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description this family of t-1 3 / 4 tinted, diffused led lamps is widely used in general purpose indicator applic a tions. difus ants, tints, and optical design are balanced to yield superior light output and wide viewing angles. several intensity choices are available in each color for increased design fexibility. features ? high intensity ? choice of 4 bright colors C high efciency red C orange C yellow C high performance green ? popular t-1 3 / 4 diameter package ? selected minimum intensities ? wide viewing angle ? general purpose leads ? reliable and rugged ? available on tape and reel selection guide luminous intensity material/ iv (mcd) at 10 ma color part number min. max. hlmp-3301 5.4 C hlmp-3301-d00xx 2.1 C gap her hlmp-3301-f00xx 5.4 C hlmp-3301-fg0xx 5.4 17.2 hlmp-3762 8.6 C hlmp-3762-g00xx 8.6 C hlmp-3401 5.7 C hlmp-3401-e00xx 5.7 C hlmp-3401-ef0xx 5.7 18.4 gap yellow hlmp-3401-efbxx 5.7 18.4 hlmp-3862 9.2 C hlmp-3862-f00xx 9.2 C hlmp-3862-fgbxx 9.2 29.4 hlmp-d401 5.4 C gap orange hlmp-d401-d00xx 2.1 C hlmp-d401-ef0xx 3.4 10.8 hlmp-d401-f00xx 5.4 C hlmp-3507 4.2 C hlmp-3507-d00xx 4.2 C gap green hlmp-3507-ef0xx 6.7 21.2 hlmp-3962 10.6 C hlmp-3962-f00xx 10.6 C hlmp-3301, hlmp-3401, hlmp-3507, hlmp-3762, hlmp-3862, hlmp-3962, hlmp-d401 t-1 3 / 4 (5 mm) difused led lamps data sheet
2 package dimensions part numbering system hlmp - x x xx - x x x xx mechanical option 00: bulk 01: tape & reel, crimped leads 02: tape & reel, straight leads b1: right angle housing, uneven leads b2: right angle housing, even leads dd: ammo pack r4: tape & reel, counter clockwise color bin options 0: full color bin distribution b: color bins 2 & 3 only maximum iv bin options 0: open (no max. limit) others: please refer to the iv bin table minimum iv bin options please refer to the iv bin table brightness level 0x: less brightness 62: higher brightness color options 3,7: gap her 4,8: gap yellow (except d4xx) 5,9: gap green package options 3: t-1 3/4 (5 mm) d: t-1 3/4 (5 mm) gap orange
3 optical/electrical characteristics at t a = 25c test symbol parameter color min. typ. max. units condition 2 q 1 / 2 included angle high efciency red 60 deg. i f = 10 ma between half orange 60 see note 1 luminous intensity yellow 60 points green 60 l peak peak wavelength high efciency red 635 nm measurement orange 600 at peak yellow 583 green 565 dl 1/2 spectral line halfwidth her/orange 40 nm yellow 36 green 28 l d dominant wavelength high efciency red 626 nm see note 2 orange 602 yellow 585 green 569 t s speed of response high efciency red 90 ns orange 280 yellow 90 green 500 c capacitance high efciency red 11 pf v f = 0; orange 4 f = 1 mhz yellow 15 green 18 r q j-pin thermal resistance all 260 c/w junction to cathode lead v f forward voltage her/orange 1.9 2.4 v i f = 10 ma yellow 2.0 2.4 green 2.1 2.7 v r reverse breakdown all 5.0 v i r = 100 a voltage h v luminous efcacy high efciency red C 145 lumens see note 3 orange 380 watt yellow C 500 green 595 notes: 1. q 1 / 2 is the of-axis angle at which the luminous intensity is half the axial luminous intensity. 2. the dominant wavelength, l d , is derived from the cie chromaticity diagram and represents the single wavelength which defnes the color of the device. 3. radiant intensity, i e , in watts/steradian, may be found from the equation i e = i v / h v , where i v is the luminous intensity in candelas and h v is the luminous efcacy in lumens/watt.
4 figure 1. relative intensity vs. wavelength absolute maximum ratings at t a = 25c green/ parameter her/orange yellow emerald green units peak forward current 90 60 90 ma average forward current [1] 25 20 25 ma dc current [2] 30 20 30 ma power dissipation [3] 135 85 135 mw reverse voltage (i r = 100 a) 5 5 5 v transient forward current [4] 500 500 500 ma (10 sec pulse) led junction temperature 110 110 110 c operating temperature range -40 to +100 -40 to +100 -20 to +100 c storage temperature range -40 to +100 -40 to +100 -40 to +100 c notes: 1. see figure 5 (red/orange), 10 (yellow), or 15 (green) to establish pulsed operating conditions. 2. for red, orange and green series derate linearly from 50c at 0.5 ma/c. for yellow series derate linearly from 50c at 0.2 ma/c. 3. 1.8 mw/c. for yellow series derate power linearly from 50c at 1.6 mw/c. 4. the transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the led die and wirebond. it is not recommended that the device be operated at peak currents beyond the peak forward current listed in the absolute maxi - mum ratings. orange wavelength ? nm relative intensity 1.0 0.5 0 500 550 600 650 700 750 yello w emerald green green t = 25 c a high efficiency re d
5 t-1 3 / 4 high efciency red, orange difused lamps figure 3. relative luminous intensity vs. dc forward current figure 2. forward current vs. forward voltage characteristics figure 4. relative efciency (luminous intensity per unit current) vs. peak led current figure 5. maximum tolerable peak current vs. pulse duration. (i dc max as per max ratings) figure 6. relative luminous intensity vs. angular displacement
6 t-1 3 / 4 yellow difused lamps figure 8. relative luminous intensity vs. forward current figure 7. forward current vs. forward voltage characteristics figure 9. relative efciency (luminous intensity per unit current) vs. peak current figure 10. maximum tolerable peak current vs. pulse duration. (i dc max as per max ratings) figure 11. relative luminous intensity vs. angular displacement
7 t-1 3 / 4 green/emerald green difused lamps figure 15. maximum tolerable peak current vs. pulse duration. (i dc max as per max ratings) figure 16. relative luminous intensity vs. angular displacement figure 12. forward current vs. forward voltage characteristics figure 13. relative luminous intensity vs. dc forward current figure 14. relative efciency (luminous intensity per unit current) vs. peak led current
8 intensity bin limits intensity range (mcd) color bin min. max. d 2.4 3.8 e 3.8 6.1 f 6.1 9.7 g 9.7 15.5 h 15.5 24.8 i 24.8 39.6 j 39.6 63.4 k 63.4 101.5 l 101.5 162.4 m 162.4 234.6 n 234.6 340.0 red/orange o 340.0 540.0 p 540.0 850.0 q 850.0 1200.0 r 1200.0 1700.0 s 1700.0 2400.0 t 2400.0 3400.0 u 3400.0 4900.0 v 4900.0 7100.0 w 7100.0 10200.0 x 10200.0 14800.0 y 14800.0 21400.0 z 21400.0 30900.0 e 6.5 10.3 f 10.3 16.6 g 16.6 26.5 h 26.5 42.3 i 42.3 67.7 j 67.7 108.2 k 108.2 173.2 l 173.2 250.0 m 250.0 360.0 yellow n 360.0 510.0 o 510.0 800.0 p 800.0 1250.0 q 1250.0 1800.0 r 1800.0 2900.0 s 2900.0 4700.0 t 4700.0 7200.0 u 7200.0 11700.0 v 11700.0 18000.0 w 18000.0 27000.0
9 intensity bin limits, continued intensity range (mcd) color bin min. max. d 4.7 7.6 e 7.6 12.0 f 12.0 19.1 g 19.1 30.7 h 30.7 49.1 i 49.1 78.5 j 78.5 125.7 k 125.7 201.1 l 201.1 289.0 green m 289.0 417.0 n 417.0 680.0 o 680.0 1100.0 p 1100.0 1800.0 q 1800.0 2700.0 r 2700.0 4300.0 s 4300.0 6800.0 t 6800.0 10800.0 u 10800.0 16000.0 v 16000.0 25000.0 w 25000.0 40000.0 maximum tolerance for each bin limit is 18%. tolerance for each bin limit is 0.5 nm. color categories lambda (nm) color category # min. max. 6 561.5 564.5 5 564.5 567.5 green 4 567.5 570.5 3 570.5 573.5 2 573.5 576.5 1 582.0 584.5 3 584.5 587.0 yellow 2 587.0 589.5 4 589.5 592.0 5 592.0 593.0 1 597.0 599.5 2 599.5 602.0 3 602.0 604.5 orange 4 604.5 607.5 5 607.5 610.5 6 610.5 613.5 7 613.5 616.5 8 616.5 619.5
10 mechanical option matrix mechanical option code defnition 00 bulk packaging, minimum increment 500 pcs/bag 01 tape & reel, crimped leads, minimum increment 1300 pcs/bag 02 tape & reel, straight leads, minimum increment 1300 pcs/bag b1 right angle housing, uneven leads, minimum increment 500 pcs/bag b2 right angle housing, even leads, minimum increment 500 pcs/bag dd ammo pack, straight leads with minimum increment 2k/pack r4 tape & reel, straight leads, counter clockwise, anode lead leaving the reel frst note: all categories are established for classifcation of products. products may not be available in all categories. please contact your local avago repre - sentative for further clarifcation/information.
for product information and a complete list of distributors, please go to our website: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2008 avago technologies. all rights reserved. obsoletes 5989-4258en av02-1558en - october 13, 2008 precautions lead forming ? the leads of an led lamp may be preformed or cut to length prior to insertion and soldering into pc board. ? if lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to led package. otherwise, cut the leads of led to length after soldering process at room temperature. the solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the led chip die attach and wirebond. ? it is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. soldering conditions ? care must be taken during pcb assembly and soldering process to prevent damage to led component. ? the closest led is allowed to solder on board is 1.59 mm below the body (encapsulant epoxy) for those parts without standof. ? recommended soldering conditions: ? wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. customer is advised to periodically check on the soldering profle to ensure the soldering profle used is always conforming to recommended soldering condition. ? if necessary, use fxture to hold the led component in proper orientation with respect to the pcb during soldering process. ? proper handling is imperative to avoid excessive thermal stresses to led components when heated. therefore, the soldered pcb must be allowed to cool to room temperature, 25c, before handling. ? special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. ? recommended pc board plated through hole sizes for led component leads: manual solder wave soldering dipping pre-heat temperature 105 c max. C pre-heat time 30 sec max. C peak temperature 250 c max. 260 c max. dwell time 3 sec max. 5 sec max. led component plated through lead size diagonal hole diameter 0.457 x 0.457 mm 0.646 mm 0.976 to 1.078 mm (0.018 x 0.018 inch) (0.025 inch) (0.038 to 0.042 inch) 0.508 x 0.508 mm 0.718 mm 1.049 to 1.150 mm (0.020 x 0.020 inch) (0.028 inch) (0.041 to 0.045 inch) note: refer to application note an1027 for more information on soldering led components. figure 17. recommended wave soldering profle laminar wa e bo tt om side of pc bo ard ho t air nife turbulent wa e fluxing prehea t 0 1 0 2 0 30 50 100 150 200 250 30 40 50 time seconds tempera ture

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