? semiconductor components industries, llc, 2006 september, 2006 ? rev. 4 1 publication order number: mbrp40030ctl/d mbrp40030ctl preferred device powertap ii switchmode power rectifier this state-of-the-art switchmode power rectifier uses the schottky barrier principle with a platinum barrier metal. features ? dual diode construction; may be paralleled for higher current output ? guard ? ring for stress protection ? low forward voltage drop ? 150 c operating junction temperature ? recyclable epoxy ? improved mechanical ratings ? pb ? free package is available* mechanical characteristics ? case: epoxy, molded with metal heatsink base ? weight: 80 grams (approximately) ? finish: all external surfaces corrosion resistant ? top terminal torque: 25 ? 40 lb ? in max ? base plate torques: see procedure given in the package outline section maximum ratings rating symbol value unit peak repetitive reverse voltage working peak reverse voltage dc blocking voltage v rrm v rwm v r 30 v average rectified forward current (at rated v r , t c = 100 c) per leg per device i f(av) 200 400 a peak repetitive forward current, (at rated v r , square wave, 20 khz, t c = 100 c) i frm 200 a non ? repetitive peak surge current (surge applied at rated load conditions halfwave, single phase, 60 hz) i fsm 1500 a peak repetitive reverse surge current (2.0 s, 1.0 khz) i rrm 2.0 a storage temperature range t stg ? 55 to +150 c operating junction temperature t j ? 55 to +150 c voltage rate of change (rated v r ) dv/dt 10,000 v/ s stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above the recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may affect device reliability. *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. preferred devices are recommended choices for future use and best overall value. http://onsemi.com powertap ii case 357c plastic 1 2 3 1 2 3 device package shipping ordering information mbrp40030ctl powertap ii 25 units/tray marking diagram b40030l b40030l = specific device code mcc = mold compound code a = assembly location yy = year ww = work week g= pb ? free package mcc ayywwg powertap ii (pb ? free) MBRP40030CTLG 25 units/tray low v f schottky barrier rectifier 400 amperes, 30 volts
mbrp40030ctl http://onsemi.com 2 thermal characteristics characteristic symbol value unit thermal resistance, junction ? to ? case (note 1) r jc 0.4 c/w electrical characteristics maximum instantaneous forward voltage (note 2) (i f = 200 amps, t c = + 25 c) (i f = 200 amps, t c = + 100 c) v f 0.5 0.41 v maximum instantaneous reverse current (note 2) (rated dc voltage, t c = + 25 c) (rated dc voltage, t c = + 100 c) i r 20 1000 ma 1. rating applies when surface mounted on the minimum pad size recommended. 2. pulse test: pulse width = 300 s, duty cycle 2%. figure 1. typical instantaneous forward voltage figure 2. maximum instantaneous forward voltage v f , instantaneous forward voltage (volts) i f , instantaneous forward current (amps) 0.2 0.1 0 v f , maximum instantaneous forward voltage (volts) 0.4 0.3 0.6 0.5 0.1 0.05 0 1000 100 10 1 0.3 0.2 0.5 0.4 i f , instantaneous forward current (amps) t j = 100 c t j = 25 c t j = 150 c t j = 100 c t j = 25 c t j = 150 c 0.15 0.25 0.35 0.45 1000 100 10 1
mbrp40030ctl http://onsemi.com 3 i r , maximum reverse current (amps) i r , reverse current (amps) figure 3. typical reverse current figure 4. maximum reverse current 0102030 v r , reverse voltage (volts) v r , reverse voltage (volts) 0.001 0.01 0.1 1 10 0.0001 t j = 100 c t j = 25 c t j = 150 c 1000 0 v r , reverse voltage (volts) c, capacitance (pf) 25 c 100000 10000 10 20 30 5152535 5152535 0102030 0.001 0.01 0.1 1 10 0.0001 t j = 100 c t j = 25 c t j = 150 c 5152535 figure 5. typical capacitance
mbrp40030ctl http://onsemi.com 4 maximum mechanical ratings terminal penetration: 0.235 max terminal torque: 25 ? 40 in-lb max mounting torque ? outside holes: 30 ? 40 in-lb max mounting torque ? center hole: 8 ? 10 in-lb max seating plane 1 mil per in. flatness (between mounting holes) powertap mechanical data applies over operating temperature vertical pull 250 lbs. max 2 in. lever pull 50 lbs. max note: while the powertap is capable of sustaining these vertical and levered tensions, the intimate contact note: between powertap and heat sink may be lost. this could lead to thermal runaway. the use of very note: flexible leads is recommended for the anode connections. use of thermal grease is highly recommended. 2 mounting procedure the powertap package requires special mounting considerations because of the long longitudinal axis of the copper heat sink. it is important to follow the proper tightening sequence to avoid warping the heat sink, which can reduce thermal contact between the powertap and heat sink. 2 ? 3 turns 2 ? 3 turns 2 ? 3 turns power tap heat sink step 2: finger tighten the center bolt. the bolt may catch on the threads of the heat sink so it is important to make sure the face of the bolt or washer is in contact with the surface of the powertap. 2 ? 3 turns finger-tight 2 ? 3 turns power tap heat sink step 3: tighten each of the end bolts between 5 to 10 in-lb. power tap heat sink 5 ? 10 in-lb finger-tight 5 ? 10 in-lb step 4: tighten the center bolt between 8 to 10 in-lb. 5 ? 10 in-lb 8 ? 10 in-lb 5 ? 10 in-lb power tap heat sink step 5: finally, tighten the end bolts between 30 to 40 in-lb. 30 ? 40 in-lb 8 ? 10 in-lb 30 ? 40 in-lb power tap heat sink step 1: locate the powertap on the heat sink and start mounting bolts into the threads by hand (2 or 3 turns).
mbrp40030ctl http://onsemi.com 5 package dimensions case 357c ? 03 powertap plastic package issue e b 0.25 (0.010) m ta mm dim a min max min max millimeters 3.450 3.635 87.63 92.33 inches b 0.700 0.810 17.78 20.57 c 0.615 0.640 15.63 16.26 e 0.120 0.130 3.05 3.30 f 0.435 0.445 11.05 11.30 g 1.370 1.380 34.80 35.05 h 0.007 0.030 0.18 0.76 n 1/4?20unc?2b 1/4?20unc?2b q 0.270 0.285 6.86 7.23 r 31.50 bsc 80.01 bsc u 0.600 0.630 15.24 16.00 v 0.330 0.375 8.39 9.52 w 0.170 0.190 4.32 4.82 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. terminal penetration: 5.97 (0.235) maximum. r g w n q b 0.25 (0.010) m ta mm 2 pl e seating plane f v u c h ? a ? ? b ? ? t ? on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5773 ? 3850 mbrp40030ctl/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative powertap and switchmode are trademarks of semiconductor components industries, llc
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