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| tb6674pg/fg/fag ver.3 2010-07-07 1 toshiba bicd integrated ci rcuit silicon monolithic tb6674pg, tb6674fg, TB6674FAG stepping motor driver ic tb6674pg, tb6674fg, and TB6674FAG are stepping motor driver ics with mos output transistors. the ics can control two-phase stepping motor forward and reverse by bipolar driving. they have a power-saving circuit and a standby circuit. features z they are similar substituting products of ta7774pg, ta7774fg, and ta7774fag. both products have same packages and same pin assignments. z one-chip two-phase bipolar ste pping motor driver (including two bridge drivers) z power saving operation is available. z standby operation is available. current consumption 20 a (typ.) z built-in punch-through current restriction circuit for system reliability and noise suppression. z ttl-compatible inputs ina, inb, ps, and vs2 b terminals z on resistance ps = l : 2.9 ? (typ.) ps = h: 7.9 ? (typ.) z high driving ability. tb6674pg/fg/fag ver.3 2010-07-07 2 block diagram note: tb6674fg: terminals 2, 7, 12, and 13 are nc. tb6674fg: the heat fin is connected to gnd. pin description pin no. symbol functional description 1 / (1) v s2 a low-voltage power supply terminal 2 / (3) v cc power voltage supply terminal for control 3 / (4) in a a-ch forward rotation / reverse rotation signal input terminal, truth table 1 4 / (f) gnd gnd terminal 5 / (f) gnd gnd terminal 6 / (5) in b b-ch forward rotation / reverse rotation signal input terminal, truth table 1 7 / (6) ps power saving signal input terminal 8 / (8) v s2 b standby signal input terminal, truth table 2 9 / (9) v s1 b high-voltage power supply terminal 10 / (10) b output b 11 / (11) b output b 12 / (f) gnd gnd terminal 13 / (f) gnd gnd terminal 14 / (14) a output 15 / (15) a output a 16 / (16) v s1 a high-voltage power supply terminal. pin no. of ( ) :tb6674fg tb6674pg/fag / tb6674fg bridge driver bridge driver free datasheet http:/// tb6674pg/fg/fag ver.3 2010-07-07 3 truth table 1. input output ps in l l l h enable v s1 l h h l enable v s1 h l l h enable v s2 (power saving) h h h l enable v s2 (power saving) truth table 2. v s2b l power off (standby mode) h operation note: apply 5 v to v s2a as a supply terminal. tb6674pg/fg/fag ver.3 2010-07-07 4 absolute maximum ratings (ta = 25c) characteristic symbol rating unit v cc 6.0 v s1 24.0 supply voltage v s2 up to v cc v i o (peak) 400 i o (start) 350 tb6674pg tb6674fg i o (hold) 100 i o (peak) 200 i o (start) 100 output current TB6674FAG i o (hold) 50 ma input voltage v in up to v cc v 1.4 (note 1) tb6674pg 2.7 (note 2) 0.9 (note 3) tb6674fg 1.4 (note 4) power dissipation TB6674FAG p d 0.78 (note 5) w operating temperature t opr 30 to 75 c storage temperature t stg 55 to 150 c note 1: ic only note 2: this value is obtained if mounting is on a 50 mm 50 mm 0.8 mm pcb, 60 % or more of which is occupied by copper. note 3: ic only note 4: this value is obtained if mounting is on a 60 mm 30 mm 1.6 mm pcb, 50 % or more of which is occupied by copper. note 5: this value is obtained if mounting is on a 50 mm 50 mm 1.6 mm pcb, 40 % or more of which is occupied by copper. operating conditions (ta = 25c) characteristic symbol min. typ. max. unit v cc 4.5 5.5 v s1 8.0 22.0 supply voltage v s2a 2.7 5.5 v tb6674pg tb6674fg i o 350 output current TB6674FAG i o 100 ma input voltage v in 0 v cc v maximum frequency of input pulse f in 25 khz minimum resolution of input pulse t w 20 s value of on resistance tends to increase when the difference between vs1 and vs2a becomes 5 v or less. free datasheet http:/// tb6674pg/fg/fag ver.3 2010-07-07 5 electrical characteristics (unless otherwise specified, ta = 25c, v cc = 5 v, v s1 = 12 v, and v s2a = 5 v) * toshiba does not implement testing before shipping. characteristic symbol test cir ? cuit test condition min typ. max unit i cc1 ps: h, v s2b : h D 3 5 i cc2 ps: l, v s2b : h D 3 5 ma supply current i cc3 1 v s2b : l D 1 20 a high v in h 2.0 D vcc input voltage low v in l D 0.2 D 0.8 v input hysteresis voltage* v inhys 1 ina, inb, ps, vs2b 90 mv i in (h) ina, inb, ps, vs2b v in 5.0 v built in pull-down resistance. 5 20 38 p a input current i in (l) 1 v in 0 v 1 p a r on 1h 2 ps: l, v s2b : h i out = 400 ma D 2 5 r on 2h 3 ps: h, v s2b : h i out = 100 ma D 7 16 tb6674pg tb6674fg r on l 2 v s2b : h i out = 400 ma D 0.9 3.5 r on 1h 2 ps: l, v s2b : h i out = 200 ma D 2 5 r on 2h 3 ps: h, v s2b : h i out = 50 ma D 7 16 output on resistance (note) TB6674FAG r on l 2 v s2b : h i out = 200 ma D 0.9 3.5 ? v f u D 1.2 2.5 diode forward voltage v f l 4 i f = 350 ma, ps = l D 1.0 2.2 v t plh D 0.5 D delay time t phl D in ? D 0.5 D s thermal shutdown circuit* tsd D (design target only) D 160 D c tsd hysteresis * tsdhys D (design target only) D 20 D c free datasheet http:/// tb6674pg/fg/fag ver.3 2010-07-07 6 undervoltage lockout circuit uvlo the tb6674 incorporates an under voltage lockout circuit. outputs are turned off (hi-z) under the conditions as follows; v cc 4.0 v (design target) or v s1a 6.0 v (design target) and v s1b 6.0 v (design target) or v s2a 2.2 v (design target) the uvlo circuit has a hysteresis and the functi on recovers under the conditions as follows; v cc = 4.1 v (design target), v s1a / v s1b = 6.5 v (design target), v s2a = 2.3 v (design target) 4.1 v (design target only) vcc voltage uvlo internal signal h l 4.0 v (design target only) tb6674pg/fg/fag ver.3 2010-07-07 7 2.3 v (design target only) vs2a voltage h l 2.2 v (design target only) h l off hi-z output pin normal operation tb6674pg/fg/fag ver.3 2010-07-07 8 over current protection (isd) circuit the ic incorporates the over current protection circuit that monitors the current flowing through each output power transistor. if a current, which is out of the detecting current, is sensed at any one of these transistors, all output transistors are turned off (hi-z). (however, isd is not incorporated in upper pchdmos when ps is high level (vs2a is 5 v usage) because on resistance is large. masking time is 20 s. the operation does not recover automa tically (latch method). there are two recovery methods written below. (1) power monitor turns on when any of the power supply decreases and reaches the specified voltage. (2) vs2b is set low level for 20 s or more and then set high. the operation recovers in 10 s. reference design target of detecting current is as follows; ps = l, vs1a (12 v) :pchdmos = 1.1 a ps = h/ps = l in common :lower nchdmos = 1.4 a please reduce the external noise to prevent malfunction for isd. isd internal signal h l normal operation off hi-z tb6674pg/fg/fag ver.3 2010-07-07 9 thermal shutdown circuit (tsd) the tb6674 incorporates a thermal shutdown circuit. if the junction temperature (t j ) exceeds 160c (design target only), all the outputs are tuned off hi-z . it recovers automatically at 140 . it has a hysteresis width of 20 . tsd = 160c (design target only) 160c (typ.) chip temperature internal tsd signal h l < tsd operation > output terminal h l normal operation off hi-z tsd operation 140c (typ.) free datasheet http:/// tb6674pg/fg/fag 2010-08-25 10 test circuit 1. i cc1, i cc2, i cc3, i in a, i in b, and i ps item sw 1 sw 2 sw 3 sw 4 i cc1 b b a a i cc2 b b b a i cc3 b b D b i in a a D D a i in b D a D a i ps D D a a all terminals of ina, inb, and ps should output low or be connected to the ground terminal in measuring i cc3 . tb6674pg, / fg/fag tb6674pg/fag / tb6674fg free datasheet http:/// tb6674pg/fg/fag 2010-08-25 11 test circuit 2. ron 1h1, ron 1h2, ron l2, and ron l3 *: adjust r l to correspond to i l. item sw 1 sw 2 sw 3 sw 4 sw 5 i l (ma) a D a b D b D a d v sat 1h1 D b b c a 100 a D a b D b D a d v sat 1h2 D b b c a 400 a D b b D a D a c v sat l2 D b D d b 100 a D b b D a D a c v sat l3 D b b d b 400 tb6674pg, / fg/fag free datasheet http:/// tb6674pg/fg/fag 2010-08-25 12 test circuit 3. ron 2h1, ron 2h2, and ron l1 *: adjust r l to correspond to i l. item sw 1 sw 2 sw 3 sw 4 sw 5 i l (ma) a D a b D b D a c v sat 2h1 D b a d a 20 a D a b D b D a c v sat 2h2 D b a d a 100 a D b b D a D a c v sat l1 D b a d b 20 tb6674pg, / fg/fag free datasheet http:/// tb6674pg/fg/fag 2010-08-25 13 test circuit 4. v f u, and v f l item sw 1 sw 2 a b c v f u d e a b c v f l e d timing chart (two-phase excitation) measuring method tb6674pg, / fg/fag free datasheet http:/// tb6674pg/fg/fag 2010-08-25 14 thermal performance characteristics application circuit note 1: connect the v s2a terminal to the lower supply voltage (5 v). note 2: supply smoothing capacitor* should be connected between each supply terminal (vcc, v s2a, and v s1a/b ) and gnd terminal. *: (ex.): capacitors of tens of f and 0.1 f which are connected in parallel. note 3: utmost care is necessa ry in the design of the output, v cc , v m , and gnd lines since the ic may be destroyed tb6674pg tb6674fg TB6674FAG mounting on a pcb of 50 mm x 50 mm x 0.8 mm, 60% or more of which is occupied by copper no heat sink mounting on a pcb of 60 mm x 30 mm x1.5 mm, 50% or more of which is occupied by coppe r no heat sink thermal resistance thermal resistance power dissipation power dissipation ambient temperature ambient temperature ambient temperature ta (c) power dissipation p d (w) thermal resistance r th(j-a) =160c/w mounting on a pcb of 50 mm x 50 mm x 1.6 mm, 40% or more of which is occupied by copper tb6674pg/fg/fag ta7774pg / fg/fag tb6674pg/fag / tb6674fg free datasheet http:/// tb6674pg/fg/fag 2010-08-25 15 by short-circuiting between outputs, air contamination fa ults, or faults due to improper grounding, or by short-circuiting between contiguous terminals. note 4: by our short-circuited exam ination of neighboring terminals, when 9 and 10 terminals or 15 and 16 terminals are short-circuited, the tb6674pg, tb6674fg, and TB6674FAG in any case might to be destroyed and cause the trouble of smoking etc. please use an appropriate fuse to the power supply line. note 5: connect v s1a terminal and v s1b terminal externally. note 6: connect each g nd terminal externally. free datasheet http:/// tb6674pg/fg/fag 2010-08-25 16 package dimensions unit: mm weight: 1.11 g (typ.) free datasheet http:/// tb6674pg/fg/fag 2010-08-25 17 package dimensions unit: mm weight: 0.50 g (typ.) free datasheet http:/// tb6674pg/fg/fag 2010-08-25 18 package dimensions | unit: mm weight: 0.14 g (typ.) free datasheet http:/// tb6674pg/fg/fag 2010-08-25 19 notes on contents 1. block diagrams some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. 2. equivalent circuits the equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 3. timing charts timing charts may be simplified for explanatory purposes. 4. application circuits the application circuits shown in this document are provided for reference purposes only. thorough evaluation is required, especially at the mass production design stage. toshiba does not grant any license to any industrial property rights by providing these examples of application circuits. 5. test circuits components in the test circuits are used only to obtain and confirm the device characteristics. these components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment. ic usage considerations notes on handling of ics [1] the absolute maximum rating s of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. do not exceed any of these ratings. exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. [2] use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or ic fa ilure. the ic will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, caus ing a large current to continuously flow and the breakdown can lead smoke or ignition. to minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse ca pacity, fusing time and in sertion circuit location, are required. [3] if your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power on or the negative current resulting from the back electromotive force at power off. ic breakdown may cause injury, smoke or ignition. use a stable power supply with ics with built-in protection functions. if the power supply is unstable, the protection function may not operate, causing ic breakdown. ic breakdown may cause injury, smoke or ignition. [4] do not insert devices in the wrong orientation or incorrectly. make sure that the positive and negative terminals of power supplies are connected properly. otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. in addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time. free datasheet http:/// tb6674pg/fg/fag 2010-08-25 20 points to remember on handling of ics (1) heat radiation design in using an ic with large current flow such as power amp, regulator or dr iver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (t j ) at any time and condition. these ics generate heat ev en during normal use. an inadequate ic heat radiation design can lead to decrease in ic life, de terioration of ic characteristics or ic breakdown. in addition, please design the device taking into considerate the effect of ic heat radiation with peripheral components. (2) back-emf when a motor rotates in the reverse direction, stop s or slows down abruptly, a current flow back to the motor?s power supply due to the effect of back-emf. if the current sink capability of the power supply is small, the device?s motor power supply and output terminals might be exposed to conditions beyond absolute maximum ratings. to avoid this problem, take the effect of back-emf into consideration in system design. free datasheet http:/// tb6674pg/fg/fag 2010-08-25 21 restrictions on product use ? toshiba corporation, and its subsidiaries and affiliates (collect ively ?toshiba?), reserve the right to make changes to the in formation in this document, and related hardware, software a nd systems (collectively ?product?) without notice. ? this document and any information herein may not be reproduc ed without prior written permission from toshiba. even with toshiba?s written permission, reproduc tion is permissible only if reproducti on is without alteration/omission. ? though toshiba works continually to improve product?s quality and reliability, product can malfunction or fail. customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situat ions in which a malfunction or failure of product could cause loss of human life, b odily injury or damage to property, including data loss or corruption. before customers use the product, create designs including the product, or incorporate the product into their own applications, cu stomers must also refer to and comply with (a) the latest ve rsions of all relevant toshiba information, including without limitation, this document, the specifications, the data sheets and applicat ion notes for product and the precautions and condi tions set forth in the ?toshiba se miconductor reliability handbook? and (b) the instructions for the application with which the product will be us ed with or for. customers are solely responsible for all aspe cts of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this product in such design or applications; (b) eval uating and determining the applicability of any info rmation contained in this document, or in c harts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operatin g parameters for such designs and applications. toshiba assumes no liability for customers? product design or applications. ? product is intended for use in general el ectronics applications (e.g., computers, personal equipment, office equipment, measur ing equipment, industrial robots and home electroni cs appliances) or for specif ic applications as expre ssly stated in this document . product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality a nd/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or se rious public impact (?unintended use?). unintended use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic s ignaling equipment, equipment used to control combustions or explosions, safety dev ices, elevators and escalators, devices related to el ectric power, and equipment used in finance-related fields. do not use product for unintended use unless specifically permitted in thi s document. ? do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy product, whether in whole or in part. ? product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. ? the information contained herein is pres ented only as guidance for product use. no re sponsibility is assumed by toshiba for an y infringement of patents or any other intellectual property rights of third parties that may result from the use of product. no license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. ? absent a written signed agreement, except as provid ed in the relevant terms and conditions of sale for product, and to the maximum extent allowable by law, toshiba (1) assumes no liability whatsoever, including without limitation, indirect, co nsequential, special, or incidental damages or loss, including without limitation, loss of profit s, loss of opportunities, business interruption and loss of data, and (2) disclaims any and all express or implied warranties and conditions related to sale, use of product, or information, including warranties or conditions of merchantability, fitness for a particular purpose, accuracy of information, or noninfringement. ? do not use or otherwise make available product or related so ftware or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or m anufacturing of nuclear, chemical , or biological weapons or missi le technology products (mass destruction w eapons). product and related software and technology may be controlled under the japanese foreign exchange and foreign trade law and the u.s. expor t administration regulations. ex port and re-export of product or related software or technology are strictly prohibited exc ept in compliance with all applic able export laws and regulations. ? please contact your toshiba sales representative for details as to environmental matters such as the rohs compatibility of pro duct. please use product in compliance with all applicable laws and regula tions that regulate the inclus ion or use of controlled subs tances, including without limitation, the eu rohs directive. toshiba assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations. free datasheet http:/// |
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