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hlmp-cwxx precision optical performance white led lamps data sheet hlmp-cw11, hlmp-cw12, hlmp-cw26, hlmp-cw27, hlmp-cw36, hlmp-cw37, hlmp-cw46, hlmp-cw47, hlmp-cw76, hlmp-cw77, hlmp-fw66, hlmp-fw67 description these high intensity white led lamps are based on ingan material technology. a blue led die is coated by phosphor to produce white. the typical resulting color is described by the coordinates x = 0.31, y = 0.31 using the 1931 cie chromaticity diagram. these t-1 ? lamps are untinted, non-difused, and incorporate precise optics which produce well-defned spatial radiation patterns at specifc viewing cone angle. benefts ? reduced power consumption, higher reliability, and increased optical/mechanical design fexibility compared to incandescent bulbs and other alternative white light sources. features ? well defned spatial radiation pattern ? high luminous white emission ? viewing angle: 15, 23 and 30, 50, 70, 85 ? standof or non-standof leads ? superior resistance to moisture applications ? indoor electronic signs and signals ? small area illumination ? legend backlighting ? general purpose indicators caution: ingan devices are class 1c hbm esd sensitive per jedec standard. please observe appropriate precautions during handling and processing. refer to application note an-1142 for additional details.
package dimensions for 5mm round 15, 23 & 30 package package dimension a package dimension b 1.14 0.20 (0.045 0.008) 5.80 0.20 (0.228 0.008) 5.00 0.20 (0.197 0.008) 31.60 (1.244) min. 0.70 (0.028) max. 1.00 (0.039) min. 8.71 0.20 (0.343 0.008) 2.54 0.38 (0.100 0.015) 0.50 0.10 (0.020 0.004) sq. typ. cathode lead 2.35 (0.093) max. cathode flat dimension h: 15: 12.24 0.25mm (0.482 0.01 inches) 23: 12.50 0.25mm (0.492 0.01 inches) 30: 12.00 0.25mm (0.472 0.01 inches) 1.14 0.20 (0.045 0.008) 5.80 0.20 (0.228 0.008) 5.00 0.20 (0.197 0.008) 31.6 0 (1.244) min. 0.70 (0.028) max. 1.00 (0.039) min. 8.71 0.20 (0.343 0.008) 2.54 0.38 (0.100 0.015) 0.50 0.10 (0.020 0.004) sq. typ. cathode lead cathode flat 1.50 0.15 (0.059 0.006 ) dimension h
for 5mm round 50 and 70 package package dimension c package dimension d 1.14 0.20 (0.045 0.008) 5.80 0.20 (0.228 0.008) 5.00 0.20 (0.197 0.008) 31.60 (1.244) min. 0.70 (0.028) max. 1.00 (0.039) min. 8.71 0.20 (0.343 0.008) 2.54 0.38 (0.100 0.015) 0.50 0.10 (0.020 0.004) sq. typ. cathode lead 2.35 (0.093) max. cathode flat notes: 1 . all dimensions are in millimeters /inches. 2 . epoxy meniscus may extend about 1mm (0.040") down the leads. 3 . if heat-sinking application is required, the terminal for heat sink is anode. 1.14 0.20 (0.045 0.008) 5.80 0.20 (0.228 0.008) 5.00 0.20 (0.197 0.008) 31.60 (1.244) min. 0.70 (0.028) max. 1.00 (0.039) min. 8.71 0.20 (0.343 0.008) 2.54 0.38 (0.100 0.015) 0.50 0.10 (0.020 0.004) sq. typ. cathode lead cathode flat 1.50 0.15 (0.059 0.006) dimension h dimension h: 50: 11.98 0.25mm (0.4715 0.01 inches) 70: 11.09 0.25mm (0.4365 0.01 inches)
for flat top 85 package package dimension e package dimension f notes: 1. all dimensions are in millimeters /inches. 2. epoxy meniscus may extend about 1mm (0.040) down the leads. 3. if heat-sinking application is required, the terminal for heat sink is anode. 5.000.20 [ 0.1970.008 ] 1.140.20 [ 0.0450.008 ] 7.000.20 [ 0.2780.008 ] 31.60 min. [ 1.244 ] 0.500.10 [ 0.0200.004 ] 5.720.20 [ 0.2250.008 ] 2.540.38 [ 0.1000.015 ] cathode flat 1.00 [ 0.038 ] cathode ? lead min. sq. typ. 5.000.20 [ 0.1970.008 ] 1.140.20 [ 0.0450.008 ] 11.020.25 [ 0.4340.010 ] 31.60 min. [ 1.244 ] 5.720.20 [ 0.2250.008 ] 2.540.38 [ 0.1000.015 ] cathode flat cathode lead 0.500.10 [ 0.0200.004 ] 1.00 [ 0.038 ] min. sq. typ.
part numbering system hlmp - x w xx - x x x x x packaging option 00: flexi ammo packs dd: ammo packs color bin selection 0: open distribution b: color bin 2 & 3 maximum intensity bin 0: no maximum intensity limit minimum intensity bin refer to devise selection guide viewing angle and standoff option 11: 15 without standoff 12: 15 with standoff 26: 23 without standoff 27: 23 with standoff 36: 30 without standoff 37: 30 with standoff 46: 50 without standoff 47: 50 with standoff 76: 70 without standoff 77: 70 with standoff 66: 85 flat top without standoff 67: 85 flat top with standoff package c: 5mm round f: 5mm flat top note: please refer to ab 5337 for complete information about part numbering system.
device selection guide part number typical viewing angle 2 1/2 (degree) luminous intensity (mcd) at 20ma standof package dimension min. max. hlmp-cw11-x10xx 15 7200 21000 no a hlmp-cw11-y1bxx 15 9300 21000 no a hlmp-cw11-yz0xx 15 9300 16000 no a hlmp-cw12-x10xx 15 7200 21000 yes b hlmp-cw12-yz0xx 15 9300 16000 yes b hlmp-cw12-yzbxx 15 9300 16000 yes b hlmp-cw26-vy0xx 23 4200 12000 no a hlmp-cw26-wx0xx 23 5500 9300 no a hlmp-cw26-wxbxx 23 5500 9300 no a hlmp-cw27-vy0xx 23 4200 12000 yes b hlmp-cw27-wx0xx 23 5500 9300 yes b hlmp-cw36-ux0xx 30 3200 9300 no a hlmp-cw36-uxbxx 30 3200 9300 no a hlmp-cw36-vw0xx 30 4200 7200 no a hlmp-cw36-vwbxx 30 4200 7200 no a hlmp-cw37-ux0xx 30 3200 9300 yes b hlmp-cw37-vw0xx 30 4200 7200 yes b hlmp-cw37-vwbxx 30 4200 7200 yes b hlmp-cw46-ru0xx 50 1500 4200 no c hlmp-cw46-st0xx 50 1900 3200 no c hlmp-cw46-stbxx 50 1900 3200 no c hlmp-cw46-svbxx 50 1900 5500 no c hlmp-cw47-ru0xx 50 1500 4200 yes d hlmp-cw47-st0xx 50 1900 3200 yes d hlmp-cw47-stbxx 50 1900 3200 yes d hlmp-cw76-qt0xx 70 1150 3200 no c hlmp-cw76-qtbxx 70 1150 3200 no c hlmp-cw76-rs0xx 70 1500 2500 no c hlmp-cw76-rsbxx 70 1500 2500 no c hlmp-cw77-qt0xx 70 1150 3200 yes d hlmp-cw77-rs0xx 70 1500 2500 yes d hlmp-cw76-rsbxx 70 1500 2500 yes d hlmp-fw66-mq0xx 85 520 1500 no e hlmp-fw66-np0xx 85 680 1150 no e hlmp-fw66-npbxx 85 680 1150 no e hlmp-fw67-mq0xx 85 520 1500 yes f hlmp-fw67-np0xx 85 680 1150 yes f hlmp-fw67-npbxx 85 680 1150 yes f note: please refer to an 5352 for detail information on the features of stand-of and non stand-of leds.
absolute maximum rating, t a = 25c parameter white unit dc forward current [1] 30 ma peak forward current 100 [2] ma power dissipation 120 mw reverse voltage 5 (i r = 10 a) v led junction temperature 110 c operating temperature range -40 to +85 c storage temperature range -40 to +100 c notes: 1. derate linearly as shown in figure 2 2. duty factor 10%, frequency 1khz. optical/ electrical performance at 25c parameter symbol min typ max units test condition forward voltage v f 3.2 4.0 v i f = 20 ma reverse voltage v r 5.0 v i r = 10 a thermal resistance rf j-pin 240 ?c/w led junction to anode lead chromaticity coordinate x y 0.31 0.31 i f = 20 ma capacitance c 70 v f = 0,cf= 1mhz note: 1. the chromaticity coordinates are derived from the cie 1931 chromaticity diagram and represent the perceived color of the device.
figure 1. relative intensity vs wavelength 0 . 0 0 . 2 0 . 4 0 . 6 0 . 8 1 . 0 3 8 0 4 8 0 5 8 0 6 8 0 7 8 0 w a v e l e n g t h - n m r e l a t i v e l u m i n o u s i n t e n s i t y 0 5 1 0 1 5 2 0 2 5 3 0 3 5 0 2 0 4 0 6 0 8 0 1 0 0 t a - a m b i e n t t e m p e r a t u r e - c i f m a x . - m a x i m u m f o r w a r d c u r r e n t - m a figure 2. forward current vs ambient temperature figure 3. relative intensity vs dc forward current figure 4. chromaticity shift vs forward current figure 5. forward current vs forward voltage 0 0 . 3 0 . 6 0 . 9 1 . 2 1 . 5 0 1 0 2 0 3 0 f o r w a r d c u r r e n t - m a r e l a t i v e l u m i n o u s i n t e n s i t y - 0 . 0 1 0 - 0 . 0 0 5 0 . 0 0 0 0 . 0 0 5 0 . 0 1 0 0 . 0 1 5 0 . 0 2 0 0 . 0 2 5 - 0 . 0 0 5 0 . 0 0 0 0 . 0 0 5 0 . 0 1 0 0 . 0 1 5 x - c o o r d i n a t e s y - c o o r d i n a t e s 3 0 m a 2 0 m a 1 0 m a 5 m a 1 m a 0 5 1 0 1 5 2 0 2 5 3 0 2 . 0 2 . 2 2 . 4 2 . 6 2 . 8 3 . 0 3 . 2 3 . 4 3 . 6 v f - f o r w a r d v o l t a g e - v o l t s i f - f o r w a r d c u r r e n t - m a
figure 6. radiation pattern for hlmp-cw1x figure 7. radiation pattern for hlmp-cw2x figure 8. radiation pattern for hlmp-cw3x figure 9. radiation pattern for hlmp-cw4x figure 10. radiation pattern for hlmp-cw7x figure 11. radiation pattern for hlmp-fw6x 0 0 . 5 1 - 9 0 - 6 0 - 3 0 0 3 0 6 0 9 0 a n g u l a r d i s p l a c e m e n t ( ) r e l a t i v e l u m i n o u s i n t e n s i t y 0 0 . 5 1 - 9 0 - 6 0 - 3 0 0 3 0 6 0 9 0 a n g u l a r d i s p l a c e m e n t ( ) r e l a t i v e l u m i n o u s i n t e n s i t y 0 0 . 5 1 - 9 0 - 6 0 - 3 0 0 3 0 6 0 9 0 a n g u l a r d i s p l a c e m e n t ( ) r e l a t i v e l u m i n o u s i n t e n s i t y n o r m a l i z e d i n t e n s i t y 1 . 0 0 a n g u l a r d i s p l a c e m e n t - d e g r e e s 0 . 8 0 . 6 0 . 5 0 . 7 0 . 2 1 0 0 9 0 0 . 1 0 . 3 0 . 4 8 0 7 0 6 0 5 0 4 0 2 0 1 0 0 3 0 1 0 2 0 3 0 4 0 5 0 6 0 7 0 8 0 9 0 1 0 0 0 . 9 n o r m a l i z e d i n t e n s i t y 1 . 0 0 a n g u l a r d i s p l a c e m e n t - d e g r e e s 0 . 8 0 . 6 0 . 5 0 . 7 0 . 2 1 0 0 9 0 0 . 1 0 . 3 0 . 4 8 0 7 0 6 0 5 0 4 0 2 0 1 0 0 3 0 1 0 2 0 3 0 4 0 5 0 6 0 7 0 8 0 9 0 1 0 0 0 . 9 0.0 0.5 1.0 -90 -60 -30 0 3 0 6 0 9 0 angular replacement - degree relative intensity
10 intensity bin limit table at 20ma bin intensity (mcd) at 20 ma min max m 520 680 n 680 880 p 880 1150 q 1150 1500 r 1500 1900 s 1900 2500 t 2500 3200 u 3200 4200 v 4200 5500 w 5500 7200 x 7200 9300 y 9300 12000 z 12000 16000 1 16000 21000 tolerance for each bin limit is 15% color bin limit table rank limits (chromaticity coordinates) 1 x 0.330 0.330 0.356 0.361 y 0.360 0.318 0.351 0.385 2 x 0.287 0.296 0.330 0.330 y 0.295 0.276 0.318 0.339 3 x 0.264 0.280 0.296 0.283 y 0.267 0.248 0.276 0.305 4 x 0.283 0.287 0.330 0.330 y 0.305 0.295 0.339 0.360 tolerance for each bin limit is 0.01 note: 1. bin categories are established for classifcation of products. products may not be available in all bin categories. please contact your avago technologies representative for information on currently available bins. color bin limits with respect to cie 1931 chromaticity diagram 0 . 4 0 0 . 3 5 0 . 3 0 0 . 2 5 0 . 2 0 0 . 2 6 0 . 3 0 0 . 3 4 0 . 3 8 y - c o o r d i n a t e x - c o o r d i n a t e 3 2 4 1 b l a c k b o d y c u r v e note: bin categories are established for classifcation of products. products may not be available in all bin categories. please contact your avago representative for information on currently available bins. relative light output vs junction temperature 0.1 1 10 -40 -20 0 2 0 4 0 6 0 8 0 100 t j - junction temperature - ?c (normalized at t j = 25o) relative light output
11 ingan device anode precautions: lead forming: ? the leads of an led lamp may be preformed or cut to length prior to insertion and soldering on pc board. ? for better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. ? if manual lead cutting is necessary, cut the leads after the soldering process. the solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into led package. this is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. soldering and handling: ? care must be taken during pcb assembly and soldering process to prevent damage to the led component. ? led component may be efectively hand soldered to pcb. however, it is only recommended under unavoidable circumstances such as rework. the closest manual soldering distance of the soldering heat source (soldering irons tip) to the body is 1.59mm. soldering the led using soldering iron tip closer than 1.59mm might damage the led. note: 1. pcb with diferent size and design (component density) will have diferent heat mass (heat capacity). this might cause a change in temperature experienced by the board if same wave soldering setting is used. so, it is recommended to re-calibrate the soldering profle again before loading a new type of pcb. 2. avago technologies high brightness led are using high efciency led die with single wire bond as shown below. customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 250c and the solder contact time does not exceeding 3sec. over-stressing the led during soldering process might cause premature failure to the led due to delamination. avago technologies led confguration 1.59mm ? esd precaution must be properly applied on the soldering station and personnel to prevent esd damage to the led component that is esd sensitive. do refer to avago application note an 1142 for details. the soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. ? recommended soldering condition: wave soldering [1, 2] manual solder dipping pre-heat temperature 10 c max. - preheat time 0 sec max - peak temperature 0 c max. 0 c max. dwell time sec max. sec max note: 1) above conditions refers to measurement with thermocouple mounted at the bottom of pcb. 2) it is recommended to use only bottom preheaters in order to reduce thermal stress experienced by led. ? wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. customer is advised to perform daily check on the soldering profle to ensure that it is always conforming to recommended soldering conditions. note: electrical connection between bottom surface of led die and the lead frame is achieved through conductive paste. ? any alignment fxture that is being applied during wave soldering should be loosely ftted and should not apply weight or force on led. non metal material is recommended as it will absorb less heat during wave soldering process. ? at elevated temperature, led is more susceptible to mechanical stress. therefore, pcb must allowed to cool down to room temperature prior to handling, which includes removal of alignment fxture or pallet. ? if pcb board contains both through hole (th) led and other surface mount components, it is recommended that surface mount components be soldered on the top side of the pcb. if surface mount need to be on the bottom side, these components should be soldered using refow soldering prior to insertion the th led. ? recommended pc board plated through holes (pth) size for led component leads. led component lead size diagonal plated through hole diameter 0. x 0. mm (0.01x 0.01 inch) 0. mm (0.0 inch) 0. to 1.0 mm (0.0 to 0.0 inch) 0.0 x 0.0 mm (0.00x 0.00 inch) 0.0 mm (0.0 inch) 1.0 to 1.1 mm (0.0 1 to 0.0 inch) ? over-sizing the pth can lead to twisted led after clinching. on the other hand under sizing the pth can cause difculty inserting the th led.
1 note: the ammo-packs drawing is applicable for packaging option Cdd & -zz and regardless standof or non-standof ammo packs drawing a a 1 2 . 7 0 1 . 0 0 0 . 5 0 0 . 0 3 9 4 2 0 . 5 0 1 . 0 0 0 . 8 0 7 0 . 0 3 9 1 8 . 0 0 0 . 5 0 0 . 7 0 8 7 0 . 0 1 9 7 9 . 1 2 5 0 . 6 2 5 0 . 3 5 9 3 0 . 0 2 4 6 1 2 . 7 0 0 . 3 0 0 . 5 0 0 . 0 1 1 8 0 . 7 0 0 . 2 0 0 . 0 2 7 6 0 . 0 0 7 9 6 . 3 5 1 . 3 0 0 . 2 5 0 . 0 5 1 2 ? \ c 7 ; 4 . 0 0 0 . 2 0 t y p . 0 . 1 5 7 5 0 . 0 0 8 c a t h o d e v i e w a - a example of wave soldering temperature profle for th led 0 3 0 1 0 0 2 5 0 2 0 0 1 5 0 1 0 0 5 0 t i m e ( m i n u t e s ) p r e h e a t t u r b u l e n t w a v e l a m i n a r w a v e h o t a i r k n i f e r e c o m m e n d e d s o l d e r : s n 6 3 ( l e a d e d s o l d e r a l l o y ) s a c 3 0 5 ( l e a d f r e e s o l d e r a l l o y ) f l u x : r o s i n f l u x s o l d e r b a t h t e m p e r a t u r e : 2 4 5 c 5 c ( m a x i m u m p e a k t e m p e r a t u r e = 2 5 0 c ) d w e l l t i m e : 1 . 5 s e c - 3 . 0 s e c ( m a x i m u m = 3 s e c ) n o t e : a l l o w f o r b o a r d t o b e s u f f i c i e n t l y c o o l e d t o r o o m t e m p e r a t u r e b e f o r e e x e r t i n g m e c h a n i c a l f o r c e . t e m p e r a t u r e ( c ) 2 0 1 0 4 0 5 0 7 0 9 0 8 0 6 0 refer to application note an5334 for more information about soldering and handling of high brightness th led lamps.
1 packaging box for ammo packs note: for ingan device, the ammo pack packaging box contain esd logo f r o m l e f t s i d e o f b o x a d h e s i v e t a p e m u s t b e f a c i n g u p w a r d s . a n o d e l e a d l e a v e s t h e b o x f i r s t . l a b e l o n t h i s s i d e o f b o x packaging label (i) avago mother label: (available on packaging box of ammo pack and shipping box) ( 1 p ) i t e m : p a r t n u m b e r ( 1 t ) l o t : l o t n u m b e r l p n ( 9 d ) m f g d a t e : m a n u f a c t u r i n g d a t e ( p ) c u s t o m e r i t e m : ( v ) v e n d o r i d m a d e i n : c o u n t r y o f o r i g i n ( q ) q t y : q u a n t i t y c a t : i n t e n s i t y b i n b i n : r e f e r t o b e l o w i n f o r m a t i o n r e v : d e p t i d : s t a n d a r d l a b e l l s 0 0 0 2 r o h s c o m p l i a n t e 1 m a x t e m p 2 5 0 c
disclaimer: avagos products and software are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, main - tenance or direct operation of a nuclear facility or for use in medical devices or applica - tions. customer is solely responsible, and waives all rights to make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use. acronyms and defnition: bin: (i) color bin only or vf bin only (applicable for part number with color bins but without vf bin or part number with vf bins and no color bin) or (ii) color bin incorporated with vf bin (applicable for part number that have both color bin and vf bin) (ii) avago baby label (only available on bulk packaging) example: (i) color bin only or vf bin only bin: 2 (represent color bin 2 only) bin: vb (represent vf bin vb only) (ii) color bin incorporate with vf bin bin: 2vb vb: vf bin vb 2: color bin 2 only p a r t # : p a r t n u m b e r l o t # : l o t n u m b e r m f g d a t e : m a n u f a c t u r i n g d a t e c / o : c o u n t r y o f o r i g i n c u s t o m e r p / n : s u p p l i e r c o d e : q u a n t i t y : p a c k i n g q u a n t i t y c a t : i n t e n s i t y b i n b i n : r e f e r t o b e l o w i n f o r m a t i o n d a t e c o d e : d a t e c o d e r o h s c o m p l i a n t e 1 m a x t e m p 2 5 0 c for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies limited in the united states and other countries. data subject to change. copyright ? 00-00 avago technologies limited. all rights reserved. av0 -0 en - april 1, 00

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