TB6593FNG 2010-05-26 1 toshiba bi-cd integrated ci rcuit silicon monolithic TB6593FNG driver ic for dc motor features ? power supply voltage : vm = 15 v max ? output current : iout = 1.2 a (ave)/3.2 a (peak) ? output low on resistor : 0.35 ((typ. @vm 5 v) ? standby (power save)system ? cw/ccw/short break/stop function modes ? built-in thermal shutdown circuit and low voltage detecting circuit ? small faced package ssop20:0.65 mm pitch ? rohs compatible * this product has a mos structure and is sensitive to electrostatic discha rge. when handling this product, ensure that the environment is protec ted against electrostatic discharge by using an earth strap, a conductive mat and an ionizer. ensure also that the ambient temperature and relative humidity are maintained at reasonable levels. weight: 0.09 g (typ.) TB6593FNG is a driver ic for dc motor with output transistor in ld mos structur e with low on-resistor. two input signals, in1 and in2, can choose one of four modes such as cw, ccw, short break, and stop mode. the following conditions apply to solderability: *solderability 1. use of sn-37pb solder bath *solder bath temperature = 230c *dipping time = 5 seconds *number of times = once *use of r-type flux 2. use of sn-3.0ag-0.5cu solder bath *solder bath temperature = 245c *dipping time = 5 seconds *the number of times = once *use of r-type flux
TB6593FNG 2010-05-26 2 block diagram pin functions pin no. symbol characteristics remarks 1 gnd small signal gnd 2 pwm pwm signal input ?h? = active/200 k pull-down at internal 3 stby standby signal input ?l? = standby/200 k pull-down at internal 4 vm1 5 vm2 vm supply vm = 2.5 v to 13.5 v 6 o1 7 o1 output1 8 pgnd1 9 pgnd2 10 pgnd3 11 pgnd4 12 pgnd5 13 pgnd6 power gnd 14 o2 15 o2 output2 16 vm3 17 vm4 vm supply vm = 2.5 v to 13.5 v 18 in1 control signal input 1 19 in2 control signal input 2 200 k pull-down at internal 20 vcc small signal supply vcc = 2.7 v to 5.5 v stby in1 in2 pwm h-sw driver 1 uvlo standby tsd vcc gnd 4 9 6 7 pgnd2 o1 o1 vm1 14 15 o2 o2 5 vm2 8 pgnd1 11 pgnd4 10 pgnd3 17 vm4 16 vm3 control logic 20 18 19 2 3 13 pgnd6 12 pgnd5
TB6593FNG 2010-05-26 3 absolute maximum ratings (ta = 25c) operating ranges (ta = ? 20 to 85 c) characteristics symbol rating unit remarks vm 15 supply voltage vcc 6 v input voltage vin -0.2 to 6 v in1,in2,stby,pwm pins output voltage vout 15 v o1,o2 pins iout 1.2 3.2 tw = 10 ms, superimposed pulse, duty is 20 % or less. output current iout (peak) 4.5 a tw = 10 ms, single pulse 1.18 76.2 mm 114.3 mm 1.6 mm when it is packaged to the board made of glass-epoxy (cu 30 %). 0.96 50 mm 50 mm 1.6 mm when it is packaged to the board made of glass-epoxy (cu 40 %). power dissipation pd 0.71 w ic only operating temperature topr -20 to 85 c storage temperature tstg -55 to 150 c characteristics symbol min typ. max unit vcc 2.7 3 5.5 v supply voltage vm 2.5 5 13.5 v output current (h-sw) iout D D 1.0 a switching frequency fpwm D D 100 khz pd - ta 0.00 0.50 1.00 1.50 05 01 0 01 5 0 ta () (w) icgj-a=176/w ?g?r pcbe 50501.6mm cu eR40% ?g?r pcbe 76.2114.31.6mm cu eR30% ic only mounted on glass-epoxy board, (50 mm 50 mm 1.6 mm, cu film area 40 %) mounted on glass-epoxy board, (76.2 mm 114.3 mm 1.6 mm, cu film area 30 %) p d - ta power dissipation p d (w) ambient tem p erature ta ( )
TB6593FNG 2010-05-26 4 h-sw control function input output in1 in2 pwm stby out1 out2 mode h h h/l h l l short break h h l h ccw l h l h l l short break h h h l cw h l l h l l short break l l h/l h off (high impedance) stop h/l h/l h/l l off (high impedance) standby h-sw operating description ? to prevent penetrating current, dead time t2 and t4 300 ns designed value is provided in switching to each mode in the ic. v m v m v m m v m gnd t5 m v m gnd t4 m gnd m gnd t3 m gnd t2 t1 out2 out1 out1 out1 out1 out1 out2 out2 out2 out2 gnd vm out1 voltage wave t1 t2 t3 t5 t4
TB6593FNG 2010-05-26 5 electrical characteristics (unless otherwise specified, vcc = 3 v, vm = 5 v, ta = 25c) characteristics symbol test condition min typ. max unit icc stby = vcc D 0.9 1.2 ma icc(stb) D D 1 supply current im(stb) stby = 0 v D D 1 a vih 2 D vcc+0.2 control input voltage vil -0.2 D 0.8 v iih vin = 3 v 5 15 25 control input current iil vin = 0 v D D 1 a vih(stb) 2 D vcc+0.2 standby input voltage vil(stb) -0.2 D 0.8 v iih(stb) vin = 3 v 5 15 25 standby input current iil(stb) vin = 0 v D D 1 a output saturating voltage vsat(u+l) io = 1 a D 0.35 0.5 v il(u) vm = vout = 15 v D D 1 output leakage current il(l) vm = 15 v, vout = 0 v -1 D D a vf(u) D 1 1.1 regenerative diode vf vf(l) if = 1 a D 1 1.1 v low voltage detecting voltage uvld D 2.0 D recovering voltage uvlc (designed value) D 2.2 D v thermal shutdown circuit operating temperature tsd D 170 D thermal shutdown hysteresis tsd (designed value) D 20 D c
TB6593FNG 2010-05-26 6 typical application diagram note: bypass capacitors (c1, c2, c3, and c4) should be connected as close as possible to the ic. +2.7v 5.5v +2.5v 13.5v + c1 10uf c2 0.1uf m mcu stby in1 in2 pwm h-sw driver 1 uvlo standby tsd vcc gnd 4 9 6 7 pgnd2 o1 o1 vm1 14 15 o2 o2 5 vm2 8 pgnd1 11 pgnd4 10 pgnd3 17 vm4 16 vm3 control logic 20 18 19 2 3 13 pgnd6 12 pgnd5 + c3 10uf c4 0.1uf to to
TB6593FNG 2010-05-26 7 package dimensions weight: 0.09 g (typ.)
TB6593FNG 2010-05-26 8 notes on contents 1. block diagrams some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. 2. equivalent circuits the equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 3. timing charts timing charts may be simplified for explanatory purposes. 4. application circuits the application circuits shown in this document are provided for reference purposes only. thorough evaluation is required, especially at the mass production design stage. toshiba does not grant any license to any industrial property rights by providing these examples of application circuits. 5. test circuits components in the test circuits are used only to obtain and confirm the device characteristics. these components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment. ic usage considerations notes on handling of ics [1] the absolute maximum ratings of a semiconductor de vice are a set of ratings that must not be exceeded, even for a moment. do not exceed any of these ratings. exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. [2] use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or ic fa ilure. the ic will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, caus ing a large current to continuously flow and the breakdown can lead smoke or ignition. to minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse ca pacity, fusing time and in sertion circuit location, are required. [3] if your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power on or the negative current resulting from the back electromotive force at power off. ic breakdown may cause injury, smoke or ignition. use a stable power supply with ics with built-in protection functions. if the power supply is unstable, the protection function may not operate, causing ic breakdown. ic breakdown may cause injury, smoke or ignition. [4] do not insert devices in the wrong orientation or incorrectly. make sure that the positive and negative terminals of power supplies are connected properly. otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. in addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time.
TB6593FNG 2010-05-26 9 points to remember on handling of ics (1) thermal shutdown circuit thermal shutdown circuits do not necessarily prot ect ics under all circumstances. if the thermal shutdown circuits operate against the over temperature, clear the heat generation status immediately. depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the thermal shutdown circuit to not operate properly or ic breakdown before operation. (2) heat radiation design in using an ic with large current flow such as power amp, regulator or dr iver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (t j ) at any time and condition. these ics generate heat even during normal use. an inadequate ic heat radiation design can lead to decrease in ic life, de terioration of ic characteristics or ic breakdown. in addition, please design the device taking into considerate the effect of ic heat radiation with peripheral components. (3) back-emf when a motor rotates in the reverse direction, stop s or slows down abruptly, a current flow back to the motor?s power supply due to the effect of back-emf. if the current sink capability of the power supply is small, the device?s motor power supply and output pins might be exposed to conditions beyond maximum ratings. to avoid this problem, take the effect of back-emf into consideration in system design.
TB6593FNG 2010-05-26 10 restrictions on product use ? toshiba corporation, and its subsidiaries and affiliates (collect ively ?toshiba?), reserve the right to make changes to the in formation in this document, and related hardware, software a nd systems (collectively ?product?) without notice. ? this document and any information herein may not be reproduc ed without prior written permission from toshiba. even with toshiba?s written permission, reproduc tion is permissible only if reproducti on is without alteration/omission. ? though toshiba works continually to improve product?s quality and reliability, product can malfunction or fail. customers are responsible for complying with safety standards and for prov iding adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a ma lfunction or failure of product could cause loss of human life, b odily injury or damage to property, including data loss or corruption. before customers use the product, create designs including the product, or incorporate the product into their own applications, cu stomers must also refer to and comply with (a) the latest versions of all relevant toshiba information, including without limitation, this document, the specifications, the data sheets and application notes for product and the precautions and condi tions set forth in the ?toshiba semiconductor reliability handbook? and (b) the instructions for the application with which the product will be us ed with or for. customers are solely responsible for all aspe cts of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this product in such design or applications; (b) eval uating and determining the applicability of any info rmation contained in this document, or in c harts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operatin g parameters for such designs and applications. toshiba assumes no liability for customers? product design or applications. ? product is intended for use in general el ectronics applications (e.g., computers, personal equipment, office equipment, measur ing equipment, industrial robots and home electroni cs appliances) or for specif ic applications as expre ssly stated in this document . product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality a nd/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or se rious public impact (?unintended use?). unintended use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic s ignaling equipment, equipment used to control combustions or explosions, safety dev ices, elevators and escalato rs, devices related to el ectric power, and equipment used in finance-related fields. do not use product for unintended use unless specifically permitted in thi s document. ? do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy product, whether in whole or in part. ? product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. ? the information contained herein is pres ented only as guidance for product use. no re sponsibility is assumed by toshiba for an y infringement of patents or any other intellectual property rights of third parties that may result from the use of product. no license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. ? a bsent a written signed agreement, except as provid ed in the relevant terms and conditions of sale for product, and to the maximum extent allowable by law, toshiba (1) assumes no liability whatsoever, including without limitation, indirect, co nsequential, special, or incidental damages or loss, including without limitation, loss of profit s, loss of opportunities, business interruption and loss of data, and (2) disclaims any and all express or implied warranties and conditions related to sale, use of product, or information, including warranties or conditions of merchantability, fitness for a particular purpose, accuracy of information, or noninfringement. ? do not use or otherwise make available product or related so ftware or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or m anufacturing of nuclear, chemical , or biological weapons or missi le technology products (mass destruction w eapons). product and related software and technology may be controlled under the japanese foreign exchange and foreign trade law and the u.s. expor t administration regulations. ex port and re-export of product or related software or technology are strictly prohibited exc ept in compliance with all applicable export laws and regulations. ? please contact your toshiba sales representative for details as to environmental matters such as the rohs compatibility of pro duct. please use product in compliance with all applicable laws and regula tions that regulate the inclusion or use of controlled subs tances, including without limitation, the eu rohs directive. toshiba assumes no liability for damages or losses occurring as a result o f noncompliance with applicable laws and regulations.
|
