1/4 rev. b structure silicon monolithic integrated circuit product name overvoltage protection controller with internal fet model name BD6046GUL features ? overvoltage protection up to 28v ? negative voltage protection ? internal low ron (250m ? ) fet ? over voltage lockout (ovlo) ? under voltage lockout(uvlo) ? internal 2.5msec startup delay ? over current protect ? thermal shut down ? small package: vcsp50l2(2.5mm x 2.5mm, height=0.55mm) ? absolute maximum ratings (ta=25 ? ) contents symbol rating unit conditions input supply voltage 1 vmax1 -30 ? 30 v in input supply voltage 2 vmax2 -0.3 ? 7 v other power dissipation pd 975 mw operating temperature range topr -40 ? +85 ? storage temperature range tstr -55 ? +150 ? t 1 when using more than at ta=25 ? , it is reduced 7.8mw per 1 ? . rohm specification board 50mm 58mm mounting. ? operating range (ta=-40 ? +85 ? ) parameter symbol range unit usage input voltage range v in 2.2 ? 28 v t this product is not especially designed to be protected from radioactivity. 4 u b u v t p g u i j t e p d v n f o u 5 i f + b q b o f t f w f s t j p o p g u i j t e p d v n f o u j t u i f g p s n b m t q f d j g j d b u j p o " d v t u p n f s n b z v t f u i j t u s b o t m b u j p o w f s t j p o p o m z g p s s f g f s f o d f u p i f m q s f b e j o h u i f g p s n b m w f s t j p o * g u i f s f b s f b o z e j g g f s f o d f t j o u s b o t m b u j p o w f s t j p o p g u i j t e p d v n f o u
g p s n b m w f s t j p o u b l f t q s j p s j u z
2/4 rev. b ? electrical characteristics (unless otherwise noted, ta = 25 c, in=5v) 3 b u j o h 1 b s b n f u f s 4 z n c p m . j o 5 z q . b y 6 o j u $ p o e j u j p o t ? electrical input voltage range 7 * / 7 supply quiescent current 1 * $ $ " supply quiescent current 2 6 7 - 0 7 in=decreasing under voltage lockout 6 7 - 0 i n 7 in=increasing under voltage lockout hysteresis 0 7 - 0 7 in=increasing over voltage lockout 0 7 - 0 i n 7 in=decreasing current limit * - . " vin vs. vout res. 3 0 / n
flgb output low voltage ' - ( # 7 0 n 7 4 * / , n " flgb leakage current ' - ( # m f b l " ? timings (flgb pull up resistance 100k
) start up delay 5 p o n t f d output turn off time 5 p g g t f d alert delay 5 p w q t f d * this product is not especially designed to be protected from radioactivity.
3/4 rev. b ? block diagram ? pin number/pin name * o j u j b m % f m b z * / 6 7 - 0 0 $ 1 0 7 - 0 0 4 $ 7 3 & ' 5 j n j o h ( f o f s b u p s * o j u j b m % f m b z ( b u f % s j w f s * / ' - ( # 0 6 5 0 6 5 ( / % 0 6 5 * / 5 4 % * / * / * / * / 0 6 5 % " " % $ # # " % $ # " % / 7 1 figure5. block diagram ? pin descriptions 1 * / / " . & ' 6 / $ 5 * 0 / "
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% * / input voltage pin. a 1 f low esr capacitor, or larger must be connected between this pin and gnd "
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4/4 rev. b ? use-related cautions (1) absolute maximum ratings if applied voltage (vdd, vin), operating temp erature range (topr), or other absolute ma ximum ratings are exceeded, there is a r isk of damage. since it is not possible to identify short, ope n, or other damage modes, if special m odes in which absolute maximum ratings are exceeded are assumed, consider applying fuses or other physical safety measures. (2) recommended operating range this is the range within which it is possible to obtain roughly the expected characteristics. for electrical characteristics, it is those that are guaranteed under the conditions for each parame ter. even when these ar e within the recommended operating range, voltage and te mperature characteristics are indicated. (3) reverse connection of power supply connector there is a risk of damaging the lsi by reverse connection of the power supply connector. for protection from reverse connectio n, take measures such as externally placing a diode between the po wer supply and the power supply pin of the lsi. (4) power supply lines in the design of the board pattern, make po wer supply and gnd line wiring low impedance. when doing so, although the digital power supply and analog power supply are the same potential, se parate the digital power sup ply pattern and analog power supply pattern to deter digital noise from entering the analog power supply due to the common impedance of the wir ing patterns. similarly take pattern design into account for gnd lines as well. furthermore, for all power supply pins of the lsi, in conjunc tion with inserting capacitors be tween power supply and gnd pins, when using electrolytic capacitors, determine constant s upon adequately confirming that capacitanc e loss occurring at low temperatures is not a problem for various characteristics of the capacitors used. (5) gnd voltage make the potential of a gnd pin such that it will be the lowest potential even if operating below that. in addition, confirm t hat there are no pins for which the potential becomes less than a gnd by actually including transition phenomena. (6) shorts between pins and misinstallation when installing in the set board, pay adequate attention to orientation a nd placement discrepancies of the lsi. if it is insta lled erroneously, there is a risk of lsi damage. there also is a risk of damage if it is shorted by a foreign substance getting between pins or between a pin and a power supply or gnd. (7) operation in strong magnetic fields be careful when using the lsi in a str ong magnetic field, since it may malfunction. (8) inspection in set board when inspecting the lsi in the set board, si nce there is a risk of stress to the lsi when capacitors are connected to low imped ance lsi pins, be sure to discharge for each process. moreover, when getting it on and off of a jig in the inspection process, always connect it afte r turning off the power supply, perform the inspection, and remove it after turning off the power supply. furthermore, as countermeasures against stat ic electricity, use grounding in the assembly process and take a ppropriate care in transport and storage. (9) input pins parasitic elements inevitably are formed on an lsi structure due to potential relationships. because parasitic elements operat e, they give rise to interference with circuit operation and may be the cause of malf unctions as well as damage. accordingly, take care not to appl y a lower voltage than gnd to an input pin or use the lsi in other ways such that para sitic elements operate. moreover, do not apply a voltage to an input pin when the power supply voltage is not being applied to the lsi. furthermore, when the power s upply voltage is being applied, make each i nput pin a voltage less than the power supply voltage as well as within th e guaranteed values of el ectrical characteristics. (10) ground wiring pattern when there is a small signal gnd and a large current gnd, it is recommended that you separate the large current gnd pattern and small signal gnd pattern and provide single point grounding at the reference point of the set so that voltage variation due to resistance co mponents of the pattern wiring and large currents do not cause the small signal gnd voltage to change. take care that the gnd wiring pattern of extern ally attached components also does not change. (11) externally at tached capacitors when using ceramic capacitors fo r externally attached capacitors, determine constants upon taking into account a lowering of th e rated capacitance due to dc bias and capacitance change due to factors such as temperature. (12) thermal shutdown circuit (tsd) when the junction temperature reaches the de fined value, the thermal shutdown circuit operates and turns a switch off. the the rmal shutdown circuit, which is aimed at isolating the lsi from thermal runawa y as much as possible, is not aimed at the protection or guaran tee of the lsi. therefore, do not continuously use the lsi with this circuit operating or use the lsi assuming its operation. (13) thermal design perform thermal design in which there are adequate margins by taking into account the permissibl e dissipation (pd) in actual st ates of use.
notes no technical content pages of this document may be reproduced in any form or transmitted by any means without prior permission of rohm co.,ltd. the contents described herein are subject to change without notice. the specifications for the product described in this document are for reference only. upon actual use, therefore, please request that specifications to be separately delivered. application circuit diagrams and circuit constants contained herein are shown as examples of standard use and operation. please pay careful attention to the peripheral conditions when designing circuits and deciding upon circuit constants in the set. any data, including, but not limited to application circuit diagrams information, described herein are intended only as illustrations of such devices and not as the specifications for such devices. rohm co.,ltd. disclaims any warranty that any use of such devices shall be free from infringement of any third party's intellectual property rights or other proprietary rights, and further, assumes no liability of whatsoever nature in the event of any such infringement, or arising from or connected with or related to the use of such devices. upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or otherwise dispose of the same, no express or implied right or license to practice or commercially exploit any intellectual property rights or other proprietary rights owned or controlled by rohm co., ltd. is granted to any such buyer. products listed in this document are no antiradiation design. appendix1-rev2.0 thank you for your accessing to rohm product informations. more detail product informations and catalogs are available, please contact your nearest sales office. rohm customer support system the americas / eupope / asia / japan contact us : webmaster@ rohm.co. jp www.rohm.com copyright ? 2007 rohm co.,ltd. the products listed in this document are designed to be used with ordinary electronic equipment or de vices (such as audio visual equipment, office-automation equipment, communications devices, electrical appliances and electronic toys). should you intend to use these products with equipment or devices which require an extremely high level of reliability and the malfunction of which would directly endanger human life (such as medical instruments, transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers and other safety devices), please be sure to consult with our sales representative in advance. it is our top priority to supply products with the utmost quality and reliability. however, there is always a chance of failure due to unexpected factors. therefore, please take into account the derating characteristics and allow for sufficient safety features, such as extra margin, anti-flammability, and fail-safe measures when designing in order to prevent possible accidents that may result in bodily harm or fire caused by component failure. rohm cannot be held responsible for any damages arising from the use of the products under conditions out of the range of the specifications or due to non-compliance with the notes specified in this catalog. 21, saiin mizosaki- cho, ukyo-ku, kyoto 615-8585, japan tel : +81-75-311-2121 fax : +81-75-315-0172 appendix
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