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? 2012 microchip technology inc. preliminary information ds70686b-page 1 mrf24wg0ma/mb features: ? ieee 802.11-compliant rf transceiver ? serialized unique mac address ? data rate: 1 to 11 mbps for 802.11b / 6 to 54 mbps for 802.11g ? compatible with ieee 802.11b/g/n networks ? small size: 21 mm x 31 mm 36-pin surface mount module ? integrated pcb antenna (mrf24wg0ma) ? external antenna option (MRF24WG0MB) with ultra-miniature coaxial (u.fl) connector ? easy integration into final product ? accelerates product development, provides quicker time to market ? radio regulation certification for united states (fcc), canada (ic), and europe (etsi) ? designed for use with microchip microcontroller families (pic18, pic24, dspic33, and pic32) with downloadable microchip tcp/ip stack operational: ? single operating voltage: 2.8v to 3.6v (3.3v typical) ? temperature range: -40c to +85c ? simple, four-wire spi interface with interrupt ? low-current consumption: - rx mode ? 156 ma (typical) - tx mode ? 240 ma (+18 dbm typical) - ps mode ? 4 ma (typical) - hibernate mode ? 0.1 ma (typical) rf/analog features: ? ism band 2.400 to 2.484 ghz operation ? channels 1-11 ? dsss/ofdm modulation ? application throughput: 4500 kbps ? -95 dbm typical sensitivity at 1 mbps ? +18 dbm typical 802.11b tx power with control ? +16 dbm typical 802.11g tx power with control ? integrated low phase noise vco, rf frequency synthesizer, pll loop filter and pa ? integrated rssi adc and i/q dacs, rssi readings available to host mac/baseband features: ? hardware csma/ca access control, automatic ack, and fcs creation and checking ? automatic mac packet retransmit ? hardware security engine for aes and rc4-based ciphers ? supports 802.1x, 802.1i security: wep, wpa-psk, and wpa-2-psk. ? supports infrastructure, adhoc, wi-fi ? direct client ? implements wi-fi protected setup (wps), and softap for easy product commissioning applications: ? utility and smart energy: - thermostats - smart meters - white goods -hvac ? consumer electronics: - remote control - internet radio - home security -toys ? industrial controls: - chemical sensors -hvac - security systems - m2m communication ? remote device management: - location and asset tracking - automotive - code update ? retail: -pos terminals - wireless price tags - digital remote ? medical, fitness, and health care: -glucose meters - fitness equipment - patient asset tracking mrf24wg0ma/mb data sheet 2.4 ghz ieee 802.11b/g?
mrf24wg0ma/mb ds70686b-page 2 preliminary information ? 2012 microchip technology inc. pin diagram note: antenna connector on MRF24WG0MB only.
? 2012 microchip technology inc. preliminary information ds70686b-page 3 mrf24wg0ma/mb table of contents 1.0 device overview ............................................................................................................. ............................................................. 5 2.0 circuit description ......................................................................................................... ............................................................. 11 3.0 regulatory approval......................................................................................................... .......................................................... 21 4.0 electrical characteristics .................................................................................................. .......................................................... 27 appendix a: revision history................................................................................................... ............................................................ 31 the microchip web site ......................................................................................................... .............................................................. 33 customer change notification service ........................................................................................... ..................................................... 33 customer support............................................................................................................... ................................................................. 33 reader response ................................................................................................................ ................................................................ 34 product identification system .................................................................................................. ............................................................ 35 to our valued customers it is our intention to provide our valued customers with the best documentation possible to ensure successful use of your micro chip products. to this end, we will continue to improve our publications to better suit your needs. our publications will be refined and enhanced as new volumes and updates are introduced. if you have any questions or comments regar ding this publication, please contact the marketing communications department via e-mail at docerrors@microchip.com or fax the reader response form in the back of this data sheet to (480) 792-4150. we welcome your feedback. most current data sheet to obtain the most up-to-date version of this data s heet, please register at our worldwide web site at: http://www.microchip.com you can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page . the last character of the literature number is the vers ion number, (e.g., ds30000a is version a of document ds30000). errata an errata sheet, describing minor operational differences fr om the data sheet and recommended workarounds, may exist for curren t devices. as device/documentation issues become known to us, we will publish an errata sheet. the errata will specify the revisi on of silicon and revision of document to which it applies. to determine if an errata sheet exists for a particular device, please check with one of the following: ? microchip?s worldwide web site; http://www.microchip.com ? your local microchip sales office (see last page) when contacting a sales office, please specify which device, re vision of silicon and data sheet (include literature number) you are using. customer notification system register on our web site at www.microchip.com to receive the most current information on all of our products.
mrf24wg0ma/mb ds70686b-page 4 preliminary information ? 2012 microchip technology inc. notes:
? 2012 microchip technology inc. preliminary information ds70686b-page 5 mrf24wg0ma/mb 1.0 device overview the mrf24wg0ma and MRF24WG0MB are low- power, 2.4 ghz, ieee 802.11-compliant, surface mount modules with all associated rf components ? crystal oscillator, bypass and bias passives with inte- grated mac, baseband, rf and power amplifier, and built-in hardware support for aes, and tkip (wep, wpa, wpa2 security). the modules also provide acceleration for hosts running wpa-eap application security. the integrated module design frees the designer from rf and antenna design tasks and regu- latory compliance testing, ultimately providing quicker time to market. the mrf24wg0ma module is approved for use with the integrated pcb meander antenna. the MRF24WG0MB module comes with an ultra- miniature coaxial connector (u.fl) and is approved for use with a list of antenna types that are certified with the module. see section 2.7 ?external antenna? for specific recommendations. the mrf24wg0ma/mb modules are designed to be used with microchip?s tcp/ip software stack. the soft- ware stack has an integrated driver that implements the api that is used in the modules for command and control, and for management and data packet traffic. the microchip tcp/ip software stack is available in the free microchip application libraries download (including example applications and source code) from the microchip web site, http://www.microchip.com/ wireless . the combination of the module and a pic running the tcp/ip stack results in support for ieee standard 802.11 and ip services. for example, this allows the immediate implementation of a wireless web server and e-mail clients. the mrf24wg0ma/mb modules have received regu- latory approvals for modular devices in the united states (fcc), canada (ic), and europe (etsi). the modular approval removes the need for expensive rf and antenna design, and allows the end user to place the modules inside a finished product and not require regulatory testing for an intentional radiator (rf trans- mitter). see section 3.0 ?regulatory approval? , for the specific requirements that should be adhered to by the integrator. 1.1 interface description the block diagram in figure 1-1 represents a mrf24wg0ma/mb module. it interfaces to microchip pic18, pic24, dspic33, or pic32 microcontrollers through a four-wire serial slave spi interface ? interrupt, hibernate, reset, power and ground signals. the module runs on a single supply voltage of nominally 3.3v. the serial trace port operates at 3.3v and requires a level shifter for operation with rs-232 devices. this port provides a serial output of module status messages and is helpful for debugging purposes. figure 1-2 shows a simplified example connection between a microchip pic ? mcu and the module. tab le 1 - 1 lists the pin descriptions. data communications with the mrf24wg0ma/mb are through the spi interface that is detailed in section 2.0 ?circuit description? . the microchip pic microcon- troller communicates with the module through a com- mand api from within the microchip tcp/ip stack. the command api is detailed in the microchip tcp/ip stack online help that is included in the free microchip application libraries download.
mrf24wg0ma/mb ds70686b-page 6 preliminary information ? 2012 microchip technology inc. figure 1-1: mrf24wg0ma/mb block diagram figure 1-2: microcontroller to mrf24wg0ma/mb interface slave spi power encryption interface 802.1x (eap) accelerator ram rom spi flash interrupt trace reset hibernate matching circuitry antenna phy ieee 802.11b/g wpa engine aes, tkip mrf24wg0ma/mb 2.4 ghz ieee 802.11b/g module mrf24wg0ma pcb internal mac/llc ieee 802.11b/g 2.4 ghz transceiver/pa regulators pic ? microcontroller mrf24wg0mx gnd vdd external antenna (MRF24WG0MB) i/o cs sdo sdi sck sdi sdo sck intx int i/o hibernate i/o wp i/o reset +3.3v (typ) gnd
? 2012 microchip technology inc. preliminary information ds70686b-page 7 mrf24wg0ma/mb table 1-1: pin description pin symbol type description 1gnd pground 2 nc* nc* no connect (3) 3 nc* nc* no connect (3) 4 nc* nc* no connect (4) 5 nc* nc* no connect (3) 6 nc* nc* no connect (3) 7 reset i: constant (1) module reset input 8 nc nc do not connect 9 nc* nc* no connect (3) 10 gnd p ground 11 nc nc do not connect 12 nc nc do not connect 13 nc nc do not connect 14 nc nc do not connect 15 nc nc do not connect 16 wp (2) i write protect (this pin is used to enable flash update) 17 v dd p power 18 gnd p ground 19 gnd p ground 20 hibernate i hibernate mode enable (high input will disable the module) 21 nc* nc* no connect (3) 22 nc nc do not connect 23 cs i: constant (1) spi chip select input, constant drive or pull-up required 24 nc nc do not connect 25 gnd p ground 26 debug rx i serial debug port input (see section 2.0 ?circuit description? ) 27 debug tx o serial debug port output (see section 2.0 ?circuit description? ) 28 gnd p ground 29 v dd p power 30 gnd p ground 31 nc nc do not connect 32 sdo o spi data out 33 int o interrupt output (open drain ? requires a pull-up) 34 sck i spi clock input 35 sdi i spi data in 36 gnd p ground legend: pin type abbreviation: p = power input, i = input, o = output, nc = do not connect, nc* = no connect note 1: signals of type ?i: constant? must either be constantly driven by the host or have a pull-up or pull-down (in case the host is likely to tri-state the signal during power down modes). the constant drive is used to ensure defined operation of the part and to minimize leakage current during low power modes. 2: wp is used as write-protect for the internal module spi flash. for production use, this pin should be pulled low. this pin can be controlled by the host microcontroller to enable in field flash updates. 3: signals of type ?nc*? were jtag function pins on previous family devices. signals on these pins will have no functional affect and will not impact the operation of this device. 4: this signal should be left floating or pulled high only to support lowest 802.11ps power mode.
mrf24wg0ma/mb ds70686b-page 8 preliminary information ? 2012 microchip technology inc. 1.2 mounting details the mrf24wg0ma/mb is a surface mountable mod- ule. module dimensions are shown in figure 1-3 . the module printed circuit board (pcb) is 1 mm thick with castellated mounting points on two sides. figure 1-3: mrf24wg0ma/mb module physical dimensions note: antenna connector on MRF24WG0MB only.
? 2012 microchip technology inc. preliminary information ds70686b-page 9 mrf24wg0ma/mb figure 1-4 shows the recommended host pcb footprint for the module. the mrf24wg0ma has an integrated pcb antenna. for best performance, follow the mounting details shown in figure 1-4 . for best performance, mount the module on the pcb without metal obstructions in the keep out area of figure 1-4 . the antenna is tuned to have fr4 pcb material underneath the module. do not ?cut-out? host pcb material under the antenna. figure 1-4: recommende d host pcb footprint note 1: the ?note 1? demarcation specifies the host pcb copper plane keep-out area on underlying board layers. it is permissible to route surface escape traces in this area.
mrf24wg0ma/mb ds70686b-page 10 preliminary information ? 2012 microchip technology inc. figure 1-5 illustrates the module reflow profile that is recommended for mounting the device onto the host pcb. figure 1-5: preliminary modul e reflow profile and setpoints 300 250 200 150 100 50 0 temperature (c) time (seconds) 0 50 100 1 2 150 200 250 300 3 4 5 6 7 8 zones table 1-2: module reflow profile (1) zone 12345678 temperature (c) 180 180 200 200 200 220 265 270 note 1: conveyor speed: 90 cm/min
? 2012 microchip technology inc. preliminary information ds70686b-page 11 mrf24wg0ma/mb 2.0 circuit description the mrf24wg0ma/mb interfaces to microchip pic18, pic24, dspic33, and pic32 microprocessors with a minimal of external components through digital- only connections. this section details use of the module, starting with an example host connection as shown in figure 2-1 . 2.1 schematic figure 2-1: mrf24wg0ma/mb ex ample application schematic +3.3v + 3.3v 10f c1 10f c2 r2 4.7 k ? r4 4.7 k ? u1 mrf24wg0ma gnd nc nc* nc* nc* nc* reset nc nc* gnd nc nc nc nc nc wp vdd gnd gnd hibernate nc* nc cs nc gnd debug_rx debug_tx gnd vdd gnd nc sdo int sck sdi gnd 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 nc nc nc nc nc nc nc nc nc nc nc nc to h o s t microcontroller to h o s t to system reset controller microcontroller nc* nc* nc* nc* nc* nc* 4x 4.7 k ? +3.3v note: the example application schematic is for suggested design purposes. please refer to table 1-1 in section 1.0 ?device overview? for the module pin descriptions.
mrf24wg0ma/mb ds70686b-page 12 preliminary information ? 2012 microchip technology inc. 2.2 power-on sequence the internal regulators for the digital and analog core power supplies are disabled by driving the hibernate pin high. figure 2-2 shows the power up sequence for the mrf24wg0ma/mb. there is an internal power-on-reset (por) circuit which keeps the module in reset until v dd is within specification. the hibernate and reset signals are also used to control startup. in figure 2-2 , section a is controlled by the internal por and section b is an allowance for the spi bus to stabilize when the module supplies are enabled. once hibernate is disabled, the host software provides 1ms of startup to allow the spi to stabilize. this time is pre-programmed into the host driver, and may need to be increased if sufficient initial drive current is not provided to the mrf24wg0ma/mb module. section c is the driver controlled release from reset period. this takes approximately 300 ms and is monitored by the stack driver. no additional time needs to be provided by user software for startup. figure 2-2: mrf24wg0ma/mb power-on sequence timing 2.7v v dd ab c ready time por host driver auto-timed boot, approximately 50-300 ms after reset 1 ms spi stabilize
? 2012 microchip technology inc. preliminary information ds70686b-page 13 mrf24wg0ma/mb 2.3 power states the mrf24wg0ma/mb has several power states. these are hibernate, sleep and active (two sub- states), as shown in figure 2-3 . the selection of power state directly affects system behavior, and overall power consumption or battery life. there is also a ?stand-by? state that is not user-controlled. 2.3.1 hibernate state an ?off? state is defined as no power applied to the device. the hibernate mode is the closest to controlled off that the module can approach. it is controlled through the hibernate pin (high input puts the module into hibernate). when in hibernate, the module only consumes leakage current, but does not maintain state. hibernate has to be fully controlled by the pic mcu. the module contains about 70 f of internal bulk capacitance. supplies should be provisioned to supply sufficient charge on release of hibernate for desired start time or sufficient delay must be provided in software after hibernate release and before releasing reset. this state provides the best battery life for embedded products. entering hibernate for intervals of less than 1 minute is not likely to save power. 2.3.2 power save (ps) mode the ps mode is a low-power dynamic state that automatically implements the 802.11 power save feature. in this mode, if enabled, the module will enter ps mode when all activity is complete. the module will wake autonomously to any pic intervention so it can check dtim beacons from the access point. if any traffic is listed as queued for the module, then it will awake and get the data from the access point on the next possible opportunity. when data is acquired, the module will interrupt the pic microcontroller on a normal ?data available? indication. if no data is available on a dtim check, the module reenters the power save state until the next dtim. the dtim interval is programmed at the access point. this state can provide ?as if on? behavior of the radio with a significant power savings versus ?always on?. the battery life expectation of this mode is several days to several weeks. this mode is characterized by a very low latency (as low as 200 ms) to begin data transfer from the state. 2.3.3 active state the active state is identified as one of two states where the radio circuitry is fully on. the two active states are the receive state (rx on) and the transmit state (tx on). 2.3.4 stand-by state the stand-by state is not user-controlled but is noted as it helps identify and track certain operations of the module during power tracing. table 2-1: mrf24wg0ma/mb power state definitions state v dd cs description off 0v 0v power is completely disconnected hibernate 3.3v 3.3v all internal power regulators are off ? enabled by hibernate pin power save 3.3v 0v enabled by tcp/ip driver rx on 3.3v 0v receive circuits are on and receiving tx on 3.3v 0v transmit circuits are on and transmitting stand-by 3.3v 0v state machine transition state only ? not user controlled
mrf24wg0ma/mb ds70686b-page 14 preliminary information ? 2012 microchip technology inc. figure 2-3: mrf24wg0ma/mb power-state diagram note 1: see section 2.2 ?power-on sequence? . off hibernate stand-by rx on tx on power save 200 s 200 s 10 s note 1 note 1
? 2012 microchip technology inc. preliminary information ds70686b-page 15 mrf24wg0ma/mb 2.4 serial trace port interface the mrf24wg0ma/mb incorporates a transmit data pin (debug tx ) and a receive data pin (debug rx ) for serial debugging purposes. these pins can be con- nected to commercially available rs-232 line drivers/ receivers with appropriate external level shifters. the serial interface operates at 19200 (baud rate), 8 (data), n (parity), 1 (stop bit), n (flow control). 2.5 spi interface the slave serial peripheral interface (spi) is used to interface with the host pic microcontroller. the slave spi interface works with the interrupt line (int ). when data is available for the pic microcontroller during operation, the int line is asserted (logic low) by the mrf24wg0ma/mb module. the int line is de- asserted (logic high) by the mrf24wg0ma/mb after the data is transferred to the host pic microcontroller. the spi sck frequency can be up to 25 mhz. the slave spi interface implements the [cpol = 0; cpha = 0] and [cpol = 1; cpha = 1] modes (0 and 3) of operation. that is, data is clocked in on the first rising edge of the clock after chip select (cs ) is asserted. data is placed on the bus with most significant bit (msb) first. the cs pin must be toggled with transfer blocks and cannot be held low permanently. the falling edge of cs is used to indicate the start of a transfer. the rising edge of cs is used to indicate the completion of a transfer. figure 4-1 in section 4.0 ?electrical characteris- tics? shows the spi timing diagram. tab l e 4 - 7 details the spi timing ac characteristics. 2.6 pcb antenna for the mrf24wg0ma, the pcb antenna is fabricated on the top copper layer and covered in solder mask. the layers below the antenna have no copper trace. it is recommended that the module be mounted on the edge of the host pcb. it is permitted for pcb material to be below the antenna structure of the module as long as no copper traces or planes are on the host pcb in that area. for best performance, place the module on the host pcb according to the details shown in figure 1-4 in section 1.0 ?device overview? . the antenna patterns shown in the following plots are simulated results of the pcb antenna. figure 2-4 illus- trates the simulation drawing and figure 2-5 and figure 2-6 illustrate the two-dimensional (2d) and three-dimensional (3d) radiation patterns. the calculated average of the radiated field is shown in figure 2-5 , highlighted in yellow. the radiation pattern for the xz plane is shown in red, and the yz plane is shown in black. as shown, the most powerful radiation occurs in the xy plane (the red pattern). figure 2-6 shows the relative position of the 3d radia- tion ?donut? with reference to the module orientation. this is a very useful guide for placement of the module to obtain the maximum range. figure 2-7 shows the 3d radiation pattern with the col- ored distribution of the radiation magnitude. the values range from -9 db to +0.3 db. this is very useful in interpreting the 2d radiation pattern.
mrf24wg0ma/mb ds70686b-page 16 preliminary information ? 2012 microchip technology inc. figure 2-4: pcb antenna simulation drawing
? 2012 microchip technology inc. preliminary information ds70686b-page 17 mrf24wg0ma/mb figure 2-5: simulated two-dimensional radiation pattern two-dimensional (2d) pattern, including the average on main radiation planes (phi = 0 and 90 degrees). radiation pattern 1 name theta angle mag. m1 -60.0000 -60.0000 0.6323 m2 -20.0000 -20.0000 0.3962 m3 30.0000 30.0000 -0.1038 m4 100.0000 100.0000 -0.9490 m5 170.0000 170.0000 -0.1414 curve information average db(gaintotal) setup 1: lastadaptive freq. = ?2.44 ghz? phi = ?0 deg? 0.0097 db(gaintotal) setup 2: lastadaptive freq. = ?2.44 ghz? phi = ?0 deg? -3.2020
mrf24wg0ma/mb ds70686b-page 18 preliminary information ? 2012 microchip technology inc. figure 2-6: simulated three- dimensional radiation pattern radiation pattern against the module dimensions
? 2012 microchip technology inc. preliminary information ds70686b-page 19 mrf24wg0ma/mb figure 2-7: simulated three- dimensional radiation pattern three-dimensional (3d) pattern and magnitude distribution
mrf24wg0ma/mb ds70686b-page 20 preliminary information ? 2012 microchip technology inc. 2.7 external antenna the MRF24WG0MB module has a 50 ? ultra-miniature coaxial (u.fl) connector to connect to an external 2.4 ghz antenna. the choice of antenna is limited to the antenna types the module has been tested with. refer to the respec- tive country in section 3.0 ?regulatory approval? for a list of tested and approved antenna types that may be used with the MRF24WG0MB module. a list of antennas approved for use with the module is provided in table 2-2 . caution: the u.fl connector is fragile and can only tolerate a very limited number of insertions. table 2-2: approved external antenna types type manufacturer part number gain dipole aristotle rfa-02-c2m2-d034 2 dbi pcb aristotle rfa-02-p33-d034 1 dbi pcb aristotle rfa-02-p05-d034 2 dbi pifa aristotle rfa-02-g03-d034 0 dbi
? 2012 microchip technology inc. preliminary information ds70686b-page 21 mrf24wg0ma/mb 3.0 regulatory approval the mrf24wg0ma/mb module has received regulatory approvals for modular devices in the united states and canada. modular approval allows the end user to place the mrf24wg0ma/mb module inside a finished product and not require regulatory testing for an intentional radiator (rf transmitter), provided no changes or modifications are made to the module circuitry. changes or modifications could void the user?s authority to operate the equipment. the end user must comply with all of the instructions provided by the grantee, which indicate installation and/or operating conditions necessary for compliance. the mrf24wg0ma/mb module has been tested and conforms to en 300 328 v1.7.1 (2006-10), european standards. the module tests can be applied toward final product certification and declaration of conformity (doc). additional testing may be required depending on the end application. the integrator may still be responsible for testing the end product for any additional compliance requirements that become necessary with this module installed (for example, digital device emission, pc peripheral requirements, etc.) in the specific country that the end device will be marketed. for more information on regulatory compliance, refer to the specific country radio regulations in the following sections. 3.1 united states the mrf24wg0ma/mb has received federal communications commission (fcc) cfr47 telecommunications, part 15 subpart c ?intentional radiators? 15.247 and modular approval in accordance with part 15.212 modular transmitter approval. the mrf24wg0ma/mb module can be integrated into a finished product without obtaining subsequent and separate fcc approvals for intentional radiation. the mrf24wg0ma/mb module has been labeled with its own fcc id number, and if the fcc id is not visible when the module is installed inside another device, then the outside of the finished product into which the module is installed must also display a label referring to the enclosed module. this exterior label can use wording as follows: a user?s manual for the product should include the following statement: contains transmitter module fcc id: w7omrf24wg0mamb or contains fcc id: w7omrf24wg0mamb this device complies with part 15 of the fcc rules. operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. this equipment has been tested and found to comply with the limits for a class b digital device, pursuant to part 15 of the fcc rules. these limits are designed to provide reasonable protection against harmful interference in a residential installation. this equipment generates, uses and can radiate radio frequency energy, and if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. however, there is no guarantee that interference will not occur in a particular installation. if this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: ? reorient or relocate the receiving antenna. ? increase the separation between the equipment and receiver. ? connect the equipment into an outlet on a circuit different from that to which the receiver is connected. ? consult the dealer or an experienced radio/tv technician for help.
mrf24wg0ma/mb ds70686b-page 22 preliminary information ? 2012 microchip technology inc. 3.1.1 rf exposure all transmitters regulated by fcc must comply with rf exposure requirements. oet bulletin 65, evaluating compliance with fcc guidelines for human exposure to radio frequency electromagnetic fields , provides assistance in determining whether proposed or existing transmitting facilities, operations or devices comply with limits for human exposure to radio frequency (rf) fields adopted by the federal communications commission (fcc). the bulletin offers guidelines and suggestions for evaluating compliance. if appropriate, compliance with exposure guidelines for mobile and unlicensed devices can be accomplished by the use of warning labels and by providing users with information concerning minimum separation distances from transmitting structures and proper installation of antennas. the following statement must be included as a caution statement in manuals and oem products to alert users of fcc rf exposure compliance: if the mrf24wg0ma/mb module is used in a portable application (i.e., the antenna is less than 20 cm from persons during operation), the integrator is responsible for performing specific absorption rate (sar) testing in accordance with fcc rules 2.1091. 3.1.2 approved external antenna types to maintain modular approval in the united states, only the antenna types that have been tested shall be used. it is permissible to use different antenna manufacturer provided the same antenna type and antenna gain (equal to or less than) is used. testing of the MRF24WG0MB module was performed with the antenna types listed in tab le 2 - 2 in section 2.0 ?circuit description? . 3.1.3 helpful web sites federal communications commission (fcc): http://www.fcc.gov . 3.2 canada the mrf24wg0ma/mb module has been certified for use in canada under industry canada (ic) radio standards specification (rss) rss-210 and rss- gen. modular approval permits the installation of a module in a host device without the need to recertify the device. labeling requirements for the host device (from section 3.2.1, rss-gen, issue 3, december 2010): the host device shall be properly labeled to identify the module within the host device. the industry canada certification label of a module shall be clearly visible at all times when installed in the host device, otherwise the host device must be labeled to display the industry canada certification number of the module, preceded by the words ?contains transmitter module?, or the word ?contains?, or similar wording expressing the same meaning, as follows: user manual notice for license-exempt radio apparatus (from section 7.1.3 rss-gen, issue 3, december 2010): user manuals for license-exempt radio apparatus shall contain the following or equivalent notice in a conspicuous location in the user manual or alternatively on the device or both: to satisfy fcc rf exposure requirements for mobile and base station transmission devices, a separation distance of 20 cm or more should be maintained between the antenna of this device and persons during operation. to ensure compliance, operation at closer than this distance is not recommended. the antenna(s) used for this transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. this device complies with industry canada license-exempt rss standard(s). operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. le prsent appareil est conforme aux cnr d'industrie canada applicables aux appareils radio exempts de licence. l'exploitation est autorise aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. contains transmitter module ic: 7693a-24wg0mamb
? 2012 microchip technology inc. preliminary information ds70686b-page 23 mrf24wg0ma/mb 3.2.1 approved external antenna types transmitter antenna (from section 7.1.2 rss-gen, issue 3, december 2010): the MRF24WG0MB module can only be sold or operated with antennas with which it was approved. transmitter may be approved with multiple antenna types. an antenna type comprises antennas having similar in-band and out-of-band radiation patterns. testing shall be performed using the highest gain antenna of each combination of transmitter and antenna type for which approval is being sought, with the transmitter output power set at the maximum level. any antenna of the same type having equal or lesser gain as an antenna that had been successfully tested with the transmitter, will also be considered approved with the transmitter, and may be used and marketed with the transmitter. when a measurement at the antenna connector is used to determine rf output power, the effective gain of the device's antenna shall be stated, based on measurement or on data from the antenna manufacturer. for transmitters of output power greater than 10 milliwatts, the total antenna gain shall be added to the measured rf output power to demonstrate compliance to the specified radiated power limits. user manuals for transmitters shall display the following notice in a conspicuous location: the above notice may be affixed to the device instead of displayed in the user manual. user manuals for transmitters equipped with detach- able antennas shall also contain the following notice in a conspicuous location: immediately following the above notice, the manufacturer shall provide a list of all antenna types approved for use with the transmitter, indicating the maximum permissible antenna gain (in dbi) and required impedance for each. approved external antenna types for the mrf24wg0ma/mb module are listed in ta b l e 2 - 2 in section 2.0 ?circuit description? . 3.2.2 helpful web sites industry canada: http://www.ic.gc.ca/ under industry canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by industry canada. to reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. conformment la rglementation d'industrie canada, le prsent metteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou infrieur) approuv pour l'metteur par industrie canada. dans le but de rduire les risques de brouillage radiolectrique l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonne quivalente (p.i.r.e.) ne dpasse pas l'intensit ncessaire l'tablissement d'une communication satisfaisante. this radio transmitter (identify the device by certifi- cation number, or model number if category ii) has been approved by industry canada to operate with the antenna types listed below with the maximum permissible gain and required antenna impedance for each antenna type indicated. antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. conformment la rglementation d'industrie canada, le prsent metteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou infrieur) approuv pour l'metteur par industrie canada. dans le but de rduire les risques de brouillage radiolectrique l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonne quivalente (p.i.r.e.) ne dpasse pas l'intensit ncessaire l'tablissement d'une communication satisfaisante.
mrf24wg0ma/mb ds70686b-page 24 preliminary information ? 2012 microchip technology inc. 3.3 europe the mrf24wg0ma/mb module conforms to the emission standards summarized in tab l e 3 - 1 . the module tests can be applied toward product certification and declaration of conformity (doc). the european standards do not provide a modular approval similar to the usa (fcc) and canada (ic). however, the completed compliance testing can be used as part of the customer?s application for product compliance approvals. the module test report data can be used as part of the customer?s product test plan and can significantly lower customer?s compliance burden. depending on the end application, additional testing may be required. the integrator is responsible for test- ing the end product for any additional compliance requirements that become necessary with this module installed (for example, digital device emission, pc peripheral requirements and so on) in the specific country where end device is marketed). 3.3.1 external antenna requirements european conformance testing was performed using the antenna types listed in tab l e 2 - 2 in section 2.0 ?circuit description? . 3.3.2 helpful web sites a document that can be used as a starting point in understanding the use of short range devices (srd) in europe is the european radio communications committee (erc) recommendation 70-03 e, which can be downloaded from the european radio communications office (ero) at: http://www.ero.dk/ . additional helpful web sites are: ? radio and telecommunications terminal equipment (r&tte): http://ec.europa.eu/enterprise/rtte/index_en.htm ? european conference of postal and telecommunications administrations (cept): http://www.cept.org ? european telecommunications standards institute (etsi): http://www.etsi.org ? european radio communications office (ero): http://www.ero.dk note: to maintain conformance tested etsi standards, the module shall not be modified. table 3-1: emissions standards tested specification test method emission standards en 300 328 v1.7.1 (2006-10) 4.3.1 maximum transmit power 5.7.2 en 300 328 v1.7.1 (2006-10) 4.3.2 maximum eirp spectral density 5.7.3 en 300 328 v1.7.1 (2006-10) 4.3.3 frequency range 5.7.4 en 300 328 v1.7.1 (2006-10) 4.3.6 transmitter spurious emissions 5.7.5 en 300 328 v1.7.1 (2006-10) 4.3.7 receiver spurious emissions 5.7.6
? 2012 microchip technology inc. preliminary information ds70686b-page 25 mrf24wg0ma/mb 3.4 other regulatory jurisdictions should other regulatory jurisdiction certification be required by the customer, or the customer need to recertify the module for other reasons, a certification utility is available. the utility runs on a window's pc and utilizes a usb to spi converter to interface to the mrf24wg0ma/mb module. in order to use the utility, the mrf24wg0ma/mb module must be out of reset and not accessed by the system host. that is, the spi signals to the mrf24wg0ma/mb module must be tri- state, with reset and hibernate deasserted. the fol- lowing signals will need to be brought from the mrf24wg0ma/mb module for connection to the pc (through the usb adapter): ?sdo ?sdi ?cs ?sck ?int ?gnd for further regulatory certification utility and documentation, contact your local microchip salesperson. 3.5 wi-fi ? alliance wi-fi alliance certification focuses on interoperability testing of devices based on 802.11 standards. historically, when the certification process and programs were developed by wi-fi alliance members, the vast majority of the 802.11 clients were pc-centric, and certification testing adequately addressed those types of devices. in subsequent years, the number of wi-fi devices that are not pc-centric has grown significantly. these non-standard devices, as a class of products, have been dubbed application specific devices (asds) by the wi-fi alliance. asds are 802.11 devices, for example clients or access points (aps), which cannot be tested under a standard alliance test plan because they do not comply with the standard test configuration and/or because they are designed to perform a specific application. examples include, but are not limited to: bar code scanners, pagers, recording devices, monitoring equipment, and cable modems. the aps or clients that are used to validate asd compliance (from the standard test bed) will meet all of the requirements specified in the applicable system interoperability test plans (referred to as the ?standard test plan?), unless specifically exempted. the mrf24wg0ma/mb modules are in the asd category. the modules are certified under wi-fi 802.11 with asd model test plan with test engine for ieee 802.11a, b, and g devices (version 1.0).
mrf24wg0ma/mb ds70686b-page 26 preliminary information ? 2012 microchip technology inc. notes:
? 2012 microchip technology inc. preliminary information ds70686b-page 27 mrf24wg0ma/mb 4.0 electrical characteristics note 1: the listed absolute maximum ratings are not meant for functional operation. operation exceeding these levels is not guaranteed, and may reduce the operating life of the component. note 1: current consumption values represent typical peak currents, and the measured current conditions were done with 85% duty cycle modulated signal. wi-fi applications typically operate at less than 85% tx duty cycle. tx current is dependent on such criteria as transmit power setting, and transmit data rate and bandwidth being used. rx current is affected by connection distance. 2: power save current is current consumed during periods of ?stand-by? between dtim beacons. the module will awake 2 ms before a dtim and turn on its receiver, and possibly its transmitter (if data is available). table 4-1: digital electrical characteristics (nominal conditions: 25oc, v dd =3.3v) parameters min typ max units v il (input low voltage) -0.3 ? 0.8 v v ih (input high voltage) 2 ? 5.5 v v ol (output low voltage) ? ? 0.4 v v oh (output high voltage) 2.4 ? ? v i ol (output low level current at v ol max) ? 8.5 ? ma i oh (output high level current at v oh min) ? 15.4 ? ma table 4-2: absolute maximum ratings (1) parameters min max notes storage temperature -40oc +125oc ? v dd 0v 3.60v ? v in on sdi, cs , sck -0.3v 3.60v ? table 4-3: recommended operating conditions parameters min typ max units ambient temperature -40 ? +85 degrees celsius v dd ? for fcc and ic 2.80 3.3 3.60 volts v dd ? for etsi 3.0 3.3 3.60 volts table 4-4: current consumption (1) (nominal conditions: 25oc, v dd = 3.3v) parameters min typ max units conditions i dd , hibernate = 3.3v ? 0.1 ? ma ? i dd , power save (software enabled) ? 4 (2) ?ma ? i dd , rx on, receive @ -91 dbm with 1 mbps modulated signal at antenna port ?156?ma ? i dd , tx on, 802.11b, +18 dbm ? 237 ? ma measured at 11 mbps i dd , tx on, 802.11g, +16 dbm ? 226 ? ma measured at 6 mbps
mrf24wg0ma/mb ds70686b-page 28 preliminary information ? 2012 microchip technology inc. note 1: nominal conditions: 25oc, v dd = 3.3v, flo = 2437 mhz, measurements at antenna port. note 1: nominal conditions: 25oc, v dd = 3.3v, flo = 2437 mhz, 2 mbps. modulated signal measured at antenna port. 2: gain step control is not calibrated. steps are shown for planning purposes only. table 4-5: receiver ac characteristics (1) parameters min typ max units flo 2412 ? 2484 mhz rx min input level sensitivity, 1 mbps, 8% per ? -95 ? dbm rx min input level sensitivity, 2 mbps, 8% per ? -88 ? dbm rx max input level (power), 1 mbps, 8% per ? -4 ? dbm rx max input level (power), 2 mbps, 8% per ? -4 ? dbm table 4-6: transmitter ac characteristics (1) parameters min typ max units flo 2412 ? 2484 mhz average p out (transmit spectrum mask compliant) ? +18 ? dbm average p out gain step resolution from +5 to +10 dbm (2) ?0.5?db average p out gain step resolution from -5 to max. (2) ?1.0?db
? 2012 microchip technology inc. preliminary information ds70686b-page 29 mrf24wg0ma/mb figure 4-1: spi input timing figure 4-2: spi output timing cs (1) sck si so t css t hd t su t csd lsb in msb in high-impedance t csh t sck note 1: cs must be toggled for each spi block transfer. cs sck so msb out lsb out t dis don?t care si t v t v lsb in t sck table 4-7: spi interface ac characteristics symbol parameters min max units t sck sck period 40 ? ns t csd cs high time 50 ? ns t css cs setup time 50 ? ns t csh cs hold time 50 ? ns t su sdi setup time 10 ? ns t hd sdi hold time 10 ? ns t v sdo valid time ? 15 ns
mrf24wg0ma/mb ds70686b-page 30 preliminary information ? 2012 microchip technology inc. notes:
? 2012 microchip technology inc. preliminary information ds70686b-page 31 mrf24wg0ma/mb appendix a: revision history revision a (august 2012) this is the initial released version of the document. revision b (october 2012) this revision includes the following updates: ? table 1-1: ?pin description? is updated and new note added ? figure 2-1: ?mrf24wg0ma/mb example application schematic? is updated ? updated the section 2.3.1 ?hibernate state?
mrf24wg0ma/mb ds70686b-page 32 preliminary information ? 2012 microchip technology inc. notes:
? 2012 microchip technology inc. preliminary information ds70686b-page 33 mrf24wg0ma/mb the microchip web site microchip provides online support via our www site at www.microchip.com . this web site is used as a means to make files and information easily available to customers. accessible by using your favorite internet browser, the web site contains the following information: ? product support ? data sheets and errata, application notes and sample programs, design resources, user?s guides and hardware support documents, latest software releases and archived software ? general technical support ? frequently asked questions (faqs), technical support requests, online discussion groups, microchip consultant program member listing ? business of microchip ? product selector and ordering guides, latest microchip press releases, listing of seminars and events, listings of microchip sales offices, distributors and factory representatives customer change notification service microchip?s customer notification service helps keep customers current on microchip products. subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. to register, access the microchip web site at www.microchip.com . under ?support?, click on ?customer change notification? and follow the registration instructions. customer support users of microchip products can receive assistance through several channels: ? distributor or representative ? local sales office ? field application engineer (fae) ? technical support customers should contact their distributor, representative or field application engineer (fae) for support. local sales offices are also available to help customers. a listing of sales offices and locations is included in the back of this document. technical support is available through the web site at: http://microchip.com/support
mrf24wg0ma/mb ds70686b-page 34 preliminary information ? 2012 microchip technology inc. reader response it is our intention to provide you with the best documentation possible to ensure successful use of your microchip product. if you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please fax your comments to the technical publications manager at (480) 792-4150. please list the following information, and use this outline to provide us with your comments about this document. to: technical publications manager re: reader response total pages sent ________ from: name company address city / state / zip / country telephone: (_______) _________ - _________ application (optional): would you like a reply? y n device: literature number: questions: fax: (______) _________ - _________ ds70686b mrf24wg0ma/mb 1. what are the best features of this document? 2. how does this document meet your hardware and software development needs? 3. do you find the organization of this document easy to follow? if not, why? 4. what additions to the document do you think would enhance the structure and subject? 5. what deletions from the document could be made without affecting the overall usefulness? 6. is there any incorrect or misleading information (what and where)? 7. how would you improve this document?
? 2012 microchip technology inc. preliminary information ds70686b-page 35 mrf24wg0ma/mb product identification system to order parts, including industrial, or obtain information, for e.g., on pricing or delivery, re fer to the factory or the list ed sales office . part no. -x x t tape and module temperature range device device mrf24wg0ma/mb; v dd range 2.8v to 3.60v temperature range i = -40 ? cto+85 ? c (industrial temperature) examples: a) mrf24wg0ma-i/rm = industrial temp m module type reel
mrf24wg0ma/mb ds70686b-page 36 preliminary information ? 2012 microchip technology inc. notes:
? 2012 microchip technology inc. preliminary information ds70686b-page 37 information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. it is your responsibility to ensure that your application meets with your specifications. microchip makes no representations or warranties of any kind whether express or implied, written or oral, statutory or otherwise, related to the information, including but not limited to its condition, quality, performance, merchantability or fitness for purpose . microchip disclaims all liability arising from this information and its use. use of microchip devices in life support and/or safety applications is entirely at the buyer?s risk, and the buyer agrees to defend, indemnify and hold harmless microchip from any and all damages, claims, suits, or expenses resulting from such use. no licenses are conveyed, implicitly or otherwise, under any microchip intellectual property rights. trademarks the microchip name and logo, the microchip logo, dspic, flashflex, k ee l oq , k ee l oq logo, mplab, pic, picmicro, picstart, pic 32 logo, rfpic, sst, sst logo, superflash and uni/o are registered trademarks of microchip technology incorporated in the u.s.a. and other countries. filterlab, hampshire, hi-tech c, linear active thermistor, mtp, seeval and the embedded control solutions company are registered trademarks of microchip technology incorporated in the u.s.a. silicon storage technology is a registered trademark of microchip technology inc. in other countries. analog-for-the-digital age, app lication maestro, bodycom, chipkit, chipkit logo, codeguard, dspicdem, dspicdem.net, dspicworks, dsspeak, ecan, economonitor, fansense, hi-tide, in-circuit serial programming, icsp, mindi, miwi, mpasm, mpf, mplab certified logo, mplib, mplink, mtouch, omniscient code generation, picc, picc-18, picdem, picdem.net, pickit, pictail, real ice, rflab, select mode, sqi, serial quad i/o, total endurance, tsharc, uniwindriver, wiperlock, zena and z-scale are trademarks of microchip technology incorporated in the u.s.a. and other countries. sqtp is a service mark of microchip technology incorporated in the u.s.a. gestic and ulpp are registered trademarks of microchip technology germany ii gmbh & co. & kg, a subsidiary of microchip technology inc., in other countries. all other trademarks mentioned herein are property of their respective companies. ? 2012, microchip technology incorporated, printed in the u.s.a., all rights reserved. printed on recycled paper. isbn: 978-1-62076-629-3 note the following details of the code protection feature on microchip devices: ? microchip products meet the specification cont ained in their particular microchip data sheet. ? microchip believes that its family of products is one of the most secure families of its kind on the market today, when used i n the intended manner and under normal conditions. ? there are dishonest and possibly illegal methods used to breach the code protection feature. all of these methods, to our knowledge, require using the microchip produc ts in a manner outside the operating specif ications contained in microchip?s data sheets. most likely, the person doing so is engaged in theft of intellectual property. ? microchip is willing to work with the customer who is concerned about the integrity of their code. ? neither microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as ?unbreakable.? code protection is constantly evolving. we at microchip are co mmitted to continuously improvin g the code protection features of our products. attempts to break microchip?s code protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that act. microchip received iso/ts-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona; gresham, oregon and design centers in california and india. the company?s quality system processes and procedures are for its pic ? mcus and dspic ? dscs, k ee l oq ? code hopping devices, serial eeproms, microperipherals, nonvolatile memory and analog products. in addition, microchip?s quality system for the design and manufacture of development systems is iso 9001:2000 certified. quality management s ystem certified by dnv == iso/ts 16949 ==
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