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| i u u q x x x d j u j [ f o d p k q f o h m j t i d s z t u b m j o e f y i u n m 14 dimension [mm] solder pad layout [mm] g g g g g 5 0 1 3 5 4 5 3 3 $ - $ % - * 3 g g . ) [? . ) [ ' v o e b n f o u b m . ) [? g ? . ) [ / f f e u p d p o u b d u v t g p s u i f b w b j m b c m f g s f r v f o d z . b y . ) [? g ? . ) [ . b y . ) [? g ? . ) [ . b y . ) [? g ? . ) [ . b y at 25?c ?? ? at 25?c / f f e u p t q f d j g z z p v s s f r v j s f n f o u % $ 7? 7 ?? ? ? q q n ? q q n ?? ? ?? ? 3 f g f s u p u i f g p m m p x j o h u b c m f q ' q ' q ' . b y 8 8 . b y . . j o ? q q n . b y * o u f s o b m d p o o f d u j p o (top view) ? ? ? 1.15 0.45 1.15 1.4 0.8 1.4 motional (series) resistance (r 1 ) standard specifications CS325 life-size features 7 high-density smd type. 7 reliable ceramic package and excellent environmental characteristics. 7 suitable for various applications such as communication devices, av devices and other equipment. CS325 at-cut crystal unit (smd ?ceramic package) nominal frequency frequency tolerance frequency tolerance over operating temperature range operating temperature range storage temperature range motional (series) resistance load capacitance shunt capacitance level of drive insulation resistance aging (first year) item model conditions frequency range esr 3000pcs/reel http:/// |
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