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uln2803,04apg/afwg 2011-08-20 1 toshiba bipolar digital integrated cir cuit silicon monolithic uln2803apg,uln2803afw g,uln2804apg,uln2804afwg 8ch darlington sink driver the uln2803apg / afwg series are high ? voltage, high ? current darlington driver s comprised of eight npn darlington pairs. all units feature integral clamp diodes for switching inductive loads. applications include relay, hammer, lamp and display (led) drivers. features z output current (single output) 500 ma (max) z high sustaining voltage output 50 v (min) z output clamp diodes z inputs compatible with various types of logic. z package type ? apg : dip ? 18pin z package type ? afwg : sol ? 18pin pin connection (top view) type input base resistor designation uln2803apg / afwg 2.7 k ? ttl, 5 v cmos uln2804apg / afwg 10.5 k ? 6~15 v pmos, cmos uln2803apg uln2804apg uln2803afwg uln2804afwg weight dip18 ? p? 300 ? 2.54f : 1.478 g (typ.) sol18? p? 300 ? 1.27 : 0.48 g (typ.)
uln2803,04apg/afwg 2011-08-20 2 schematics (each driver) uln2803apg / afwg uln2804apg / afwg note: the input and output parasitic diodes cannot be used as clamp diodes. absolute maximum ratings (ta = 25c) characteristic symbol rating unit output sustaining voltage v ce (sus) ? 0.5 to 50 v output current i out 500 ma / ch input voltage v in ? 0.5 to 30 v clamp diode reverse voltage v r 50 v clamp diode forward current i f 500 ma apg 1.47 power dissipation afwg p d 0.92 / 1.31 (note) w operating temperature t opr ? 40 to 85 c storage temperature t stg ? 55 to 150 c note: on glass epoxy pcb (75 114 1.6 mm cu 20%)
uln2803,04apg/afwg 2011-08-20 3 recommended operating conditions (ta = ? 40~85c) characteristic symbol test condition min typ. max unit output sustaining voltage v ce (sus) 0 D 50 v t pw = 25 ms, duty = 10%, 8 circuits 0 D 347 apg t pw = 25 ms, duty = 50%, 8 circuits 0 D 123 t pw = 25 ms, duty = 10%, 8 circuits 0 D 268 output current afwg i out t pw = 25 ms, duty = 50%, 8 circuits 0 D 90 ma / ch input voltage v in 0 D 30 v uln2803a 2.5 D 30 input voltage (output on) uln2804a v in (on) 8 D 30 v clamp diode reverse voltage v r D D 50 v clamp diode forward current i f D D 400 ma apg ta = 85c D D 0.76 power dissipation afwg p d ta = 85c (note) D D 0.48 w note: on glass epoxy pcb (75 114 1.6 mm cu 20%)
uln2803,04apg/afwg 2011-08-20 4 electrical characteristics (ta = 25c) characteristic symbol test cir ? cuit test condition min typ. max unit v ce = 50 v ta = 25c D D 50 output leakage current v ce = 50 v ta = 85c D D 100 uln2804a i cex 1 v ce = 50 v v in = 1 v D D 500 a i out = 350 ma, i in = 500 a D 1.3 1.6 i out = 200 ma, i in = 350 a D 1.1 1.3 collector ? emitter saturation voltage vce (sat) 2 i out = 100 ma, i in = 250 a D 0.9 1.1 v uln2803a v in = 3.85 v D 0.93 1.35 v in = 5 v D 0.35 0.5 uln2804a i in (on) 2 v in = 12 v D 1.0 1.45 ma input current i in (off) 4 i out = 500 a, ta = 85c 50 65 D a v ce = 2 v, i out = 200 ma D D 2.4 v ce = 2 v, i out = 250 ma D D 2.7 uln2803a v ce = 2 v, i out = 300 ma D D 3.0 v ce = 2 v, i out = 125 ma D D 5.0 v ce = 2 v, i out = 200 ma D D 6.0 v ce = 2 v, i out = 275 ma D D 7.0 input voltage (output on) uln2804a v in (on) 5 v ce = 2 v, i out = 350 ma D D 8.0 v dc current transfer ratio h fe 2 v ce = 2 v, i out = 350 ma 1000 D D ta = 25c (note) D D 50 clamp diode reverse current i r 6 ta = 85c (note) D D 100 a clamp diode forward voltage v f 7 i f = 350 ma D D 2.0 v input capacitance c in D D 15 D pf turn ? on delay t on r l = 125 ? , v out = 50 v D 0.1 D turn ? off delay t off 8 r l = 125 ? , v out = 50 v D 0.2 D s note: v r = v r (max)
uln2803,04apg/afwg 2011-08-20 5 test circuit 1. i cex 2. v ce (sat), h fe 3. i in (on ) 4. i in (off) 5. v in (on) 6. i r 7. v f
uln2803,04apg/afwg 2011-08-20 6 8. t on , t off note 1: pulse width 50 s, duty cycle 10% output impedance 50 ? , t r 5 ns, t f 10 ns note 2: see below. input condition type number r1 v ih uln2803a 0 ? 3 v uln2804a 0 ? 8 v note 3: c l includes probe and jig capacitance precautions for using this ic does not integrate protection circuits such as overcurrent and overvoltage protectors. thus, if excess current or voltage is applied to the ic, the ic may be damaged. please design the ic so that excess current or voltage will not be applied to the ic. utmost care is necessary in the design of the output line, common and gnd line since ic may be destroyed due to short ? circuit between outputs, air contamination fault, or fault by improper grounding.
uln2803,04apg/afwg 2011-08-20 7
uln2803,04apg/afwg 2011-08-20 8
uln2803,04apg/afwg 2011-08-20 9 package dimensions dip18 ? p? 300 ? 2.54f unit: mm weight: 1.478 g (typ.)
uln2803,04apg/afwg 2011-08-20 10 package dimensions sol18? p? 300 ? 1.27 unit: mm weight: 0.48 g (typ.)
uln2803,04apg/afwg 2011-08-20 11 notes on contents 1. equivalent circuits the equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 2. test circuits components in the test circuits are used only to obtain and confirm the devi ce characteristics. these components and circuits are not guaranteed to prev ent malfunction or failure from occurring in the application equipment. ic usage considerations notes on handling of ics (1) the absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. do not exceed any of these ratings. exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. (2) use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or ic failure. the ic will fully break down when used under conditions that exceed its absolute maximum rating s, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large curren t to continuously flow and the breakdown can lead smoke or ignition. to minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. (3) if your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power on or the negati ve current resulting from the back electromotive force at power off. ic breakdown may cause in jury, smoke or ignition. use a stable power supply with ics with built-in protec tion functions. if the power supply is unstable, the protection function may not operate, causing ic breakdown. ic breakdown may cause injury, smoke or ignition. (4) do not insert devices in the wrong orientation or incorrectly. make sure that the positive and negative term inals of power supplies are connected properly. otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. in addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time. (5) carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, power amp and regulator. if there is a large amount of leakage current such as input or negative feedback condenser, the ic output dc voltage will increase. if this output voltage is connected to a speaker with low input withstand voltage, overcurrent or ic failure can ca use smoke or ignition. (the over current can cause smoke or ignition from the ic itself.) in particular, please pay attention when using a bridge tied load (btl) connection type ic that inputs output dc voltage to a speaker directly.
uln2803,04apg/afwg 2011-08-20 12 points to remember on handling of ics (1) heat radiation design in using an ic with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (tj) at any time and condition. these ics generate heat ev en during normal use. an inadequate ic heat radiation design can lead to decrease in ic life, dete rioration of ic characterist ics or ic breakdown. in addition, please design the device taking into co nsiderate the effect of ic heat radiation with peripheral components. (2) back-emf when a motor rotates in the reverse direction, stop s or slows down abruptly, a current flow back to the motor?s power supply due to the effect of back- emf. if the current sink capability of the power supply is small, the device?s motor power supply an d output pins might be exposed to conditions beyond absolute maximum ratings. to avoid this problem, take the effect of back-emf into consideration in system design. about solderability, following conditions were confirmed ? solderability (1) use of sn-37pb solder bath solder bath temperature = 230c dipping time = 5 seconds the number of times = once use of r-type flux (2) use of sn-3.0ag-0 .5cu solder bath solder bath temperature = 245c dipping time = 5 seconds the number of times = once use of r-type flux
uln2803,04apg/afwg 2011-08-20 13 restrictions on product use ? toshiba corporation, and its subsidiaries and affiliates (collect ively ?toshiba?), reserve the right to make changes to the in formation in this document, and related hardware, software a nd systems (collectively ?product?) without notice. ? this document and any information herein may not be reproduc ed without prior written permission from toshiba. even with toshiba?s written permission, reproduc tion is permissible only if reproducti on is without alteration/omission. ? though toshiba works continually to improve product?s quality and reliability, product can malfunction or fail. customers are responsible for complying with safety standards and for prov iding adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a ma lfunction or failure of product could cause loss of human life, b odily injury or damage to property, including data loss or corruption. before customers use the product, create designs including the product, or incorporate the product into their own applications, cu stomers must also refer to and comply with (a) the latest versions of all relevant toshiba information, including without limitation, this document, the specifications, the data sheets and application notes for product and the precautions and condi tions set forth in the ?toshiba semiconductor reliability handbook? and (b) the instructions for the application with which the product will be us ed with or for. customers are solely responsible for all aspe cts of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this product in such design or applications; (b) eval uating and determining the applicability of any info rmation contained in this document, or in c harts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operatin g parameters for such designs and applications. toshiba assumes no liability for customers? product design or applications. ? product is intended for use in general el ectronics applications (e.g., computers, personal equipment, office equipment, measur ing equipment, industrial robots and home electroni cs appliances) or for specif ic applications as expre ssly stated in this document . product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality a nd/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or se rious public impact (?unintended use?). unintended use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic s ignaling equipment, equipment used to control combustions or explosions, safety dev ices, elevators and escalato rs, devices related to el ectric power, and equipment used in finance-related fields. do not use product for unintended use unless specifically permitted in thi s document. ? do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy product, whether in whole or in part. ? product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. ? the information contained herein is pres ented only as guidance for product use. no re sponsibility is assumed by toshiba for an y infringement of patents or any other intellectual property rights of third parties that may result from the use of product. no license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. ? a bsent a written signed agreement, except as provid ed in the relevant terms and conditions of sale for product, and to the maximum extent allowable by law, toshiba (1) assumes no liability whatsoever, including without limitation, indirect, co nsequential, special, or incidental damages or loss, including without limitation, loss of profit s, loss of opportunities, business interruption and loss of data, and (2) disclaims any and all express or implied warranties and conditions related to sale, use of product, or information, including warranties or conditions of merchantability, fitness for a particular purpose, accuracy of information, or noninfringement. ? do not use or otherwise make available product or related so ftware or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or m anufacturing of nuclear, chemical , or biological weapons or missi le technology products (mass destruction w eapons). product and related software and technology may be controlled under the japanese foreign exchange and foreign trade law and the u.s. expor t administration regulations. ex port and re-export of product or related software or technology are strictly prohibited exc ept in compliance with all applicable export laws and regulations. ? please contact your toshiba sales representative for details as to environmental matters such as the rohs compatibility of pro duct. please use product in compliance with all applicable laws and regula tions that regulate the inclusion or use of controlled subs tances, including without limitation, the eu rohs directive. toshiba assumes no liability for damages or losses occurring as a result o f noncompliance with applicable laws and regulations.

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