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2 5 m w s t e r e o c a p - f r e e h e a d p h o n e d r i v e r c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 1 - j u l . , 2 0 1 2 a p a 2 1 7 7 w w w . a n p e c . c o m . t w 1 a n p e c r e s e r v e s t h e r i g h t t o m a k e c h a n g e s t o i m p r o v e r e l i a b i l i t y o r m a n u f a c t u r a b i l i t y w i t h o u t n o t i c e , a n d a d v i s e c u s t o m e r s t o o b t a i n t h e l a t e s t v e r s i o n o f r e l e v a n t i n f o r m a t i o n t o v e r i f y b e f o r e p l a c i n g o r d e r s . f e a t u r e s t h e a p a 2 1 7 7 i s a s t e r e o , f i x e d g a i n , s i n g l e s u p p l y , a n d c a p - f r e e h e a d p h o n e d r i v e r , w h i c h i s a v a i l a b l e i n a w l c s p - 1 6 p a c k a g e s . t h e a p a 2 1 7 7 i s g r o u n d - r e f e r e n c e o u t p u t , a n d n o n e e d t h e o u t p u t c a p a c i t o r s f o r d c b l o c k i n g . t h e a d v a n t a g e s o f e l i m i n a t i n g t h e o u t p u t c a p a c i t o r a r e s a v i n g t h e c o s t , e l i m i - n a t i n g c o m p o n e n t h e i g h t , a n d i m p r o v i n g t h e l o w f r e q u e n c y r e s p o n s e . t h e i n t e r n a l s e l e c t a b l e g a i n ( 0 d b o r 6 d b ) c a n m i n i m i z e t h e e x t e r n a l c o m p o n e n t c o u n t s a n d s a v e t h e p c b s p a c e . h i g h p s r r p r o v i d e s i n c r e a s e d i m m u n i t y t o n o i s e a n d r f r e c t i f i c a t i o n . t h e a p a 2 1 7 7 i s c a p a b l e o f d r i v i n g 2 5 m w a t 3 . 6 v i n t o 1 6 w l o a d a n d p r o v i d e s t h e r m a l p r o t e c t i o n . a p p l i c a t i o n s h a n d e s t s p d a s p o r t a b l e m u l t i m e d i a d e v i c e s n o t e b o o k s g e n e r a l d e s c r i p t i o n o p e r a t i n g v o l t a g e : 2 . 4 v ~ 5 . 5 v s u p p l y c u r r e n t - i d d = 2 . 1 m a a t v d d = 3 . 6 v l o w s h u t d o w n c u r r e n t - i d d = 0 . 7 m a a t v d d = 3 . 6 v g r o u n d r e f e r e n c e o u t p u t - n o o u t p u t c a p a c i t o r r e q u i r e d ( f o r d c b l o c k i n g ) - s a v e t h e p c b s p a c e - r e d u c e t h e b o m c o s t s - i m p r o v e t h e l o w f r e q u e n c y r e s p o n s e o u t p u t p o w e r 2 5 m w / c h i n t o 1 6 w a t v d d = 3 . 6 v , t h d + n = 0 . 0 4 % 2 0 m w / c h i n t o 3 2 w a t v d d = 3 . 6 v , t h d + n = 0 . 0 2 % high psrr: 90db at 217hz fast start-up time: 4ms integrate the de-pop circuitry t h e r m a l p r o t e c t i o n s u r f a c e - m o u n t p a c k a g i n g w l c s p 1 . 6 x 1 . 6 - 1 6 s i m p l i f i e d a p p l i c a t i o n c i r c u i t apa2177 rout rin+ sdn lin+ lout stereo input signal shutdown control stereo headphone gain gain control hi-z hi-z control lin- rin-
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 1 - j u l . , 2 0 1 2 a p a 2 1 7 7 w w w . a n p e c . c o m . t w 2 a b s o l u t e m a x i m u m r a t i n g s ( n o t e 1 ) symbol parameter rating unit v pgnd _ gnd pgnd to gnd voltage - 0.3 to 0.3 v dd supply voltage ( vdd to gnd and sgnd ) - 0.3 to 6.0 hpv dd headphone amplifier supply voltage (hpv dd to gnd and sgnd) - 0.3 to 2.3 v / sd n input voltage (/sdn to gnd ) gnd - 0.3 t o v dd +0.3 v gain input voltage (gain to gnd ) gnd - 0.3 to v dd +0.3 v hi - z input voltage (hi - z to gnd ) gnd - 0.3 to v dd +0.3 hpv ss hpvss to gnd and sgnd voltage - 2.3 to 0.3 v p i n c o n f i g u r a t i o n o r d e r i n g a n d m a r k i n g i n f o r m a t i o n n o t e : a n p e c l e a d - f r e e p r o d u c t s c o n t a i n m o l d i n g c o m p o u n d s / d i e a t t a c h m a t e r i a l s a n d 1 0 0 % m a t t e t i n p l a t e t e r m i n a t i o n f i n i s h ; w h i c h a r e f u l l y c o m p l i a n t w i t h r o h s . a n p e c l e a d - f r e e p r o d u c t s m e e t o r e x c e e d t h e l e a d - f r e e r e q u i r e m e n t s o f i p c / j e d e c j - s t d - 0 2 0 d f o r m s l c l a s s i f i c a t i o n a t l e a d - f r e e p e a k r e f l o w t e m p e r a t u r e . a n p e c d e f i n e s ? g r e e n ? t o m e a n l e a d - f r e e ( r o h s c o m p l i a n t ) a n d h a l o g e n f r e e ( b r o r c l d o e s n o t e x c e e d 9 0 0 p p m b y w e i g h t i n h o m o g e n e o u s m a t e r i a l a n d t o t a l o f b r a n d c l d o e s n o t e x c e e d 1 5 0 0 p p m b y w e i g h t ) . lin - ( a 4 ) x pin a 1 date code marking lin + ( b 4 ) rin + ( c 4 ) rin - ( d 4 ) lout ( a 3 ) hpvdd ( b 3 ) sgnd ( c 3 ) rout ( d 3 ) vdd ( a 2 ) cpp ( b 2 ) hpvss ( c 2 ) gain ( d 2 ) sdn ( a 1 ) gnd ( b 1 ) cpn ( c 1 ) hi - z ( d 1 ) apa 2177 package code ha : wlcsp - 16 operating ambient temperature range i : - 40 to 85 o c handling code tr : tape & reel assembly material assembly material handling code temperature range package code apa 2177 ha : a 77 x x - date code g : halogen and lead free device
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 1 - j u l . , 2 0 1 2 a p a 2 1 7 7 w w w . a n p e c . c o m . t w 3 a b s o l u t e m a x i m u m r a t i n g s ( c o n t . ) ( n o t e 1 ) symbol parameter rating unit v out rout and lout to gnd voltage hpv ss - 0.3 to hpv dd +0.3 v cpp cpp to gnd voltage gnd - 0.3 to hpv dd +0.3 v cpn cpn to gnd voltage hppv ss - 0.3 to gnd+0.3 v t j maximum junction temperature 150 t stg storage temperature ra nge - 65 to +150 t s dr maximum soldering temperature range 260 , 10 seconds o c p d power dissipation internally limited w n o t e 1 : s t r e s s e s b e y o n d t h o s e l i s t e d u n d e r " a b s o l u t e m a x i m u m r a t i n g s " m a y c a u s e p e r m a n e n t d a m a g e t o t h e d e v i c e . t h e s e a r e s t r e s s r a t i n g s o n l y a n d f u n c t i o n a l o p e r a t i o n o f t h e d e v i c e a t t h e s e o r a n y o t h e r c o n d i t i o n s b e y o n d t h o s e i n d i c a t e d u n d e r " r e c o m - m e n d e d o p e r a t i n g c o n d i t i o n s " i s n o t i m p l i e d . e x p o s u r e t o a b s o l u t e m a x i m u m r a t i n g c o n d i t i o n s f o r e x t e n d e d p e r i o d s m a y a f f e c t d e v i c e r e l i a b i l i t y t h e r m a l c h a r a c t e r i s t i c s symbol parameter typical value unit q ja thermal resistance - junction to ambient ( note 2) wlcsp - 16 160 o c/w n o t e 2 : p l e a s e r e f e r t o ? t h e r m a l c o n s i d e r a t i o n ? . 2 l a y e r e d p r i n t e d c i r c u i t b o a r d s w i t h 2 o z t r a c e a n d c o p p e r t h r o u g h s e v e r a l t h e r m a l v i a s . t h e t h e r m a l p a d i s s o l d e r e d o n t h e p c b . r e c o m m e n d e d o p e r a t i n g c o n d i t i o n s symbol parameter range unit v dd supply voltage 2.4 ~ 5.5 v ih high level threshold voltage sdn, gain, hi - z 1.3 ~ v dd v il low level threshold voltage sdn, gain, hi - z 0 ~ 0.6 voltage applied to output; outr, outl (when sdn = 0 v) - 0.3 ~ 3.6 voltage applied to output; outr, outl (when sdn ? 1.3 v and hi ? z ? 1.3 v) - 1.8 ~ 1.8 v t a operating ambient temperature range - 40 ~ 85 t j operating junction temperature range - 40 ~ 125 o c r l headphone resistance 16 ~ 100k w apa2177 symbol parameter test condition s min. typ. max. unit i dd v dd supply current - 2.5 3.5 ma i sd v dd shutdown current v sdn = 0v - 1 2 i i input current sdn - 0. 1 - m a charge pump f osc switching frequency 400 500 600 khz r eq equ ivalent resistance - 15 - w e l e c t r i c a l c h a r a c t e r i s t i c s v d d = 3 . 6 v , v g n d = v p g n d = 0 v , v / s d n = v d d , c c p f = c c p o = 1 m f , c i = 1 m f , t a = 2 5 o c ( u n l e s s o t h e r w i s e n o t e d )
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 1 - j u l . , 2 0 1 2 a p a 2 1 7 7 w w w . a n p e c . c o m . t w 4 symbol parameter test condition min. typ. max. unit drivers v gain =0v, no load - 0.95 - 1.0 - 1.05 a v internal voltage gain v gain ?? 1.3 v, no load - 1.95 - 2.0 - 2.05 v/v ? a v gain matching - 1 - % gain = 0v(0db) - 19.8 - input resistance gain ?? 1.3 v (6db) - 13.2 - r i input resistance in shutdown sdn = 0v - 10 - k w sdn = hi - z ?? 1.3 v , f in =10khz - 35 - sdn = hi - z ?? 1.3 v, f in =1mhz - 17 - k w z o output impedance sdn = 0 v (shutdown mode) - 25 - w v os output offset voltage v dd =2.5v to 5.5 v, r l = 16 w - 0.5 - mv v n output noise - 7 - m v rms f in = 217 hz - - 90 - psrr power supply rejection ratio v rr =0.2v pp , r l = 16 w, input ac - ground f in = 10k hz - - 80 - db c l maximum capacitive load - 220 - pf t start - up start up time - 4 - ms v esd es d protection outr, outl - 8 - kv r l = 16 w - 25 - p o output power (stereo, in phase) thd +n =1% , f in =1khz r l = 32 w - 22 - mw v o output voltage (stereo, in phase) thd+n=1%, f in =1khz, r l =100 w - 1.1 - v rms p o =2 0mw, r l =16 w , f in =1khz - 0.04 - thd+n total harmonic distortion pulse noise p o =25mw, r l =32 w , v dd =5.5v, f in =1khz - 0.0 2 - % crosstalk channel separation p o = 20mw, r l = 16 w f in =1 k hz - 80 - att shutdown shutdown attenuation f in =1khz, rl= 16 w , v in =1vrms - 80 - s/n p o =2 0 mw, r l =16 w gain = 0v(av =0db) , with a - weighting filter - 95 - db e l e c t r i c a l c h a r a c t e r i s t i c s ( c o n t . ) v d d = 3 . 6 v , v g n d = v p g n d = 0 v , v / s d n = v d d , c c p f = c c p o = 1 m f , c i = 1 m f , t a = 2 5 o c ( u n l e s s o t h e r w i s e n o t e d )
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 1 - j u l . , 2 0 1 2 a p a 2 1 7 7 w w w . a n p e c . c o m . t w 5 pin wlcs p name i/o/p function description a1 sdn i shutdown mode control pin. a low - level voltage applied on this pin shuts off the headphone driver. a2 vdd p supply voltage input pin. a3 lout o left channel output for headphone. a4 lin - i left cha nnel audio signal inverting input pin. b1 gnd p ground connection for circuitry. b2 cpp p charge pump flying capacitor positive connection. b3 hpvdd p positive power supply for headphone amplifiers. b4 lin+ i left channel audio signal non - inverting inp ut pin. c1 cpn p charge pump flying capacitor negative connection. c2 hpvss p charge pump output. c3 sgnd i amplifier reference voltage. c4 rin+ i right channel audio signal non - inverting input pin. d1 hi - z i output impedance select. set to logic low for normal operation and logic high for high output impedance. d2 gain i gain select. set to logic low for a gain of 0db and to high for a gain of 6db. d3 rout o right channel output for headphone. d4 rin - i right channel audio signal inverting input pi n. p i n d e s c r i p t i o n
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 1 - j u l . , 2 0 1 2 a p a 2 1 7 7 w w w . a n p e c . c o m . t w 6 t y p i c a l o p e r a t i n g c h a r a c t e r i s t i c s thd + n vs . output power t h d + n ( % ) output power ( w ) v dd = 3 . 6 v in phase v dd = 2 . 4 v in phase v dd = 2 . 4 v out of phase v dd = 3 . 6 v out of phase r l = 32 w f = 1 khz 0 10 m 20 m 30 m 40 m 50 m 0 . 01 10 0 . 1 1 thd + n vs . frequency t h d + n ( % ) frequency ( hz ) 20 20 k 100 1 k 10 k 0 . 001 0 . 01 0 . 1 1 r r r r r po = 10 mw po = 1 mw po = 4 mw r l = 16 w v dd = 2 . 4 v thd + n vs . frequency t h d + n ( % ) frequency ( hz ) 20 20 k 100 1 k 10 k 0 . 001 0 . 01 0 . 1 1 r r r r r po = 20 mw po = 1 mw po = 10 mw r l = 16 w v dd = 3 . 6 v thd + n vs . frequency frequency ( hz ) t h d + n ( % ) 20 20 k 100 1 k 10 k 0 . 001 0 . 01 0 . 1 1 r r r r r po = 20 mw po = 1 mw po = 10 mw r l = 16 w v dd = 5 . 5 v t h d + n ( % ) thd + n vs . frequency frequency ( hz ) 20 20 k 100 1 k 10 k 0 . 001 0 . 01 0 . 1 1 r r r r r r r r r r r po = 10 mw po = 1 mw po = 4 mw r l = 32 w v dd = 2 . 4 v thd + n vs . output power t h d + n ( % ) output power ( w ) v dd = 3 . 6 v in phase v dd = 2 . 4 v in phase v dd = 2 . 4 v out of phase v dd = 3 . 6 v out of phase 0 10 m 20 m 30 m 40 m 50 m 0 . 01 10 0 . 1 1 r l = 16 w f = 1 khz
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 1 - j u l . , 2 0 1 2 a p a 2 1 7 7 w w w . a n p e c . c o m . t w 7 t y p i c a l o p e r a t i n g c h a r a c t e r i s t i c s thd + n vs . frequency t h d + n ( % ) frequency ( hz ) 20 20 k 100 1 k 10 k 0 . 001 0 . 01 0 . 1 1 r r r r r r r r r r r r l = 32 w v dd = 3 . 6 v po = 1 mw po = 20 mw po = 10 mw t h d + n ( % ) thd + n vs . frequency frequency ( hz ) 20 20 k 100 1 k 10 k 0 . 001 0 . 01 0 . 1 1 r r r r r r r r r r r po = 20 mw po = 1 mw po = 10 mw r l = 32 w v dd = 5 . 5 v vdd ( v ) output power vs supply voltage p o ( m w ) 2 . 5 5 . 5 3 . 5 4 . 5 0 50 5 25 40 3 4 5 10 15 20 30 35 45 thd + n = 10 % thd + n = 1 % r l = 32 w psrr vs frequency p s r r ( d b ) frequency ( hz ) t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t rl = 16 w vrr = 0 . 2 vpp v dd = 5 . 5 v v dd = 2 . 4 v v dd = 3 . 6 v - 120 - 50 - 90 - 80 - 70 20 20 k 100 1 k 10 k - 110 - 100 - 60 output voltage vs supply voltage v dd - supply voltage ( v ) o u t p u t v o l t a g e ( v r m s ) 2 . 5 5 . 5 3 . 5 4 . 5 0 2 0 . 2 1 1 . 6 3 4 5 0 . 4 0 . 6 0 . 8 1 . 2 1 . 4 1 . 8 rl = 32 w rl = 16 w f = 1 khz thd + n = 1 % rl = 600 w vdd ( v ) output power vs supply voltage p o ( m w ) 2 . 5 5 . 5 3 . 5 4 . 5 0 50 5 25 40 3 4 5 10 15 20 30 35 45 thd + n = 10 % thd + n = 1 % r l = 16 w
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 1 - j u l . , 2 0 1 2 a p a 2 1 7 7 w w w . a n p e c . c o m . t w 8 t y p i c a l o p e r a t i n g c h a r a c t e r i s t i c s frequency ( hz ) p s r r ( d b ) psrr vs . frequency t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t - 120 - 50 - 90 - 80 - 70 20 20 k 100 1 k 10 k - 110 - 100 - 60 rl = 32 w vrr = 0 . 2 vpp v dd = 5 . 5 v v dd = 2 . 4 v v dd = 3 . 6 v frequency ( hz ) output noise voltage vs . frequency o u t p u t n o i s e v o l t a g e ( v r m s ) rl = 16 w v dd = 5 . 5 v v dd = 2 . 4 v v dd = 3 . 6 v 1 m 2 m 3 m 7 m 10 m 20 20 k 100 1 k 10 k 4 m 5 m frequency ( hz ) output noise voltage vs . frequency o u t p u t n o i s e v o l t a g e ( v r m s ) 1 m 2 m 3 m 7 m 10 m 20 20 k 100 1 k 10 k 4 m 5 m rl = 32 w v dd = 5 . 5 v v dd = 2 . 4 v v dd = 3 . 6 v crosstalk vs . frequency c r o s s t a l k ( d b ) t t t t t t t t t t t t t t t t - 120 - 60 - 90 - 80 20 20 k 100 1 k 10 k - 110 - 100 - 70 v dd = 3 . 6 v r l = 16 w po = 20 mw left to right right to left frequency ( hz ) crosstalk vs . frequency c r o s s t a l k ( d b ) frequency ( hz ) t t t t t t t t t t t t t t t t t - 120 - 60 - 90 - 80 20 20 k 100 1 k 10 k - 110 - 100 - 70 v dd = 3 . 6 v r l = 32 w po = 20 mw left to right right to left 0 1 i d d - s u p p l y c u r r e n t ( m a ) supply current vs . supply voltage v dd - supply voltage ( v ) 2 . 5 5 . 5 3 . 5 4 . 5 3 4 5 2 3 4 5 6 7 8 sdn = 1 . 3 v no load
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 1 - j u l . , 2 0 1 2 a p a 2 1 7 7 w w w . a n p e c . c o m . t w 9 t y p i c a l o p e r a t i n g c h a r a c t e r i s t i c s 10 80 20 30 40 50 60 70 0 35 5 10 30 supply current vs . output power output power ( mw ) s u p p l y c u r r e n t ( m a ) 0 15 20 25 90 100 r l = 16 w f = 1 khz v dd = 5 . 5 v v dd = 2 . 4 v v dd = 3 . 6 v supply current vs . output power 10 80 20 30 40 50 60 70 0 35 5 10 30 0 15 20 25 90 100 output power ( mw ) s u p p l y c u r r e n t ( m a ) r l = 32 w f = 1 khz v dd = 5 . 5 v v dd = 2 . 4 v v dd = 3 . 6 v hi - z output impedance vs . frequency 0 5 10 15 20 25 30 40 10 100 1000 10 k 100 k 1 m frequency ( hz ) h i - z o u t p u t i m p e d a n c e ( k w ) 35 v o u t ( d b v ) v d d ( d b v ) - 160 0 400 800 1 . 2 k 1 . 6 k 2 k frequency ( hz ) gsm power supply rejection vs . frequency - 140 - 120 - 100 - 100 - 80 - 60 - 40 - 20
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 1 - j u l . , 2 0 1 2 a p a 2 1 7 7 w w w . a n p e c . c o m . t w 1 0 o p e r a t i n g w a v e f o r m s shutdown release v out sdn 1 2 v dd = 3 . 6 v r l = 16 w ch 1 : 2 v / div , dc ch 2 : 2 v / div , dc time : 2 ms / div shutdown v dd = 3 . 6 v r l = 16 w ch 1 : 2 v / div , dc ch 2 : 2 v / div , dc time : 2 ms / div sdn v out
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 1 - j u l . , 2 0 1 2 a p a 2 1 7 7 w w w . a n p e c . c o m . t w 1 1 b l o c k d i a g r a m control power and depop circuit rout rin - sdn charge pump vdd cpp cpn hpvss pgnd sgnd supply control hpvdd rin + hpvdd resistor array lout lin - lin + resistor array gain hi - z hpvdd hpvss hpvdd hpvss
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 1 - j u l . , 2 0 1 2 a p a 2 1 7 7 w w w . a n p e c . c o m . t w 1 2 t y p i c a l a p p l i c a t i o n c i r c u i t single-ended input differential input shutdown control 1 m f 0 . 68 m f rout - audio dac c cpf c cpo c i 1 1 m f control power and depop circuit rout rin - sdn charge pump cpp cpn hpvss pgnd hpvdd rin + hpvdd resistor array lout lin - lin + resistor array gain hi - z 0 . 68 m f c i 2 rout + 0 . 68 m f lout - c i 3 0 . 68 m f c i 4 lout + gain control hi - z control c cpb 2 . 2 m f c s 2 . 2 m f headphone jack pgnd hpvdd hpvss hpvdd hpvss vdd shutdown control 1 m f 1 m f rout audio dac c cpf c cpo c i 1 1 m f control power and depop circuit rout rin - sdn charge pump vdd cpp cpn hpvss pgnd hpvdd rin + hpvdd resistor array lout lin - lin + resistor array gain hi - z 1 m f lout c i 3 gain control hi - z control c cpb 2 . 2 m f c s 2 . 2 m f headphone jack pgnd hpvdd hpvss hpvdd hpvss
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 1 - j u l . , 2 0 1 2 a p a 2 1 7 7 w w w . a n p e c . c o m . t w 1 3 headphone driver operation f u n c t i o n d e s c r i p t i o n t h e a p a 2 1 7 7 ? s h e a d p h o n e d r i v e r s u s e a c h a r g e p u m p t o i n v e r t t h e p o s i t i v e p o w e r s u p p l y ( v d d ) t o n e g a t i v e p o w e r s u p p l y ( v s s ) , s e e f i g u r e 1 . t h e h e a d p h o n e d r i v e r s o p e r - a t e a t t h i s b i p o l a r p o w e r s u p p l y ( v d d a n d v s s ) a n d t h e o u t - p u t s r e f e r e n c e r e f e r s t o t h e g r o u n d . t h i s f e a t u r e e l i m i - n a t e s t h e o u t p u t c a p a c i t o r t h a t i s u s i n g i n c o n v e n t i o n a l s i n g l e - e n d e d h e a d p h o n e d r i v e a m p l i f i e r . c o m p a r e w i t h t h e s i n g l e p o w e r s u p p l y a m p l i f i e r , t h e p o w e r s u p p l y r a n g e h a s a l m o s t d o u b l e d . f i g u r e 1 . c a p - f r e e o p e r a t i o n thermal protection t h e t h e r m a l p r o t e c t i o n c i r c u i t l i m i t s t h e j u n c t i o n t e m p e r a - t u r e o f t h e a p a 2 1 7 7 . w h e n t h e j u n c t i o n t e m p e r a t u r e e x - c e e d s t j = + 1 5 0 o c , a t h e r m a l s e n s o r t u r n s o f f t h e d r i v e r , a l l o w i n g t h e d e v i c e s t o c o o l . t h e t h e r m a l s e n s o r a l l o w s t h e d r i v e r t o s t a r t - u p a f t e r t h e j u n c t i o n t e m p e r a t u r e d o w n a b o u t 1 2 5 o c . t h e t h e r m a l p r o t e c t i o n i s d e s i g n e d w i t h a 2 5 o c h y s t e r e s i s t o l o w e r t h e a v e r a g e t j d u r i n g c o n t i n u - o u s t h e r m a l o v e r l o a d c o n d i t i o n s , i n c r e a s i n g l i f e t i m e o f t h e i c s . shutdown function i n o r d e r t o r e d u c e p o w e r c o n s u m p t i o n w h i l e n o t i n u s e , t h e a p a 2 1 7 7 c o n t a i n s s h u t d o w n c o n t r o l l e r s t o e x t e r n a l l y t u r n s o f f t h e a m p l i f i e r b i a s c i r c u i t r y . t h i s s h u t d o w n f e a - t u r e t u r n s t h e a m p l i f i e r o f f w h e n l o g i c l o w i s p l a c e d o n t h e s d n p i n s f o r t h e a p a 2 1 7 7 . t h e t r i g g e r p o i n t b e t w e e n a l o g i c h i g h i s 1 . 0 v a n d l o g i c l o w l e v e l i s 0 . 3 5 v . i t i s r e c o m - m e n d e d t o s w i t c h b e t w e e n g r o u n d a n d t h e s u p p l y v o l t - a g e v d d t o p r o v i d e m a x i m u m d e v i c e p e r f o r m a n c e . b y s w i t c h i n g t h e s d n p i n s t o a l o w l e v e l , t h e a m p l i f i e r e n t e r s a l o w - c o n s u m p t i o n c u r r e n t c i r c u m s t a n c e , c h a r g e p u m p i s d i s a b l e d , a n d i d d f o r t h e a p a 2 1 7 7 i s i n s h u t d o w n m o d e . i n n o r m a l o p e r a t i n g , t h e a p a 2 1 7 7 ? s s d n p i n s s h o u l d b e p u l l e d t o a h i g h l e v e l t o k e e p t h e i c o u t o f t h e s h u t d o w n m o d e . t h e s d n p i n s s h o u l d b e t i e d t o a d e f i n i t e v o l t a g e t o a v o i d u n w a n t e d c i r c u m s t a n c e c h a n g e s . v dd v dd /2 gnd v out v dd v ss gnd v out conventional headphone driver cap-free headphone driver
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 1 - j u l . , 2 0 1 2 a p a 2 1 7 7 w w w . a n p e c . c o m . t w 1 4 a p p l i c a t i o n i n f o r m a t i o n input capacitor, c i i n t h e t y p i c a l a p p l i c a t i o n , a n i n p u t c a p a c i t o r , c i , i s r e q u i r e d t o a l l o w t h e a m p l i f i e r t o b i a s t h e i n p u t s i g n a l t o t h e p r o p e r d c l e v e l f o r o p t i m u m o p e r a t i o n . i n t h i s c a s e , c i a n d t h e m i n i m u m i n p u t i m p e d a n c e r i f r o m a h i g h - p a s s f i l t e r w i t h t h e c o r n e r f r e q u e n c y a r e d e t e r m i n e d i n t h e f o l l o w i n g e q u a t i o n : the value of c i is important to consider as it directly af- fects the low frequency performance of the circuit. ri is the internal input resistance that typical value is 13.2k w at 6db and the specification calls for a flat bass response down to 20hz. equation is reconfigured as below: p o w e r s u p p l y d e c o u p l i n g ( c s ) t h e a p a 2 1 7 7 i s a h i g h - p e r f o r m a n c e c m o s a u d i o a m p l i - f i e r t h a t r e q u i r e s a d e q u a t e p o w e r s u p p l y d e c o u p l i n g t o e n s u r e t h e o u t p u t t o t a l h a r m o n i c d i s t o r t i o n ( t h d + n ) i s a s l o w a s p o s s i b l e . p o w e r s u p p l y d e c o u p l i n g a l s o p r e - v e n t s t h e o s c i l l a t i o n s c a u s i n g b y l o n g l e a d l e n g t h b e - t w e e n t h e a m p l i f i e r a n d t h e s p e a k e r . charge pump flying capacitor, c cpf the flying capacitor affects the load transient of the charge pump. if the capacitor?s value is too small, then that will degrade the charge pump?s current driver capability and the performance of headphone drive amplifier. increasing the flying capacitor?s value will improve the load transient of charge pump. it is recommend using the low esr ceramic capacitors (x7r type is recommended) above 1 m f. (1) ci i ) c(highpass f r 2 1 f p = consider to input resistance variation, the c i is 0.6 m f so one would likely choose a value in the range of 0.6 m f to 1 m f. a further consideration for this capacitor is the leak- age path from the input source through the input network (r i + r f , c i ) to the load. this leakage current creates a dc offset voltage at the input to the amplifier that reduces useful headroom, es- pecially in high gain applications. for this reason, a low leakage tantalum or ceramic capacitor is the best choice. when polarized capacitors are used, the negative side of the capacitor should face the amplifier input in most ap- plications as the dc level there is held at gnd, which is likely lower than the source dc level. please note that it is important to confirm the capacitor polarity in the application. c i i f r 2 1 c p = (2) t h e o p t i m u m d e c o u p l i n g i s a c h i e v e d b y u s i n g t w o d i f f e r - e n t t y p e s o f c a p a c i t o r t h a t t a r g e t o n d i f f e r e n t t y p e s o f n o i s e o n t h e p o w e r s u p p l y l e a d s . f o r h i g h e r f r e q u e n c y t r a n s i e n t s , s p i k e s , o r d i g i t a l h a s h o n t h e l i n e , a g o o d l o w e q u i v a l e n t - s e r i e s - r e s i s t a n c e ( e s r ) c e r a m i c c a p a c i t o r , t y p i c a l l y 0 . 1 m f , i s p l a c e d a s c l o s e a s p o s s i b l e t o t h e d e - v i c e v d d l e a d f o r t h e b e s t p e r f o r m a n c e . f o r f i l t e r i n g l o w e r f r e q u e n c y n o i s e s i g n a l s , a l a r g e a l u m i n u m e l e c t r o l y t i c c a p a c i t o r o f 1 m f o r g r e a t e r p l a c e d n e a r t h e a u d i o p o w e r a m p l i f i e r i s r e c o m m e n d e d . charge pump output capacitor, c cpo the output capacitor?s value affects the power ripple di- rectly at hpvss. increasing the value of output capacitor reduce the power ripple. the esr of output capacitor affects the load transient of hpvss. lower esr and greater than 1 m f ceramic capacitor is recommendation.
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 1 - j u l . , 2 0 1 2 a p a 2 1 7 7 w w w . a n p e c . c o m . t w 1 5 a p p l i c a t i o n i n f o r m a t i o n layout recommendation 0 . 4 mm 0 . 4 mm 16 x x 0 . 25 mm figure : wlcsp - 16 land pattern recommendation 1. all components should be placed close to the apa2177. for example, the input capacitor (cir, cil) should be close to apa2177 input pins to avoid causing noise coupling to apa2177 high impedance inputs; the decoupling capacitor (cs) should be placed by the apa2177 power pin to decouple the power rail noise. 2. the output traces should be short, wide (>50mil), and symmetric. 3. the input trace should be short and symmetric. 4. the power trace width should be greater than 50mil. 5. the input trace and output trace should be away from ccpf and ccpb possible.
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 1 - j u l . , 2 0 1 2 a p a 2 1 7 7 w w w . a n p e c . c o m . t w 1 6 p a c k a g e i n f o r m a t i o n w l c s p 1 . 6 x 1 . 6 - 1 6 a a2 a1 nx seating plane aaa c b e/2 e e d pin d e s y m b o l min. max. 0.63 0.12 0.20 0.30 1.54 1.60 0.30 a a1 b d e e millimeters a2 0.27 0.33 0.4 bsc wlcsp1.6x1.6-16 0.016 bsc min. max. inches 0.025 0.005 0.011 0.013 0.008 0.012 0.061 0.063 0.012 1.54 1.60 0.061 0.063 aaa 0.05 0.002
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 1 - j u l . , 2 0 1 2 a p a 2 1 7 7 w w w . a n p e c . c o m . t w 1 7 application a h t1 c d d w e1 f 178.0 ? 2.00 50 min. 8.4+2.00 - 0.00 13.0+0.50 - 0.20 1.5 min. 20.2 min. 8.0 ? 0.30 1.75 ? 0.10 3.5 ? 0.05 p 0 p1 p 2 d 0 d1 t a 0 b 0 k 0 wlcsp1.6x1.6 - 16 4.0 ? 0.10 4.0 ? 0.10 2.0 ? 0.05 1.5+0.10 - 0.00 1.5 min. 0.6+0.00 - 0.40 1.75 ? 0.15 1.75 ? 0.15 0.75 ? 0.10 (mm) c a r r i e r t a p e & r e e l d i m e n s i o n s package type unit quantity wlcsp1.6x1.6 - 16 tape & reel 3000 d e v i c e s p e r u n i t a e 1 a b w f t p0 od0 b a0 p2 k0 b 0 section b-b section a-a od1 p1 h t1 a d
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 1 - j u l . , 2 0 1 2 a p a 2 1 7 7 w w w . a n p e c . c o m . t w 1 8 t a p i n g d i r e c t i o n i n f o r m a t i o n w l c s p 1 . 6 x 1 . 6 - 1 6 user direction of feed c l a s s i f i c a t i o n p r o f i l e
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 1 - j u l . , 2 0 1 2 a p a 2 1 7 7 w w w . a n p e c . c o m . t w 1 9 profile feature sn - pb eutectic assembly pb - free assembly preheat & soak temperature min (t smin ) temperature max (t smax ) time (t smin to t smax ) ( t s ) 100 c 150 c 60 - 120 seconds 150 c 200 c 60 - 1 2 0 seconds average ramp - up rate (t smax to t p ) 3 c/second ma x. 3 c/second max. liquidous temperature ( t l ) time at l iquidous (t l ) 183 c 60 - 150 seconds 217 c 60 - 150 seconds peak package body temperature (t p ) * see classification temp in table 1 see classification temp in table 2 time (t p ) ** within 5 c of the spec ified c lassification t emperature ( t c ) 2 0 ** seconds 3 0 ** seconds average r amp - down rate (t p to t smax ) 6 c/second max. 6 c/second max. time 25 c to p eak t emperature 6 minutes max. 8 minutes max. * tolerance for peak profile temperature (t p ) is defined a s a supplier minimum and a user maximum. ** tolerance for time at peak profile temperature (t p ) is defined as a supplier minimum and a user maximum. c l a s s i f i c a t i o n r e f l o w p r o f i l e s table 1. snpb eutectic process ? classification temperatures (tc) package thickness volume mm 3 <350 volume mm 3 3 350 <2.5 mm 235 c 22 0 c 3 2.5 mm 220 c 220 c table 2. pb - free process ? classification temperatures (tc) package thickness volume mm 3 <350 volume mm 3 350 - 2000 volume mm 3 >2000 <1.6 mm 260 c 260 c 260 c 1.6 mm ? 2.5 mm 260 c 250 c 245 c 3 2.5 mm 250 c 245 c 245 c r e l i a b i l i t y t e s t p r o g r a m test item method description solderability jesd - 22, b102 5 sec, 245 c holt jesd - 22, a108 1000 hrs, bias @ tj=125 c pct jesd - 22, a102 168 hrs, 100 % rh, 2atm , 121 c tct jesd - 22, a104 500 cycles, - 65 c~150 c hbm mil - std - 883 - 3015.7 vhbm ? 2kv mm jesd - 22, a1 15 vmm ? 200v latch - up jesd 78 10ms, 1 tr ? 100ma
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 1 - j u l . , 2 0 1 2 a p a 2 1 7 7 w w w . a n p e c . c o m . t w 2 0 c u s t o m e r s e r v i c e a n p e c e l e c t r o n i c s c o r p . head office : no.6, dusing 1st road, sbip, hsin-chu, taiwan tel : 886-3-5642000 fax : 886-3-5642050 t a i p e i b r a n c h : 2 f , n o . 1 1 , l a n e 2 1 8 , s e c 2 j h o n g s i n g r d . , s i n d i a n c i t y , t a i p e i c o u n t y 2 3 1 4 6 , t a i w a n t e l : 8 8 6 - 2 - 2 9 1 0 - 3 8 3 8 f a x : 8 8 6 - 2 - 2 9 1 7 - 3 8 3 8

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