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  ? 2010 microchip technology inc. ds21375d-page 1 tc1264 features: ? very low dropout voltage ? 800 ma output current ? high output voltage accuracy ? standard or custom output voltages ? overcurrent and overtemperature protection applications: ? battery operated systems ? portable computers ? medical instruments ? instrumentation ? cellular/gsm/phs phones ? linear post-regulators for smps ? pagers typical application description: the tc1264 is a fixed-output, high-accuracy (typically 0.5%) cmos low dropout regulator. designed specifically for battery-operated systems, the tc1264?s cmos construction eliminates wasted ground current, significantly extending battery life. total supply current is typically 80 a at full load (20 to 60 times lower than in bipolar regulators). tc1264 key features include ultra low noise operation, very low dropout voltage (typically 450 mv at full load), and fast response to step changes in load. the tc1264 incorporates both over temperature and over current protection. the tc1264 is stable with an output capacitor of only 1 f and has a maximum output current of 800 ma. it is available in 3-pin sot-223, 3-pin to-220 and 3-pin ddpak packages. package type tc1264 v in v out c 1 1f gnd v out v in + v in v in v out gnd gnd v out tab is gnd front view front view 1 12 3 3 2 3-pin to-220 tab is gnd 3-pin sot-223 3-pin ddpak 123 tc1264 tc1264 tc1264 v in gnd v out 800 ma fixed-output cmos ldo with shutdown
tc1264 ds21375d-page 2 ? 2010 microchip technology inc. 1.0 electrical characteristics absolute maximum ratings ? input voltage .........................................................6.5v output voltage.................. (v ss ? 0.3v) to (v in + 0.3v) power dissipation................internally limited ( note 8 ) maximum voltage on any pin ........v in +0.3v to -0.3v operating temperature range...... -40c < t j < 125c storage temperature..........................-65c to +150c ? notice: stresses above those listed under "maximum ratings" may cause permanent damage to the device. this is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specific ation is not implied. exposure to maximum rating conditions for extended periods may affect device reliability. dc characteristics electrical specifications: unless otherwise indicated, v in = v r + 1.5v, ( note 1 ) , i l = 100 a, c l = 3.3 f, shdn > v ih , t a = +25c. boldface type specifications apply for juncti on temperatures of -40c to +125c. parameters sym min typ max units conditions input operating voltage v in 2.7 ? 6.0 v note 2 maximum output current i outmax 800 ??ma output voltage v out v r ? 2.5% v r 0.5% v r + 2.5% vv r ? 2.5v v r ? 2% v r 0.5% v r + 3% v r = 1.8v v r ? 7% ? v r + 3% i l = 0.1 ma to 800 ma ( note 3 ) v out temperature coefficient ? v out / ? t ? 40 ? ppm/c note 4 line regulation ? v out / ? v in ? 0.007 0.35 %(v r + 1v) ?? v in ??? 6v load regulation ( note 5 ) ? v out /v out -0.01 0.002 0 %/ma i l = 0.1 ma to i outmax dropout voltage ( note 6 ) v in ?v out ?20 30 mv v r ? 2.5v, i l = 100 a ?50 160 v r ? 2.5v, i l = 100 ma ? 150 480 v r ? 2.5v, i l = 300 ma ? 260 800 v r ? 2.5v, i l = 500 ma ? 450 1300 v r ? 2.5v, i l = 800 ma ? 1000 1200 v r = 1.8v, i l = 500 ma ? 1200 1400 i l = 800 ma supply current i dd ?80 130 a shdn = v ih , i l = 0 power supply rejection ratio psrr ? 64 ? db f ?? 1khz output short circuit current i outsc ? 1200 ? ma v out = 0v note 1: v r is the regulator output voltage setting. 2: the minimum v in has to justify the conditions: v in ? v r + v dropout and v in ? 2.7v for i l = 0.1 ma to i outmax . 3: this accuracy represents the worst-case over the entire output current and temperature range. 4: 5: regulation is measured at a constant ju nction temperature using low duty cycle pulse testing. load regulation is tested over a load range from 0.1 ma to the maximum specified output current. changes in output voltage due to heating effects are covered by the thermal regulation specification. 6: dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal value measured at a 1.5v differential. 7: thermal regulation is defined as the change in output voltage at a time t after a change in power dissipation is applied, excluding load or line regulation effects. specif ications are for a current pulse equal to i lmax at v in = 6v for t = 10 ms. 8: the maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistanc e from junction-to-air (i.e., t a , t j , ? ja ). exceeding the maximum allowable power dissipation causes the device to init iate thermal shutdown. please see section 5.0 ?thermal considerations? for more details. tcv out v outmax v outmin ? ?? 10 6 ? v out t ? ? ------------------------------------------------------------------------- =
? 2010 microchip technology inc. ds21375d-page 3 tc1264 thermal regulation ? v out / ? p d ?0.04?v/w note 7 output noise en ? 260 ? nv/ ? hz i l = i outmax , f = 10 kh z dc characteristics (continued) electrical specifications: unless otherwise indicated, v in = v r + 1.5v, ( note 1 ) , i l = 100 a, c l = 3.3 f, shdn > v ih , t a = +25c. boldface type specifications apply for juncti on temperatures of -40c to +125c. parameters sym min typ max units conditions note 1: v r is the regulator output voltage setting. 2: the minimum v in has to justify the conditions: v in ? v r + v dropout and v in ? 2.7v for i l = 0.1 ma to i outmax . 3: this accuracy represents the worst-case over the entire output current and temperature range. 4: 5: regulation is measured at a constant j unction temperature using low duty cycle pulse testing. load regulation is tested over a load range from 0.1 ma to the maximum specified output current. changes in output voltage due to heating effects are covered by the thermal regulation specification. 6: dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal value measured at a 1.5v differential. 7: thermal regulation is defined as the change in output voltage at a time t after a change in power dissipation is applied, excluding load or line regulation effects. specif ications are for a current pulse equal to i lmax at v in = 6v for t = 10 ms. 8: the maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistanc e from junction-to-air (i.e., t a , t j , ? ja ). exceeding the maximum allowable power dissipation causes the device to init iate thermal shutdown. please see section 5.0 ?thermal considerations? for more details. tcv out v outmax v outmin ? ?? 10 6 ? v out t ? ? ------------------------------------------------------------------------- = temperature characteristics electrical specifications: unless otherwise indicated, v in = v r + 1.5v, i l = 100 a, c l = 3.3 f, shdn > v ih , t a = +25c. parameters sym min typ max units conditions temperature ranges specified temperature range t a -40 ? +125 c ( note 1 ) operating temperature range t j -40 ? +125 c storage temperature range t a -65 ? +150 c thermal package resistances thermal resistance, 3l-sot-223 ? ja ?59?c/w thermal resistance, 3l-ddpak ? ja ?71?c/w thermal resistance, 3l-to-220 ? ja ?71?c/w note 1: operation in this range must not cause t j to exceed maximum junction temperature (+125c).
tc1264 ds21375d-page 4 ? 2010 microchip technology inc. 2.0 typical performance curves figure 2-1: line regulation vs. temperature. figure 2-2: output noise vs. frequency. figure 2-3: load regulation vs. temperature. figure 2-4: i dd vs. temperature. figure 2-5: 3.0v dropout voltage vs. i load . figure 2-6: 3.0v v out vs.temperature. note: the graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. the performance characteristics listed herein are not tested or guaranteed. in some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 0.020 0.018 0.016 0.012 0.010 0.008 0.006 0.004 0.002 0.000 0.014 temperature (c) line regulation (%) -40c 0c 25c 70c 85c 125c frequency (khz) noise ( v/ hz) 10.0 1.0 0.01 0.01 1 10 100 1000 0.1 0.0 r load = 50 c out = 1 f -40c 0c 25c 70c 85c 125c 0.0100 0.0090 0.0080 0.0070 0.0060 0.0050 0.0040 0.0030 0.0020 0.0010 0.0100 temperature (c) load regulation (%/ma) 1 ma to 800 ma v out = 3v temperature (c) i dd (  a) 150 135 120 105 90 75 60 45 30 15 0 -40c 0c 25c 70c 85c 125c v out = 3v 0.600 0.550 0.500 0.450 0.400 0.350 0.300 0.250 0.200 0.150 0.100 0.050 0.000 0 100 200 300 400 500 600 700 800 i load (ma) dropout voltage (v) 85c 125c -40c 0c 25c 70c 3.030 3.020 3.010 3.000 2.990 2.980 2.970 2.960 2.950 2.940 2.930 2.920 temperature (c) v out (v) i load = 0.1 ma i load = 300 ma i load = 500 ma i load = 800 ma -40c 0c 25c 70c 85c 125c
? 2010 microchip technology inc. ds21375d-page 5 tc1264 3.0 pin descriptions the descriptions of the pins are listed in tab l e 3 - 1 . table 3-1: pin function table 3.1 unregulated supply (v in ) unregulated supply input. 3.2 ground (gnd) ground terminal. 3.3 regulated output voltage (v out ) regulated voltage output. pin no. 3-pin sot-223 3-pin to-220 3-pin ddpak symbol description 1v in unregulated supply input 2 gnd ground terminal 3v out regulated voltage output
tc1264 ds21375d-page 6 ? 2010 microchip technology inc. 4.0 detailed description the tc1264 is a precision, fixed output ldo. unlike bipolar regulators, the tc1264?s supply current does not increase with load current. in addition, v out remains stable and within regulation over the entire 0ma to i load max load current range (an important consideration in rtc and cmos ram battery back-up applications). figure 4-1 shows a typical application circuit. figure 4-1: typical application circuit. 4.1 output capacitor a 1 f (min) capacitor from v out to ground is required. the output capacitor should have an effective series resistance greater than 0.1 ? and less than 5 ? . a 1 f capacitor should be connected from v in to gnd if there is more than 10 inches of wire between the regulator and the ac filter capacitor, or if a battery is used as the power source. aluminum electrolytic or tantalum capacitor types can be used. (since many aluminum electrolytic capacitors freeze at approximately -30c, solid tantalums are recommended for applications operating below -25c.) when operating from sources other than batteries, supply-noise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques. tc1264 v in v out c 1 1f gnd v out v in shdn +
? 2010 microchip technology inc. ds21375d-page 7 tc1264 5.0 thermal considerations 5.1 thermal shutdown integrated thermal protection circuitry shuts the regulator off when die temperature exceeds 160c. the regulator remains off until the die temperature drops to approximately 150c. 5.2 power dissipation the amount of power the regulator dissipates is primarily a function of input and output voltage, and output current. the following equation is used to calculate worst-case actual power dissipation: equation 5-1: the maximum allowable power dissipation ( equation 5-2 ) is a function of the maximum ambient temperature (t a max ), the maximum allowable die temperature (t j max ) and the thermal resistance from junction-to-air ( ? ja ). equation 5-2: table 5-1 and ta b l e 5 - 2 show various values of ? ja for the tc1264 packages. table 5-1: thermal resistance guidelines for tc1264 in sot-223 package table 5-2: thermal resistance guidelines for tc1264 in 3-pin ddpak/to-220 package equation 5-1 can be used in conjunction with equation 5-2 to ensure regulator thermal operation is within limits. for example: find: 1. actual power dissipation. 2. maximum allowable dissipation. actual power dissipation: maximum allowable power dissipation: in this example, the tc1264 dissipates a maximum of 260 mw, which is below the allowable limit of 508 mw. in a similar manner, equation 5-1 and equation 5-2 can be used to calculate maximum current and/or input voltage limits. for example, the maximum allowable v in , is found by substituting the maximum allowable power dissipation of 508 mw into equation 5-1 , from which v in max = 4.6v. copper area (topside)* copper area (backside) board area thermal resistance ?? ja ) 2500 sq mm 2500 sq mm 2500 sq mm 45c/w 1000 sq mm 2500 sq mm 2500 sq mm 45c/w 225sqmm 2500sqmm 2500sqmm 53c/w 100sqmm 2500sqmm 2500sqmm 59c/w 1000 sq mm 1000 sq mm 1000 sq mm 52c/w 1000 sq mm 0 sq mm 1000 sq mm 55c/w * tab of device attached to topside copper where: v inmax v outmin i loadmax p d = worst-case actual power dissipation = minimum regulator output voltage = maximum output (load) current = maximum voltage on v in p d v inmax v outmin ? ?? i loadmax = p d max = (t j max ? t a max ) ? ja where all terms are previously defined. copper area (topside)* copper area (backside) board area thermal resistance ?? ja ) 2500 sq mm 2500 sq mm 2500 sq mm 25c/w 1000 sq mm 2500 sq mm 2500 sq mm 27c/w 125sqmm 2500sqmm 2500sqmm 35c/w * tab of device attached to topside copper given: v inmax = 3.3v 10% v outmin = 2.7v 0.5% i loadmax =275ma t jmax = 125c t amax =95c ? ja = 59c/w (sot-223) p d v inmax v outmin ? ?? i loadmax ? p d 3.3 1.1 ? ?? 2.7 .995 ? ?? ? 275 10 3 ? ? = p d 260 mw = p dmax t jmax t amax ? ? ja -------------------------------------- - = p dmax 125 95 ? ?? 59 ------------------------- = p dmax 508 mw =
tc1264 ds21375d-page 8 ? 2010 microchip technology inc. 6.0 packaging information 6.1 package marking information legend: xx...x customer-specific information y year code (last digit of calendar year) yy year code (last 2 digits of calendar year) ww week code (week of january 1 is week ?01?) nnn alphanumeric traceability code pb-free jedec designator for matte tin (sn) * this package is pb-free. the pb-free jedec designator ( ) can be found on the outer packaging for this package. note : in the event the full microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e xxxxxxxxx xxxxxxxxx yywwnnn 3-lead ddpak example 3-lead sot-223 xxxxxxx xxxyyww nnn example 1264-25 vdb1030 256 3-lead to-220 xxxxxxxxx xxxxxxxxx yywwnnn example tc1264 3.0vab ^^ 1030256 tc1264 1.8veb ^^ 1030256 3 e 3 e
? 2010 microchip technology inc. ds21375d-page 9 tc1264 
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tc1264 ds21375d-page 10 ? 2010 microchip technology inc. note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging
? 2010 microchip technology inc. ds21375d-page 11 tc1264 
 

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tc1264 ds21375d-page 14 ? 2010 microchip technology inc. notes:
? 2010 microchip technology inc. ds21375d-page 15 tc1264 appendix a: revision history revision d (september 2010) the following is the list of modifications: 1. updated figure 2-4 . 2. updated package drawings (c04-011b, c04-2011a, c04-032b, c04-2032a, c04-034b). revision c (october 2006) the following is the list of modifications: 1. section 1.0 ?electrical characteristics? : changed dropout voltage typical value for i l = 500 ma from 700 to 1000 and maximum value from 1000 to 1200 for. changed typical value for i l = 800 ma from 890 to 1200. 2. section 6.0 ?packaging information? : added package marking information and package outline drawings. 3. added disclaimer to package outline drawings. revision b (may 2002) ? undocumented changes. revision a (march 2002) ? original release of this document.
tc1264 ds21375d-page 16 ? 2010 microchip technology inc. notes:
? 2010 microchip technology inc. ds21375d-page 17 tc1264 product identification system to order or obtain information, e. g., on pricing or delivery, refer to the factory or the listed sales office . device tc1264 fixed output cmos ldo voltage option:* 1.8v = 1.8v 2.5v = 2.5v 3.0v = 3.0v 3.3v = 3.3v * other output voltages are available. please contact your local microchip sales office for details. package ab = plastic (to-220), 3-lead db = plastic (sot-223), 3-lead dbtr = plastic (sot-223), 3-lead, tape and reel eb = plastic transistor outline (ddpak), 3-lead ebtr = plastic transistor outline (ddpak), 3-lead, tape and reel part no. x.xx xx package voltage option device examples: a) tc1264-1.8vab 1.8v ldo, to-220-3 pkg. b) tc1264-2.5vab 2.5v ldo, to-220-3 pkg. c) tc1264-3.0vab 3.0v ldo, to-220-3 pkg. d) tc1264-3.3vab 3.3v ldo, to-220-3 pkg. a) tc1264-1.8vebtr 1.8v ldo, ddpak-3 pkg., tape and reel b) tc1264-2.5vebtr 2.5v ldo, ddpak-3 pkg., tape and reel c) tc1264-3.0vebtr 3.0v ldo, ddpak-3 pkg., tape and reel d) tc1264-3.3vebtr 3.3v ldo, ddpak-3 pkg., tape and reel a) tc1264-1.8vdb 1.8v ldo, sot-223 pkg. b) tc1264-1.8vdbtr 1.8v ldo, sot-223 pkg., tape and reel c) tc1264-2.5vdb 2.5v ldo, sot-223 pkg. d) tc1264-2.5vdbtr 2.5v ldo, sot-223 pkg., tape and reel e) tc1264-3.0vdb 3.0v ldo, sot-223 pkg. f) tc1264-3.0vdbtr 3.0v ldo, sot-223 pkg., tape and reel g) tc1264-3.3vdb 3.3v ldo, sot-223 pkg. h) tc1264-3.3vdbtr 3.3v ldo, sot-223 pkg., tape and reel xx tape and reel
tc1264 ds21375d-page 18 ? 2010 microchip technology inc. notes:
? 2010 microchip technology inc. ds21375d-page 19 information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. it is your responsibility to ensure that your application meets with your specifications. microchip makes no representations or warranties of any kind whether express or implied, written or oral, statutory or otherwise, related to the information, including but not limited to its condition, quality, performance, merchantability or fitness for purpose . microchip disclaims all liability arising from this information and its use. use of microchip devices in life support and/or safety applications is entirely at the buyer?s risk, and the buyer agrees to defend, indemnify and hold harmless microchip from any and all damages, claims, suits, or expenses resulting from such use. no licenses are conveyed, implicitly or otherwise, under any microchip intellectual property rights. trademarks the microchip name and logo, the microchip logo, dspic, k ee l oq , k ee l oq logo, mplab, pic, picmicro, picstart, pic 32 logo, rfpic and uni/o are registered trademarks of microchip technology incorporated in the u.s.a. and other countries. filterlab, hampshire, hi-tech c, linear active thermistor, mxdev, mxlab, seeval and the embedded control solutions company are registered trademarks of microchip technology incorporated in the u.s.a. analog-for-the-digital age, appl ication maestro, codeguard, dspicdem, dspicdem.net, dspicworks, dsspeak, ecan, economonitor, fansense, hi-tide, in-circuit serial programming, icsp, mindi, miwi, mpasm, mplab certified logo, mplib, mplink, mtouch, omniscient code generation, picc, picc-18, picdem, picdem.net, pickit, pictail, real ice, rflab, select mode, total endurance, tsharc, uniwindriver, wiperlock and zena are trademarks of microchip tec hnology incorporated in the u.s.a. and other countries. sqtp is a service mark of microchip technology incorporated in the u.s.a. all other trademarks mentioned herein are property of their respective companies. ? 2010, microchip technology incorporated, printed in the u.s.a., all rights reserved. printed on recycled paper. isbn: 978-1-60932-564-0 note the following details of the code protection feature on microchip devices: ? microchip products meet the specification cont ained in their particular microchip data sheet. ? microchip believes that its family of products is one of the most secure families of its kind on the market today, when used i n the intended manner and under normal conditions. ? there are dishonest and possibly illegal methods used to breach the code protection feature. all of these methods, to our knowledge, require using the microchip produc ts in a manner outside the operating specif ications contained in microchip?s data sheets. most likely, the person doing so is engaged in theft of intellectual property. ? microchip is willing to work with the customer who is concerned about the integrity of their code. ? neither microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as ?unbreakable.? code protection is constantly evolving. we at microchip are co mmitted to continuously improvin g the code protection features of our products. attempts to break microchip?s code protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that act. microchip received iso/ts-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona; gresham, oregon and design centers in california and india. the company?s quality system processes and procedures are for its pic ? mcus and dspic ? dscs, k ee l oq ? code hopping devices, serial eeproms, microperipherals, nonvolatile memory and analog products. in addition, microchip?s quality system for the design and manufacture of development systems is iso 9001:2000 certified.
ds21375d-page 20 ? 2010 microchip technology inc. americas corporate office 2355 west chandler blvd. chandler, az 85224-6199 tel: 480-792-7200 fax: 480-792-7277 technical support: http://support.microchip.com web address: www.microchip.com atlanta duluth, ga tel: 678-957-9614 fax: 678-957-1455 boston westborough, ma tel: 774-760-0087 fax: 774-760-0088 chicago itasca, il tel: 630-285-0071 fax: 630-285-0075 cleveland independence, oh tel: 216-447-0464 fax: 216-447-0643 dallas addison, tx tel: 972-818-7423 fax: 972-818-2924 detroit farmington hills, mi tel: 248-538-2250 fax: 248-538-2260 kokomo kokomo, in tel: 765-864-8360 fax: 765-864-8387 los angeles mission viejo, ca tel: 949-462-9523 fax: 949-462-9608 santa clara santa clara, ca tel: 408-961-6444 fax: 408-961-6445 toronto mississauga, ontario, canada tel: 905-673-0699 fax: 905-673-6509 asia/pacific asia pacific office suites 3707-14, 37th floor tower 6, the gateway harbour city, kowloon hong kong tel: 852-2401-1200 fax: 852-2401-3431 australia - sydney tel: 61-2-9868-6733 fax: 61-2-9868-6755 china - beijing tel: 86-10-8528-2100 fax: 86-10-8528-2104 china - chengdu tel: 86-28-8665-5511 fax: 86-28-8665-7889 china - chongqing tel: 86-23-8980-9588 fax: 86-23-8980-9500 china - hong kong sar tel: 852-2401-1200 fax: 852-2401-3431 china - nanjing tel: 86-25-8473-2460 fax: 86-25-8473-2470 china - qingdao tel: 86-532-8502-7355 fax: 86-532-8502-7205 china - shanghai tel: 86-21-5407-5533 fax: 86-21-5407-5066 china - shenyang tel: 86-24-2334-2829 fax: 86-24-2334-2393 china - shenzhen tel: 86-755-8203-2660 fax: 86-755-8203-1760 china - wuhan tel: 86-27-5980-5300 fax: 86-27-5980-5118 china - xian tel: 86-29-8833-7252 fax: 86-29-8833-7256 china - xiamen tel: 86-592-2388138 fax: 86-592-2388130 china - zhuhai tel: 86-756-3210040 fax: 86-756-3210049 asia/pacific india - bangalore tel: 91-80-3090-4444 fax: 91-80-3090-4123 india - new delhi tel: 91-11-4160-8631 fax: 91-11-4160-8632 india - pune tel: 91-20-2566-1512 fax: 91-20-2566-1513 japan - yokohama tel: 81-45-471- 6166 fax: 81-45-471-6122 korea - daegu tel: 82-53-744-4301 fax: 82-53-744-4302 korea - seoul tel: 82-2-554-7200 fax: 82-2-558-5932 or 82-2-558-5934 malaysia - kuala lumpur tel: 60-3-6201-9857 fax: 60-3-6201-9859 malaysia - penang tel: 60-4-227-8870 fax: 60-4-227-4068 philippines - manila tel: 63-2-634-9065 fax: 63-2-634-9069 singapore tel: 65-6334-8870 fax: 65-6334-8850 taiwan - hsin chu tel: 886-3-6578-300 fax: 886-3-6578-370 taiwan - kaohsiung tel: 886-7-213-7830 fax: 886-7-330-9305 taiwan - taipei tel: 886-2-2500-6610 fax: 886-2-2508-0102 thailand - bangkok tel: 66-2-694-1351 fax: 66-2-694-1350 europe austria - wels tel: 43-7242-2244-39 fax: 43-7242-2244-393 denmark - copenhagen tel: 45-4450-2828 fax: 45-4485-2829 france - paris tel: 33-1-69-53-63-20 fax: 33-1-69-30-90-79 germany - munich tel: 49-89-627-144-0 fax: 49-89-627-144-44 italy - milan tel: 39-0331-742611 fax: 39-0331-466781 netherlands - drunen tel: 31-416-690399 fax: 31-416-690340 spain - madrid tel: 34-91-708-08-90 fax: 34-91-708-08-91 uk - wokingham tel: 44-118-921-5869 fax: 44-118-921-5820 worldwide sales and service 08/04/10


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