protection products 1 www.semtech.com protection products - microclamp tm uclamp0504a clamp tm 4-line esd protection array description features dimensions schematic & pin configuration revision 06/23/2004 the clamp tm series of tvs arrays are designed to pro- tect sensitive electronics from damage or latch-up due to esd. they are designed for use in applications where board space is at a premium. each device requires less than 2.9mm 2 of pcb area and will protect up to four lines. they are unidirectional devices and may be used on lines where the signal polarities are above ground. tvs diodes are solid-state devices designed specifically for transient suppression. they feature large cross-sec- tional area junctions for conducting high transient cur- rents. they offer desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. the uclamp tm 0504a may be used to meet the immunity requirements of iec 61000-4-2, level 4. the small sc- 89 package makes them ideal for use in portable elec- tronics such as cell phones, pda?s, notebook comput- ers, and digital cameras. these devices feature a lead- free, matte tin lead finish. they are compatible with both lead free and snpb assembly techniques. applications mechanical characteristics ? cellular handsets & accessories ? cordless phones ? personal digital assistants (pda?s) ? notebooks & handhelds ? portable instrumentation ? digital cameras ? peripherals ? mp3 players ? transient protection for data lines to iec 61000-4-2 (esd) 15kv (air), 8kv (contact) iec 61000-4-4 (eft) 40a (5/50ns) ? protects four i/o lines ? ultra-small sc-89 package ( 1.7 x 1.7 x 0.6mm 1.7 x 1.7 x 0.6mm 1.7 x 1.7 x 0.6mm 1.7 x 1.7 x 0.6mm 1.7 x 1.7 x 0.6mm) requires less than 2.9mm 2 of pcb area ? working voltage: 5v ? low leakage current ? low operating and clamping voltages ? solid-state silicon-avalanche technology ? sc-89 (sot-666) package ? molding compound flammability rating: ul 94v-0 ? marking : marking code ? weight: 2.9mg (typical) ? lead finish: matte tin ? packaging : tape and reel per eia 481 sc-89 (top view) 0.60 1.70 1.70 1.25 0.30 0.50 maximum dimensions (mm)
2 ? 2004 semtech corp. www.semtech.com protection products uclamp0504a absolute maximum rating electrical characteristics (t=25 o c) r e t e m a r a pl o b m y ss n o i t i d n o cm u m i n i ml a c i p y tm u m i x a ms t i n u e g a t l o v f f o - d n a t s e s r e v e rv m w r 5v e g a t l o v n w o d k a e r b e s r e v e rv r b i t a m 1 =6 v t n e r r u c e g a k a e l e s r e v e ri r v m w r c 5 2 = t , v 5 =1a t n e r r u c e g a k a e l e s r e v e ri r v m w r c 5 2 = t , v 3 =0 0 5 . 0a e g a t l o v d r a w r o fv f i f a m 0 1 =0 8 . 0v e g a t l o v g n i p m a l cv c i p p t , a 1 = p s 0 2 / 8 =9v e g a t l o v g n i p m a l cv c i p p t , a 7 = p s 0 2 / 8 =2 1v e c n a t i c a p a c n o i t c n u jc j d n a s n i p o / i n e e w t e b d n g v r z h m 1 = f , v 0 = 0 65 7f p g n i t a rl o b m y se u l a vs t i n u ) s 0 2 / 8 = p t ( r e w o p e s l u p k a e pp k p 0 0 1s t t a w ( t n e r r u c e s l u p k a e p m u m i x a m) s 0 2 / 8 = p ti p p 7s p m a ) r i a ( 2 - 4 - 0 0 0 1 6 c e i r e p d s e ) t c a t n o c ( 2 - 4 - 0 0 0 1 6 c e i r e p d s e v p p 0 2 - / + 2 1 - / + v k e r u t a r e p m e t g n i r e d l o s d a e lt l ) . c e s 0 1 ( 0 6 2c e r u t a r e p m e t g n i t a r e p ot j 5 2 1 + o t 5 5 -c e r u t a r e p m e t e g a r o t st g t s 0 5 1 + o t 5 5 -c
3 ? 2004 semtech corp. www.semtech.com protection products uclamp0504a typical characteristics non-repetitive peak pulse power vs. pulse time 0 10 20 30 40 50 60 70 80 90 100 110 0 25 50 75 100 125 150 ambient temperature - t a ( o c) % of rated power or i pp power derating curve clamping voltage vs. peak pulse current forward voltage vs. forward current junction capacitance vs. reverse voltage insertion loss s21 0.01 0.1 1 10 0.1 1 10 100 1000 pulse duration - tp ( s) peak pulse power - p pp (kw) start . 030 mhz 3 stop 000 . 000 000 mhz ch1 s21 log 6 db / ref 0 db 0 2 4 6 8 10 12 012345678 peak pulse current - ipp (a) clamping voltage - vc (v) waveform parameters: tr = 8us td = 20us 0 2 4 6 8 0 5 10 15 forward current - i f (a) forward voltage - v f (v) waveform parameters: tr = 8us td = 20us 20 30 40 50 60 012345 reverse voltage - v r (v) capacitance - c j (pf)
4 ? 2004 semtech corp. www.semtech.com protection products uclamp0504a typical characteristics (con?t.) esd clamping (15kv air per iec 61000-4-2) esd clamping (8kv contact per iec 61000-4-2) esd clamping (-8kv contact per iec 61000-4-2) esd clamping (-15kv air per iec 61000-4-2)
5 ? 2004 semtech corp. www.semtech.com protection products uclamp0504a circuit diagram protection of four unidirectional lines device connection for protection of four data lines these devices are designed to protect up to four unidirectional data lines. the device is connected as follows: 1. unidirectional protection of four i/o lines is achieved by connecting pins 1, 3, 4, and 6 to the data lines. pins 2 and 5 are connected to ground. the ground connection should be made directly to the ground plane for best results. the path length is kept as short as possible to reduce the effects of parasitic inductance in the board traces. circuit board layout recommendations for suppres- sion of esd. good circuit board layout is critical for the suppression of esd induced transients. the following guidelines are recommended: z place the tvs near the input terminals or connec- tors to restrict transient coupling. z minimize the path length between the tvs and the protected line. z minimize all conductive loops including power and ground loops. z the esd transient return path to ground should be kept as short as possible. z never run critical signals near board edges. z use ground planes whenever possible. matte tin lead finish matte tin has become the industry standard lead-free replacement for snpb lead finishes. a matte tin finish is composed of 100% tin solder with large grains. since the solder volume on the leads is small com- pared to the solder paste volume that is placed on the land pattern of the pcb, the reflow profile will be determined by the requirements of the solder paste. therefore, these devices are compatible with both lead-free and snpb assembly techniques. in addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. 2, 5 1346 applications information
6 ? 2004 semtech corp. www.semtech.com protection products uclamp0504a typical applications uclamp0504a
7 ? 2004 semtech corp. www.semtech.com protection products uclamp0504a outline drawing land pattern
8 ? 2004 semtech corp. www.semtech.com protection products uclamp0504a marking code ordering information r e b m u n t r a p g n i k r o w e g a t l o v e c i v e d g n i k r a m r e p y t q l e e r l e e r e z i s t c t . a 4 0 5 0 p m a l c uv 5h 0 0 0 , 3h c n i 7 note: (1) device is symmetrical so there is no pin 1 identifier. h microclamp, uclamp and clamp are trademarks of semtech corporation tape and reel specification tape specification and device orientation h h h
9 ? 2004 semtech corp. www.semtech.com protection products uclamp0504a h c n a r b n a w i a t 0 8 3 3 - 8 4 7 2 - 2 - 6 8 8 : l e t fx a0 9 3 3 - 8 4 7 2 - 2 - 6 8 8 : h b m g d n a l r e z t i w s h c e t m e s h c n a r b n a p a j 0 5 9 0 - 8 0 4 6 - 3 - 1 8 : l e t 1 5 9 0 - 8 0 4 6 - 3 - 1 8 : x a f h c n a r b a e r o k tl e7 7 3 4 - 7 2 5 - 2 - 2 8 : f6 7 3 4 - 7 2 5 - 2 - 2 8 : x a ) . k . u ( d e t i m i l h c e t m e s 0 0 6 - 7 2 5 - 4 9 7 1 - 4 4 : l e t 1 0 6 - 7 2 5 - 4 9 7 1 - 4 4 : x a f e c i f f o i a h g n a h s t0 3 8 0 - 1 9 3 6 - 1 2 - 6 8 : l e 1 3 8 0 - 1 9 3 6 - 1 2 - 6 8 : x a f l r a s e c n a r f h c e t m e s 0 0 - 2 2 - 8 2 - 9 6 1 ) 0 ( - 3 3 : l e t 8 9 - 2 1 - 8 2 - 9 6 1 ) 0 ( - 3 3 : x a f f o y r a i d i s b u s d e n w o - y l l o h w a s i g a l a n o i t a n r e t n i h c e t m e s . a . s . u e h t n i s r e t r a u q d a e h s t i s a h h c i h w , n o i t a r o p r o c h c e t m e s h b m g y n a m r e g h c e t m e s 3 2 1 - 0 4 1 - 1 6 1 8 ) 0 ( - 9 4 : l e t 4 2 1 - 0 4 1 - 1 6 1 8 ) 0 ( - 9 4 : x a f contact information for semtech international ag
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