kbp005m thru kbp10m, 3n246 thru 3n252 vishay semiconductors document number 88531 www.vishay.com 18-jan-02 1 glass passivated single-phase bridge rectifiers rev. voltage 50 to 1000v forward current 1.5a 0.125 x 45 o (3.2) 0.600 (15.24) 0.560 (14.22) 0.034 (0.86) 0.028 (0.76) 0.105 (2.67) 0.085 (2.16) 0.160 (4.1) 0.140 (3.6) 0.060 (1.52) polarity shown on front side of case: positive lead by beveled corner 0.460 (11.68) 0.50 (12.7) min. 0.420 (10.67) 0.500 (12.70) 0.460 (11.68) 60 (15.2) min. dia. 0.200 (5.08) 0.180 (4.57) maximum ratings & thermal characteristics ratings at 25? ambient temperature unless otherwise specified. kbp kbp kbp kbp kbp kbp kbp parameter symb. 005m 01m 02m 04m 06m 08m 10m unit 3n246 3n247 3n248 3n249 3n250 3n251 3n252 * maximum repetitive peak reverse voltage v rrm 50 100 200 400 600 800 1000 v * maximum rms voltage v rms 35 70 140 280 420 560 700 v * maximum dc blocking voltage v dc 50 100 200 400 600 800 1000 v max. average forward output rectified current at t a = 40? i f(av) 1.5 a * peak forward surge current single half sine-wave 50 superimposed on rated load (jedec method) t j =150? i fsm 30 a rating for fusing (t < 8.3ms) i 2 t10a 2 sec typical thermal resistance per leg (1) r ja 40 r jl 13 ?/w * operating junction and storage temperature range t j , t stg 55 to +150 c electrical characteristics ratings at 25? ambient temperature unless otherwise specified. * max. instantaneous at 1.0a per leg 1.0 forward voltage drop at 1.57a per leg v f 1.3 v * maximum dc reverse current t a = 25? 5.0 at rated dc blocking voltage per leg t a = 125? i r 500 a typical junction capacitance per leg at 4.0v, 1mhz c j 15 pf note: (1) thermal resistance from junction to ambient and from junction to lead mounted on p.c.b. with, 0.47 x 0.47" (12 x12mm) copper pads * jedec registered values dimensions in inches and (millimeters) features ?plastic package has underwriters laboratory flammability classification 94v-0 ?this series is ul listed under recognized component index, file number e54214 ?glass passivated chip junctions ?high surge current capability ?ideal for printed circuit boards ?high temperature soldering guaranteed: 260?/10 seconds at 5 lbs. (2.3kg) tension mechanical data case: molded plastic body over passivated junctions terminals: plated leads solderable per mil-std-750, method 2026 polarity: polarity symbols marked on case mounting position: any weight: 0.06 ounce, 1.7 grams packaging codes/options: 1/600 ea. per bulk tray stack case style kbpm
kbp005m thru kbp10m, 3n246 thru 3n252 vishay semiconductors www.vishay.com document number 88531 2 18-jan-02 ratings and characteristic curves (t a = 25? unless otherwise noted) 0 fig. 1 ?derating curve output rectified current bridge output full wave rectified current, average amperes ambient temperature ( c) 20 40 60 80 100 120 140 150 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 60h z resistive or inductive load 0 fig. 2 ?maximum non-repetitive peak forward surge current 1 10 100 number of cycles at 60h z 10 20 30 40 50 60 peak forward surge current (a) single half sine-wave (jedec method) fig. 3 ?typical forward characteristics per leg 0.4 0.6 0.8 1.0 1.2 1.4 1.6 instantaneous forward voltage (v) 0.01 0.1 1 10 20 instantaneous forward current (a) t j = 25 c pulse width = 300 s 1% duty cycle 0 fig. 4 ?typical reverse leakage characteristics per leg 0.01 0.1 1 10 instantaneous reverse current ( a) 60 80 100 20 40 percent of rated peak reverse voltage (%) t j = 25 c t j = 100 c t j = 125 c fig. 5 ?typical junction capacitance per leg 1 0.1 10 100 reverse voltage (v) 1 10 100 junction capacitance (pf) t j = 25 c f = 1.0mh z vsig = 50mvp-p p.c.b. mounted with 0.47 x 0.47" (12 x 12mm) copper pads capacitive load ipk/i av = 5.0 ipk/i av = 10 ipk/i av = 20 (per leg) t a = 25 c t j = 150 c 1.0 cycle
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