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rev 1.1 3/13 copyright ? 2013 by silicon laboratories si4012 si4012 si4012 c rystal - less fsk/ook rf t ransmitter features applications description silicon laboratories? si4012 is a fully-i ntegrated crystalless cmos high-data-rate rf transmitter designed for the sub-ghz ism band. this chip is optimized for battery powered applications requirin g low standby currents and high output transmit power. the device offers advanced radio features including continuous frequency coverage from 27?960 mhz, adjustable output power of up to +10 dbm, and data rates up to 100 kbaud in fsk mode. the si4012?s high level of integration offers reduced bom cost while simpli fying overall system design. functional block diagram ? frequency range ?? 27?960 mhz ? output power range ?? ?13 to +10 dbm ? low power consumption ?? ook 14.2ma @ +10dbm ?? fsk 19.8ma @ +10dbm ? data rate: ?? up to 100 kbaud fsk ?? up to 50 kbaud ook ? fsk and ook modulation ? power supply = 1.8 to 3.6 v ? automatic antenna tuning ? programmable ramp rate ? crystal-less operation ?? 150 ppm: 0 to 70 c ?? 250 ppm: ?40 to 85 c ?? optional crystal input for applications requiring tighter tolerances ? ultra low standby current <10 na ? integrated voltage regulator ? 255 byte fifo ? low battery detector ? smbus interface ? ?40 to +85 c temperature range ? 10-pin msop package, rohs compliant ? low bom ? wireless mbus t1-mode ? remote control ? home security & alarm ? personal data logging ? toy control ? wireless pc peripherals ? remote meter reading ? remote keyless entry ? home automation ? industrial control ? sensor networks ? health monitors si4012 xtal led lcosc pa divider xtal osc auto tune fsk ook lposc ldo por bandgap va vd txp txm vdd gnd rf analog core antenna tune modulator smbus interface digital logic tx 255 byte data fifo register bank digital controller battery monitor host mcu patents pending ordering information: see page 43. pin assignments 2 3 6 7 8 4 5 9scl sdn nirq led vdd xtal txp gnd txm 1 10 sda si4012 si4012
si4012 2 rev 1.1
si4012 rev 1.1 3 t able of c ontents section page 1. electrical specificat ions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 1.1. definition of test conditi ons . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 2. typical application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 3. functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 4. host mcu interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 4.1. smbus interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 4.2. smbus flow control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 4.3. host interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 4.4. operating mode control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 5. command structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 5.1. commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 7 5.2. properties . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 5.3. error codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41 6. pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 7. ordering guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 8. package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 9. land pattern: 10-pin msop . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 10. top marking: 10-pin msop . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 document change list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 contact information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50
si4012 4 rev 1.1 1. electrical specifications table 1. recommended operating conditions 1 parameter symbol test condition min typ max unit supply voltage v dd 1.8 ? 3.6 v supply voltage slew rate initial battery insertion 2 20 ? 650 mv/ us input voltage digital input signals ?0.3 ? v dd + 0.3 v notes: 1. all specifications guaranteed by production test unless otherwise noted. prod uction test conditions and max limits are listed in "1.1. definition of test conditions" on page 7. 2. recommend bypass capacitor = 1 f; slew rate measured 1 v < v dd ,< 1.7 v. table 2. dc characteristics* parameter symbol conditions min typ max units power saving modes i shutdown lowest current mode ? 10 ? na i idle register values retained, lowest current consumption idle mode ?600?a tx mode current @ 10 dbm i tx_ook ook, manchester encoded ? 14.2 ? ma i tx_fsk fsk ? 19.8 ? ma *note: all specifications guaranteed by production test unless othe rwise noted. production test conditions and max limits are listed in "1.1. definition of test conditions" on page 7.
si4012 rev 1.1 5 table 3. si4012 rf transmitter characteristics 1 (ta = 25 c, vdd = 3.3 v, rl = 550 ? , unless otherwise noted) parameter test condition min typ max unit frequency range (f rf ) 2 27 ? 960 mhz frequency noise (rms) 3 allen deviation, measured across 1ms interval ?0.3 ?ppm phase noise @ 915 mhz 10 khz offset ? ?70 ? dbc/hz 100 khz offset ? ?100 ? dbc/hz 1 mhz offset ? ?105 ? dbc/hz frequency tuning time ? 5 ? ms carrier frequency accuracy 0 c t a 70 c ?150 +150 ppm ?40 c t a 85 c ?250 +250 ppm frequency error contribution with external crystal ?10 ? +10 ppm transmit power 4 maximum programmed tx power, with optimum differential load, v dd > 2.2 v ? 10 ? dbm minimum programmed tx power, with optimum differential load, v dd > 2.2 v ? ?13 ? dbm power variation vs temp and supply, with optimum differential load, v dd >2.2v ?1.0 ? 0.5 db power variation vs temp and supply, with optimum differential load, v dd >1.8v ?2.5 ? 0.5 db transmit power step size from ?13 to 6.5 dbm ?0.25 ? db pa edge ramp rate programmable range ook mode 0.34 ? 10.7 us data rate ook 0.1 ? 50 kbaud fsk 0.1 ? 100 kbaud fsk deviation max frequency deviation ? 275 ? ppm deviation resolution ? 2 ? ppm deviation accuracy (4 ppm + 2% pk-pk target fsk deviation in ppm) ppm ook modulation depth 60 ? ? db antenna tuning capacitive range (differential) 315 mhz 2.4 ? 12.5 pf notes: 1. all specifications guaranteed by producti on test unless otherwise noted. production test conditions and max limits are listed in "1.1. definition of test conditions" on page 7. 2. the frequency range is continuo us over the specified range. 3. the frequency step size is limited by the frequency noise. 4. optimum differential load is equal to 4 v/(11.5 ma/2 x 4/pi) = 550 ??? therefore the antenna load resistance in parallel with the si4012 differential output resistance should equal 600 ??
si4012 6 rev 1.1 table 4. low battery detector characteristics* (ta = 25 c, vdd = 3.3 v, rl = 550 ? , unless otherwise noted) parameter test condition min typ max unit battery voltage measur ement accuracy ? 2 ? % *note: all specifications guaranteed by production test unless otherwise noted. prod uction test conditions and max limits are listed in "1.1. definition of test conditions" on page 7. table 5. optional crystal oscillator characteristics* (ta = 25 c, vdd = 3.3 v, rl = 600 ? , unless otherwise noted) parameter test condition min typ max unit crystal frequency range 10 ? 13 mhz input capacitance (gpio0) gpio0 conf igured as a crystal oscillator; xo_lowcap=1 ?3 ? pf gpio0 configured as a crystal oscillator; xo_lowcap=0 ?5.5 ? pf crystal esr gpio0 configured as a crystal oscillator; xo_lowcap=1 ??120 ? gpio0 configured as a crystal oscillator; xo_lowcap=0 ?? 80 ? start-up time crystal oscillator only, 60 mh motional arm inductance ?9 50ms *note: all specifications guaranteed by producti on test unless otherwise noted. producti on test conditions and max limits are listed in "1.1. definition of test conditions" on page 7. table 6. thermal conditions parameter symbol value unit ambient temperature t a ?40 to 85 ? c junction temperature t op ?40 to 90 ? c storage temperature t stg ?55 to 125 ? c table 7. absolute maximum ratings 1,2 parameter symbol value unit supply voltage v dd ?0.5 to 3.9 v input current 3 i in 10 ma input voltage 4 v in ?0.3 to (v dd + 0.3) v notes: 1. permanent device damage may occur if the absolute maximum ratings are exceeded. functional operation should be restricted to the conditions as specified in the operational sections of this data shee t. exposure beyond recommended operating conditions for extended periods may affect device reliability. 2. handling and assembly of these devices should only be done at esd-protected workstations. 3. all input pins besides v dd . 4. for gpio pins configured as inputs.
si4012 rev 1.1 7 1.1. definition of test conditions production test conditions: ? t a =+25c . ? v dd =+3.3vdc. ? tx output power measured at 100 mhz. ? all rf output levels referr ed to the pins of the si4012 (not the rf module). qualification test conditions: ? t a = ?40 to +85 c . ? v dd = +1.8 to +3.6 vdc. ? all rf output levels referr ed to the pins of the si4012 (not the rf module).
si4012 8 rev 1.1 2. typical application schematic notes: 1. the si4012 has internal 50 k ? pull-up resistors. additional optional external pull-up resistors may be added should the board design required it. 2. see note about how to choose the value of c3 in "5.2.10. property: xo_config" on page 39. vdd xtal txp gnd txm si4012 1 2 3 4 5 optional c3 x1 c2 cr2032 coin cell 1.8 to 3.6 v loop antenna c1 scl sdn nirq led sda 10 9 8 7 6 host mcu d1 r1 r2 see note 1 1 f see note 2
si4012 rev 1.1 9 3. functional description figure 1. si4012 functional block diagram the si4012 is a fully-integrated, crystal-less, sub-gh z cmos rf transmitter offering industry-leading rf performance, high int egration, flexibility, low bom, sma ll board area, and ease of design. the device is designed to operate with any host mcu vi a a serial interface while optimized for battery-powered applications. the si4012 operates from voltages ranging fr om 1.8 to 3.6 v and offers an ultra-low standby current consumption of less than 10 na. the embedded power amplifier can be programmed to supply from ?13 dbm up to +10 dbm, while the patented automatic antenna tuning circuit ensures that the reso nant frequency and impedance matching between the pa output and the connected antenna are configured for optimum transmit efficiency and low harmonic content. users may configure the device for either fsk or ook modu lation with supported symbol rates of up to 100 kbps. to ensure the lowest system cost, the si4012 can be us ed without an external crystal or frequency reference by leveraging silicon labs' pat ented and proven crystal-less os cillator technology. this tech nology offers better than 150 ppm carrier frequency stability over the temperature range of 0 to +70 c and 250 ppm carrier frequency stability over the industrial temperatur e range of ?40 to + 85 c. no production alignments are necessary since all rf functions are integrated into the device. si4012 xtal led lcosc pa divider xtal osc auto tune fsk ook lposc ldo por bandgap va vd txp txm vdd gnd rf analog core antenna tune modulator smbus interface digital logic tx 255 byte data fifo register bank digital controller battery monitor host mcu
si4012 10 rev 1.1 4. host mcu interface 4.1. smbus interface the smbus interface is implemented as a bidirectional 2-wire interface (scl, sda) with the host configured as master and the si4012 configured as slave. both standa rd (100 kbps) and fast (400 kbps) modes are supported with 7-bit addressing. the default device add ress is 1110000x, where x is the r/w bit. 4.1.1. design recommendation in designs with multiple smbus devices, it is recommended to use separate smbus buses where possible since all attached smbus devices will wake on bus tr affic to confirm a ddress. this process can le ad to better battery life compared to systems wit h single-bus designs. 4.2. smbus flow control the scl and sda pins are configured as open drain requiring external pull-up resistors. flow control is implemented using the open drain configuration as shown below. figure 2. write operation from master to slave the data (sda) pin never changes when scl = 1 during bit da ta transfers. if it changes, it indicates a start or stop condition generated by the mast er/host. after the start condition, a 7-bit address is sent to the si4012/slave by the host/master, followed by a single bit determining what is going to drive sda (i.e., a write or read operation). for a write operation, the master driv es the following sda bits, an d the slave sends ack/nak bits. for a read operation, the slave drives the da ta bits, and the master responds with ack/nack. figure 2 shows a write operation from master to slave. shortly after the r/w bit is received, the slave device holds the scl line low (blue line), thus stalling the master. the master will detect when scl is released by the slave and will clock in the ack/nack bit from the slav e (ack shown above). by this, the slave (si4012) can service each incoming byte and manage flow control to the host. 4.3. host interrupts an nirq line from the si4012 to the host is used to issu e interrupts to the host. the host can then read the interrupt status and clear interrupts from the si4012 via the smbus interface.
si4012 rev 1.1 11 4.4. operating mode control figure 3. state machine diagram transition notes 1. transition to any state (including shutdown) using the change_state command. alternatively, transition to shutdown using the sdn pin. 2. if a change_state command to the xo tu ne state is issued (even if already in the xo tune state), then an xo tune operation is carried out immediately. this enables cl ose control of timing (fastest execution) for a subsequent tx_start command. in the tune state, a tune operation is carried out in the interval specified in tune_interval. 3. transition to end state specified in th e tx_start command or tx_stop command. 4. if coming out of the shutdown via smbus, an smbus ?wake- up? byte is required. this byte is discarded, and normal smbus communication can proceed after the power on reset (ipor) is asserted to the host. state descriptions the si4012 has six power modes, which are summarized below. further details on the ic configuration in these modes can be found in "5.1.5. command: change_state" on page 22. ? shutdown ?lowest current consumption; the majority of hardware blocks are powered down. ? standby ?low power state with fast smbus response. ? sensor ?same as standby, but the battery is measured periodically. ? tune ?periodic tuning state. a tune is performed on any change_state to tune command and then periodically based on the interval defined in tune_interval. this provides faster transition to tx. if xo is enabled, xo will be used during tune operation. ? tx ?transmission state. tune with xo 5 sdn=1? standby 2 tx 6 sensor 3 note1, 2 tune without xo 4 xo in chip_config? yes no note1 note1 note1 note1, 3 shutdown 1 smbus or sdn (note 4) yes change_state change_state / tx_start tx_start tx_start no
si4012 12 rev 1.1 table 8. power modes mode circuit blocks i vdd response time to tx (without xo) response time to tx (with xo early enable) digital ldo smbus sys clk lbd lc xtal div pa shut- down off off off off off off off off 10 na 22.2 ms 22.2 ms standby on on slow off off off off off 600 a 3 6.6 ms 6.6 ms 4 sensor on fast on off off off off 610 a 3 6.6 ms 6.6 ms 4 tune without xo on fast off on 1 off on 1 on 1 note 2 370 s ? tune with xo on fast off on 1 on on 1 on 1 note 2 ?370s notes: 1. the lc, div, and pa are turned on as needed during the tune operation. 2. see the tune section from tune start to pa tune in the charts below for current consumption in tune with xo and tune without xo. 3. the current consumption at standby and sensor does not incl ude the power consumed by the internal xo circuitry. xo should be turned off with set_property/chip_config to save power if external xo is not used or if tuning is not happening soon when external xo is present. 4. the response time assumes external xo stays enabled prior to tx.
si4012 rev 1.1 13 figure 4. current consumption with xo figure 5. current consumption with xo (upscaled between 30 and 80 ms)
si4012 14 rev 1.1 figure 6. current consumption without xo figure 7. current consumption without xo (upscaled between 30 and 80 ms)
si4012 rev 1.1 15 5. command structure the si4012 has been designed to complete commands in th e shortest time possible and to support both polled or event driven (interrupt based) modes. for longer op erations, commands are implemented as launch commands. when the result of the launched comma nd is completed, status is returned to the host via host polling or as an interrupt (if enabled). the status is obtained over the smbus. for example, when a tx_start comma nd is launched, the si40 12 will parse the command, check it for errors, and return the status to the host immediately; it will also start the tx process. the host can then either poll for an error or ?packet sent? or receive an interrupt on nirq. all host commands consist of a 1-byte opcode followed by 0 or more arguments. all responses from the si4012 consist of a 1-byte top level status followed by 0 or more data values. command structure: response structure: a cts (clear to send) indicates that the si4012 has received the command and that the host can send another command. the cts does not necessarily mean the command has been processed. the host should poll interrupt status or use interrupts (nirq) to get execution status for deferred operations. err[6:0] indicates an error has occurred if it is non-zero. see the ?error codes? section for a full list of available error codes. bit 76543210 cmd arg1 arg2 ? argn bit 76543210 status cts err[6:0] data1 data2 ? datan
si4012 16 rev 1.1 figure 8. smbus sequence example figure 8 above demonstrates two exampl es using the smbus command sequence. s = start w = write (1bit) r = read (1bit) a = acknowledge n = not-acknowledge p = stop w s a a sla cmd arg1 arg2 sla status a s r a n p tx_stop command w s a a sla cmd data1 sla status s r a n p sla = slave address (7 bits) cmd = command opcode (8bit) arg = command argument (8bit) data = data value (8bit) status = top level status (8bit) get_int_status command a a underlined items are sent from the si4012 (slave) p sla status s r a n p p
si4012 rev 1.1 17 5.1. commands table 9 lists the commands available via the smbus and described in the following sections. table 9. commands available via smbus section command description 5.1.1 get_rev device revision information 5.1.2 set_property sets device properties 5.1.3 get_property gets device properties 5.1.4 led_ctrl led control 5.1.5 change_state configures device mode 5.1.6 get_state get device mode 5.1.7 tx_start start data transmission 5.1.8 set_int enable interrupts 5.1.9 get_int_status read & clear interrupts 5.1.10 init_fifo clears tx fifo 5.1.11 set_fifo stores data in fifo for tx 5.1.12 tx_stop stops transmission 5.1.13 get_bat_status gets battery status
si4012 18 rev 1.1 5.1.1. comma nd: get_rev purpose: return product and revision information for the device. arg: none data: product id, revision id. command: response: get_rev command 76543210 cmd 0x10 get_rev reply 76543210 status cts err data1 prodid[31:24] data2 prodid[23:16] data3 prodid[15:8] data4 prodid[7:0] data5 revisionid_rmidu[47:40] data6 revisionid_rmidu[39:32] data7 revisionid_rmidl[31:24] data8 revisionid_rvid[23:16] data9 revisionid_fwidu[15:8] data10 revisionid_fwidl[7:0]
si4012 rev 1.1 19 5.1.2. command: set_property purpose: set a property common to one or more commands. these are similar to parameters for a command but are not expected to change fr equently and may be controlled by the higher software layers. setting properties may not cause the device to take immediate action, however the prop erty will take effect once a command which uses it is issued. see the ?properties? section of this document for details on properties. arg: prop_id[7:0]? selects the property to set. data[n:0]?value of the property. the length varies depending on the prop_id, up to 6-byte in big endian can be specified. data: none command: response: set_property command 7654321 0 cmd 0x11 arg1 prop_id[7:0] arg2 prop_data1, msb of property 's value arg3 prop_data 2 arg4 prop_data 3 arg5 prop_data 4 arg6 prop_data5 arg7 prop_data6 set_property reply 7 6 543210 status cts err
si4012 20 rev 1.1 5.1.3. command: get_property purpose: return the value of a specified property. see "5.2. properties" on page 32 for details on properties. arg: prop_id[7:0]?selects th e property to retrieve. data: data[n:0] ?value of the specified property , the length varies depending on the prop_id, up to 6 bytes command: response: get_property command 76543210 cmd 0x12 arg1 prop_id[7:0] get_property reply 7 6 5 4321 0 status cts err data1 prop_data1, msb of property's value data2 prop_data 2 data3 prop_data 3 data4 prop_data 4 data5 prop_data5 data6 prop_data6
si4012 rev 1.1 21 5.1.4. comma nd: led_ctrl purpose: turn on/off led if led driver is enabled. arg: ledon?if led driver is enabled, turn led on if se t, otherwise, turn led off. if led driver is not enabled, ledon is ignored if set. data: none command: response: notes: if ledon is set, the si4012 checks the ledintensity setting set by the host in set_property/led_intensity. if the ledintensity is 0, led driver will be disabled. err is set to 0x0a to report this condition. led_ctrl command 7654321 0 cmd 0x13 arg1 ledon led_ctrl reply 7 6 54321 0 status cts err
si4012 22 rev 1.1 5.1.5. command: change_state purpose: change state to idle or shutdown. the devi ce will change to the s pecified state at the earliest time possible. if chan ging into idle state, arg2 specifies the idle mode. arg: ? state[1:0]?state to transition to. 00 idle ? go to idle mode state using the idle mode specified. 01 shutdown ? go to shutdown state. 10?11 ? reserved. ? idlemode[2:0]?idle mode if changing to idle state. 000 standby ? low power state 001 sensor ? enable low battery detector 010 tune ? periodic tuning 011?111 ? reserved data: none table 10. mode circuit blocks i vdd response time to tx (without xo) response time to tx (with xo early enable) digital ldo smbus sys clk lbd lc xtal div pa shut- down off off off off off off off off 15 na 22.2 ms 22.2 ms standby on on slow off off off off off 600 a 3 6.6 ms 6.6 ms 4 sensor on fast on off off off off 610 a 3 6.6 ms 6.6 ms 4 tune without xo on fast off on 1 off on 1 on 1 note 2 370 s ? tune with xo on fast off on 1 on on 1 on 1 note 2 ?370s notes: 1. the lc, div and pa are turned on as needed during the tune operation. 2. see the tune section from tune start to pa tune in the charts below for current consumption in tune with xo and tune without xo. 3. the current consumption at standby and sensor does not incl ude the power consumed by the internal xo circuitry. xo should be turned off with set_property/chip_config to save power if external xo is not used or if tuning is not happening soon when external xo is present. 4. the response time assumes external xo stays enabled prior to tx.
si4012 rev 1.1 23 command: response: : none if changing to shutdown, otherwise notes: 1. changing state among different idle modes is allowed. 2. state can also be changed via tx_start/tx_stop. 3. an alternative way to tran sition to shutdown is by setting sdn pin to high. 4. smbus activity or setting sdn pin to low will take the device out of shut down state. change_state command 76543 2 1 0 cmd 0x60 arg1 state[1:0] arg2 idlemode[2:0] change_state reply 7 6 54321 0 status cts err
si4012 24 rev 1.1 5.1.6. command: get_state purpose: get chip state and status. arg: none data: ? state[1:0]?current state 00 idle 01 reserved 10 tx ? autotx?current autotx setting ? idlemode[2:0]. if state is idle 000 standby ? low power state 001 sensor ? enable low battery detector 010 tune ? periodic tuning ? dtmod[1:0] if state is tx 00 ? fifo mode 01 ? cw mode 10 ? pn9-0 mode 11 ? pn9-1 mode ? acttxpktsize?actual packet se nt in the last transmission ? preverror ?error code if error occurred in the previous operation command: response: get_state command 76543 2 10 cmd 0x61 get_state 7 6 5 4 3 2 1 0 status cts err data1 autotx state[1:0] data2 idlemode[2:0]/dtmod[1:0] data3 acttxpktsize[15:8] data4 acttxpktsize[7:0] data5 preverror
si4012 rev 1.1 25 5.1.7. command: tx_start purpose: start transmission and go to a designated state after the packet is transmitted. this is an asynchronous operation. transmission may not have been started when response is sent back the host. arg: ? packet size[15:0] to be transmitted ? state to transition to wh en transmission is completed. ? autotx?enable/disable fifo auto-tx 1: auto-transmit enabled. transmission will start when the fifo level reaches the aut o transmit threshold specified in ffautotxthr in fifo_threshold. if ffautotxthr=0, transmission will start immediately. 0:auto-transmit disabled. transmit will start immediately until th e data specified in the packetsize is transmitted, or all the data in the fifo is exhausted, whichever occurs first. if the fifo becomes empty before the specified packet length is transmitted a fifo underflow error will occur. ? state[1:0]?state to transition to when transmission is completed. 00: idle?go to idle state when the packe t transmission complete s based on the idle mode. 01: shutdown?go to shutdown state wh en the packet transmission completes. 10?11: reserved. ? idlemode[2:0] if state is idle ; dtmod[1:0] if state is tx. idle mode 000 standby ? low power state 001 sensor ? enable low battery detector 010 tune ? periodic tuning ? dtmod[1:0] 00 ? fifo mode 01 ? cw mode 10 ? pn9-0 mode 11 ? pn9-1 mode data: current data size in the fifo when tx_start is received. command: tx_start command 7 654 3 2 1 0 cmd 0x62 arg1 packetsize[15:8] arg2 packetsize[7:0] arg3 autotx state[1:0] arg4 idlemode[2:0] arg5 dtmod[1:0]
si4012 26 rev 1.1 response: notes: si4012 allows larger packet sizes than the fifo. it also allows the packet size to be greater than the data available in the fifo. ? if the packet size is less than the data stored in the fifo, the data specified in packet size will be transmitted in one transm ission leaving leftover data in the fifo . the size to be transmitted will be specified in the data field. ? if the packet size is larger than t he data stored in the fifo size, when tx_start is received, all the data in the fifo will be transm itted. the size of the data curr ently available in the fifo will be specified in the data field. if auto transmit is enabled, the si4012 will auto matically transmit data when the tx fifo level reaches the auto transmi t level dictated by ffautotxthr without another explicit tx_start until the data specified in packet size is all transmitted. an interrupt is triggered with pksent set in the interrupt status. autotx state will be cleared when packet is successfully transmitted or fifo unde rflow has happened. if auto transmit is not enabled, the si4012 will start transmitting what?s available in the fifo until fifo becomes empty. the host is responsible for keeping fifo from underflow by supplying the ba lance of the data needed for the packet size. ? if the packet size equals to the data stored in the fifo size, all the data in the fifo will be transmitted, actualdatasize will be equal to the packet size. the host should poll ipksent using get_int_status to check when the packet has been sent, or monitor the pksent interrupt. tx_start reply 7 6 543210 status cts err data1 actualdatasize[7:0]
si4012 rev 1.1 27 5.1.8. command: set_int purpose: enable interrupts. arg: ? enffunder?enable fifo underflow ? entxffafull?enable tx fifo almost full ? entxffaem?enable tx fifo almost empty ? enffover?enable fifo overflow ? enpksent?enable packet sent ? enlbd?enable low battery detect data: none command: response: set_int command 76543210 cmd 0x63 arg1 enffunder entxffafull entxffaem en ffover enpksent enlbd entune reserved set_int reply 76 5 43210 status cts err
si4012 28 rev 1.1 5.1.9. command: get_int_status purpose: read the interrupt status and clear interrupts. arg: none data: ? iffunder?fifo underflow ? itxffafull?tx fifo almost full ? itxffaem?tx fifo almost empty ? iffover?fifo overflow ? ipksent?packet sent ? ilbd?low battery detect ? itune?tune complete ? ipor?power on reset command: response: notes: calling the get_int_status command will clear all interrupts and reset the nirq pin. therefore, the host must note any interrupt bits that are set and take the necessary actions to service these interrupts. tx fifo almost full and tx fifo almost empty interrupts these interrupts are triggered upon transition at the respecti ve thresholds. therefore, if an interrupt is generated for fifo almost empty and then cleared by a call to get_int_ status, another interrupt will not be generated if the fifo remains below the almost empty threshol d. the fifo must go above the threshold and then fall back to the threshold before another almost empty threshold is generated and sent to the host. low battery detect (lbd) interrupt the lbd is cleared when the host calls get_int_status. the si4012 regenerates lbd interrupts periodically when the lbd timer expires. get_int_status command 76543210 cmd 0x64 get_int_status reply 76543210 status cts err data1 iffunder itxffafull itxf- faem iffover ipksent ilbd itune ipor
si4012 rev 1.1 29 5.1.10. command: init_fifo purpose: clear the tx fifo by clearing the fifo with 0s and initializing the fifo head and tail pointer arg: none data: none command: response: 5.1.11. command: set_fifo purpose: store data from the command interface into fifo for transmission. arg: up to 255 bytes data: none command: response: if arg exceeds the fifo size of 255 bytes, err is set to 0x08 (too many arguments). the si4012 raises the ?fifo almost full? or ?fifo almost empty? inte rrupt when approp riate. if auto transmit is enabled and the fifo level is above the auto transmit th reshold, the si4012 will start transmit automatically. init_fifo command 76543210 cmd 0x65 init_fifo reply 7 6 543210 status cts err set_fifo command 76543210 cmd 0x66 arg1 fifo_data1[7:0] arg2 fifo_data2[7:0] ? argn fifo_datan[7:0] set_fifo reply 7 6 543210 status cts err
si4012 30 rev 1.1 5.1.12. command: tx_stop purpose: stop transmission and go to designated state (this command can also be used to abort existing transmissions) arg: ? state[1:0]?state to transition to when transmission is stopped. 00 idle ? go to idle state when the packet transmission is stopped based on the idle mode. 01 shutdown ? go to shutdown state when the packet transmission is stopped. 10-11 ? reserved. ? idlemode[2:0] ?idle mode if changing to idle state. 000 standby ? low power state 001 sensor ? enable low battery detector 010 tune ? periodic tuning 011?111 ? reserved data: none command: response: none if changing to shutdown, otherwise tx_stop command 7654 3 2 1 0 cmd 0x67 arg1 state[1:0] arg2 idlemode[2:0] tx_stop reply 7 6 54321 0 status cts err
si4012 rev 1.1 31 5.1.13. command: get_bat_status purpose: get the battery st atus such as current vdd voltage. arg: load option?0: battery voltage is measured immediately without any load. >0: battery voltage is measured after major power hungry parts of the device are temporarily turned on. these parts are turned off when measurement is done after loadwaittime x 17 s of wait time. data: btv[15:0]?batter y voltage in mv command: response: notes: 1. if tuning is in progress when this api is received, err is set to 0x11 (device busy). 2. in sensor mode, si4012 reads battery voltage periodi cally with no load based on the interval set in set_property/lbd_config. get_bat_status command 7 6 5 4321 0 cmd 0x68 arg load/wait time get_bat_status reply 7 6 5 4 3 210 status cts err data1 btv[15:8] data2 btv[7:0]
si4012 32 rev 1.1 5.2. properties 5.2.1. properties summary the format table in this section applies to the arg field of set_property after prop_id and data field of get_property. i.e., prop_id corresponds to arg1, prop_data1 corresponds to arg2 or data1, prop_data2 corresponds to arg3 or data 2, etc. default is the value of a property the si4012 defaults to if the host does not set t he property via set_property. fields correspond to the prop_data. section property id property description 5.2.2 0x10 chip_config fsk dev polarity, lsb first, xo 5.2.3 0x11 led_intensity le d current drive strength 5.2.4 0x20 modulation_fskdev mod type and fsk deviation if fsk 5.2.5 0x21 tune_interval tuning interval in seconds 5.2.6 0x30 fifo_threshold fifo almost full, almost empty and auto transmit threshold 5.2.7 0x31 bitrate_config data rate and ramp rate if ook 5.2.8 0x40 tx_freq carrier frequency for transmission if ook, upper frequency for transmission if fsk 5.2.9 0x41 lbd_config low battery voltage threshold that triggers interrupt, batt ery voltage sampling interval 5.2.10 0x50 xo_config xo frequency and low capacitance control 5.2.11 0x60 pa_config pa maximum current driver, pa level, cap, alpha and beta steps
si4012 rev 1.1 33 5.2.2. property: chip_config purpose: select fsk deviation polar ity, lsb first and external crystal. property: 0x10 default: 0x08 fields: ? fskdevpola?fsk deviation polarity. ?? 0: +deviation when modulation data is 1 and ?dev for din = 0 ?? 1: +dev for din = 0 and ?dev for din = 1 ? lsbfirst?when ? set, ? lsb ? is ? transmitted ? first. ? otherwise, ? msb ? is ? transmitted ? first. ? usexo?use ? external ? crystal ? if ? set format: note: if the crystal is not populated on the board, there will still be a 1.4 ma curre nt draw penalty for the xo circuitry on the si4012. the host should send set_p roperty/chip_config with bit 3 clear ed to turn off the xo circuitry. chip_config property 7654321 0 prop_id 0x10 prop_data1 usexo lsbfirst fskdevpola
si4012 34 rev 1.1 5.2.3. property: led_intensity purpose: led current drive strength property: 0x11 default: 0x00 fields: ledintensity [1:0 ]?led intensity ? 00: led off ? 01: 0.37 ma ? 10: 0.60 ma ? 11: 0.97 ma. format: 5.2.4. property: modulation_fskdev purpose: modulation type and fsk deviation. property: 0x20 default: 0x013f fields: ? modutype?modulation type, default 1. ?? 0: ook ?? 1: fsk ? bifskdev[6:0] ?bifskdev if fsk, default 63. format: note: if set_property\data_rate is sent and data rate is set to a value above 500, but modulation is set to ook, err will be set in the response with ?data rate out of range? error co de. the bifskdev parameter is attained either via the wds chip configurator utility or by usin g the si4012 calculation spreadsheet. led_intensity property 76 5 4 3 2 1 0 prop_id 0x11 prop_data1 ledintensity[1:0] modulation_fskdev property 76 5 4 3 2 1 0 prop_id 0x20 prop_data1 modutype prop_data2 bifskdev[6:0]
si4012 rev 1.1 35 5.2.5. property : tune_interval purpose: tune interval used for periodic tuning. property: 0x21 default: 0x000a fields: ? tuningitv[15:0]?tuning interval in seconds format: note: the tuning interval specifies the frequency in which the devic e performs periodic tuning in tune state and in cw mode. in cw or pn9 mode, if tuningitv is 0, no tuning will be perfor med. in fifo mode, if si4012 is in tune state but tuningitv is set to 0 by the host, tuning will be performed every 10 seconds. 5.2.6. property : fifo_threshold purpose: fifo threshold settings?fifo almost empty, fifo almost full and auto transmit level. property: 0x30 fields: ? ffafullthr[7:0]?fifo almost full threshold in bytes, default 0xf0 ? ffaemthr[7:0]?fifo almost empty threshold in bytes, default 0x10 ? ffautotxthr[7:0]?fifo threshold controlling when to start auto transmit, default 0x20 bytes. format: notes: ffautotxthr applies only when auto transmit is enabled. if ff autotxthr is set to 0, the si4012 transmits whenever data becomes available in the fifo. this field is ignored when auto transmit is disabled. tune_interval property 7 6 5 4 3 2 1 0 prop_id 0x21 prop_data1 tuningitv[15:8] prop_data2 tuningitv[7:0] fifo_threshold property 76 5 4 3 2 1 0 prop_hi 0x30 prop_data1 ffafullthr[7:0] prop_data2 ffaemthr[7:0] prop_data3 ffautotxthr[7:0]
si4012 36 rev 1.1 5.2.7. property : bitrate_config purpose: data rate and ramp rate if ook. property: 0x31 fields: ? datarate[9:0]?data rate in units of 100 bps, ranging from 1 to 1000 for fsk and 1 to 500 for ook. default 0x60. ? ramprate[3:0]?ramp rate in s. 1, 2, 4, or 8 is supported. default 2. format: notes: the data rate won?t take into effect until transmission time. if set_property\modulation_conf ig is sent and modulation is set to ook by the host, but datarate is set to > 500, err will be set in the response. the default modulation type is fsk. if set_property \m odulation_fskdev is not sent, any value above 1000 will result in err being set in the response?0x0d (data rate out of range). ramprate is ignored if modutype in modulation_fskdev is fsk. in ook mode, any value except 1, 2, 4, or 8 wi ll result in err 0x04?bad parameter in arg4. in fsk mode, the minimu m data rate is 200 bps. the ramp rate parameter dictates the minimum data rate. the si4012 will set err to 0x10 (data rate not supported) if the value is smaller than the minimum data rate on the specified ramp rate. data_rate property 7654321 0 prop_id 0x31 prop_data1 datarate[9:8] prop_data2 datarate[7:0] prop_data3 ramprate[3:0] ramp rate 1 2 4 8 min data rate (bps) 300 200 200 100
si4012 rev 1.1 37 5.2.8. property: tx_freq purpose: carrier frequency for transmission if ook, upper frequency if fsk and center frequency in cw mode. property: 0x40 default: 0x19ddc7c8 for 433.965 mhz (433.92 mhz+90 khz/2) fields: txfreq[31:0]?ranging from 27 mhz to 960 mhz. ook: carrier frequency (hz) fsk: upper frequency (hz) cw mode: center frequency (hz) format: note: frequency out of range in set_property will result in err = 0x0e (frequency out of range) in the response. tx_freq property 7 6 5 43210 prop_id 0x40 prop_data1 txfreq[31:24] prop_data2 txfreq[23:16] prop_data3 txfreq[15:8] prop_data4 txfreq[7:0]
si4012 38 rev 1.1 5.2.9. property: lbd_config purpose: battery voltage threshold used to determine wh en to raise low battery detector interrupt, battery voltage sampling interval. property: 0x41 fields: lbdthr[15:0]?battery voltage threshold in mv. default 0x09c4 or 2500 mv. sampleinterval[15:0]?battery voltage sampling interval in seconds. default: 0x3c or 60 seconds. format: lbd_config property 7 6 5 4 3 2 1 0 prop_id 0x41 prop_data1 lbdthr[15:8] prop_data2 lbdthr[7:0] prop_data3 sampleinterval[15:8] prop_data4 sampleinterval[7:0]
si4012 rev 1.1 39 5.2.10. property: xo_config purpose: frequency of external crystal and low cap configuration if using external crystal. property: 0x50 fields: ? xofreq[31:0]?crystal frequency, unit in hz. default 0x00989680 or 10 mhz. ? xolowcap ?this bit should be set for crystal that require less than 14 pf of cload capacitance. default 0. see note below. format: note: for correct operation of the oscillator , the user must do the following: ?? check the crystal data sheet for the ?c load? capacitor value that should be placed across the crystal?s terminals to oscillate at the correct frequency ?? if cload > 14 pf, xo_lowcap bit of the xo _config property has to be set to 0. in this case, the input capacitance of the xtal pin of the si4012 is appr oximately 5.5 pf, so a ( cload ? 5.5)pf capacitor should be placed externally across the crystal terminals. ?? if cload < 14 pf xo_lowcap bit of the xo_config property have to be set to 1. in this case, the input capacitance of the xtal pin of the si4012 is approximately 3 pf, so the external capacitor placed across the crystal has to be (cload ? 3)pf. xo_config property 7 6 54 32 1 0 prop_id 0x50 prop_data1 xofreq[31:24] prop_data2 xofreq[23:16] prop_data3 xofreq[15:8] prop_data4 xofreq[7:0] prop_data5 xolowcap
si4012 40 rev 1.1 5.2.11. property: pa_config purpose: pa max current driver, pa level, pa cap, alpha steps and beta steps. property: 0x60 fields: ? pamaxdrv?allows for maximum current drive, calculated from spreadsheet. default 1. ? palevel[6:0]?pa level calculated from spreadsheet. default 70. ? pacap[8:0]?pa cap. default 128. ? falphasteps[7:0]?pa alpha steps, default 125 ? fbetasteps[7:0]?pa beta steps, default 127 format: note: f alphasteps and fbetasteps should be calculated by the si 4012 calculator spreadsheet. see an564 for details. falpha- steps specifies the number of steps advancing from th e minimum supported value ?0.075 with 0.0006 per step. the maximum falpha is +0.075. falpha is computed using the formula below: fbetasteps specifies the number of steps advancing fr om the minimum supported value ?0.254 with 0.002 per step. the maximum fbeta is +0.254. fb eta is computed using the formula below: pa_config property 76543 2 1 0 prop_id 0x60 prop_data1 pamaxdrv prop_data2 palevel[6:0] prop_data3 pacap[8] prop_data4 pacap[7:0] prop_data5 falphasteps[7:0] prop_data6 fbetasteps[7:0] f alphasteps alpha 0.075 + ?? 0.0006 ------------------------------------------ - = f betasteps beta 0.254 + ?? 0.002 --------------------------------------- =
si4012 rev 1.1 41 5.3. error codes if the si4012 detects an error upon receipt of a command, such as a bad parameter, the error is reported in the response. if the si4012 detects an error while executing a command after the response has sent back to the host, the error is stored. the host can retrieve an actual error code via the get_state command. the table below provides the list of error codes. error code description 0x7f bad parameter in cmd 0x01 bad parameter in arg1 0x02 bad parameter in arg2 0x03 bad parameter in arg3 0x04 bad parameter in arg4 0x05 bad parameter in arg5 0x06 bad parameter in arg6 0x07 bad parameter in arg7 0x08 too many arguments 0x09 too few arguments 0x0a led on requested but led driver is disabled 0x0b state change failed 0x0c lbd is disabled 0x0d data rate is out of range 0x0e frequency out of range 0x0f internal error 0x10 data rate not supported 0x11 device busy 0x12 fifo overflow 0x13 fifo underflow
si4012 42 rev 1.1 6. pin descriptions pin number name description 1 xtal crystal input 2 gnd ground 3,4 txm, txp rf transmitter differential outputs 5 vdd supply input 9 led led driver output 7 nirq interrupt status output, active low, open collector 8 sdn shutdown input pin, active high 9 scl smb (smbus) clock input/output, open collector 10 sda smb (smbus) data input/output, open collector 2 3 6 7 8 4 5 9scl sdn nirq led vdd xtal txp gnd txm 1 10 sda si4012
si4012 rev 1.1 43 7. ordering guide part number* description package type operating temperature si4012-c1001gt crystal-less rf transmitter msop-10 ?40 to 85 c SI4012-C1001AT crystal-less rf transmitte r (automotive grade) msop-10 ?40 to 85 c *note: add an ?(r)? at the end of the device part number to denote tape and reel option.
si4012 44 rev 1.1 8. package outline figure 9 illustrates the package details for the si4012. table 11 lists the values for the dimensions shown in the illustration. figure 9. 10-pin msop package table 11. package dimensions symbol millimeters symbol millimeters min nom max min nom max a ? ? 1.10 e 0.50 bsc a1 0.00 ? 0.15 l 0.40 0.60 0.80 a2 0.75 0.85 0.95 l2 0.25 bsc b 0.17 ? 0.33 q 0 ? 8 c 0.08 ? 0.23 aaa ? ? 0.20 d 3.00 bsc bbb ? ? 0.25 e 4.90 bsc ccc ? ? 0.10 e1 3.00 bsc ddd ? ? 0.08 notes: 1. all dimensions are shown in millimeters (mm). 2. dimensioning and tolerancing per asme y14.5m-1994. 3. this drawing conforms to jedec outline mo-187, variation ?ba.? 4. recommended card reflow profile is per the jede c/ipc j-std-020 specific ation for small body components.
si4012 rev 1.1 45 9. land pattern: 10-pin msop figure 10 shows the recommended land pattern details for the si4012 in a 10-pin msop package. table 12 lists the values for the dimensions shown in the illustration. figure 10. 10-pin msop land pattern
si4012 46 rev 1.1 table 12. 10-pin msop land pattern dimensions dimension min max c1 4.40 ref e 0.50 bsc g1 3.00 ? x1 ? 0.30 y1 1.40 ref z1 ? 5.80 notes: general 1. all dimensions shown are in milli meters (mm) unless otherwise noted. 2. dimensioning and tolerancing per asme y14.5m-1994. 3. this land pattern design is based on the ipc-7351 guidelines. 4. all dimensions shown are at maximum material condition (mmc). least material condition (lmc) is calculated based on a fabrication allowance of 0.05 mm. solder mask design 1. all metal pads are to be non-sol der mask defined (nsmd). clearance between the solder mask and the metal pad is to be 60 m minimum, all the way around the pad. stencil design 1. a stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release. 2. the stencil thickness should be 0.125 mm (5 mils). 3. the ratio of stencil aperture to land pad size should be 1:1. card assembly 1. a no-clean, type-3 solder paste is recommended. 2. the recommended card reflow prof ile is per the jedec/ipc j-std- 020 specification for small body components.
si4012 rev 1.1 47 10. top marking: 10-pin msop figure 11. 10-pin msop top marking table 13. top marking explanation line 1 marking: base part number ordering options (see "7. ordering guide" on page 43). 12 = si4012 c1 = revision line 2 marking: tttt = manufacturing code manufacturing code from assembly house. line 3 marking: y = year ww = workweek assigned by assembly subcontractor. corresponds to the year and workweek of the mold date. ?
si4012 48 rev 1.1 d ocument c hange l ist revision 0.1 to revision 1.0 ? added api. ? updated "1. electrical specifications" on page 4. revision 1.0 to revision 1.1 ? added automotive grade version to ordering guide.
si4012 rev 1.1 49 n otes :
si4012 50 rev 1.1 c ontact i nformation silicon laboratories inc. 400 west cesar chavez austin, tx 78701 tel: 1+(512) 416-8500 fax: 1+(512) 416-9669 toll free: 1+(877) 444-3032 please visit the silicon labs technical support web page: https://www.silabs.com/support/pages/contacttechnicalsupport.aspx and register to submit a technical support request. patent notice silicon labs invests in research and development to help our cust omers differentiate in the market with innovative low-power, s mall size, analog- intensive mixed-signal soluti ons. silicon labs' extensive pat ent portfolio is a testament to our unique approach and world-clas s engineering team. silicon laboratories and silicon labs are trademarks of silicon laboratories inc. other products or brandnames mentioned herein are trademarks or registered trademarks of their respective holders. the information in this document is believed to be accurate in all respects at the time of publication but is subject to change without notice. silicon laboratories assumes no responsibility for errors and omissions, and disclaims responsib ility for any consequences resu lting from the use of information included herein. a dditionally, silicon laboratorie s assumes no responsibility for the functioning of und escribed features or parameters. silicon laboratories reserves the right to make changes without further notice . silicon laboratories makes no wa rranty, rep- resentation or guarantee regarding the suitability of its products for any particular purpose, nor does silicon laboratories as sume any liability arising out of the application or use of any product or circuit, and s pecifically disclaims any an d all liability, including wi thout limitation conse- quential or incidental damages. silicon laborat ories products are not designed, intended, or authorized for use in applications intended to support or sustain life, or for any other application in which the failure of the silicon laboratories product could create a s ituation where per- sonal injury or death may occur. should buyer purchase or us e silicon laboratories products for any such unintended or unauthor ized ap- plication, buyer shall indemnify and hold silicon laboratories harmless against all claims and damages.

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