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? 2006 california micro devices corp. all rights reserved. 01/06/06 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 1 cm1470 preliminary 4-, 6- and 8-channel se ries inductor network features ? optiguard ? coating for improved reliability at assembly ? 4, 6 and 8 channels of inductive filtering ? 2kv hbm ? mil-std883 (method 3015) ? chip scale package (csp) features extremely low parasitic inductance for optimum filter and esd performance ? 10 bump, 2.030mm x 0.836mm footprint csp for cm1470-04 ? 14 bump, 2.830mm x 0.836mm footprint csp for cm1470-06 ? 18 bump, 3.630mm x 0.836mm footprint csp for cm1470-08 ? lead-free version available applications ? camera data and control lines for high resolution camera modules in camera handsets ?lcd modules product description cmd?s cm1470 is a family of series inductor networks providing inductive filtering for applic ations where an l- c filter will potential degrade signal integrity due to the capacitive element in t he device. the cm1470 is configured in 4, 6 and 8 channel formats. each emi filter channel of the cm1470 is implemented as a single inductor element where the component value is 17nh. the cm1470 will help suppress emi radiation to the external environment. the parts integrate esd protection diodes on every pin to provide esd protection during the manufacturing process when the device is placed on the pcb from a pick and place machine. the esd protec tion diodes connected to each pin safely dissipate esd strikes of 2kv, per the mil-std-883 (method 3015) specification for human body model (hbm) esd. this device is particular ly well suited for portable electronics (e.g. wireless handsets, pdas) because of its small package format and easy-to-use pin assignments. in particular, the cm1470 is ideal for emi filtering data and control lines in camera modules where it is placed near the transmission source on a flexible pcb. with little to no capacitance on each line, the cm1470 prevents noise from being de-coupled between the pcb and device as the capacitor will absorb this energy and radi ate it to the surrounding environment. the cm1470 incorporates optiguard ? which results in improved reliability at asse mbly. the cm1470 is avail- able in a space saving, low profile chip scale package with optional lead-free finishing . electrical schematic 17nh a1 - (an-1) gnd an b2 - bn b1 1 of n channels
? 2006 california micro devices corp. all rights reserved. 2 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 01/06/06 cm1470 preliminary pin descriptions pin number pin description pin number pin description -04 -06 -08 -04 -06 -08 a1 a1 a1 inductor input #1 b1 b1 b1 gnd a2 a2 a2 inductor input #2 b2 b2 b2 inductor input #1 a3 a3 a3 inductor input #3 b3 b3 b3 inductor input #2 a4 a4 a4 inductor input #4 b4 b4 b4 inductor input #3 a5 a5 inductor input #5 b5 b5 inductor input #4 a6 a6 inductor input #6 b6 b6 inductor input #5 a7 inductor input #7 b7 inductor input #6 a8 inductor input #8 b8 inductor input #7 a5 a7 a9 gnd b5 b7 b9 inductor input #8 l704 3 25 4 1 b a orientation marking (see note 2) l706 3 25 47 6 1 b a orientation marking (see note 2) 147008 3 25 47 69 8 1 b a orientation marking (see note 2) a3 b3 a2 a1 b2 a5 b5 a4 b4 b1 a1 orientation marking a3 b3 a2 a1 b2 a5 b5 a4 b4 a7 b7 a6 b6 b1 a1 orientation marking a3 b3 a2 a1 b2 a5 b5 a4 b4 a7 b7 a6 b6 a9 b9 a8 b8 b1 a1 orientation marking cm1470-8cs/cp 18-bump csp package / pinout diagrams notes: top view bottom view (bumps down view) (bumps up view) 1) these drawings are not to scale. 2) lead-free devices are specified by using a " + " character for the top side orientation mark. cm1470-6cs/cp 14-bump csp cm1470-4cs/cp 10-bump csp
? 2006 california micro devices corp. all rights reserved. 01/06/06 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 3 cm1470 preliminary ordering information note 1: parts are shipped in tape & reel form unless otherwise specified. note 2: lead-free devices ar e specified by using a " + " character for the top side orientation mark. part numbering information bumps package standard finish lead-free finish 2 ordering part number 1 part marking ordering part number 1 part marking 10 csp CM1470-04CS l704 cm1470-04cp l704 14 csp cm1470-06cs l706 cm1470-06cp l706 18 csp cm1470-08cs 147008 cm1470-08cp 147008
? 2006 california micro devices corp. all rights reserved. 4 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 01/06/06 cm1470 preliminary specifications note 1: t a =25 c unless otherwise specified. note 2: esd applied to input and output pins with respect to gnd, one at a time. note 3: clamping voltage is measured at the opposite side of the em i filter to the esd pin. for example, if esd is applied to pi n a1, then clamping voltage is measured at pin b2. note 4: unused pins are left open. note 5: these parameters are guarant eed by design and characterization. absolute maximum ratings parameter rating units storage temperature range -65 to +150 c dc current per inductor 30 ma standard operat ing conditions parameter rating units operating temperature range -40 to +85 c electrical operatin g characteristics (note 1 ) symbol parameter conditions min typ max units l tot total channel inductance 17 nh r dc channel resistance 10 i leak input capacitance / channel 2.5v dc; 1mhz, 30mv ac 2.8 pf v sig signal voltage positive clamp negative clamp i load = 10ma 5 -15 7 -10 15 -5 v v v st stand-off voltage i = 10 a6.0v i leak diode leakage current v in = + 3.3v 0.1 1.0 a v sig signal clamp voltage positive clamp negative clamp i load = 10ma i load = -10ma 5.6 -1.5 6.8 -0.8 9.0 -0.4 v v v esd in-system esd withstand voltage a) human body model, mil-std-883, method 3015 b) contact discharge per iec 61000-4-2 level 4 notes 2, 3, 4 and 5 4 2 kv kv f c cut-off frequency z source = 50 , z load = 50 900 mhz
? 2006 california micro devices corp. all rights reserved. 01/06/06 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 5 cm1470 preliminary performance information typical filter performance (nominal conditions unless specified otherwise, 50 ohm environment) figure 1. insertion loss vs. frequency (a1-b2 to gnd) figure 2. typical diode ca pacitance vs. input voltage (normalized to 2.5v d.c)
? 2006 california micro devices corp. all rights reserved. 6 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 01/06/06 cm1470 preliminary performance information (cont?d) typical filter performance (nominal conditions unless specified otherwise, 50 ohm environment) figure 3. 2ns rise and fall times of cl ocked signals at 25mhz, 50mhz and 100mhz through cm1470 inductor array (simulation) 25mhz 50mhz 75mhz
? 2006 california micro devices corp. all rights reserved. 01/06/06 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 7 cm1470 preliminary application information refer to application no te ap-217, "the chip scale package", for a detailed description of chip scale packages offered by california micro devices. figure 4. recommended non-solder mask defined pad illustration figure 5. eutectic (snpb) solder ball reflow profile figure 6. lead-free (snagcu) solder ball reflow profile printed circuit boar d recommendations parameter value pad size on pcb 0.240mm pad shape round pad definition non-solder mask defined pads solder mask opening 0.290mm round solder stencil thickness 0.125 - 0.150mm solder stencil aperture opening (laser cut, 5% tapered walls) 0.300mm round solder flux ratio 50/50 by volume solder paste type no clean pad protective finish osp (entek cu plus 106a) tolerance ? edge to corner ball + 50 m solder ball side coplanarity + 20 m maximum dwell time above liquidous 60 seconds maximum soldering temperature for eutectic devices using a eutectic solder paste 240c maximum soldering temperature for lead-free devices using a lead-free solder paste 260c solder mask opening 0.290mm dia. non-solder mask defined pad 0.240mm dia. solder stencil opening 0.300mm dia. 200 250 150 100 50 0 1:00.0 2:00.0 3:00.0 4:00.0 time (minutes) temperature (c)
? 2006 california micro devices corp. all rights reserved. 8 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 01/06/06 cm1470 preliminary mechanical details CM1470-04CS/cp mechanical specifications dimensions for the CM1470-04CS/cp supplied in a 10-bump, 0.4mm pitch chip scale package (csp) are presented below. for complete information on the csp-10, see the cali- fornia micro devices csp package information docu- ment. package dimensions for CM1470-04CS/cp chip scale package package dimensions package custom csp bumps 10 dim millimeters inches min nom max min nom max a1 0.791 0.836 0.881 0.0311 0.0329 0.0347 a2 1.985 2.030 2.075 0.0781 0.0799 0.0817 b1 0.395 0.400 0.405 0.0156 0.0157 0.0159 b2 0.395 0.400 0.405 0.0156 0.0157 0.0159 c1 0.168 0.218 0.268 0.0066 0.0086 0.0106 c2 0.165 0.215 0.265 0.0065 0.0085 0.0104 d1 0.537 0.607 0.676 0.0211 0.0239 0.0266 d2 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel 3500 pieces controlling dimension: millimeters mechanical package diagrams 0.25 dia. note: dimensions in millimeters 63/37 sn/pb (eutectic) or solder bumps 96.8/2.6/0.6 sn/ag/cu (lead-free) optiguard tm coating 4 5 b c1 b1 a1 b2 c2 d1 d2 a2 bottom view side view a 1 2 3 a b optiguard tm coated csp
? 2006 california micro devices corp. all rights reserved. 01/06/06 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 9 cm1470 preliminary mechanical details cm1470-06cs/cp mechanical specifications dimensions for the CM1470-04CS/cp supplied in a 14-bump, 0.4mm pitch chip scale package (csp) are presented below. for complete information on the csp-14, see the cali- fornia micro devices csp package information docu- ment. package dimensions for cm1470-06cs/cp chip scale package package dimensions package custom csp bumps 14 dim millimeters inches min nom max min nom max a1 0.791 0.836 0.881 0.0311 0.0329 0.0347 a2 2.785 2.830 2.875 0.1096 0.1114 0.1132 b1 0.395 0.400 0.405 0.0156 0.0157 0.0159 b2 0.395 0.400 0.405 0.0156 0.0157 0.0159 c1 0.168 0.218 0.268 0.0066 0.0086 0.0106 c2 0.165 0.215 0.265 0.0065 0.0085 0.0104 d1 0.537 0.607 0.676 0.0211 0.0239 0.0266 d2 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel 3500 pieces controlling dimension: millimeters mechanical package diagrams note: dimensions in millimeters optiguard tm coated csp 0.25 dia. 63/37 sn/pb (eutectic) or solder bumps 96.8/2.6/0.6 sn/ag/cu (lead-free) optiguard tm coating 4 5 b c1 b1 a1 b2 c2 d1 d2 a2 bottom view side view a 1 2 3 a b a b 6 7
? 2006 california micro devices corp. all rights reserved. 10 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 01/06/06 cm1470 preliminary mechanical details cm1470-08cs/cp mechanical specifications dimensions for the cm1470-08cs/cp supplied in a 18-bump, 0.4mm pitch chip scale package (csp) are presented below. for complete information on the csp-18, see the cali- fornia micro devices csp package information docu- ment. package dimensions for cm1470-08cs/cp chip scale package package dimensions package custom csp bumps 18 dim millimeters inches min nom max min nom max a1 0.791 0.836 0.881 0.0311 0.0329 0.0347 a2 3.585 3.630 3.675 0.1411 0.1429 0.1447 b1 0.395 0.400 0.405 0.0156 0.0157 0.0159 b2 0.395 0.400 0.405 0.0156 0.0157 0.0159 c1 0.168 0.218 0.268 0.0066 0.0086 0.0106 c2 0.165 0.215 0.265 0.0065 0.0085 0.0104 d1 0.537 0.607 0.676 0.0211 0.0239 0.0266 d2 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel 3500 pieces controlling dimension: millimeters mechanical package diagrams note: dimensions in millimeters optiguard tm coated csp 0.25 dia. 63/37 sn/pb (eutectic) or solder bumps 96.8/2.6/0.6 sn/ag/cu (lead-free) optiguard tm coating 4 5 b c1 b1 a1 b2 c2 d1 d2 a2 bottom view side view a 1 2 3 a b a b 6 7 8 9
? 2006 california micro devices corp. all rights reserved. 01/06/06 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 11 cm1470 preliminary csp tape and reel specifications figure 7. tape and reel mechanical data part number chip size (mm) pocket size (mm) b 0 x a 0 x k 0 tape width w reel diameter qty per reel p 0 p 1 CM1470-04CS/cp 2.03 x 0.836 x 0.644 2.17 x 1.12 x 0.71 8mm 178mm (7") 3500 4mm 4mm cm1470-06cs/cp 2.83 x 0.836 x 0.644 2.97 x 0.97 x 0.74 8mm 178mm (7") 3500 4mm 4mm cm1470-08cs/cp 3.63 x 0.836 x 0.644 3.76 x 0.97 x 0.74 8mm 178mm (7") 3500 4mm 4mm to p for tape feeder reference cover ta p e p 1 only including draft. concentric around b. k o embossment user direction of feed 0.2 mm p o center lines of cavity w 10 pitches cumulative tolerance on tape a o b o

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