by229-200 thru by229-800 by229x-200 thru by229x-800 by229b-200 thru by229b-800 document number 88540 09-mar-05 vishay semiconductors www.vishay.com 1 case pin 2 pin 1 to-220ac ito-220ac k heatsink pin 1 pin 2 1 2 1 2 1 2 k by229 series by229x series by229b series pin 2 pin 1 to-263ab fast switching plastic rectifier major ratings and characteristics features ? glass passivated chip junction superfast recovery time for high efficiency low leakage current high forward surge capability meets msl level 1, per j-std-020c i f(av) 8.0 a v rrm 200 v to 800 v i fsm 100 a t rr 145 ns v f 1.85 v t j max 150 c typical applications for use in fast switching re ctification of power supply, inverters, converters and freewheeling diodes appli- cation mechanical data case: to-220ac, ito-220ac, to-263ab epoxy meets ul 94v-0 flammability rating terminals: matte tin plated (e3 suffix) leads, solder- able per j-std-002b and mil-std-750, method 2026 polarity: as marked mounting torque: 10 in-lbs maximum maximum ratings (t c = 25 c, unless otherwise noted) parameter symbol by229- 200 by229- 400 by229- 600 by229- 800 unit maximum recurrent peak reverse voltage v rrm 200 400 600 800 v maximum rms voltage v rms 140 280 420 560 v maximum dc blocking voltage v dc 200 400 600 800 v maximum average forward rectified current at t c = 100 c i f(av) 8.0 a peak forward surge current 8.3 ms single half sine-wave superimposed on rated load i fsm 100 a maximum slope of reverse recovery current i f = 2.0 a, v r = 30 v, di/dt = 20 s dir/dt 60 a/ s operating junction and storage temperature range t j , t stg - 40 to + 150 c rms isolation voltage from te rminals to heatsink with t = 1 second, rh 30 % (by229x only) v isol 4500 (1) 3500 (2) 1500 (3) v
www.vishay.com 2 document number 88540 09-mar-05 by229-200 thru by229-800 by229x-200 thru by229x-800 by229b-200 th ru by229b-800 vishay semiconductors electrical characteristics (t c = 25 c unless otherwise noted) notes: (1) clip mounting (on case), where lead does not overlap heatsink with 0.110" offset (2) clip mounting (on case), where leads do overlap heatsink (3) screw mounting with 4-40 screw, where washer diameter is 4.9 mm (0.19") (4) pulse test: 300 s pulse width, 1 % duty cycle thermal characteristics (t c = 25 c unless otherwise noted) parameter test condition symbol by229- 200 by229- 400 by229- 600 by229- 800 unit maximum instantaneous forward voltage at 20 a (4) v f 1.85 v maximum dc reverse current at rated dc blocking voltage t j = 25 c t j = 125 c i r 10 300 a maximum reverse recovery time at i f = 1.0 a, v r = 30 v, di/dt = 50 a/s, i rr = 10 % i rm t rr 145 ns maximum recovered stored charge i f = 2.0 a, v r = 30 v, di/dt = 20 a/s q rr 700 nc parameter symbol by229 by229x by229b unit typical thermal resistance, junction to case r jc 2.0 4.8 2.0 c/w typical thermal resistance, junction to air r ja 20 - 20 c/w
by229-200 thru by229-800 by229x-200 thru by229x-800 by229b-200 thru by229b-800 document number 88540 09-mar-05 vishay semiconductors www.vishay.com 3 ratings and characteristics curves (t a = 25 c unless otherwise noted) figure 1. forward current derating curve figure 2. maximum non-repetitive peak forward surge current figure 3. typical instantaneous forward characteristics 0 4.0 12 0 75 25 50 100 125 150 8.0 average forward rectified current (a) case ambient temperature (c) resistive or inductive load 2.0 6.0 10 0 75 100 125 50 25 150 1 100 t l =75c 8.3ms single half sine-wave peak forward surge current (a) number of cycles at 60 h z 10 i f - instantaneous f orward current (a) 100 10 1 0.1 0.4 0.6 1.4 1.6 1.8 2.0 0.8 1.0 1.2 pulse width = 300 s 1% duty cycle instantaneous forward voltage (v) t j =25 c t j = 100 c t j = 150 c t j = 125 c figure 4. typical revers e leakage characteristics figure 5. typical junction capacitance i r - instantaneous re verse leakage current ( a) 0.1 1 10 100 0.01 100 c 25 c 20 0 100 40 60 80 percent of rated peak reverse voltage (%) 125 c 1000 t j = 150 c 1 100 100 10 reverse voltage (v) t j =25c f = 1.0 mh z v sig = 50mvp-p pf - j unction capacitance 10
www.vishay.com 4 document number 88540 09-mar-05 by229-200 thru by229-800 by229x-200 thru by229x-800 by229b-200 th ru by229b-800 vishay semiconductors package outline dime nsions in inches (millimeters) to-220ac 0.154 (3.91) 0.148 (3.74) dia. 0.113 (2.87) 0.103 (2.62) 0.185 (4.70) 0.175 (4.44) 0.055 (1.39) 0.045 (1.14) 0.145 (3.68) 0.135 (3.43) 0.350 (8.89) 0.330 (8.38) 0.160 (4.06) 0.140 (3.56) 0.037 (0.94) 0.027 (0.68) 0.205 (5.20) 0.195 (4.95) 0.560 (14.22) 0.530 (13.46) 0.022 (0.56) 0.014 (0.36) 0.110 (2.79) 0.100 (2.54) 12 1.148 (29.16) 1.118 (28.40) 0.105 (2.67) 0.095 (2.41) 0.410 (10.41) 0.390 (9.91) 0.635 (16.13) 0.625 (15.87) 0.603 (15.32) 0.573 (14.55) pin 0.415 (10.54) max. 0.370 (9.40) 0.360 (9.14) 0.057 (1.45) 0.045 (1.14) case pin 2 pin 1 0.405 (10.27) 0.383 (9.72) 0.191 (4.85) 0.171 (4.35) 0.600 (15.5) 0.580 (14.5) 0.560 (14.22) 0.530 (13.46) 0.037 (0.94) 0.027 (0.69) 0.140 (3.56) 0.130 (3.30) 0.350 (8.89) 0.330 (8.38) 0.188 (4.77) 0.172 (4.36) 0.110 (2.80) 0.100 (2.54) 0.131 (3.39) 0.122 (3.08) 0.110 (2.80) 0.100 (2.54) 0.022 (0.55) 0.014 (0.36) 0.205 (5.20) 0.195 (4.95) 12 pin dia. dia. 0.676 (17.2) 0.646 (16.4) ito-220ac 0.057 (1.45) 0.045(1.14) k-heatsink pin 2 pin 1 0.380 (9.65) 0.411 (10.45) 0.320 (8.13) 0.360 (9.14) 0.591(15.00) 0.624 (15.85) 1 2 0.245 (6.22) min k k 0.160 (4.06) 0.190 (4.83) 0.045 (1.14) 0.055 (1.40) 0.014 (0.36) 0.021 (0.53) 0.110 (2.79) 0.140 (3.56) 0.110 (2.79) 0.090 (2.29) 0.047 (1.19) 0.055 (1.40) 0-0.01 (0-0.254) 0.027 (0.686) 0.037 (0.940) 0.105 (2.67) 0.095 (2.41) 0.205 (5.20) 0.195 (4.95) to-263ab 0.08 (2.032) 0.42 (10.66) 0.670 (17.02) 0.591 (15.00) 0.15 (3.81) 0.33 (8.38) mounting pad layout k-heatsink pin 2 pin 1 min. min. min. min. 0.095 (2.41) 0.105 (2.67)
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