b b r r i i g g h h t t l l e e d d e e l l e e c c t t r r o o n n i i c c s s c c o o r r p p . . b b l l - - x x y y 0 0 3 3 6 6 1 1 - - t t r r 8 8 since 1981 features: 1. emitted color: yellow. 2. lens appearance: water clear. 3. low cost plastic package. 4. this product doesn?t contain restriction substance, comply rohs standard. applications: 1. automotive: dashboards, stop lamps, turn signals. 2. backlighting: lcds, key pads advertising. 3. status indicators: comsumer & industrial electronics. 4. general use. absolute maximum ratings(ta=25 ) parameter symbol rating unit power dissipation pd 100 mw forward current i f 30 ma peak forward current 1 i fp 100 ma reverse voltage v r 5 v operating temperature topr -25 ~80 - storage temperature tstg -30 ~100 - soldering temperature tsol see page 5 - 1 condition for i fp is pulse of 1/10 duty and 0.1msec width. package dimensions: notes: 1. all dimensions are in millimeters (inches). 2. tolerance is 0.10mm (0. 004?) unless otherwise specified. 3. specifications are subject to change without notice. ver.2.0 page 1 of 6 I??? http://www.brtled.com
b b r r i i g g h h t t l l e e d d e e l l e e c c t t r r o o n n i i c c s s c c o o r r p p . . b b l l - - x x y y 0 0 3 3 6 6 1 1 - - t t r r 8 8 since 1981 electrical and optical characteristics(ta=25 ) parameter symbol condition min. typ. max. unit forward voltage vf i f =20ma - 2.1 2.6 v luminous intensity iv i f =20ma 12.3 30 - mcd reverse current i r v r =5v - - 100 a peak wave length p i f =20ma - 583 - nm dominant wave length d i f =20ma 580 - 590 nm spectral line half-width ? i f =20ma - 35 - nm viewing angle 2 1/2 i f =20ma - 35 - deg typical electro-optical characteristics curves wavelength (nm) 100 80 60 40 50 60 40 20 30 1010 0 3.0 forward current (ma) ambient temperature ta( c) 20 fig.2 forward current derating curve vs. ambient temperature fig.4 relative luminous intensity 60 40 20 0 2.5 2.0 1.0 0.5 1.5 relative luminous intensity (normalized at 20ma) a -40 0 ambient temperature ta( c) -20 fig.6 radiation diagram 0.3 0.5 relative radiant intensity 0.7 0.8 0.9 1.0 0.1 0.2 0.4 0.6 90 80 60 70 50 40 20 10 0 30 fig.5 relative luminous intensity 10 vs. forward current 1 relative luminous intensity(@20ma) 0 0.5 1.0 1.5 2.0 forward current (ma) 10 0 20 30 40 forward current (ma) 20 30 40 50 forward voltage (v) 2345 forward voltage fig.3 forward current vs. fig.1 relative intensity vs. wavelength relative radiant intensity 50 0 0.5 1.0 583 533 633 ver.2.0 page 2 of 6 I??? http://www.brtled.com
b b r r i i g g h h t t l l e e d d e e l l e e c c t t r r o o n n i i c c s s c c o o r r p p . . b b l l - - x x y y 0 0 3 3 6 6 1 1 - - t t r r 8 8 since 1981 tapping and packaging speci fications(units: mm) specification minimum maximum item symbol mm inch mm inch tape feed hole diameter (dia) d 0 1.40 0.055 1.55 0.061 feed hole location e 1.65 0.065 1.85 0.072 centers line dimensions length direction f 5.45 0.215 5.55 0.218 compartment depth k 0 3.00 0.118 3.20 0.126 carrier tape overall thickness k 3.00 0.118 3.20 0.126 compartment pitch p 3.90 0.153 4.10 0.161 sprocket hole diameter p 0 3.90 0.153 4.10 0.161 centers line dimensions length direction p 2 1.95 0.076 2.05 0.080 carrier tape thickness t 0.30 0.012 carrier tape width w 12.00 0.472 12.30 0.484 flange diameter a 178.0 7.008 180.0 7.087 hub spindle hole c 12.50 0.492 13.50 0.531 hub diameter d 2 20.00 0.788 21.50 0.846 fixing tape width w 1 9.00 0.354 9.30 0.366 flange space between flanges t 16.00 0.629 17.00 0.669 compartment length a 0 1.87 0.074 2.07 0.081 compartment width b 0 6.30 0.248 6.50 0.256 d b u i p e f b o p e f ver.2.0 page 3 of 6 I??? http://www.brtled.com
b b r r i i g g h h t t l l e e d d e e l l e e c c t t r r o o n n i i c c s s c c o o r r p p . . b b l l - - x x y y 0 0 3 3 6 6 1 1 - - t t r r 8 8 since 1981 reliability test classification test item reference standard test conditions result operation life mil-std-750:1026 mil-std-883:1005 jis-c-7021 :b-1 connect with a power if=20ma ta=under room temperature test time=1,000hrs 0/20 high temperature high humidity storage mil-std-202:103b jis-c-7021 :b-11 ta=+65 5 rh=90%-95% test time=240hrs 0/20 high temperature storage mil-std-883:1008 jis-c-7021 :b-10 high ta=+85 5 test time=1,000hrs 0/20 endurance te s t low temperature storage jis-c-7021 :b-12 low ta=-35 5 test time=1,000hrs 0/20 temperature cycling mil-std-202:107d mil-std-750:1051 mil-std-883:1010 jis-c-7021 :a-4 -35 ~ +25 ~ +85 ~ +25 60min 20min 60min 20min test time=5cycle 0/20 thermal shock mil-std-202:107d mil-std-750:1051 mil-std-883:1011 -35 5 ~+85 5 20min 20min te s t ti m e = 1 0 c y c l e 0/20 environmental te s t solder resistance mil-std-202:201a mil-std-750:2031 jis-c-7021 :a-1 preheating 140 -160 ,within 2 minutes. operation heating 235 (max.), within 10seconds. (max.) 0/20 judgment criteria of failure for the reliability measuring items symbol measuring conditions judgment criteria for failure forward voltage v f ( v) i f =20ma over ux1.2 reverse current i r (ua) v r =5v over ux2 luminous intensity iv ( mcd ) i f =20ma below sx0.5 note: 1.u means the upper limit of specified characteristics. s means initial value. 2. measurment shall be taken between 2 hours and after the test pieces have been returned to normal ambient conditions after completion of each test. ver.2.0 page 4 of 6 I??? http://www.brtled.com
b b r r i i g g h h t t l l e e d d e e l l e e c c t t r r o o n n i i c c s s c c o o r r p p . . b b l l - - x x y y 0 0 3 3 6 6 1 1 - - t t r r 8 8 since 1981 soldering : 1. manual of soldering the temperature of the iron tip should not be higher than 300 (572 H ) and soldering within 3 seconds per solder-land is to be observed. 2. refold soldering preheating : 140 ~160 5 ,within 2 minutes. operation heating : 260 (max.) within 10 seconds.(max) gradual cooling (avoid quenching). 3. dip soldering (wave soldering) : preheating : 120 ~150 ,within 120~180 sec. operation heating : 245 5 within 5 sec.260 (max) gradual cooling (avoid quenching). handling : care must be taken not to cause to the epoxy resin portion of bright leds while it is exposed to high temperature. care must be taken not rub the epoxy resin portion of bright leds with hard or sharp article such as the sand blast and the metal hook . temperature time over 2 min. 4 /sec. max. 4 /sec. max. 10 sec. max. 260 max. 140~160 temperature time 120~180 sec. preheat 245 5 within 5 sec. soldering heat max. 260 120~150 ver.2.0 page 5 of 6 I??? http://www.brtled.com
b b r r i i g g h h t t l l e e d d e e l l e e c c t t r r o o n n i i c c s s c c o o r r p p . . b b l l - - x x y y 0 0 3 3 6 6 1 1 - - t t r r 8 8 since 1981 notes for designing: care must be taken to provide the current limiting resistor in the circuit so as to drive the bright leds within the rated figures. also, caution should be taken not to overload bright leds with instantaneous voltage at the turning on and off of the circuit. when using the pulse drive care must be taken to keep the average current within the rated figures. also, the circuit should be designed so as be subjected to reverse voltage when turning off the bright leds. storage: in order to avoid the absorption of moisture, it is recommended to solder bright leds as soon as possible after unpacking the sealed envelope. if the envelope is still packed, to store it in the environment as following: (1) temperature : 5 -30 (41 H )humidity : rh 60 max. (2) after this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or equivalent soldering process must be: a. completed within 168 hours. b. stored at less than 30% rh. (3) devices require baking before mounting, if: (2) a or (2) b is not met. (4) if baking is required, devices must be baked under below conditions: 48 hours at 60 3 . package and label of products: (1) package: products are packed in one bag of 1500 pcs (one taping reel) and a label is attached on each bag. (2) label: bright led logo part no. quantity bin. sealing date x xx xx xx year month day manufacture location ver.2.1 page 6 of 6 b I??? http://www.brtled.com
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