View ESDAVLC8-1BU2_7321056.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

this is information on a product in full production. may 2012 doc id 16546 rev 2 1/11 11 ESDAVLC8-1BU2 single-line low capacitance tran sil?, transient surge voltage suppressor (tvs) for bidi rectional esd protection datasheet ? production data features bidirectional device withstands multiple esd strikes very low diode capacitance: 5 pf typ. at 0 v low leakage current 0201 smd package size compatible ultra small pcb area: 0.18 mm 2 rohs compliant benefits high esd protection level high integration suitable for high density boards msl1 complies with the following standards: iec 61000-4-2 level 4 ? 15 kv (air discharge) ? 8 kv (contact discharge) applications where transient overvoltage protection in esd sensitive equipment is required, such as: portable multimedia players and accessories notebooks digital cameras and camcorders communication systems cellular phone handsets and accessories figure 1. functional diagram (top view) description the ESDAVLC8-1BU2 is a bidirectional single line tvs diode designed to protect the data lines or other i/o ports against esd transients. the device is ideal for applications where both reduced line capacitance and board space saving are required. tm: transil is a trademar k of stmicroelectronics pin 2 a v a il ab le in different form s st0201 package www.st.com
characteristics ESDAVLC8-1BU2 2/11 doc id 16546 rev 2 1 characteristics figure 2. electrical characteristics (definitions) table 1. absolute maximum ratings (t amb = 25 c) symbol parameter value unit v pp peak pulse voltage: iec 61000-4-2 contact discharge ec 61000-4-2 air discharge 15 16 kv i pp peak pulse current (8/20 s) 1.5 a t j junction temperature 125 c t stg storage temperature range - 55 to +150 c t l maximum lead temperature for soldering during 10 s 260 c t op operating junction temperature range -40 to +125 c symbol parameter v = breakdown voltage i = leakage current @ v v = stand-off voltage i = forward current i = peak pulse current i = breakdown current v = forward voltage drop r br rm rm rm pp r f v = clamping voltage cl f d = dynamic impedance t = voltage temperature a table 2. electrical characteristics (values, t amb = 25 c) symbol test condition min. typ. max. unit v br from pin1 to pin 2, i r = 1 ma 8.5 11 v from pin 2 to pin1, i r = 1 ma 14.5 17 i rm v rm = 3 v 100 na r d square pulse, i pp = 1 a t p = 2.5 s 2.5 t v br = t(t amb - 25 c) x v br (25 c) 6 10 -4 /c c line v r = 0 v, f osc = 1 mhz, v osc = 30 mv 5 7 pf
ESDAVLC8-1BU2 characteristics doc id 16546 rev 2 3/11 figure 3. relative variation of peak pulse power versus initial junction temperature figure 4. peak pulse power versus exponential pulse duration p pp [t j initial] / p pp [t j initial=25c] 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 0 25 50 75 100 125 150 t j (c) p pp (w) 10 100 1000 1 10 100 1000 t j initial = 25c t p (s) figure 5. junction capacitance versus reverse applied voltage (typical values) figure 6. relative variation of leakage current versus junction temperature (typical values) c(pf) 0 1 2 3 4 5 -5.0 -4.0 -3.0 -2.0 -1.0 0.0 1.0 2.0 3.0 4.0 5.0 f=1mhz v osc =30mv rms t j =25c v r (v) i r [t j ]/i r [t j =25c] 1 10 100 25 50 75 100 125 v r =3v t j (c) figure 7. esd response to iec 61000-4-2 (+8 kv contact discharge) figure 8. esd response to iec 61000-4-2 (-8 kv contact discharge) 10 v/div 20 ns/div 10 v/div 20 ns/div
characteristics ESDAVLC8-1BU2 4/11 doc id 16546 rev 2 figure 9. s21 attenuation measurement results figure 10. static characteristic (pin 2 to gnd) 100.0k 1.0m 10.0m 100.0m 1.0g - 30.00 -24.00 -18.00 -12.00 - 6.00 0.00 db f (hz) 0 -1 -2 -3 -4 -5 1 2 3 4 5 0 510152025 -25 -20 -15 -10 -5 ma v
ESDAVLC8-1BU2 ordering information scheme doc id 16546 rev 2 5/11 2 ordering information scheme figure 11. ordering information scheme esda vlc 8 - 1b u2 esd array very low capacitance package u2 = st0201 breakdown voltage direction 8 = 8.5 v min b = bidirectional
package information ESDAVLC8-1BU2 6/11 doc id 16546 rev 2 3 package information epoxy meets ul94, v0 lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. note: product marking may be rotated by multiples of 180 for assembly plant differentiation. in no case should this product marking be used to orient the component for its placement on a pcb. only pin 1 mark is to be used for this purpose. table 3. st0201 dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.23 0.28 0.33 0.009 0.011 0.013 b1 0.13 0.18 0.23 0.005 0.007 0.009 b2 0.14 0.19 0.24 0.006 0.007 0.009 d 0.55 0.60 0.65 0.022 0.024 0.026 e 0.25 0.30 0.35 0.010 0.012 0.014 e - 0.35 - - 0.014 - l1 0.20 0.25 0.30 0.008 0.010 0.012 l2 0.20 0.25 0.30 0.008 0.010 0.012 figure 12. footprint (dimensions in mm) figure 13. marking d e a b1 b1 b2 b2 e e l2 l2 l1 l1 to p side bottom pin 2 available in different forms pin 2 bottom 0.425 0.20 0.30 0.425 1.05 pin1 pin 2 v2
ESDAVLC8-1BU2 package information doc id 16546 rev 2 7/11 figure 14. tape and reel specifications bar indicates pin 1 user direction of unreeling all dimensions in mm 4.0 0.1 2.0 0.05 8.0 0.3 2.0 0.1 1.75 0.1 3.5 - 0.05 ? 1.55 0.05 0.34 0.03 0.37 +0.03, -0.02 0.20 0.05 0.67 0.03 v2 v2 v2 v2 v2 v2 v2
recommendation on pcb assembly ESDAVLC8-1BU2 8/11 doc id 16546 rev 2 4 recommendation on pcb assembly 4.1 stencil opening design figure 15. recommended stencil windows position 4.2 solder paste 1. halide-free flux qualification rol0 according to ansi/j-std-004. 2. ?no clean? solder paste is recommended. 3. offers a high tack force to resist component movement during high speed 4. solder paste with fine particles: powder particle size is 20-45 m. 0.425 0.20 0.038 0.065 footprint stencil window 0.040 0.038 0.30 0.320 0.425 1.05 0.225
ESDAVLC8-1BU2 recommendation on pcb assembly doc id 16546 rev 2 9/11 4.3 placement 1. manual positioning is not recommended. 2. it is recommended to use the lead recognition capabilities of the placemen t system, not the outline centering 3. standard tolerance of 0.05 mm is recommended. 4. 3.5 n placement force is recommended. too much placement force can lead to squeezed out solder paste and cause solder joints to short. too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. to improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. for assembly, a perfect supporting of the pcb (all the more on flexible pcb) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. 4.4 pcb design preference 1. to control the solder paste amount, the closed via is recommended instead of open vias. 2. the position of tracks and open vias in the solder area should be well balanced. the symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. 4.5 reflow profile figure 16. st ecopack ? recommended soldering reflow profile for pcb mounting note: minimize air convection currents in the reflow oven to avoid component movement. 60 sec (90 max) 250 0 50 100 150 200 240 210 180 150 120 90 60 30 300 270 -2 c/s to -3 c/s -6 c/s max 240-245 c 2 - 3 c/s 0.9 c/s temperature (c) time (s)
ordering information ESDAVLC8-1BU2 10/11 doc id 16546 rev 2 5 ordering information 6 revision history table 4. ordering information order code marking weight base qty delivery mode ESDAVLC8-1BU2 v2 (1) 1. the marking can be rotated by multiples of 180 to differentiate assembly location 0.124 mg 15000 tape and reel table 5. document revision history date revision changes 03-mar-2011 1 initial release. 15-may-2012 2 updated figure 10 for flow polarity. updated graphic in ta b l e 3 for pin 2 form. updated note under figure 13 and ta b l e 4 for marking rotation. updated figure 16 for recommended soldering reflow. updated marking in ta bl e 4 .
ESDAVLC8-1BU2 doc id 16546 rev 2 11/11 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by two authorized st representatives, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2012 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

▲Up To Search▲

Price & Availability of ESDAVLC8-1BU2

	To Download ESDAVLC8-1BU2 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .