominant 37xx 3390 1340 6  6 nm note 1 wavelength 38xx 3490 1440 585 39xx 3590 1540 569 d640 k640 560 ? 3 / 4 spectral line 37xx 3390 1340 40 nm halfwidth 38xx 3490 1440 36 39xx 3590 1540 8 d640 k640 4 s speed of 37xx 3390 1340 90 ns respond 38xx 3490 1440 90 39xx 3590 1540 500 d640 k640 3100 c capacitance 37xx 3390 1340 11 pf v f = 0, 38xx 3490 1440 15 f = 1 mhz 39xx 3590 1540 18 d640 k640 35 r j-pin thermal 37xx 3390  10 c/w junction to resistance 38xx 3490  10 cathode lead 39xx 3590 10 d640 510 1340 90 1440 90 1540 90 k640 90 v f forward 37xx 3390 1340 1.5 1.9  .6 v i f = 0 ma voltage 38xx 3490 1440 1.5 .1  .6 (figure 3) 39xx 3590 1540 1.5 . 3.0 d640 k640 . 3.0 v r reverse 37xx 3390 1340 5.0 v i f = 100 a breakdown 38xx 3490 1440 voltage 39xx 3590 1540 d640 k640 v luminous 37xx 3390 1340 145 lumens note  efcacy 38xx 3490 1440 500 watt 39xx 3590 1540 595 d640 k640 655 notes: 1. the dominant wavelength, d, is derived from the cie chromaticity diagram and represents the single wavelength which defnes the color of the device. . the radiant intensity, ie, in watts per steradian, may be found from the equation ie = iv/ v , where iv is the luminous intensity in candelas and v is the luminous efcacy in lumens/watt.
6 figure 1. relative intensity vs. wavelength. red, yellow, and green figure 4. relative luminous intensity vs. forward current. figure 5. relative efciency (luminous intensity per unit current) vs. peak current. figure 2. maximum tolerable peak current vs. pulse duration. (i dc max as per max ratings). figure 3. forward current vs. forward voltage. high efficiency re d wavelength ? nm relative intensity 1.0 0.5 0 0 0 7 0 5 6 0 0 6 0 5 5 0 0 5 yellow emerald gree n gree n t = 25 c a
7 figure 6. relative luminous intensity vs. angular displacement. t-1 3 / 4 lamp. figure 7. relative luminous intensity vs. angular displacement. t-1 3 / 4 low profle lamp. figure 8. relative luminous intensity vs. angular displacement. t-1 lamp. intensity range (mcd) color bin min. max. red g 9.7 15.5 h 15.5 4.8 i  4.8 39.6 j 39.6 63.4 k 63.4 101.5 l 101.5 16 .4 m 16.4 34.6 n  34.6 340.0 o 340.0 540.0 p 540.0 850.0 q 850.0 1 00.0 r 1 00.0 1700.0 s 1700.0 400.0 t  400.0 3400.0 u 3400.0 4900.0 v 4900.0 7100.0 w 7100.0 10 00.0 x 10 00.0 14800.0 y 14800.0 1400.0 z  1400.0 30900.0 maximum tolerance for each bin limit is 18%. intensity bin limits
8 lambda (nm) color cat # min. max. emerald green 9 55 .5 555.5 8 555.5 558.5 7 558.5 561.5 6 561.5 564.5 green 6 561.5 564.5 5 564.5 567.5 4 567.5 570.5 3 570.5 573.5  573.5 576.5 yellow 1 58  .0 584.5 3 584.5 587.0  587.0 589.5 4 589.5 59 .0 5 59  .0 593.0 orange 1 597.0 599.5  599.5 60.0 3 60  .0 604.5 4 604.5 607.5 5 607.5 610.5 6 610.5 613.5 7 613.5 616.5 8 616.5 619.5 maximum tolerance for each bin limit is 0.5 nm. color categories intensity range (mcd) color bin min. max. yellow h 6.5 4.3 i 4.3 67.7 j 67.7 108. k 108. 173. l 173. 50.0 m 50.0 360.0 n 360.0 510.0 o 510.0 800.0 p 800.0 150.0 q 150.0 1800.0 r 1800.0 900.0 s 900.0 4700.0 t 4700.0 700.0 u 700.0 11700.0 v 11700.0 18000.0 w 18000.0 7000.0 green/ a 1.1 1.8 emerald b 1.8 .9 green c .9 4.7 d 4.7 7.6 e 7.6 1.0 f 1.0 19.1 g 19.1 30.7 h 30.7 49.1 i 49.1 78.5 j 78.5 15.7 k 15.7 01.1 l 01.1 89.0 m 89.0 417.0 n 417.0 680.0 o 680.0 1100.0 p 1100.0 1800.0 q 1800.0 700.0 r 700.0 4300.0 s 4300.0 6800.0 t 6800.0 10800.0 u 10800.0 16000.0 v 16000.0 5000.0 w  5000.0 40000.0 maximum tolerance for each bin limit is 18%. intensity bin limits (continued)
9 mechanical option matrix mechanical option code defnition 00 bulk packaging, minimum increment 500 pcs/bag 01 tape & reel, crimped leads, min. increment 1300 pcs/bag for t-1 3 / 4 , 1800 pcs/bag for t-1 0 tape & reel, straight leads, min. increment 1300 pcs/bag for t-1 3 / 4 , 1800 pcs/bag for t-1 a1 t-1, right angle housing, uneven leads, minimum increment 500 pcs/bag a t-1, right angle housing, even leads, minimum increment 500 psc/bag b1 t-1 3 / 4 , right angle housing, uneven leads, minimum increment 500 pcs/bag b t-1 3 / 4 , right angle housing, even leads, minimum increment 500 psc/bag bj t-1, tape & reel, straight leads, minimum increment 000 pcs/bag eg ammo pack, straight leads in 5 k increment fh devices that require inventory control and  i v bin select vr ammo pack, crimped leads, min. increment  k for t-1 3 / 4 and t-1 note: all categories are established for classifcation of products. products may not be available in all categories. please contact your local avago repre - sentative for further clarifcation/information.
precautions: lead forming ? the leads of an led lamp may be preformed or cut to length prior to insertion and soldering into pc board. ? if lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to led package. otherwise, cut the leads of led to length after soldering process at room temperature. the solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the led chip die attach and wirebond. ? it is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. soldering conditions ? care must be taken during pcb assembly and soldering process to prevent damage to led component. ? the closest led is allowed to solder on board is 1.59 mm below the body (encapsulant epoxy) for those parts without standof. ? recommended soldering conditions: ? wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. customer is advised to periodically check on the soldering profle to ensure the soldering profle used is always conforming to recommended soldering condition. ? if necessary, use fxture to hold the led component in proper orientation with respect to the pcb during soldering process. ? proper handling is imperative to avoid excessive thermal stresses to led components when heated. therefore, the soldered pcb must be allowed to cool to room temperature, 5c, before handling. ? special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. ? recommended pc board plated through hole sizes for led component leads: wave soldering dipping manual solder pre-heat temperature 105 c max. C pre-heat time 30 sec max. C peak temperature 50 c max. 60 c max. dwell time 3 sec max. 5 sec max. led component plated through lead size diagonal hole diameter 0.457 x 0.457 mm 0.646 mm 0.976 to 1.078 mm (0.018 x 0.018 inch) (0.0  5 inch) (0.038 to 0.04  inch) 0.508 x 0.508 mm 0.718 mm 1.049 to 1.150 mm (0.00 x 0.00 inch) (0.08 inch) (0.041 to 0.045 inch) note: refer to application note an107 for more information on solder - ing led components. figure 8. recommended wave soldering profle. laminar wa ve bo tt om side of pc bo ard ho t air knife turbulent wa ve fluxing prehea t 0 1 0 2 0 30 50 100 150 200 250 30 40 50 time ? seconds tempera ture ? c 60 70 80 90 100 t op side of pc bo ard convey or speed = 1.83 m/min (6 ft/min) prehea t setting = 150 c (100 c pcb) solder wa ve tempera ture = 245 c air knife air tempera ture = 390 c air knife dist ance = 1.91 mm (0.25 in.) air knife angle = 40 solder: sn63; flux: rma no te: allo w for bo ards to be sufficientl y cooled before exer ting mechanical force. for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2008 avago technologies. all rights reserved. obsoletes 5989-4254en av02-1556en - october 13, 2008


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