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product structure silicon monolithic integrated circuit this product is not designed to be radiation resistant. 1/20 tsz02201-0t1t0al00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 20 .sep.2012 rev.002 www.rohm.com tsz22111 ? 14? 001 datashee t secondary power supply series for automotive 2.69 to 5.5v, fixed output, 2.25mhz synchronous step-down converter bd9053xefj-c series general description the bd9053xefj-c series is a synchronous rectification type step-down dc/dc converter with a 2.25mhz fixed frequency that operates in with an input voltage range of 2.69v-5.5v. it has an integrated feedback resistor that supplies a fixed output voltage of 1.2v/1.5v/1.8v and a phase compensation constant. applications can be created with a minimum of three external components. moreover, the integrated pch and nch output mosfet can supply a maximum output current of 3a. features integrated output feedback resistors and phase compensation network, contributes to minimize external components for the applications. excellent load response through current mode control integrated pch and nch output mosfet integrated overcurrent protection with auto-reset integrated output overvoltage detection/ short-circuit detection integrated tsd and uvlo light load mode/pwm fixation operation selection pin applications automotive equipment car audio and navigation tv other electronic equipment key specifications input voltage range output voltage bd90532efj-c bd90535efj-c bd90538efj-c output voltage accuracy operating frequency maximum output current circuit current at standby operational temperature range 2.69v 5.5[v] 1.2 [v](typ.) 1.5 [v](typ.) 1.8 [v](typ.) 2.0[%](-40 125 c) 2.25 [mhz] (typ.) 3.0 [a] (max.) 0[a](typ., 25 c) -40 +125 c package htsop-j8 4.90 L 6.00 L 1.00 L typical application circuit 1f 10f 1.0h 22f x 4 0 10 20 30 40 50 60 70 80 90 100 0.01 0.10 1.00 10.00 load current [a] efficiency [%] light load mode pwm mode vin=5v figure 1 circuit figure 1. typical application circuit (bd90535efj-c, vin=5v, iout=3a) figure 2. efficiency (bd90535efj-c)
2/20 datasheet datasheet bd9053xefj-c series tsz02201-0t1t0al00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 20 .sep.2012 rev.002 www.rohm.com tsz22111 ? 15? 001 pin configuration [top view] pin description block diagram pin symbol function 1 pvin power supply pin for output fet 2 vin power supply pin 3 en enable pin 4 gnd gnd pin 5 mode light load mode/fixed pwm mode select pin 6 fb output feedback pin 7 pgnd gnd pin for output fet 8 sw sw pin soft start uvlo /tsd fb gnd pgnd sw pvin error amp. pwm comp vref vin en slope ovp uvlo scp mode driver logic s r osc ocp 1024cycle osc figure 3. pin arrangement diagram top view sw pgnd mode pvin vin en gnd fb 7 8 6 5 3 4 2 1 figure 4. block diagram
3/20 datasheet datasheet bd9053xefj-c series tsz02201-0t1t0al00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 20 .sep.2012 rev.002 www.rohm.com tsz22111 ? 15? 001 b lock operation descriptions standby the circuit enters the state of standby when t he en pin is set to 0.7v or less. all the circuits, such as internal reference voltage vref, oscillators osc, and drivers are turned off du ring standby, and current consumption of the power supply becomes 0a(25 , typ.). via the fb pin, the output capa citor is discharged at a resistance of 1k ?. start operation the circuit starts operating when en pin is set to 2.1v or more. a soft start circuit (soft start) is integrated to prevent inrush current to the capacitor when starting. t he output voltage reaches a set voltage with 1ms(typ.) while following the startup of the soft start circuit. there is a de lay of about 200sec until the soft starts begins after the en pin is turned on and the internal logic operation is started. in order to prevent a defective start, the short-circuit protection is not active during startup. error amplifier and phase compensation the voltage of the output feedback pin(fb) is compared with an internal reference voltage. the voltage corresponding to the difference will be generated, and sent to the pwm co mparator which determines the duty ratio of the output. the feedback resistor which determines the output voltage, resi stance for compensations, and the capacitor are integrated into the bd9053 xefj-c series. oscillator the 2.25mhz(typ.) internally fixed clock is generated and sent to the slope generatio n circuit (slope) and to the driver. light load mode and forced pwm mode bd90535efj-c operates in the light load mode when the mode pin is set to 0.7v or less. when the output load current is small, the switching operation automatically becomes intermittent in the light load mode. the efficiency at light load improves compared to the forced pwm mode because the switching loss is suppressed by operating intermittently. the intermittently operating load current leve l changes depending on the input voltage, inductor value, etc. if the mode pin is set to 2.1v or more, the chip o perates in forced pwm mode. in the forced pwm mode, the efficiency at a light load decreases compared with the light load mode. however, because of the fixed frequency switching through the entire load range, noise is more easily countered. overcurrent detection when in the output stage the current flowing to the pch fet is 3.0a(min.) or more, the pch fet is turned off and the power supply to the output is intercepted. the overcurrent de tection is operated every cycle, limits the switching duty, and returns at the next clock cycle. figure 5. switching operation at light load mode figure 6. sw itching operation at pwm mode vout(10mv/div) sw vout(10mv/div) sw
4/20 datasheet datasheet bd9053xefj-c series tsz02201-0t1t0al00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 20 .sep.2012 rev.002 www.rohm.com tsz22111 ? 15? 001 output short-circuit detection the output short-circuit detection circuit (scp) detects a short-circuit of the output when ou tput voltage falls below 70% of a set value during 1024 cycles of the frequency. in this case, the pch fet and nch fet of the output are turned off, and the power supply is intercepted. the count is reset when the output voltage returns to 70% or more before 1024 cycles, and the output voltage returns to the set value. this scp automatically resets when after 1024 cycles of th e frequency after detecting the short-circuit, and switching is restarted. resetting triggers the soft start operation because the internal soft start circuit is initialized when the short-circuit detection is activated. the short-circuit detection circuit is not active while soft start is starting. in case t he short-circuit continues after resetting, the cycle of starting wi th a soft start, turning off the output after 1024 cycles, and returning after 1024 cycles is repeated. output overvoltage detection when the output overvoltage detection circuit (ovp) detects that the output voltage is exceeding 120% of a set value, the pch fet and nch fet of t he output are turned off and the power supply is intercepted. switching is restarted if after the power supply interception the output decreases and the overvoltage situation is released. the overvoltage detection voltage and the release volta ge have a hysteresis of about 100mv. uvlo the uvlo circuit is activated and shuts down the circuit when the input voltage (vin) decreases to 2.6v or less. when the uvlo is activated, the control circui t of the error amplifier, the oscillator, the driver and the output are turned off. vi a the fb pin, the output capacitor is discharged at a resistance of 1k ? . afterwards, uvlo is released when the input voltage vin rises to 2.69v or more, and t he output is restored. the output voltage starts with soft start when uvlo is reset. thermal shutdown(tsd) thermal shutdown (tsd) is activated when the ic junction part temperature exceeds 175 (typ.). when the tsd is activated the control circuit of the erro r amplifier, the oscillator, the driver and the output are turned off. there is hysteresis in the detection temperat ure of tsd, which is reset when the junction temperature decreases to 150 (typ.) or less. the output voltage starts with soft start when tsd is reset.
5/20 datasheet datasheet bd9053xefj-c series tsz02201-0t1t0al00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 20 .sep.2012 rev.002 www.rohm.com tsz22111 ? 15? 001 absolute maximum rating parameter symbol rating unit vin voltage vin -0.3 7 *1 v pvin voltage pvin -0.3 7 *1 v en voltage en -0.3 7 v sw voltage sw -1.0 pvin *1 v fb voltage fb -0.3 7 v mode voltage mode -0.3 7 v power dissipation pd 3.75 *2 w operating temperatur e range topr -40 +125 storage temperature range tstg -55 +150 junction temperature tj +150 *1 pd should not be exceeded. *2 33.3mw/c reduction when ta R 25c if mounted on 4 layers glass epoxy board of 70mm70mm1.6mm recommended operating range(ta=-40 +125) parameter symbol rating unit vin voltage vvin 2.69 5.5 v pvin voltage vpvin 2.69 5.5 v en voltage ven 0 5.5(*1) v mode voltage vmode 0 5.5 v output current isw 03 a *1 the circuit goes into test mode when the en pin is set at 6v or higher.
6/20 datasheet datasheet bd9053xefj-c series tsz02201-0t1t0al00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 20 .sep.2012 rev.002 www.rohm.com tsz22111 ? 15? 001 electrical characteristics (unle ss otherwise specified: ta=-40~+125 c, vin=pvin=5v, en=3.3v) parameter symbol ratings unit conditions min. typ. max. standby circuit current ist - 0 1 a en=0v, ta=25 circuit current icc - 650 1300 a fb=vfb+0.1v, ta=25 uvlo detection voltage vuvlo1 2.30 2.45 2.60 v sweep down uvlo release voltage vuvlo2 2.40 2.55 2.69 v sweep up en threshold voltage ven 0.7 1.4 2.1 v en inflow current ien 0.2 0.7 1.2 a en=3.3v operating frequency fosc 1.8 2.25 2.7 mhz output voltage(bd90532efj-c) vfb 1.176 1.20 1.224 v io=0ma output voltage(bd90535efj-c) vfb 1.470 1.50 1.530 v io=0ma output voltage(bd90538efj-c) vfb 1.764 1.80 1.836 v io=0ma fb pull-down resistance rfb 0.4 1 2 m ? fb=vfb soft start time tss 0.4 1 2 ms pch fet on resistance pron - 85 - m ? nch fet on resistance nron - 70 - m ? overcurrent detection current iocp - 6.5 - a output overvoltage detection voltage vovp typ. -0.15 vfb 1.2 typ. +0.15 v output short-circuit detection voltage vscp typ. -0.15 vfb 0.7 typ. +0.20 v mode threshold voltage vmode 0.9 1.6 2.3 v mode inflow current imode 3.5 7 14 a mode=3.3v
7/20 datasheet datasheet bd9053xefj-c series tsz02201-0t1t0al00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 20 .sep.2012 rev.002 www.rohm.com tsz22111 ? 15? 001 typical performance curve 0 10 20 30 40 50 60 70 80 90 100 0.01 0.10 1.00 10.00 load current [a] efficiency [%] figure 7. efficiency(bd90532efj-c) figure 8. efficiency(bd90535efj-c) figure 9. efficiency(bd90538efj-c) 0.0 0.5 1.0 1.5 2.0 -40-200 20406080100120 temperature [ ] standby circuit current [ua] figure 10. standby circuit current 0 10 20 30 40 50 60 70 80 90 100 0.01 0.10 1.00 10.00 load current [a] efficiency [%] light load mode pwm mode figure 1. circuit vin=5v vin=3.3v vin=5v vin=3.3v light load mode pwm mode vin=5v vin=3.3v vin=5v vin=3.3v 0 10 20 30 40 50 60 70 80 90 100 0.01 0.10 1.00 10.00 load current [a] efficiency [%] light load mode pwm mode vin=5v vin=3.3v vin=5v vin=3.3v
8/20 datasheet datasheet bd9053xefj-c series tsz02201-0t1t0al00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 20 .sep.2012 rev.002 www.rohm.com tsz22111 ? 15? 001 0.4 0.5 0.6 0.7 0.8 0.9 -40 -20 0 20 40 60 80 100 120 temperature [ ] circuit current [ma] figure 11. circuit current figure 12. output voltage vs. temperature ( bd90532efj-c ) figure 14. output voltage vs. temperature ( bd90538efj-c ) 1.47 1.48 1.49 1.50 1.51 1.52 1.53 -40-200 20406080100120 temperature [ ] output voltage [v] figure 13. output voltage vs. temperature ( bd90535efj-c ) 1.17 1.18 1.19 1.20 1.21 1.22 1.23 -40 -20 0 20 40 60 80 100 120 temperature [ ] output voltage [v] 1.77 1.78 1.79 1.80 1.81 1.82 1.83 -40 -20 0 20 40 60 80 100 120 temperature [ ] output voltage [v]
9/20 datasheet datasheet bd9053xefj-c series tsz02201-0t1t0al00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 20 .sep.2012 rev.002 www.rohm.com tsz22111 ? 15? 001 -1.0 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 load current [a] S output voltage [%] 0.7 0.9 1.1 1.3 1.5 1.7 1.9 2.1 -40-200 20406080100120 temperature [ ] en threshold voltage [v] 1.8 2.0 2.2 2.4 2.6 -40 -20 0 20 40 60 80 100 120 temperature [ ] frequency [mhz] 2.3 2.4 2.5 2.6 2.7 -40 -20 0 20 40 60 80 100 120 temperature [ ] uvlo threshold voltage [v] figure 15. load regulation figure 16. en threshold voltage figure 17. uvlo detect/release voltage figure 18. frequency vs. temperature on off bd90535efj-c bd90532efj-c bd90538efj-c
10/20 datasheet datasheet bd9053xefj-c series tsz02201-0t1t0al00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 20 .sep.2012 rev.002 www.rohm.com tsz22111 ? 15? 001 4.0 5.0 6.0 7.0 8.0 9.0 -40 -20 0 20 40 60 80 100 120 temperature [] ocp threshol d current [a] 0 10 20 30 40 50 60 70 80 90 -40 -20 0 20 40 60 80 100 120 temperature [ ] on resistance [m ] figure 19. frequency vs. input voltage figure 20. fet on resistance figure 21. over current detect vs. temperature figure 22. output over/short detect voltage pch nch 1.8 2.0 2.2 2.4 2.6 2.5 3.0 3.5 4.0 4.5 5.0 5.5 input voltage vin[v] frequency [mhz] 0.7 0.9 1.1 1.3 1.5 1.7 1.9 2.1 2.3 -40 -20 0 20 40 60 80 100 120 temperature [] threshold voltage [v] ovp(bd90535efj-c) ovp(bd90532efj-c) ovp(bd90538efj-c) scp(bd90535efj-c) scp(bd90532efj-c) scp(bd90538efj-c)
11/20 datasheet datasheet bd9053xefj-c series tsz02201-0t1t0al00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 20 .sep.2012 rev.002 www.rohm.com tsz22111 ? 15? 001 the characteristics below are reference data which are measur ed with the typical application circuit as shown in figure 1 also, these characteristics are influenced by the external components and board layout. figure 23. loop response (bd90535efj-c, vin=5v, iout=3a) figure 24. start-up waveform (bd90535efj-c, vin=5v, mode=3.3v) figure 25. load response (bd90535efj-c, vin=5v, mode=0v) figure 26. load response (bd90535efj-c, vin=5v, mode=3.3v) vout(50mv/div) iout(2a/div) vout(50mv/div) iout(2a/div)
12/20 datasheet datasheet bd9053xefj-c series tsz02201-0t1t0al00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 20 .sep.2012 rev.002 www.rohm.com tsz22111 ? 15? 001 timing chart start-up ocp scp figure 28. ocp figure 29. scp figure 27. start-up
13/20 datasheet datasheet bd9053xefj-c series tsz02201-0t1t0al00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 20 .sep.2012 rev.002 www.rohm.com tsz22111 ? 15? 001 i l vo 1 co vin f v pp = i l r esr + [v] f: switching frequency il pvin-vout vout il pvin f l = [h] selection of external components selection of inductor the inductor value significantly influences the output ripple current. the larger the coil is, the more the ripple current drops will be as shown in the equation below. an inductor with a low value will cause the ripple current to increase and also causes an increase of the ripple element of the output voltage. the optimal output ripple current setting is between 10% ~ 30% of the maximum output current. ? il = 0.2ioutmax. [a] ? il: output ripple current, f: switching frequency supplying the coil with a current exceeding the coil?s rated current will cause magnetic saturation of the coil and will decrease the efficiency of the coil. please allow for a sufficient margin in selecting the inductor to ensure that the peak current does not exceed the inductor?s rated current. please select a coil with a small resistance element (dcr, acr) to reduce the coil loss, and to improve efficiency. selection of input capacitor the input capacitor serves to lower the impedance of the power supply connected to the input pin (vin, pvin). an increase of the impedance of this power supply can caus e input voltage instability and may negatively impact oscillation and ripple rejection characteristics. therefore, it is necessary to place an input capacitor in close proximity to the vin, pvin, gnd and pgnd pins. we recommend selecting a ceramic capacitor with a value of 10uf or more that influenced by changes in temperature as little as possible and that has a sufficiently large permissible ripple current. the ripple current rms can be calculated using the following equation. note that depending on the capacitor, the capacitance may be significantly influenced by the applied voltage. please select a capacitor with good dc bias characteristics and with a high voltage. selection of output capacitor we recommend selecting a ceramic capacitor. the ripple element of the output voltage is determined by the esr of the output capacitor. please take the permissible voltage of the actual application into consideration when selecting the output capacitor. the ripple element of the output voltage can be calculated by using the equation below. selecting a low-esr capacitor can reduce the ripple element of the output voltage. note that depending on the capacitor, the capacitance may be significantly influenced by the applied voltage. please select a acapacitor with good dc bias characteristics and with a high voltage. the startup time needs to be within the soft start time. ther efore, please take the following equation into consideration when selecting the output capacitor . tss (ilimit ? iout) tss: soft start time (typ. 1ms) co Q vout ilimit: overcurrent detection value (min. 3a) non-optimal capacitance values may cause startup proble ms. especially in cases of extremely large capacitance values, the possibility exists that the inrush current at star tup will activate the overcurrent protection, thus not starting the output. therefore, verification and confirmation with the actual application is recommended. selection of schottky diode depending on the application the efficiency may be improved by placing a schottky diode between the sw pin and pgnd pin thereby creating a current path when the synchronous switching (nch fet) is off. when selecting the schottky diode ensure that the maximum reverse voltage is higher than the input voltage and that the rated current is higher than the maximum inductor current (the sum of the maximum output current and inductor ripple current). irms = iout [a] vout vin - vout vin figure 30. . ripple current l pvin i l vout co pvin-vout vout l pvin f il = [a]
14/20 datasheet datasheet bd9053xefj-c series tsz02201-0t1t0al00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 20 .sep.2012 rev.002 www.rohm.com tsz22111 ? 15? 001 notes on the substrate layout the substrate layout greatly influences the stable operation of the ic. depending on the substrate layout the ic might not show its original characteristics or might not function properly. please note the following points when drawing the substrate layout. ? the input capacitors c1 and c2 should be placed as close as possible to the vin, pvin, gnd and pgnd pins. ? the output voltage feedback line should be separated from lines with a lot of noise such as the sw line. ? the gnd signal should be separated from the input capacitor and the gnd and pgnd of the output capacitor and brought together at one point. ? the output capacitors c3 and c4 should be placed in close proximity to inductor l1. ? the inductor l1 should be placed as close as possible to the sw pin. the pattern area of the sw node should be as small as possible. ? the mode pin should be pulled down via r3 by gnd and pulled up via r2 by vin. it is also possible to directly supple the mode pin with voltage. ? the feedback frequency characteristics (phase margin) can be measured by inserting a resistor at the location of r1 and using fra. however, this should be shorted during normal operation. figure 31. reference circuit figure 32. reference layout pattern vin gnd vout c3 c2 c1 l1 r3 r2 r1 ic c4
15/20 datasheet datasheet bd9053xefj-c series tsz02201-0t1t0al00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 20 .sep.2012 rev.002 www.rohm.com tsz22111 ? 15? 001 heat dissipation the maximum allowable junction temperature tj of bd9053xefj-c series is 150 c. in case tj exceeds 150 , the temperature protection circuit is activated and the circuit sh uts down. therefore, it is necessary to design the system requirements and the board layout so that the junction temperature does not exceed 150 in the power-supply voltage, the output load and the operating temperature range. the maximum junction temperature can be calculated us ing the ambient temperature ta, the thermal resistance ja of the package and heat dissipation p of the ic. tj = ta + ja p [ c] the thermal resistance ja of the package changes depending on the number of layers and the copper foil area of the board. the heat dissipation ptotal of the ic can be calculated by the equation below. p total = p icc + p ron + p sw [w] p icc = vin icc ??? heat dissipation in control circuit p ron = r on io 2 ??? heat dissipation in output fet p sw = tr io vin f ??? heat dissipation in switching icc: circuit current ron: on resistance of the output fet f: frequency all values are specified in the electrical characteristics. tr is the rise time and fall time at switching. in the standard case is 5nsec and in the max case is 10nsec. also, these characteristics are influenced by the external components and board layout. thermal derating characteristic ic mounted on rohm standard board ? board size 70mm70mm1.6mm ? the board and the back exposure heat radiation board part of package are connected with solder. ic unit, ja=249.5 /w 2 layers board (copper foil 15mm15mm), ja =113.6 /w 2 layers board (copper foil 70mm70mm), ja =59.2 /w 4 layers board (copper foil 70mm70mm), ja =33.3 /w figure 33. thermal derating characteristic 0 0.5 1 1.5 2 2.5 3 3.5 4 0 25 50 75 100 125 150 ambient temperature: ta( ) power dissipation: pd w) 3.75w 2.11w 1.10w 0.50w
16/20 datasheet datasheet bd9053xefj-c series tsz02201-0t1t0al00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 20 .sep.2012 rev.002 www.rohm.com tsz22111 ? 15? 001 i/o equivalence circuit 3pin (en) 5pin (mode) 6pin (fb) 8pin (sw)
17/20 datasheet datasheet bd9053xefj-c series tsz02201-0t1t0al00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 20 .sep.2012 rev.002 www.rohm.com tsz22111 ? 15? 001 operational notes 1. absolute maximum ratings exceeding the absolute maximum rating for supply voltage, operating temperature or other parameters may result in damages to or destruction of the chip. in this event it also becomes impossible to determine the cause of the damage (e.g. short circuit, open circuit, etc.). therefore, if any special mode is being considered with values expected to exceed the absolute maximum ratings, implementing physical safety measures, such as adding fuses, should be considered. 2. thermal protection circuit (tsd) if the junction temperature (tj) exceeds 175 (typ.) the thermal protection circuit (tsd) is activated and the output is put in the off status. the releasing temperature has hysteresis of about 25 c(typ.). the thermal protection circuit only functions to block thermal overloads from reaching the ic. its purpose is not to protect the circuit or to guarantee the operations of the ic. therefore, the ic should not be continuously operated after this circuit has been activated, nor should the ic be used in applications where t he activation of this circuit is a prerequisite. 3. overcurrent protection circuit this ic incorporates an integrated overcurrent protection ci rcuit that operates in accordance with the rated output capacity. this circuit serves to protect the ic from dam age when the load becomes shorted. the protection circuit is effective in preventing damage due to sudden and unexpected accidents. however, the ic should not be used in applications characterized by the continuous or transitive operation of the protection circuit. 4. high temperature, no load behavior in a situation where there is a high temperature and no load , it might be that the leak current of the output transistor causes output voltage to rise (up to maximum vin). it case it is expected that in the application conditions the output load drops below 1ma, please place a 1k resistor at the output in order to prevent an no-load situation. 5. power dissipation, aso should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in deterioration of the properties of the chip and lead to a decrease of the reliability. therefore, allow for sufficient margins to ensure use within the power dissipation rating. also, please ensure in the design that the absolute maximum rating of the output transistor and the aso are not exceeded when operating the ic. 6. operation in strong electromagnetic fields use caution when operating in the presence of strong electromagnetic fields, as this may cause the ic to malfunction. 7. connection to the power supply connector a reverse connection to the power supply connector may cause damages to the ic. in order to prevent against reverse connection damages please externally place a diode between the power supply and the power supply pin of the ic. 8. inter-pin shorts and mounting errors use caution when orienting and positioning the ic for m ounting on printed circuit boards. improper mounting may result in damage to the ic. shorts between output pins or between output pins and the power supply or gnd pins (caused by poor soldering or foreign objects) may result in damage to the ic. 9. short to power supply, short to ground, inter-pin shorts please avoid shorts between the output pin and the power supply (vin, pvin), shorts between the output pin and ground (gnd, pgnd) and shorts between the output pins. 10. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ic?s power supply should always be turned off completely before connecting or removing it from a jig or fixture during the evaluation process. to prevent damage from static discharge, ground the ic durin g assembly and use similar precautions during transport and storage. 11. gnd potential the potential of the gnd pin must be the minimum potential in the system in all operating conditions. ensure that no pins are at a voltage below the gnd at any time, regardless of transient characteristics. 12. wiring of vin and gnd for the wiring of vin, pvin, gnd and pgnd please create a layout with as wide as possible wires and a minimum distance in between the wires. in case of both small signal lines and high current lines, use single-point grounding to separate the small-signal and high current patterns and to ensure that voltage changes stemming from the wiring resistance and high current do not cause any voltage change in the small-signal. also place a capacitor at the grounding point for stabilization.
18/20 datasheet datasheet bd9053xefj-c series tsz02201-0t1t0al00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 20 .sep.2012 rev.002 www.rohm.com tsz22111 ? 15? 001 13. capacitor between pvin and pgnd the capacitor between pvin and pgnd absorbs the steep chan ges in voltage and current caused by the pwm drive and thereby suppress fluctuations in the pvin voltage. however, this effect is diminished due to wiring impedance the further the capacitor is removed from the ic. 14. input pins this monolithic ic contains p+ isolation and p substrat e layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of thes e p layers with the n layers of other elements, creating a parasitic diode or transistor. relations between each potential may form as shown in the example below, where a resistor and transistor are connected to a pin: ? with the resistor, when gnd pin a, and with the transistor (npn), when gnd pin b: the p-n junction operates as a parasitic diode. ? with the transistor (npn), when gnd pin b: the p-n junction operates as a parasitic transistor by interacting with the n layers of elements in proximity to the parasitic diode described above. parasitic diodes inevitably occur in the structure of the ic. their operation can result in mutual interference between circuits and can cause malfunctions and, in turn, physic al damage to or destruction of the chip. therefore do not employ any method in which parasitic diodes can operate such as applying a voltage to an input pin that is lower than the (p substrate) gnd. 15. application current and constants the application circuit as shown in figure 1. and the constants are examples to show the standard operation and application of this ic. in case of creating a design for mass production with different external components please contact rohm for detailed information. 16. in some applications, the pvin pin and sw pin potential might be reversed, possibly resulting in circuit internal damage or damage to the elements. for example, while the external capacitor is charged, the pvin shorts to the gnd. to prevent this we recommend reverse polarity diode s in series or placing a bypass diode between the sw pin and pvin pin. note concerning this document the japanese version of this document is the official specification. this translation should be seen as a reference to aid read ing the official specification. in case of any discrapencies between the two versions, the offical version always takes precedence. gnd n p n n p+ p+ parasitic element o r transistor p sub (pin b) c b e transistor (npn) (pin a) n p n n p+ p+ resistor parasitic element p parasitic element (pin a) parasitic element or transistor (pin b) gnd c b e n gnd figure 34. example of ic structure pvin pin bypass diode reverse ? ? diode figure 35. measure for reverse
19/20 datasheet datasheet bd9053xefj-c series tsz02201-0t1t0al00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 20 .sep.2012 rev.002 www.rohm.com tsz22111 ? 15? 001 ordering information bd9053xefj - ce2 physical dimension tape and reel information marking diagram output voltage product name marking 1.2v d90532 1.5v d90535 1.8v d90538 (unit : mm) htsop-j8 0.08 s 0.08 m s 1.0max 0.850.05 1.27 0.080.08 0.42 +0.05 - 0.04 1.050.2 0.650.15 4 + 6 ? 4 0.17 +0.05 - 0.03 234 568 (max 5.25 include burr) 7 1 0.545 (3.2) 4.90.1 6.00.2 (2.4) 3.90.1 1pin mark ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin packaging and forming specification ce2: embossed tape and reel package efj: htsop-j8 output voltage 2: 1.2v 5: 1.5v 8: 1.8v htsop-j8(top view) part number marking lot number 1pin mark
20/20 datasheet datasheet bd9053xefj-c series tsz02201-0t1t0al00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 20 .sep.2012 rev.002 www.rohm.com tsz22111 ? 15? 001 revision history rev. date notes 001 2012/05/16 new release 002 2012/09/20 ? add the contents of the model line-up (bd90532efj-c, bd90538efj-c) general description, key specifications, electrical characteristics typical performance curve, ordering information, marking diagram, etc. ? add the contents that ceramic capacitors are recommended in the description of input and output capacitors in selection of external components ? add the maximum value of tr in the description of heat dissipation
datasheet datasheet notice - rev.004 ? 2013 rohm co., ltd. all rights reserved. notice general precaution 1. before you use our products, you are requested to care fully read this document and fully understand its contents. rohm shall not be in any way responsible or liable for fa ilure, malfunction or accident arising from the use of any rohm?s products against warning, caution or note contained in this document. 2. all information contained in this document is current as of the issuing date and subjec t to change without any prior notice. before purchasing or using rohm?s products, please confirm the la test information with a rohm sales representative. precaution on using rohm products 1. if you intend to use our products in devices requirin g extremely high reliability (such as medical equipment, aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohm?s products for specific applications. 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohm?s products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document.
datasheet datasheet notice - rev.004 ? 2013 rohm co., ltd. all rights reserved. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document.
datasheet datasheet notice - rev.004 ? 2013 rohm co., ltd. all rights reserved. other precaution 1. the information contained in this document is provi ded on an ?as is? basis and rohm does not warrant that all information contained in this document is accurate and/or error-free. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 3. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 4. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 5. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.

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