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| 6 2009-09-24 01 .000.00x .000.1 a 1 sudhir.varma anish.salam c-cd-0022 compact d packaging as per gs-14-920 "this lf product meets european union directives and other country regulations as described in gs-22-008" in a convection,infra-red or vapor reflow oven solder application. the housing will withstand exposure to 260c peak temperature for 30 seconds m m 2009-09-24 2007-12-04 2009-09-24 nirmal.george nirmal.george b 1 c 1 pdm: rev:c released . status: printed: feb 17, 2010
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