hlmp-egxx, hlmp-elxx and hlmp-ehxx t- ? (5mm) extra high brightness alingap led lamps data sheet features ? f viewing fangle:f15,f23,f30 ? f high fluminousfoutput ? colors: f 590nm f amber f 615nm f red-orange f 626nm f red ? package foptions: f with forfwithoutfleadfstandof applications ? trafc f management: -f trafc f signals -f pedestrian f signals -f work f zonef warningf lights -f variable fmessagef signs ? commercial f outdoorf advertising -f signs -f marquees description these f precision f opticalf performance f alingap f ledsf provide f superior f light f outputf for f excellent f readability f inf sunlight f andf are f extremely f reliable. f alingap f ledf tech - nologyf provides f extremely f stablef light f outputf over f longf periods f off time. f precision f opticalf performance f lampsf utilize f thef aluminumf indiumf galliumf phosphidef (alingap) f technology. f these f ledf lampsf are f untinted, f t-1? f packages f incorpo - rating f second f generation f opticsf producing f well f defnedf spatial f radiationf patternsf atfspecifcfviewingf conef angles. benefts ? superior f performancef forf outdoorf environments ? suitablef forf auto-insertionf ontofpcf board
package dimension notes: 1 . all dimensions are in millimeters (inches) . 2 . leads are mild steel, solder dipped. 3 . tapers shown at top of leads (bottom of lamp package) indicate an epoxy meniscus that may extend about 1 mm (0.040 in.) down the leads. 4 . recommended pc board hole diameters: - lamp package a without stand-offs: flush mounting at base of lamp package = 1.143/1.067 (0.044/0.042) . - lamp package b with stand-offs: mounting at lead stand-offs = 0.965/0.889 (0.038/0.035) . 5 . for dome heights above lead stand-off seating plane, d, lamp package b, see table. b a 1.14 0.20 (0.045 ? 0.008) 5.80 0.20 (0.228 0.008) 5.00 0.20 (0.197 ? 0.008) 31.60 (1.244) min. 0.70 (0.028) max. 1.00 (0.039) min. 8.71 0.20 (0.343 0.008) 2.54 0.38 (0.100 0.015) 0.50 0.10 (0.020 0.004) sq. typ. cathode lead 2.35 (0.093) max. cathode flat 1.14 0.20 (0.045 0.008) 5.80 0.20 (0.228 0.008) 5.00 0.20 (0.197 0.008) 31.60 (1.244) min . 0.70 (0.028) max. 1.00 (0.039) min. 8.71 0.20 (0.343 0.008) 2.54 0.38 (0.100 0.015) 0.50 0.10 (0.020 0.004 ) sq. typ. cathode lea d cathode fla t d 1.50 0.15 (0.059 0.006 ) part no. d hlmp-xx13 12.42 0.25 (0.489 0.010 ) hlmp-xx23 11.59 0.25 (0.446 0.010 ) hlmp-xx37 11.96 0.25 (0.471 0.010 ) 6 . for identification of polarity after the leads are trimmed off, please refer to the illustration below: 7 . major heat path is through the anode lead cathode anode
device selection guide typical viewing angle 2? (deg) [4] color and dominant wavelength (nm), typ. [3] lamps without standofs on leads (outline drawing a) lamps with standofs on leads (outline drawing b) luminous intensity iv (mcd) [1,2,5] @ 20ma min. max. 5 amber 590 hlmp-el -vy0dd hlmp-el -vy0dd 400 000 hlmp-el -xykdd 700 000 red-orange 6 5 hlmp-eh -vy0dd hlmp-eh -vy0dd 400 000 red 66 hlmp-eg -vy0dd hlmp-eg -vy0dd 400 000 hlmp-eg -wx0dd 5500 900 amber 590 hlmp-el -uxkdd hlmp-el -uxkdd 00 900 hlmp-el -ux0dd hlmp-el -ux0dd 00 900 hlmp-el -vwkdd 400 700 red-orange 6 5 hlmp-eh -tw0dd hlmp-eh -tw0dd 500 700 red 66 hlmp-eg -ux0dd hlmp-eg -ux0dd 00 900 hlmp-eg -vw0dd 400 700 0 amber 590 hlmp-el 5-tw0dd hlmp-el 7-tw0dd 500 700 hlmp-el 5-twkdd hlmp-el 7-twkdd 500 700 hlmp-el 5-uvkdd 00 5500 red-orange 6 5 hlmp-eh 5-sv0dd hlmp-eh 7-sv0dd 900 5500 red 66 hlmp-eg 5-tw0dd hlmp-eg 7-tw0dd 500 700 hlmp-eg 5-uv0dd 00 5500 notes: 1.f the fluminousf intensityfisf measuredfonfthefmechanicalfaxisfofftheflampf package. 2.f the fopticalfaxisfisfcloselyf alignedfwithfthef packagefmechanicalf axis. 3.f dominant f wavelength,f d,fisf derivedf fromfthefcief chromaticityf diagramfandf representsfthef colorfoffthef lamp. 4.f ? fisfthefof-axisfanglef wherefthefluminousf intensityfisfhalffthefon-axisf intensity.f 5.f tolerance f forfeachf intensityfbinflimitfisff15%.
4 part numbering system absolute maximum ratings at t a = 25c dc forward current [] 50 ma peak pulsed forward current 00 ma average forward current 0 ma reverse voltage (ir = 00 a) 5 v operating temperature C40c to + 00c storage temperature C40c to + 0c wave soldering temperature [] 50c for seconds solder dipping temperature [] 60c for 5 seconds notes: 1.f derate f linearlyfasf shownfinf figuref4. 2.f 1.59mm f(0.060fin.)f belowfbody hlmp ? e x x x - x x x x x mechanical options 00 : bulk packaging dd : ammo pack yy : flexi-bin; bulk packaging zz : flexi-bin; ammo pack color bin selections 0 : full color distribution 2 : amber color bin 2 only 4 : amber color bin 4 only k : amber color bin 2 and 4 only z : special vf bin range maximum intensity bin 0 : no maximum intensity bin limitation minimum intensity bin viewing angle and lead standoffs 12 : 15 deg without lead standoffs 13 : 15 deg with lead standoffs 22 : 23 deg without lead standoffs 23 : 24 deg with lead standoffs 35 : 30 deg without lead standoffs 37 : 30 deg with lead standoffs color g : 626nm red h : 615nm red-orange l : 590nm amber
5 electrical/ optical characteristics at t a = 25oc parameter symbol minimum average maximum units test condition forward voltage amber red red-orange v f .80 .0 .0 .00 .40 v i f = 0ma peak wavelength amber red red-orange peak 590 66 65 nm i f = 0ma dominant wavelength [] amber red red-orange d 584.5 60.0 6.0 594.5 60.0 6.7 nm i f = 0ma reverse voltage v r 5 v i r = 00fa spectral halfwidth d ? 7 nm i f = 0 ma capacitance c 40 pf v f = 0, f = mhz thermal resistance r j-pin 40 oc/w led junction-to-anode lead luminous efcacy [] amber red red-orange h v 480 50 60 lm/w emitted luminous flux/emitted radiant flux notes: 1.f the f dominant f wavelength, f df isf derived f from f thef cief chromaticity f diagram f referenced f to f illuminant f e. f tolerance f for f eachf color f off dominant f wavelength fisf+/-f0.5nm. 2.f the f radiant f intensity, f ief inf watts f perf steradian, f maybe f found f from f thef equation f ief =f iv f /f vf where f iv f isf thef luminousf intensity f inf candelaf andf vf isf thefluminousf efcacyfinf lumens/watt. figure 1. relative intensity vs. peak wavelength
6 figure 2. forward current vs. forward voltage figure 3. relative luminous intensity vs. forward current figure 4. maximum forward current vs. ambient temperature figure 5. representative spatial radiation pattern for 15 viewing angle lamps figure 6. representative spatial radiation pattern for 23 viewing angle lamps figure 7. representative spatial radiation pattern for 30 viewing angle lamps 0 10 20 30 40 50 60 0 0.5 1 1.5 2 2.5 3 forward voltage - v forward current - ma amber red-orang e red 0 0.5 1 1.5 2 2.5 0 1 0 2 0 3 0 4 0 5 0 dc forward current - ma relative luminous intensity (normalized at 20 ma) 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 -90 -60 -30 0 3 0 6 0 9 0 angular displacement - degrees normalized intensity 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 -90 -60 -30 0 3 0 6 0 9 0 angular displacement - degrees normalized intensity 0 5 10 15 20 25 30 35 40 45 50 55 0 2 0 4 0 6 0 8 0 100 120 t a - ambient temperature - oc i f - forward current - ma 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 -90 -60 -30 0 3 0 6 0 9 0 angular displacement -degrees normalized intensity
7 intensity bin limits (mcd at 20ma) bin name minimum maximum r 500 900 s 900 500 t 500 00 u 00 400 v 400 5500 w 5500 700 x 700 900 y 900 000 z 000 6000 6000 000 000 7000 tolerance f forfeachfbinflimitfisff15% forward voltage bin limits (v at 20ma) bin name minimum maximum vd .8 .0 va .0 . vb . .4 tolerance f forfeachfbinflimitfisff0.05v amber color bin limits (nm at 20ma) bin name minimum maximum 584.5 587.0 587.0 589.5 4 589.5 59.0 6 59.0 594.5 tolerance f forfeachfbinflimitfisff0.5nm note: f binf categories f are f establishedf for f classifcation f off products. f products f mayfnotf availablefinfallfbinf categories. figure 8. relative light output vs. junction temperature 0.1 1 10 -50 -25 0 2 5 5 0 7 5 100 125 150 junction temperature - c relative lop (normalize at 25 c ) amber red-orange red
8 precautions: lead forming: ? f the f leadsf off anf ledf lampf may f bef performed f orf cutf to f lengthf priorf tof insertionfandf solderingfonfpcf board. ? f if f leadf forming f isf required f before f soldering, f care f mustf bef takenf to f avoid f any f excessive f mechanicalf stress f that f induced f into f thef ledf package. f otherwise, f cutf thef leadsf to f applicablef lengthf after f soldering f process f at f room f temperature. f the f solderf joint f formed f willf absorb f thef mechanicalf stress, f duef to f thef leadf cutting, f from f traveling f tofthefledfchipfdief attachfandf wirebond.f ? f for f better f control, f itf isf recommended f to f usef proper f tool f to f precisely f form f andf cutf thef leadsf to f applicablef lengthf ratherfthanfdoingfitf manually. soldering condition: ? f care f mustf bef takenf during f pcbf assemblyf andf soldering f process f to f prevent f damagef to f thef ledf component. f ? f the f closestf manualf soldering f distance f off thef soldering f heat f source f (soldering f irons f tip) f to f thef bodyf isf 1.59mm.f soldering f thef ledf closerf thanf 1.59mmf might f damagefthef led.f avago technologies led confguration 1.59mm anode allngap device ? f recommended f solderingf condition: wavefsoldering manualfsolderf dipping pre-heat temperature 05 c max. - preheat time 0 sec max - peak temperature 50 c max. 60 c max. dwell time sec max. 5 sec max ? f wave f soldering f parameter f mustf bef setf andf maintain f according f to f thef recommended f temperature f andf dwell f time. f customer f isf advisedf to f dailyf checkf onf thef soldering f profle f to f ensure f that f thef soldering f profle f isf always f conforming f to f recommended f soldering f condition. note: f 1.f pcb f withf diferent f size f andf design f (component f density) f willf have f diferent f heat f massf (heat f capacity). f this f might f causef af changef inf temperature f experienced f by f thef board f iff samef wave f soldering f settingf isf used. f so, f itf isf recommended f to f re-calibrate f thef soldering f profle fagainf beforefloadingfafnewf typefoff pcb. 2.f avago f technologies f highf brightness f ledf are f usingf highf efciency f ledf dief withf singlef wire f bondf asf shown f below. f customer f isf advisedf to f takef extra f precaution f during f wave f soldering f to f ensure f that f thef maximumf wave f temperature f isf notf exceeding f 250c.f over-stressing f thef ledf during f soldering f process f might f causef premature f failure f to f thefledfduef tof delamination. f note: f electrical f connection f between f bottom f surface f off ledf dief andf thefleadf framef materialf throughf conductivef pastefoff solder. ? f if f necessary, f usef fxture f to f holdf thef ledf component f inf proper f orientation f withf respect f to f thef pcbf during f soldering f process. ? f at f elevated f temperature, f thef ledf isf more f susceptible f to f mechanicalf stress. f therefore, f pcbf mustf allowed f to f cool f down f to f room f temperature f prior f to f handling, f whichfincludesf removalfoff jigs,f fxturesforf pallet. ? f special f attention f mustf bef given f to f board f fabrication, f solderf masking, f surface f platting f andf leadf holesf size f andf componentf orientationf tof assurefthef solderability. ? f recommended f pcf board f plated f through f holesf size f for f ledf componentf leads. ledfcomponentf f leadfsize diagonal platedfthroughf f holefdiameter 0.457 x 0.457 mm (0.08 x 0.08 inch) 0.646 mm (0.05 inch) 0.976 to .078 mm (0.0 8 to 0.04 inch) 0.508 x 0.508 mm (0.00 x 0.00 inch) 0.78 mm (0.08 inch) .049 to .50 mm (0.04 to 0.045 inch) ? f under f sizingf off plated f through f holef canf leadf to f twisting f orf improper f ledf placement f during f auto f insertion. f over f sizingf plated f through f holef canf leadf to f mechanicalf stressfonfthef epoxyflensf duringf clinching. f note: f refer f to f application f note f an1027f for f more f information f onf soldering fledf components.
9 figure 10. dimension for ammo pack figure 9. recommended wave soldering profle recommended wave soldering profle ammo packs drawing note: f the f ammo-packsf drawingfisfapplicablef forf packagingfoptionfCddf&f-zzfandf regardlessfstandofforfnon-standof bottomfsid e topfsidef note:fallowfforfboardsftofbe conveyorfspeedf=f1.83fm/minf(6fft/min ) 250 20 0 150 fluxing turbulentf wave prehea t timef-fseconds temperaturef-f c 10 0 50 30 0 10 20 30 40 50 60 70 80 90 10 0 laminarf wave hotfairfknife leadffreefsolder 96.5%sn;f3.0%ag;f0.5%fc u sufficientlyfcooledfbefore exertingfmechanicalfforce. offpcfboard offpcfboard preheatfsettingf=f15 0 cf(10 0 cfpcb) solderfwaveftemperaturef=f24 5 cff5?c airfknifefairftemperaturef=f390 c airfknifefdistancef=f1.91fmmf(0.25fin.) solder:fsn63;fflux:frma airfknifefanglef=f4 0
packaging box for ammo packs figure 11. the arrangement of unit in ammo pack note: f the fdimensionf forfammofpackfisfapplicablef forfthef devicefwithfstandoffandfwithoutf standof. for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies, limited in the united states and other countries. data subject to change. copyright ? 007 avago technologies limited. all rights reserved. av0 -0086en - january , 007
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