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hlmp-egxx, hlmp-elxx and hlmp-ehxx t- ? (5mm) extra high brightness alingap led lamps data sheet features ? f viewing fangle:f15,f23,f30 ? f high fluminousfoutput ? colors: f 590nm f amber f 615nm f red-orange f 626nm f red ? package foptions: f with forfwithoutfleadfstandof ? superior f resistancef tof moisture ? untinted f non-difusedf forf15fandf30flamps ? untinted fdifusedf forf23flamps applications ? trafc f management: -f trafc f signals -f pedestrian f signals -f work f zonef warningf lights -f variable fmessagef signs ? commercial f outdoorf advertising -f signs -f marquees description these f precision f opticalf performance f alingap f ledsf provide f superior f light f outputf for f excellent f readability f inf sunlight f andf are f extremely f reliable. f alingap f ledf tech - nologyf provides f extremely f stablef light f outputf over f longf periods f off time. f precision f opticalf performance f lampsf utilize f thef aluminumf indiumf galliumf phosphidef (alingap) f technology. f these f ledf lampsf are f untinted, f t-1? f packages f incorpo - rating f second f generation f opticsf producing f well f defnedf spatial f radiationf patternsf atfspecifcfviewingf conef angles. these f lampsf are f madef withf anf advanced f opticalf grade f epoxy f ofering f superior f highf temperature f andf highf moisture f resistance f performance f inf outdoor f signal f andf sign f application. f the f maximumf ledf junction f tempera - ture f limitf off +130cf enablesf highf temperature f operation f inf bright f sunlight f conditions. f the f epoxy f contains f bothf uv-a f andf uv-b f inhibitors f to f reduce f thef efects f off longf term f exposuref tof directf sunlight. benefts ? superior f performancef forf outdoorf environments ? suitablef forf auto-insertionf ontofpcf board
package dimension n o t e s : 1 . a l l d i m e n s i o n s a r e i n m i l l i m e t e r s ( i n c h e s ) . 2 . t a p e r s s h o w n a t t o p o f l e a d s ( b o t t o m o f l a m p p a c k a g e ) i n d i c a t e a n e p o x y m e n i s c u s t h a t m a y e x t e n d a b o u t 1 m m ( 0 . 0 4 0 i n . ) d o w n t h e l e a d s . 3 . r e c o m m e n d e d p c b o a r d h o l e d i a m e t e r s : - l a m p p a c k a g e a w i t h o u t s t a n d - o f f s : f l u s h m o u n t i n g a t b a s e o f l a m p p a c k a g e = 1 . 1 4 3 / 1 . 0 6 7 ( 0 . 0 4 4 / 0 . 0 4 2 ) . - l a m p p a c k a g e b w i t h s t a n d - o f f s : m o u n t i n g a t l e a d s t a n d - o f f s = 0 . 9 6 5 / 0 . 8 8 9 ( 0 . 0 3 8 / 0 . 0 3 5 ) . 4 . f o r d o m e h e i g h t s a b o v e l e a d s t a n d - o f f s e a t i n g p l a n e , d , l a m p p a c k a g e b , s e e t a b l e . b a 1 . 1 4 0 . 2 0 ( 0 . 0 4 5 ? 0 . 0 0 8 ) 5 . 8 0 0 . 2 0 ( 0 . 2 2 8 0 . 0 0 8 ) 5 . 0 0 0 . 2 0 ( 0 . 1 9 7 ? 0 . 0 0 8 ) 3 1 . 6 0 ( 1 . 2 4 4 ) m i n . 0 . 7 0 ( 0 . 0 2 8 ) m a x . 1 . 0 0 ( 0 . 0 3 9 ) m i n . 8 . 7 1 0 . 2 0 ( 0 . 3 4 3 0 . 0 0 8 ) 2 . 5 4 0 . 3 8 ( 0 . 1 0 0 0 . 0 1 5 ) 0 . 5 0 0 . 1 0 ( 0 . 0 2 0 0 . 0 0 4 ) s q . t y p . c a t h o d e l e a d 2 . 3 5 ( 0 . 0 9 3 ) m a x . c a t h o d e f l a t 1 . 1 4 0 . 2 0 ( 0 . 0 4 5 0 . 0 0 8 ) 5 . 8 0 0 . 2 0 ( 0 . 2 2 8 0 . 0 0 8 ) 5 . 0 0 0 . 2 0 ( 0 . 1 9 7 0 . 0 0 8 ) 3 1 . 6 0 ( 1 . 2 4 4 ) m i n . 0 . 7 0 ( 0 . 0 2 8 ) m a x . 1 . 0 0 ( 0 . 0 3 9 ) m i n . 8 . 7 1 0 . 2 0 ( 0 . 3 4 3 0 . 0 0 8 ) 2 . 5 4 0 . 3 8 ( 0 . 1 0 0 0 . 0 1 5 ) 0 . 5 0 0 . 1 0 ( 0 . 0 2 0 0 . 0 0 4 ) s q . t y p . c a t h o d e l e a d c a t h o d e f l a t d 1 . 5 0 0 . 1 5 ( 0 . 0 5 9 0 . 0 0 6 ) p a r t n o . d h l m p - x x 1 3 1 2 . 4 2 0 . 2 5 ( 0 . 4 8 9 0 . 0 1 0 ) h l m p - x x 2 3 1 1 . 5 9 0 . 2 5 ( 0 . 4 4 6 0 . 0 1 0 ) h l m p - x x 3 7 1 1 . 9 6 0 . 2 5 ( 0 . 4 7 1 0 . 0 1 0 ) 5 . f o r i d e n t i f i c a t i o n o f p o l a r i t y a f t e r t h e l e a d s a r e t r i m m e d o f f , p l e a s e r e f e r t o t h e i l l u s t r a t i o n b e l o w : 7 . m a j o r h e a t p a t h i s t h r o u g h t h e a n o d e l e a d c a t h o d e a n o d e
device selection guide typical viewing angle 2? (deg) [4] color and dominant wavelength (nm), typ. [3] lamps without standofs on leads (outline drawing a) lamps with standofs on leads (outline drawing b) luminous intensity iv (mcd) [1,2,5] @ 20ma min. max. 15 amber f590 hlmp-el12-vy0dd hlmp-el13-vy0dd 4200 12000 hlmp-el12-xykdd 7200 12000 red-orange f615 hlmp-eh12-vy0dd HLMP-EH13-VY0DD 4200 12000 red f626 hlmp-eg12-vy0dd hlmp-eg13-vy0dd 4200 12000 hlmp-eg12-wx0dd 5500 9300 23 amber f590 hlmp-el22-uxkdd hlmp-el23-uxkdd 3200 9300 hlmp-el22-ux0dd hlmp-el23-ux0dd 3200 9300 hlmp-el22-vwkdd 4200 7200 red-orange f615 hlmp-eh22-tw0dd hlmp-eh23-tw0dd 2500 7200 red f626 hlmp-eg22-ux0dd hlmp-eg23-ux0dd 3200 9300 hlmp-eg22-vw0dd 4200 7200 30 amber f590 hlmp-el35-tw0dd hlmp-el37-tw0dd 2500 7200 hlmp-el35-twkdd hlmp-el37-twkdd 2500 7200 hlmp-el35-uvkdd 3200 5500 red-orange f615 hlmp-eh35-sv0dd hlmp-eh37-sv0dd 1900 5500 red f626 hlmp-eg35-tw0dd hlmp-eg37-tw0dd 2500 7200 hlmp-eg35-uv0dd 3200 5500 notes: 1.f the fluminousf intensityfisf measuredfonfthefmechanicalfaxisfofftheflampf package. 2.f the fopticalfaxisfisfcloselyf alignedfwithfthef packagefmechanicalf axis. 3.f dominant f wavelength,f d,fisf derivedf fromfthefcief chromaticityf diagramfandf representsfthef colorfoffthef lamp. 4.f ? fisfthefof-axisfanglef wherefthefluminousf intensityfisfhalffthefon-axisf intensity.f 5.f tolerance f forfeachf intensityfbinflimitfisff15%.
part numbering system absolute maximum ratings at t a = 25c dcf forwardf currentf [1] 50fma peak f pulsedf forwardf current 100fma average f forwardf current 30fma reverse f voltage f (irf=f100f a)f 5f v operating f temperature f C40cf tof+100c storage f temperature f C40cf tof+100c notes: 1.f derate f linearlyfasf shownfinf figuref4. hlmp ? e x x x - x x x x x mechanical options 00 : bulk packaging dd : ammo pack yy : flexi-bin; bulk packaging zz : flexi-bin; ammo pack color bin selections 0 : full color distribution 2 : amber color bin 2 only 4 : amber color bin 4 only k : amber color bin 2 and 4 only z : special vf bin range maximum intensity bin 0 : no maximum intensity bin limitation minimum intensity bin viewing angle and lead standoffs 12 : 15 deg without lead standoffs 13 : 15 deg with lead standoffs 22 : 23 deg without lead standoffs 23 : 23 deg with lead standoffs 35 : 30 deg without lead standoffs 37 : 30 deg with lead standoffs color g : 626nm red h : 615nm red-orange l : 590nm amber note: f pleasef referf tofabf5337f forf completef informationfonf partf numberingf system.
5 electrical/ optical characteristics at t a = 25oc parameter symbol minimum average maximum units test condition forward f voltage f amber red red-orange v f 1.80 2.20 2.10 2.00 2.40 v i f f=f20ma peak f wavelength amber f red red-orange peak 590 626 615 nm i f f=f20ma dominant f wavelength f [1] amber f red red-orange d 584.5 620.0 612.0 594.5 630.0 621.7 nm i f f=f20ma reverse f voltage v r 5 v i r f=f100a spectral fhalfwidth d ? 17 nm i f f=f20fma capacitance f c 40 pf v f f=f0,fff=f1f mhz thermal f resistance r j-pin 240 oc/w ledf junction-to-anodef lead luminous f efcacyf [2] amber f red red-orange h v 480 150 260 lm/w emitted f luminousf flux/emittedf radiant f flux luminous f flux j v 1300 mlm i ff =f20ma luminous f efciency f[3] h e 30 lm/w emitted f luminousf flux/f electricalf power notes: 1.f the f dominant f wavelength, f df isf derived f from f thef cief chromaticity f diagram f referenced f to f illuminant f e. f tolerance f for f eachf color f off dominant f wavelength fisf+/-f0.5nm. 2.f the f radiant f intensity, f ief inf watts f perf steradian, f maybe f found f from f thef equation f ief =f iv f /f vf where f iv f isf thef luminousf intensity f inf candelaf andf vf isf thefluminousf efcacyfinf lumens/watt. 3.f h e f=f j v f/fi f ffxf v f ,f wheref j v ffisfthef emittedfluminousffux,fi f fisf electricalf forwardf currentfandf v f fisfthef forwardf voltage. figure 1. relative intensity vs. peak wavelength
figure 2. forward current vs. forward voltage figure 3. relative luminous intensity vs. forward current figure 4. maximum forward current vs. ambient temperature figure 5. representative spatial radiation pattern for 15 viewing angle lamps figure 6. representative spatial radiation pattern for 23 viewing angle lamps figure 7. representative spatial radiation pattern for 30 viewing angle lamps 0 10 20 30 40 50 60 0 0.5 1 1.5 2 2.5 3 forward voltage - v forward current - ma amber red-orang e red 0 0.5 1 1.5 2 2.5 0 1 0 2 0 3 0 4 0 5 0 dc forward current - ma relative luminous intensity (normalized at 20 ma) 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 -90 -60 -30 0 3 0 6 0 9 0 angular displacement - degrees normalized intensity 0 0 . 1 0 . 2 0 . 3 0 . 4 0 . 5 0 . 6 0 . 7 0 . 8 0 . 9 1 - 9 0 - 6 0 - 3 0 0 3 0 6 0 9 0 a n g u l a r d i s p l a c e m e n t - d e g r e e s n o r m a l i z e d i n t e n s i t y 0 5 10 15 20 25 30 35 40 45 50 55 0 2 0 4 0 6 0 8 0 100 120 t a - ambient temperature - oc i f - forward current - ma 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 -90 -60 -30 0 3 0 6 0 9 0 angular displacement -degrees normalized intensity
intensity bin limits (mcd at 20ma) bin name minimum maximum r 1500 1900 s 1900 2500 t 2500 3200 u 3200 4200 v 4200 5500 w 5500 7200 x 7200 9300 y 9300 12000 z 12000 16000 1 16000 21000 2 21000 27000 tolerance f forfeachfbinflimitfisff15% forward voltage bin limits (v at 20ma) bin name minimum maximum vd 1.8 2.0 va 2.0 2.2 vb 2.2 2.4 tolerance f forfeachfbinflimitfisff0.05v amber color bin limits (nm at 20ma) bin name minimum maximum 1 584.5 587.0 2 587.0 589.5 4 589.5 592.0 6 592.0 594.5 tolerance f forfeachfbinflimitfisff0.5nm note: f binf categories f are f establishedf for f classifcation f off products. f products f mayfnotf availablefinfallfbinf categories. figure 8. relative light output vs. junction temperature 0.1 1 10 -50 -25 0 2 5 5 0 7 5 100 125 150 junction temperature - c relative lop (normalize at 25 c ) amber red-orange red
precautions: lead forming: ? f the f leadsf off anf ledf lampf may f bef preformed f orf cutf to f lengthf priorf tof insertionfandf solderingfonfpcf board. ? f for f better f control, f itf isf recommended f to f usef proper f tool f to f precisely f form f andf cutf thef leadsf to f applicablef lengthf ratherfthanfdoingfitf manually. ? f if f manualf leadf cuttingf isf necessary, f cutf thef leadsf after f thef soldering f process. f the f solderf connection f forms f af mechanicalf ground f whichf prevents f mechanicalf stress f duef to f leadf cuttingf from f traveling f into f ledf package. f this f isf highlyf recommended f for f handf solderf operation, f asfthef excessfleadflengthfalsof actsfasfsmallf heatf sink. soldering and handling: ? f care f mustf bef takenf during f pcbf assemblyf andf soldering f process f to f prevent f damagef to f thef ledf component. f ? f led f component f may f bef efectively f handf soldered f to f pcb. f however, f itf isf onlyf recommended f underf unavoidable f circumstances f suchf asf rework. f the f closestf manualf soldering f distance f off thef soldering f heat f source f (soldering f irons f tip) f to f thef bodyf isf 1.59mm.f soldering f thef ledf usingf soldering f iron f tipf closerf thanf 1.59mmf mightfdamagefthef led. 1 . 5 9 m m ? f esd f precaution f mustf bef properly f appliedf onf thef soldering f station f andf personnelf to f prevent f esdf damagef to f thef ledf component f that f isf esdf sensitive. f do f refer f to f avago f application f note f anf 1142f for f details. f the f soldering f iron f usedf shouldf have f grounded f tipf to f ensure f electrostaticf chargefisf properlyf grounded. ? f recommended f solderingf condition: wave soldering [1, 2] manual solder dipping pre-heat f temperature 105fcf max. - preheat ftime 60fsecf max - peak f temperature 250fcf max. 260fcf max. dwell ftime 3fsecf max. 5fsecf max note: f 1.f above f conditions f refers f to f measurement f withf thermocouple f mounted f atfthef bottomfoff pcb. 2.f it f isf recommended f to f usef onlyf bottom f preheaters f inf order f to f reduce f thermal f stressf experiencedf byf led. ? f wave f soldering f parameters f mustf bef setf andf maintained f according f to f thef recommended f temperature f andf dwell f time. f customer f isf advisedf to f perform f dailyf checkf onf thef soldering f profle f to f ensure f that f itf isf always f conforming f to f recommended f soldering f conditions. note: f 1.f pcb f withf diferent f size f andf design f (component f density) f willf have f diferent f heat f massf (heat f capacity). f this f might f causef af changef inf temperature f experienced f by f thef board f iff samef wave f soldering f settingf isf used. f so, f itf isf recommended f to f re-calibrate f thef soldering f profle fagainf beforefloadingfafnewf typefoff pcb. 2.f avago f technologies f highf brightness f ledf are f usingf highf efciency f ledf dief withf singlef wire f bondf asf shown f below. f customer f isf advisedf to f takef extra f precaution f during f wave f soldering f to f ensure f that f thef maximumf wave f temperature f doesf notf exceed f 250cf andf thef solderf contact f timef doesf notf exceeding f 3sec. f over-stressing f thef ledf during f soldering f process f might f causef premature f failure f to f thef ledf duef tof delamination. avago technologies led confguration anode ingan device f note: f electrical f connection f between f bottom f surface f off ledf dief andf thefleadf framefisf achievedf throughf conductivef paste. ? f any f alignment f fxture f that f isf beingf appliedf during f wave f soldering f shouldf bef looselyf ftted f andf shouldf notf applyf weight f orf force f onf led. f nonf metalf material f isf recommended f asf itf willf absorb f lessf heat f during f wave f solderingf process. f note: f in f order f to f further f assistf customer f inf designing f jigf accurately f that f ftf avago f technologies f product, f 3df modelf off thef product f isf available fuponf request. ? f at f elevated f temperature, f ledf isf more f susceptible f to f mechanicalf stress. f therefore, f pcbf mustf allowed f to f cool f down f to f room f temperature f prior f to f handling, f whichf includesf removalfoff alignmentf fxtureforf pallet. ? f if f pcbf board f contains f bothf through f holef (th) f ledf andf otherf surface f mount f components, f itf isf recommended f that f surface f mount f components f bef soldered f onf thef top f sidef off thef pcb. f if f surface f mount f needf to f bef onf thef bottom f side, f thesef components f shouldf bef soldered f usingf refowf solderingf priorf tof insertionfthef thf led. ? f recommended f pcf board f plated f through f holesf (pth)f size f forfledf componentf leads. led component lead size diagonal plated through hole diameter 0.45fxf0.45fmm (0.018xf0.018finch) 0.636fmm (0.025finch) 0.98f tof1.08fmm (0.039f tof0.043finch) 0.50fxf0.50fmm (0.020xf0.020finch) 0.707fmm (0.028finch) 1.05f tof1.15fmm (0.041f tof0.045finch) ? f over-sizing f thef pthf canf leadf to f twisted f ledf after f clinching. f onf thef otherf handf underf sizingf thef pthf canf causef difcultyf insertingfthef thfled
figure 10. dimension for ammo pack figure 9. recommended wave soldering profle recommended wave soldering profle ammo packs drawing note: f the f ammo-packsf drawingfisfapplicablef forf packagingfoptionfCddf&f-zzfandf regardlessfstandofforfnon-standof 0 3 0 4 0 9 0 1 0 0 2 5 0 2 0 0 1 5 0 1 0 0 5 0 t i m e ( m i n u t e s ) p r e h e a t t u r b u l e n t w a v e l a m i n a r w a v e h o t a i r k n i f e r e c o m m e n d e d s o l d e r : s n 6 3 ( l e a d e d s o l d e r a l l o y ) s a c 3 0 5 ( l e a d f r e e s o l d e r a l l o y ) f l u x : r o s i n f l u x s o l d e r b a t h t e m p e r a t u r e : 2 4 5 c 5 c ( m a x i m u m p e a k t e m p e r a t u r e = 2 5 0 c ) d w e l l t i m e : 1 . 5 s e c - 3 . 0 s e c ( m a x i m u m = 3 s e c ) n o t e : a l l o w f o r b o a r d t o b e s u f f i c i e n t l y c o o l e d t o r o o m t e m p e r a t u r e b e f o r e e x e r t i n g t e m p e r a t u r e ( c ) 1 0 2 0 6 0 7 0 8 0 5 0 m e c h a n i c a l f o r c e .
0 packaging box for ammo packs figure 11. the arrangement of unit in ammo pack note: f the fdimensionf forfammofpackfisfapplicablef forfthef devicefwithfstandoffandfwithoutf standof. packaging label: (i) avago mother label: (available on packaging box of ammo pack and shipping box) ( 1 p ) i t e m : p a r t n u m b e r ( 1 t ) l o t : l o t n u m b e r l p n : ( 9 d ) m f g d a t e : m a n u f a c t u r i n g d a t e ( p ) c u s t o m e r i t e m : ( v ) v e n d o r i d : d e p t i d : m a d e i n : c o u n t r y o f o r i g i n ( q ) q t y : q u a n t i t y c a t : i n t e n s i t y b i n b i n : r e f e r t o b e l o w i n f o r m a t i o n ( 9 d ) d a t e c o d e : d a t e c o d e s t a n d a r d l a b e l l s 0 0 0 2 r o h s c o m p l i a n t e 3 m a x t e m p 2 5 0 c ( 1 p ) p a r t # : p a r t n u m b e r ( 1 t ) l o t # : l o t n u m b e r ( 9 d ) m f g d a t e : m a n u f a c t u r i n g d a t e c / o : c o u n t r y o f o r i g i n c u s t o m e r p / n : s u p p l i e r c o d e : q u a n t i t y : p a c k i n g q u a n t i t y c a t : i n t e n s i t y b i n b i n : r e f e r t o b e l o w i n f o r m a t i o n d a t e c o d e : d a t e c o d e r o h s c o m p l i a n t e 3 m a x t e m p 2 5 0 c l a m p s b a b y l a b e l
disclaimer: avagos products and software are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenance or direct operation of a nuclear facility or for use in medical devices or applications. customer is solely responsible, and waives all rights to make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use. ( 1 p ) i t e m : p a r t n u m b e r ( 1 t ) l o t : l o t n u m b e r l p n : ( 9 d ) m f g d a t e : m a n u f a c t u r i n g d a t e ( p ) c u s t o m e r i t e m : ( v ) v e n d o r i d : d e p t i d : m a d e i n : c o u n t r y o f o r i g i n ( q ) q t y : q u a n t i t y c a t : i n t e n s i t y b i n b i n : r e f e r t o b e l o w i n f o r m a t i o n ( 9 d ) d a t e c o d e : d a t e c o d e s t a n d a r d l a b e l l s 0 0 0 2 r o h s c o m p l i a n t e 3 m a x t e m p 2 5 0 c ( 1 p ) p a r t # : p a r t n u m b e r ( 1 t ) l o t # : l o t n u m b e r ( 9 d ) m f g d a t e : m a n u f a c t u r i n g d a t e c / o : c o u n t r y o f o r i g i n c u s t o m e r p / n : s u p p l i e r c o d e : q u a n t i t y : p a c k i n g q u a n t i t y c a t : i n t e n s i t y b i n b i n : r e f e r t o b e l o w i n f o r m a t i o n d a t e c o d e : d a t e c o d e r o h s c o m p l i a n t e 3 m a x t e m p 2 5 0 c l a m p s b a b y l a b e l (ii) avago baby label (only available on bulk packaging) acronyms and defnition: bin:f (i)f colorfbinfonlyforf vffbinfonly (applicable f for f part f numberf withf color f binsf butf withoutf vff binf orf part f numberf withf vff binsf andf nof color fbin) orf (ii)f colorfbinf incorporatedfwithf vffbin (applicable f for f part f numberf that f have f bothf color f binfandf vffbin) example:f (i)f colorfbinfonlyforf vffbinfonly f bin: f2f (representf colorfbinf2fonly) f bin: f vbf (representf vffbinf vb fonly) (ii)f colorfbinf incorporatefwithf vffbin f bin: f2vb f vb:f vffbinf vb f 2:ff colorfbinf2fonly for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 005-00 avago technologies. all rights reserved. av0 -00 en - january 5, 00

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