1 publication order number: ncp553/d ? semiconductor components industries, llc, 2013 june, 2013 ? rev. 3 ncp553, ncv553 80 ma cmos low iq nocap voltage regulator this series of fixed output nocap linear regulators are designed for handheld communication equipment and portable battery powered applications which require low quiescent. this series features an ultra ? low quiescent current of 2.8 a. each device contains a voltage reference unit, an error amplifier, a pmos power transistor, resistors for setting output voltage, current limit, and temperature limit protection circuits. these voltage regulators have been designed to be used with low cost ceramic capacitors. the devices have the ability to operate without an output capacitor. the devices are housed in the micro ? miniature sc82 ? ab surface mount package. standard voltage versions are 1.5, 1.8, 2.5, 2.7, 2.8, 3.0, 3.3, and 5.0 v. other voltages are available in 100 mv steps. features ? low quiescent current of 2.8 a typical ? low output voltage option ? output voltage accuracy of 2.0% ? industrial temperature range of ? 40 ? c to 85 ? c (ncv553, t a = ? 40 ? c to +125 ? c) ? these are pb ? free devices ? ncv prefix for automotive and other applications requiring unique site and control change requirements; aec ? q100 qualified and ppap capable typical applications ? battery powered consumer products ? hand ? held instruments ? camcorders and cameras figure 1. typical application diagram output c2 + input gnd n/c v in v out + c1 this device contains 32 active transistors sc82 ? ab (sc70 ? 4) sq suffix case 419c pin connections & marking diagrams xxx = device code m = date code = pb ? free package gnd 1 2 4 3 v in n/c v out xxxm (ncp553, ncv553 top view) see detailed ordering and shipping information in the package dimensions section on page 7 of this data sheet. ordering information http://onsemi.com (note: microdot may be in either location) *date code orientation and/or position may vary depending upon manufacturing location.
ncp553, ncv553 http://onsemi.com 2 1 ? enable ? power standby. when this input is pulled low, the device is disabled. if this function is not used, enable should be connected to vin. maximum ratings rating symbol value unit input voltage ? 0.3 to v in +0.3 ? to ? ambient ja ? c/w operating junction temperature t j +125 ? c ? 40 to +85 ? 40 to +125 ? c ? 55 to +150 ? c stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. 1. this device series contains esd protection and exceeds the following tests: human body model 2000 v per mil ? std ? 883, method 3015 machine model method 200 v 2. latch up capability (85 ? c) ? 200 ma dc with trigger voltage.
ncp553, ncv553 http://onsemi.com 3 electrical characteristics (v in = v out(nom.) + 1.0 v, v enable = v in , c in = 1.0 f, c out = 1.0 f, t j = 25 ? c, unless otherwise noted.) characteristic symbol min typ max unit output voltage (t a = 25 ? c, i out = 10 ma) 1.5 v 1.8 v 2.5 v 2.7 v 2.8 v 3.0 v 3.3 v 5.0 v v out 1.455 1.746 2.425 2.646 2.744 2.94 3.234 4.900 1.5 1.8 2.5 2.7 2.8 3.0 3.3 5.0 1.545 1.854 2.575 2.754 2.856 3.06 3.366 5.100 v output voltage (t a = ? 40 ? c to 85 ? c, i out = 10 ma) 1.5 v 1.8 v 2.5 v 2.7 v 2.8 v 3.0 v 3.3 v 5.0 v v out 1.455 1.746 2.425 2.619 2.716 2.910 3.201 4.900 1.5 1.8 2.5 2.7 2.8 3.0 3.3 5.0 1.545 1.854 2.575 2.781 2.884 3.09 3.399 5.100 v output voltage (t a = ? 40 ? c, i out = 10 ma) ncv553 ? 5.0 v v out 4.900 5.0 5.100 v output voltage (t a = +125 ? c, i out = 10 ma) ncv553 ? 5.0 v v out 4.850 5.0 5.150 v line regulation (v in = v out + 1.0 v to 12 v, i out = 10 ma) reg line ? 2.0 4.5 mv/v load regulation (i out = 1.0 ma to 80 ma, v in = v out + 2.0 v) reg load ? 0.3 0.8 mv/ma output current (v out = (v out at i out = 80 ma) ? 3.0%) 1.5 v ? 3.9 v (v in = v out(nom.) + 2.0 v) 4.0 v ? 5.0 v (v in = 6.0 v) i o(nom.) 80 80 180 180 ? ? ma dropout voltage (t a = ? 40 ? c to 125 ? c, i out = 80 ma, measured at v out ? 3.0%) 1.5 v 1.8 v 2.5 v 2.7 v 2.8 v 3.0 v 3.3 v 5.0 v v in ? v out ? ? ? ? ? ? ? ? 1300 1100 800 750 730 680 650 470 1800 1600 1400 1200 1200 1000 1000 800 mv quiescent current (enable input = 0 v) (enable input = v in , i out = 1.0 ma to i o(nom.) , v in = v out +2.0 v) i q ? ? 0.1 2.8 1.0 6.0 a output short circuit current (v out = 0 v) 1.5 v ? 3.9 v (v in = v out(nom.) + 2.0 v) 4.0 v ? 5.0 v (v in = 6.0 v) i out(max) 100 100 300 300 450 450 ma output voltage noise (f = 20 hz to 100 khz, i out = 10 ma) (c out = 1.0 f) v n ? 90 ? vrms output voltage temperature coefficient t c ? 100 ? ppm/ ? c 3. maximum package power dissipation limits must be observed. pd t j(max) t a r ja 4. low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
ncp553, ncv553 http://onsemi.com 4 definitions load regulation the change in output voltage for a change in output current at a constant temperature. dropout voltage the input/output differential at which the regulator output no longer maintains regulation against further reductions in input voltage. measured when the output drops 3.0% below its nominal. the junction temperature, load current, and minimum input supply requirements affect the dropout level. maximum power dissipation the maximum total dissipation for which the regulator will operate within its specifications. quiescent current the quiescent current is the current which flows through the ground when the ldo operates without a load on its output: internal ic operation, bias, etc. when the ldo becomes loaded, this term is called the ground current. it is actually the difference between the input current (measured through the ldo input pin) and the output current. line regulation the change in output voltage for a change in input voltage. the measurement is made under conditions of low dissipation or by using pulse technique such that the average chip temperature is not significantly affected. line transient response typical over and undershoot response when input voltage is excited with a given slope. thermal protection internal thermal shutdown circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. when activated at typically 160 ? c, the regulator turns off. this feature is provided to prevent failures from accidental overheating. maximum package power dissipation the maximum power package dissipation is the power dissipation level at which the junction temperature reaches its maximum operating value, i.e. 125 ? c. depending on the ambient power dissipation and thus the maximum available output current.
ncp553, ncv553 http://onsemi.com 5 typical characteristics 5 1.5 1 0.5 time ( s) 6 2 4.5 3 2.5 3.5 output voltage deviation (mv) v in , input voltage (v) i q , quiescent current ( a) i q , quiescent current ( a) ? 60 2.75 0 ? 40 1.75 3.25 3 20 100 60 2 2.5 2.25 ? 20 40 80 temperature ( c) 0.5 0 ? 50 0.5 25 0 ? 25 v in ? v out , dropout voltage (volts) 0 figure 2. dropout voltage versus temperature figure 3. output voltage versus temperature figure 4. quiescent current versus temperature figure 5. quiescent current versus input voltage figure 6. output noise density frequency (hz) figure 7. line transient response output noise ( v/ hz ) 1 10 100 temperature ( c) 0.6 50 125 75 0.1 0.4 0.3 v out(nom.) = 3.0 v ? 60 3.02 0 ? 40 v out , output voltage (volts) 3 3.03 temperature ( c) 3.025 20 100 60 3.005 3.015 3.01 v out(nom.) = 3.3 v i out = 5 ma i out = 0 ma v in = 4 v 0 2 6 4 2 0 3 v in , input voltage (volts) 2.5 812 10 0.5 1.5 1 v out(nom.) = 3 v i out = 0 ma 4.5 1 1.5 2 2.5 3 3.5 4 1000000 ? 100 0 0 100 200 4 i out = 1 ma c out = 1 f 100 0.2 0.7 0.8 0.9 80 ma 40 ma ? 20 40 80 v in = 12 v v in = 4 v 3.5 4 1000 10000 100000 10 ma 50 ma 4
ncp553, ncv553 http://onsemi.com 6 typical characteristics ? 400 100 0 50 ? 50 200 0 400 10 time (ms) figure 8. load transient response figure 9. load transient response 0 time (ms) 100 150 0 600 20 50 0 50 30 40 output voltage deviation (mv) i out , output current (v) output voltage deviation (mv) i out , output current (ma) 0.5 1 2 1.5 v in = 4 v c out = 10 f v in = 4 v c out = 10 f 0 2 3 1 1.5 0 3.5 figure 10. output voltage versus input voltage 0 0.5 v out , output voltage (volts) 24 12 6 c in = 1 f c out = 1 f t a = 25 c v in , input voltage (volts) 2.5 8 200 ? 200 10
ncp553, ncv553 http://onsemi.com 7 applications information a typical application circuit for the ncp553 series is shown in figure 1, front page. input decoupling (c1) a 1.0 f capacitor either ceramic or tantalum is recommended and should be connected close to the package. higher values and lower esr will improve the overall line transient response. if large line or load transients are not expected, then it is possible to operate the regulator without the use of a capacitor. tdk capacitor: c2012x5r1c105k, or c1608x5r1a105k output decoupling (c2) the ncp553 are very stable regulators and do not require any specific equivalent series resistance (esr) or a minimum output current. if load transients are not to be expected, then it is possible for the regulator to operate with no output capacitor. otherwise, capacitors exhibiting esrs ranging from a few m up to 10 ? can thus safely be used. the minimum decoupling value is 0.1 f and can be augmented to fulfill stringent load transient requirements. the regulator accepts ceramic chip capacitors as well as tantalum devices. larger values improve noise rejection and load regulation transient response. tdk capacitor: c2012x5r1c105k, c1608x5r1a105k, or c3216x7r1c105k hints please be sure the vin and gnd lines are sufficiently wide. when the impedance of these lines is high, there is a chance to pick up noise or cause the regulator to malfunction. set external components, especially the output capacitor, as close as possible to the circuit, and make leads as short as possible. thermal as power across the ncp553 increases, it might become necessary to provide some thermal relief. the maximum power dissipation supported by the device is dependent upon board design and layout. mounting pad configuration on the pcb, the board material and also the ambient temperature effect the rate of temperature rise for the part. this is stating that when the devices have good thermal conductivity through the pcb, the junction temperature will be relatively low with high power dissipation applications. the maximum dissipation the package can handle is given by: pd t j(max) t a r ja if junction temperature is not allowed above the maximum 125 ? c, then the ncp553 can dissipate up to 250 mw @ 25 ? c. the power dissipated by the ncp553 can be calculated from the following equation: p tot v in *i gnd (i out ) [ v in v out ] *i out or v inmax p tot v out * i out i gnd i out if an 80 ma output current is needed then the ground current from the data sheet is 2.8 a. for an ncp553 (3.0 v), the maximum input voltage will then be 6.12 v. ordering information device nominal output voltage (note 5) marking package shipping ? ncp553sq15t1g ncp553sq18t1g ncp553sq25t1g ncp553sq27t1g ncp553sq28t1g ncp553sq30t1g NCP553SQ33T1G ncp553sq50t1g 1.5 1.8 2.5 2.7 2.8 3.0 3.3 5.0 lbe lbf lbg lbh lbi lbj lbk lbl sc82 ? ab (sc70 ? 4) (pb ? free) 3000 units/ 8 ? tape & reel ncv553sq15t1g* ncv553sq50t1g* 1.5 5.0 aaf lft ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d. *ncv prefix for automotive and other applications requiring unique site and control change requirements; aec ? q100 qualified and ppap capable 5. additional voltages in 100 mv steps are available upon request by contacting your on semiconductor representative.
ncp553, ncv553 http://onsemi.com 8 package dimensions sc ? 82ab (sc70 ? 4) sq suffix case 419c ? 02 issue f notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. 419c ? 01 obsolete. new standard is 419c ? 02. 4. dimensions a and b do not include mold flash, protrusions, or gate burrs. 12 3 a g s n j k 4 d 3 pl b f l c h 0.05 (0.002) dim min max min max inches millimeters a 1.80 2.20 0.071 0.087 b 1.15 1.35 0.045 0.053 c 0.80 1.10 0.031 0.043 d 0.20 0.40 0.008 0.016 f 0.30 0.50 0.012 0.020 g 1.10 1.50 0.043 0.059 h 0.00 0.10 0.000 0.004 j 0.10 0.26 0.004 0.010 k 0.10 ??? 0.004 ??? l 0.05 bsc 0.002 bsc n 0.20 ref 0.008 ref s 1.80 2.40 0.07 0.09 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* 1.30 0.0512 mm inches
scale 10:1 0.65 0.026 1.90 0.075 0.90 0.035 0.70 0.028 0.95 0.037 on semiconductor and are registered trademarks of semiconductor co mponents industries, llc (scillc). scillc owns the rights to a numb er of patents, trademarks, copyrights, trade secrets, and other intellectual property. a list ing of scillc?s product/patent coverage may be accessed at ww w.onsemi.com/site/pdf/patent ? marking.pdf. scillc reserves the right to make changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and s pecifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. all operating parame ters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the right s of others. scillc products are not designed, intended, or a uthorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in whic h the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or us e scillc products for any such unintended or unauthorized appli cation, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unin tended or unauthorized use, even if such claim alleges that scil lc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyrig ht laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 ncp553/d nocap is a trademark of semiconductor components industries, llc (scillc). literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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