CXG1081TN receiving dual-band mixer description the CXG1081TN is a receiving dual-band mixer mmic. this ic is designed using the sony's gaas j- fet process. features high conversion gain gc = 9.5 to 10.0db (typ.) low noise figure nf = 4.6 to 4.7db (typ.) single 2.7v power supply operation low lo input power operation plo = ?5dbm single ctl pin achieved by the built-in inverter circuit 10-pin small package applications 800mhz japan digital cellular telephones (pdc) structure gaas j-fet mmic absolute maximum ratings (ta = 25?) supply voltage v dd 4.5 v input power p in +5 dbm current consumption i dd (mixer block) 15 ma operating temperature topr ?5 to +85 ? storage temperature tstg ?5 to +150 ? recommended operating conditions supply voltage v dd 2.7 to 3.3 v control voltage v ctl (h) 2.4 to 3.3 v v ctl (l) 0 to 0.3 v ?1 e99654b1z-ps sony reserves the right to change products and specifications without prior notice. this information does not convey any licens e by any implication or otherwise under any patents or other right. application circuits shown, if any, are typical examples illustr ating the operation of the devices. sony cannot assume responsibility for any problems arising out of the use of these circuits. 16 pin tssop (plastic) block diagram 5 6 1 10 if out rfin1 lo in rfin2 pin configuration if out/v dd 3 (mix) 10 v dd 1 (lo amp1) 9 gnd 8 ctl 7 rfin1 lo in v dd 2 (lo amp2) gnd opt rfin2 6 1 2 3 4 5
2 CXG1081TN electrical characteristics conditions: v dd = 2.7v, v ctl (h) = 2.7v, v ctl (l) = 0v, f rf 1 = 870mhz, f rf 2 = 820mhz, f lo = f rf 130mhz, p lo = 15dbm, unless otherwise specified (ta = 25 c) item current consumption control current conversion gain noise figure input ip3 lo to rf leak level symbol i dd i ctl g c nf iip3 p lk path v ctl v dd 1, v dd 2 v dd 3 gnd ctl gnd ctl gnd rf in 1 if out rf in 2 if out rf in 1 if out rf in 2 if out rf in 1 if out rf in 2 if out lo in rf in 1 lo in rf in 2 h l h l h l h l h l h l h l min. typ. max. unit 5.7 7.3 ma 35 70 1 0 a db db dbm 8 9.5 11.5 17 12 19 14 8 10 11.5 4.6 6.5 4.7 6.5 dbm 29 23 29 23 0 2.5 0.5 3 measurement condition when no signal when a small signal p rf = 25dbm, offset = 100khz conversion by the im3 suppression ratio for two-wave input f lo = 690mhz f lo = 740mhz note) the values shown above are the specified values on the sony's recommended evaluation board.
3 CXG1081TN recommended evaluation circuit 10 9 8 7 v dd 2 (lo amp2) rfin2 l9 r1 l10 l11 50 ? 6 1 2 3 4 5 lo in l3 50 ? l5 c6 c7 v dd 1 (lo amp1) v dd 3 (mix) if out rfin1 ctl l7 l6 l8 50 ? 50 ? l1 l2 c3 c2 c1 l4 c5 c4 l1 l2 l3 l4 l5 l6 l7 l8 l9 l10 120nh 82nh 27nh 33nh 39nh 27nh 15nh 18nh 33nh 8.2nh l11 c1 c2 c3 c4 c5 c6 c7 r1 15nh 6pf 1000pf 1000pf 100pf 1000pf 100pf 1000pf 470 ?
4 CXG1081TN example of representative characteristics (ta = 25 c) path rf in 1 if out g c , nf vs. f rf f rf rf frequency [mhz] gc conversion gain, nf noise figure [db] 860 880 800 2 6 4 8 10 12 820 g c nf 840 900 v dd = 2.7v v ctl = 2.7v f lo = f rf 130mhz p lo = 15dbm g c nf v dd = 2.7v v ctl = 0v f lo = f rf 130mhz p lo = 15dbm path rf in 2 if out g c , nf vs. f rf f rf rf frequency [mhz] gc conversion gain, nf noise figure [db] 860 880 800 2 6 4 8 10 12 820 840 900 v dd = 2.7v v ctl = 0v f rf 1 = 820mhz f rf 2 = 820.1mhz f lo = 690mhz p lo = 15dbm p out if output power [dbm] path rf in 2 if out p out , im3 vs. p in p in rf input power [dbm] 10 0 10 40 80 40 60 20 0 20 50 70 30 10 10 30 20 p out im3 p out if output power [dbm] v dd = 2.7v v ctl = 2.7v f rf 1 = 870mhz f rf 2 = 870.1mhz f lo = 740mhz p lo = 15dbm path rf in 1 if out p out , im3 vs. p in p in rf input power [dbm] 10 0 10 40 80 40 60 20 0 20 50 70 30 10 10 30 20 p out im3
5 CXG1081TN path rf in 1 if out g c , nf vs. p lo p lo lo input power [dbm] gc conversion gain, nf noise figure [db] 10 5 25 2 6 4 8 10 12 20 g c nf 15 0 v dd = 2.7v v ctl = 2.7v f rf 1 = 870mhz f lo = 740mhz g c nf path rf in 2 if out g c , nf vs. p lo p lo lo input power [dbm] gc conversion gain, nf noise figure [db] 10 5 25 2 6 4 8 10 12 20 15 0 v dd = 2.7v v ctl = 0v f rf 2 = 820mhz f lo = 690mhz p lk iip3 path rf in 2 if out iip3, p lk vs. p lo p lo lo input power [dbm] ip3 input iip3 [dbm] p lk lo leak power [dbm] 10 5 25 1 3 4 2 5 7 6 8 20 15 0 v dd = 2.7v v ctl = 0v f rf 1 = 820mhz f rf 2 = 820.1mhz f lo = 690mhz p lo = 15dbm path rf in 1 if out iip3, p lk vs. p lo p lo lo input power [dbm] ip3 input iip3 [dbm] 10 5 25 1 4 3 2 5 6 7 8 40 32.5 35 37.5 30 27.5 25 22.5 40 32.5 35 37.5 30 27.5 25 22.5 20 15 0 p lk lo leak power [dbm] p lk iip3 v dd = 2.7v v ctl = 2.7v f rf 1 = 870mhz f rf 2 = 870.1mhz f lo = 740mhz p lo = 15dbm
6 CXG1081TN example of characteristics for option resistance r1 changed (ta = 25 c) v dd = 2.7v v ctl = 2.7v or v ctl = 0v i dd 3 (mix) vs. r1 r1 option resistance [ ? ] i dd 3 mixer block current consumption [ma] 680 560 470 270 open 0 4 2 6 8 10 1500 820 150 path rf in 1 if out g c , nf vs. r1 g c nf v dd = 2.7v v ctl = 2.7v f rf = 870mhz f lo = 740mhz p lo = 15dbm r1 option resistance [ ? ] gc conversion gain, nf noise figure [db] 680 560 470 270 open 2 6 4 8 10 12 1500 820 150 path rf in 2 if out g c , nf vs. r1 g c nf v dd = 2.7v v ctl = 0v f rf = 820mhz f lo = 690mhz p lo = 15dbm r1 option resistance [ ? ] gc conversion gain, nf noise figure [db] 680 560 470 270 open 2 6 4 8 10 12 1500 820 150 path rf in 1 if out iip3, p lk vs. r1 v dd = 2.7v v ctl = 2.7v f rf = 870mhz f lo = 740mhz p lo = 15dbm p lk iip3 r1 option resistance [ ? ] ip3 input iip3 [dbm] 680 560 470 270 open 2 2 4 0 6 8 40 32 36 28 20 24 1500 820 150 p lk lo leak power [dbm] path rf in 2 if out iip3, p lk vs. r1 v dd = 2.7v v ctl = 0v f rf = 820mhz f lo = 690mhz p lo = 15dbm p lk iip3 r1 option resistance [ ? ] ip3 input iip3 [dbm] 40 28 32 36 24 20 p lk lo leak power [dbm] 680 560 470 270 open 2 2 0 4 6 8 1500 820 150
7 CXG1081TN recommended evaluation board front 25mm 25mm if out rf in 1 lo in rf in 2 sony CXG1081TN evb ctl l7 l8 l6 l10 l11 l9 r1 c1 l3 c5c4 c6 c7 l4 l5 l1 l2 c2 c3 v dd 3 gnd v dd 1/2 back ctl v dd 3 gnd v dd 1/2 glass fabric-base 4-layer epoxy board (thickness: 0.2mm 2), total thickness: 0.8mm gnd for the whole 2nd and 3rd layers
8 CXG1081TN package outline unit: mm sony code eiaj code jedec code package material lead treatment lead material package mass epoxy resin solder plating copper alloy package structure 0.22 0.5 5 1.2max ? 2.8 0.1 10 6 ? 2.2 0.1 3.2 0.2 0.1 0.05 + 0.15 0.45 0.15 0 to 10 1 a (0.2) 0.22 0.07 + 0.08 (0.1) 0.12 0.015 + 0.025 detail a 0.02g tssop-10p-l01 10pin tssop(plastic) 0.1 0.1 m note: ? dimensions do not include mold protrusion. 0.25 sony corporation lead plating specifications item lead material copper alloy solder composition sn-bi bi:1-4wt% plating thickness 5-18 m spec. sony code eiaj code jedec code package material lead treatment lead material package mass epoxy resin solder plating copper alloy package structure 0.22 0.5 5 1.2max ? 2.8 0.1 10 6 ? 2.2 0.1 3.2 0.2 0.1 0.05 + 0.15 0.45 0.15 0 to 10 1 a (0.2) 0.22 0.07 + 0.08 (0.1) 0.12 0.015 + 0.025 detail a 0.02g tssop-10p-l01 10pin tssop(plastic) 0.1 0.1 m note: ? dimensions do not include mold protrusion. 0.25 kokubu ass'y
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