features well defined and smooth spatial radiation patterns wide viewing angle tinted diffused lamp high luminous output colors: 590/592 nm amber 615/617 nm reddish-orange 626/630 nm red high operating temperature: t jled = +130 c superior resistance to moisture benefits viewing angles match traffic management sign requirements colors meet automotive specifications superior performance in outdoor environments suitable for autoinsertion onto pc boards applications traffic management: variable message signs traffic management signs commercial indoor/outdoor advertising: signs marquees passenger information automotive: exterior and interior lights description these precision optical performance alingap leds provide superior light output for excellent readability in sunlight and are extremely reliable. alingap led technology provides extremely stable light output over long periods of time. precision optical performance lamps utilize the aluminum indium gallium phosphide (alingap) technology. these led lamps are tinted, diffused, t-1 3 / 4 packages incorporating second generation optics producing well defined radiation patterns at specific viewing cone angles. there are two families of amber, red, and red-orange lamps; alingap and the higher performance alingap ii. the high maximum led junction temperature limit of +130 c enables high temperature operation in bright sunlight conditions. these lamps are available in two package options to give the designer flexibility with device mounting. sunpower series hlmp-el55 hlmp-el57 hlmp-eh55 hlmp-eh57 hlmp-eg55 hlmp-eg57 hlmp-el55 t-1 3 / 4 (5 mm) precision optical performance alingap led lamps data sheet
2 part numbering system hlmp - x x xx - x x x xx mechanical options 00: bulk packaging dd: ammo pack color bin selections 0: no color bin limitation 4: amber color bin 4 only k: amber color bins 2 and 4 only maximum intensity bin minimum intensity bin viewing angle & lead stand offs 55: 55 deg without lead stand offs; alingap 57: 55 deg without lead stand offs; alingap ii color d: 630 nm red g: 626 nm red h: 615/617 nm red-orange l: 590/592 amber package e: 5 mm round device selection guide (alingap) typical luminous intensity viewing angle color and dominant lamps without standoffs on leads iv (mcd) [1,2] @ 20 ma 2 1 / 2 (deg.) [4] wavelength (nm), typ. [3] (outline drawing a) min. max. 55 amber 590 hlmp-el55-ghkxx 140 240 hlmp-el55-gk0xx 140 400 red-orange 615 hlmp-eh55-gk0xx 140 400 red 626 hlmp-eg55-gk0xx 140 400 hlmp-eg55-hj0dd 180 310 notes: 1. the luminous intensity is measured on the mechanical axis of the lamp package. 2. the optical axis is closely aligned with the package mechanical axis. 3. the dominant wavelength, d , is derived from the cie chromaticity diagram and represents the color of the lamp. 4. 1/2 is the off-axis angle where the luminous intensity is one half the on-axis intensity. device selection guide (alingap) typical luminous intensity viewing angle color and dominant lamps without standoffs on leads iv (mcd) [1,2] @ 20 ma 2 1 / 2 (deg.) [4] wavelength (nm), typ. [3] (outline drawing a) min. max. 55 amber 592 hlmp-el57-lp0xx 400 1150 red-orange 617 hlmp-eh57-lp0xx 400 1150 red 630 hlmp-ed57-lp0xx 400 1150 hlmp-ed57-lptxx 400 1150
3 package dimensions 2.35 (0.093) max. 5.80 0.20 (0.228 0.008) 5.00 0.20 (0.197 0.008) 31.60 (1.244) min. 0.70 (0.028) max. 1.00 (0.039) min. 2.54 0.38 (0.100 0.015) 0.50 0.10 (0.020 0.004) sq. typ. cathode lead cathode flat 8.71 0.20 (0.343 0.008 1.14 0.20 (0.045 0.008) notes: 1. all dimensions are in millimeters (inches). 2. leads are mild steel, solder dipped. 3. tapers shown at top of leads (bottom of lamp package) indicate an epoxy meniscus that may extend about 1 mm (0.040 in.) down the leads. 4. recommended pc board hole diameters: lamp package without stand-offs: flush mounting at base of lamp package = 1.143/1.067 (0.044/0.042).
4 electrical/optical characteristics at t a = 25 c parameter symbol min. typ. max. units test conditions forward voltage v f vi f = 20 ma amber ( d = 590 nm) 2.02 2.4 amber ( d = 592 nm) 2.15 2.4 red-orange ( d = 615 nm) 1.94 2.4 red-orange ( d = 617 nm) 2.08 2.4 red ( d = 626 nm) 1.90 2.4 red ( d = 630 nm) 2.00 2.4 reverse voltage v r 520 v i r = 100 a peak wavelength peak nm peak of wavelength of spectral amber ( d = 590 nm) 592 distribution at i f = 20 ma amber ( d = 592 nm) 594 red-orange ( d = 615 nm) 621 red-orange ( d = 617 nm) 623 red ( d = 626 nm) 635 red ( d = 630 nm) 639 spectral halfwidth ? 1/2 17 nm wavelength width at spectral distribution 1 / 2 power point at i f = 20 ma speed of response s 20 ns exponential time constant, e -t/ s capacitance c 40 pf v f = 0, f = 1 mhz thermal resistance r j-pin 240 c/w led junction-to-cathode lead luminous efficacy [1] v lm/w emitted luminous power/emitted amber ( d = 590 nm) 480 radiant power amber ( d = 592 nm) 500 red-orange ( d = 615 nm) 260 red-orange ( d = 617 nm) 235 red ( d = 626 nm) 150 red ( d = 630 nm) 155 note: 1. the radiant intensity, i e , in watts per steradian, may be found from the equation i e = i v / v , where i v is the luminous intensity in candelas and v is the luminous efficacy in lumens/watt. absolute maximum ratings at t a = 25 c dc forward current [1,2,3] ......................................................................................... 50 ma peak pulsed forward current [2,3] ......................................................................... 100 ma average forward current [3] .................................................................................... 30 ma reverse voltage (i r = 100 a) ...................................................................................... 5 v led junction temperature ...................................................................................... 130 c operating temperature ........................................................................ ?0 c to +100 c storage temperature ............................................................................ ?0 c to +120 c notes: 1. derate linearly as shown in figure 4. 2. for long term performance with minimal light output degradation, drive currents between 10 ma and 30 ma are recommended. for more information on recommended drive conditions, please refer to application brief i-024 (5966-3087e). 3. please contact your avago technologies sales representative about operating currents below 10 ma.
5 figure 2. forward current vs. forward voltage. figure 3. relative luminous intensity vs. forward current. figure 4. maximum forward current vs. ambient temperature. derating based on t jmax = 130 c. figure 1. relative intensity vs. peak wavelength. figure 5. representative spatial radiation pattern for 55 viewing angle lamps. wavelength ?nm relative intensity 500 600 650 700 1.0 0.5 0 amber red-orange red 550 current ?ma 1.0 0 v f ?forward voltage ?v 2.5 100 40 30 1.5 2.0 60 3.0 10 20 50 red amber 70 80 90 relative luminous intensity (normalized at 20 ma) 0 0 i f ?dc forward current ?ma 40 3.0 2.0 1.5 1.0 0.5 20 60 2.5 i f ?forward current ?ma 0 0 t a ?ambient temperature ? c 40 80 50 40 30 20 10 20 60 100 r ja = 585 c/w r ja = 780 c/w relative intensity ?% 100 0 ?angular displacement ?degrees 80 60 50 70 20 -80 -60 10 30 40 -40 0 20 40 60 80 100 90 -100 -20
6 bin name min. max. g 140 180 h 180 240 j 240 310 k 310 400 l 400 520 m 520 680 n 680 880 p 880 1150 intensity bin limits (mcd at 20 ma) tolerance for each bin limit is 15%. bin name min. max. 158 4.5 587.0 258 7.0 589.5 458 9.5 592.0 659 2.0 594.5 amber color bin limits (nm at 20 ma) tolerance for each bin limit is 0.5 nm. note: 1. bin categories are established for classification of products. products may not be available in all bin categories.
7 precautions lead forming the leads of an led lamp may be preformed or cut to length prior to insertion and soldering into pc board. if lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to led package. otherwise, cut the leads of led to length after soldering process at room temperature. the solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the led chip die attach and wirebond. it is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. soldering conditions care must be taken during pcb assembly and soldering process to prevent damage to led component. the closest led is allowed to solder on board is 1.59 mm below the body (encapsulant epoxy) for those parts without standoff. recommended soldering conditions: wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. if necessary, use fixture to hold the led component in proper orientation with respect to the pcb during soldering process. proper handling is imperative to avoid excessive thermal stresses to led components when heated. therefore, the soldered pcb must be allowed to cool to room temperature, 25 c, before handling. special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. recommended pc board plated through hole sizes for led component leads: manual solder w ave soldering dipping pre-heat temperature 105 c max. pre-heat time 30 sec max. peak temperature 250 c max. 260 c max. dwell time 3 sec max. 5 sec max. led component plated through lead size diagonal hole diameter 0.457 x 0.457 mm 0.646 mm 0.976 to 1.078 mm (0.018 x 0.018 inch) (0.025 inch) (0.038 to 0.042 inch) 0.508 x 0.508 mm 0.718 mm 1.049 to 1.150 mm (0.020 x 0.020 inch) (0.028 inch) (0.041 to 0.045 inch) note: refer to application note an1027 for more information on soldering led components. figure 6. recommended wave soldering profile. laminar wave bottom side of pc board hot air knife turbulent wave fluxing preheat 01020 30 50 100 150 200 250 30 40 50 time ?seconds temperature ? c 60 70 80 90 100 t op side of pc board conveyor speed = 1.83 m/min (6 ft/min) preheat setting = 150 c (100 c pcb) solder wave temperature = 245 c air knife air temperature = 390 c air knife distance = 1.91 mm (0.25 in.) air knife angle = 40 solder: sn63; flux: rma note: allow for boards to be sufficiently cooled before exerting mechanical force.
for product information and a complete list of distributors, please go to our website: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies, pte. in the united states and other countries. data subject to change. copyright ? 2006 avago technologies pte. all rights reserved. obsoletes 5989-2893en 5989-4364en april 19, 2006
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