description the pg2035t5f is a gaas mmic dpdt switch for 2.4 ghz and 5 ghz dualband wireless lan. high isolation and dualband operations suit to dualband wireless lan system. features ? operating frequency : f = 2.4 to 2.5 ghz and 4.9 to 6.0 ghz low insertion loss : l ins 1 = 0.8 db typ. @ f = 2.4 to 2.5 ghz : l ins 2 = 1.2 db typ. @ f = 4.9 to 6.0 ghz handling power : p in (1 db) = +31 dbm typ. @ f = 2.4 to 2.5 ghz : +30 dbm typ. @ f = 4.9 to 6.0 ghz control voltage : v cont = +3.0 v/0 v (two control type) high isolation : isl1 (between input and outp ut) = 34 db typ. @ f = 2.4 to 2.5 ghz : isl2 (between input and output) = 33 db typ. @ f = 4.9 to 6.0 ghz : isl3 (between tx and rx, between ant1 and ant2) = 24 db typ. @ f = 2.4 to 2.5 ghz : isl4 (between tx and rx, between ant1 and ant2) = 22 db typ. @ f = 4.9 to 6.0 ghz input/output return loss : rl in /rl out = 15 db typ. switching speed : 50 ns @ t rise /t fall (10/90% rf) 12-pin plastic qfn package (3.0 3.0 0.75 mm) application 2.4 ghz and 5 ghz dualband wir eless lan : ieee802.11a+b/g ordering information part number package marking supplying form pg2035t5f-e2 12-pin plastic qfn 2035 ? embossed tape 8 mm wide ? pin 1 indicates roll-in direction of tape ? qty 3 kpcs/reel remark to order evaluation samples, contact your nearby sales office. part number for sample order: pg2035t5f data sheet caution observe precautions when handling because these devices are sensitive to electrostatic discharge. the information in this document is subject to change without notice. before using this document, please confirm that this is the latest version. not all devices/types available in every country. please check with local nec compound semiconductor devices representative for availability and additional information. gaas mmic dpdt switch for 2.4 ghz and 5 ghz dualband wireless lan gaas integrated circuit pg2035t5f document no. pg10474ej01v0ds (1st edition) date published march 2004 cp(k) printed in japan ? nec compound semiconductor devices 2003, 2004
pin connections and internal block diagram pin no. pin name description 1 nc ground 2 nc ground 3 v cont1 control 1 4 ant1 antenna port 1 5 nc ground 6 ant2 antenna port 2 7 v cont2 control 2 8 nc ground 9 nc ground 10 rx receive port 11 nc ground 12 tx transmit port (top view) 1 2 3 4 5 6 9 8 7 12 11 10 exposed pad gnd ground remark nc is functionally non-connection pin but actually grounding is recommended. truth table v cont1 v cont2 ant1-rx ant1-tx ant2-tx ant2-rx 2.7 to 5.0 v 0 0.2 v on off on off 0 0.2 v 2.7 to 5.0 v off on off on absolute maximum ratings (t a = +25 c, unless otherwise specified) parameter symbol ratings unit switch control voltage v cont ? 6.0 to +6.0 note 1 v input power p in +36 dbm total power dissipation p tot 0.15 note 2 w operating ambient temperature t a ? 45 to +85 c storage temperature t stg ? 55 to +150 c notes 1. | v cont1 ? v cont2 | 6.0 v 2. mounted on double-sided copper-clad 50 50 1.6 mm epoxy glass pwb, t a = +85 c data sheet pg10474ej01v0ds 2 pg2035t5f
recommended operating range (t a = +25 c) parameter symbol min. typ. max. unit operating frequency 1 f1 2.4 ? 2.5 ghz operating frequency 2 f2 4.9 ? 6.0 ghz switch control voltage (h) v cont (h) 2.7 3.0 5.0 v switch control voltage (l) v cont (l) ? 0.2 0 0.2 v electrical characteristics (t a = +25 c, v cont = 3.0 v/0 v, z o = 50 ? , dc blocking capacitors value: 4 pf, each port, unless otherwise specified) parameter symbol test conditions min. typ. max. unit insertion loss 1 l ins 1 f = 2.4 to 2.5 ghz ? 0.8 1.0 db insertion loss 2 l ins 2 f = 4.9 to 6.0 ghz ? 1.2 1.4 db isolation 1 (between input and output) isl1 f = 2.4 to 2.5 ghz 25 34 ? db isolation 2 (between input and output) isl2 f = 4.9 to 6.0 ghz 25 33 ? db isolation 3 (between tx and rx, between ant1 and ant2) isl3 f = 2.4 to 2.5 ghz 17 24 ? db isolation 4 (between tx and rx, between ant1 and ant2) isl4 f = 4.9 to 6.0 ghz 17 22 ? db input and output return loss 1 rl1 f = 2.4 to 2.5 ghz ? 15 ? db input and output return loss 2 rl2 f = 4.9 to 6.0 ghz ? 15 ? db switch control current 1 i cont 1 f = 2.4 to 2.5 ghz ? 0.7 1.5 a switch control current 2 i cont 2 f = 4.9 to 6.0 ghz ? 0.7 1.5 a p in (1 db) f = 2.4 to 2.5 ghz ? 31 ? 1 db gain compression input power f = 4.9 to 6.0 ghz ? 30 ? dbm 3rd order distortion input intercept point 1 iip 3 1 f = 2.4 to 2.5 ghz ? 45 ? dbm 3rd order distortion input intercept point 2 iip 3 2 f = 4.9 to 6.0 ghz ? 45 ? dbm switch control speed 1 t sw 1 f = 2.4 to 2.5 ghz, t rise /t fall (10/90% rf) ? 50 ? ns switch control speed 2 t sw 2 f = 4.9 to 6.0 ghz, t rise /t fall (10/90% rf) ? 50 ? ns data sheet pg10474ej01v0ds 3 pg2035t5f
evaluation circuit (top view) pin 12 4 pf 4 pf v cont2 1 000 pf v cont1 1 000 pf 4 pf 4 pf tx rx ant1 ant2 pin 1 the application circuits and their parameters are for reference only and are not intended for use in actual design-ins. data sheet pg10474ej01v0ds 4 pg2035t5f
package dimensions 12-pin plastic qfn (unit: mm) 3.0 3.0 0.750.1 (bottom view) 0.5 1.0 1.550.1 0.40.1 0.9 0.4 0.9 0.4 dimensions of pin no.1 indication 0.5 1.0 0.40.1 0.24 +0.07 ?0.05 1.550.1 0.40.1 0.40.1 data sheet pg10474ej01v0ds 5 pg2035t5f
recommended soldering conditions this product should be soldered and mounted under the following recommended conditions. for soldering methods and conditions other than those recomm ended below, contact your nearby sales office. soldering method soldering conditions condition symbol infrared reflow peak temperature (package surface temperature) : 260 c or below time at peak temperature : 10 seconds or less time at temperature of 220 c or higher : 60 seconds or less preheating time at 120 to 180 c : 120 30 seconds maximum number of reflow processes : 3 times maximum chlorine content of rosin fl ux (% mass) : 0.2%(wt.) or below ir260 vps peak temperature (package surface temperature) : 215 c or below time at temperature of 200 c or higher : 25 to 40 seconds preheating time at 120 to 150 c : 30 to 60 seconds maximum number of reflow processes : 3 times maximum chlorine content of rosin fl ux (% mass) : 0.2%(wt.) or below vp215 wave soldering peak temperature (molten solder temperature) : 260 c or below time at peak temperature : 10 seconds or less preheating temperature (package surface temperature) : 120 c or below maximum number of flow processes : 1 time maximum chlorine content of rosin fl ux (% mass) : 0.2%(wt.) or below ws260 partial heating peak temperature (pin temperature) : 350 c or below soldering time (per side of device) : 3 seconds or less maximum chlorine content of rosin fl ux (% mass) : 0.2%(wt.) or below hs350 caution do not use different soldering met hods together (except for partial heating). data sheet pg10474ej01v0ds 6 pg2035t5f
m8e 00. 4 - 0110 the information in this document is current as of march, 2004. the information is subject to change without notice. for actual design-in, refer to the latest publications of nec's data sheets or data books, etc., for the most up-to-date specifications of nec semiconductor products. not all products and/or types are available in every country. please check with an nec sales representative for availability and additional information. no part of this document may be copied or reproduced in any form or by any means without prior written consent of nec. nec assumes no responsibility for any errors that may appear in this document. nec does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of nec semiconductor products listed in this document or any other liability arising from the use of such products. no license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec or others. descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. the incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. nec assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. while nec endeavours to enhance the quality, reliability and safety of nec semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. to minimize risks of damage to property or injury (including death) to persons arising from defects in nec semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. nec semiconductor products are classified into the following three quality grades: "standard", "special" and "specific". the "specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. the recommended applications of a semiconductor product depend on its quality grade, as indicated below. customers must check the quality grade of each semiconductor product before using it in a particular application. "standard": computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "special": transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "specific": aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. the quality grade of nec semiconductor products is "standard" unless otherwise expressly specified in nec's data sheets or data books, etc. if customers wish to use nec semiconductor products in applications not intended by nec, they must contact an nec sales representative in advance to determine nec's willingness to support a given application. (note) (1) "nec" as used in this statement means nec corporation, nec compound semiconductor devices, ltd. and also includes its majority-owned subsidiaries. (2) "nec semiconductor products" means any semiconductor product developed or manufactured by or for nec (as defined above). ? ? ? ? ? ? data sheet pg10474ej01v0ds 7 pg2035t5f
caution gaas products this product uses gallium arsenide (gaas). gaas vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. follow related laws and ordinanc es when disposing of the produc t. if there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. commission a disposal company able to (wit h a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. exclude the product from general industria l waste and household garbage, and ensure that the product is controlled (as industria l waste subject to special c ontrol) up until final disposal. do not burn, destroy, cut, crush, or chemically di ssolve the product. do not lick the product or in any way allow it to enter the mouth. nec compound semiconductor devices hong kong limited e-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general) hong kong head office taipei branch office korea branch office tel: +852-3107-7303 tel: +886-2-8712-0478 tel: +82-2-558-2120 fax: +852-3107-7309 fax: +886-2-2545-3859 fax: +82-2-558-5209 nec electronics (europe) gmbh http://www.ee.nec.de/ tel: +49-211-6503-0 fax: +49-211-6503-1327 california eastern laboratories, inc. http://www.cel.com/ tel: +1-408-988-3500 fax: +1-408-988-0279 0401 nec compound semiconductor devices, ltd. http://www.ncsd.necel.com/ e-mail: salesinfo@ml.ncsd.necel.com (sales and general) techinfo@ml.ncsd.necel.com (technical) 5th sales group, sales division tel: +81-44-435-1588 fax: +81-44-435-1579 for further information, please contact pg2035t5f
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