hlmp-cbxx, hlmp-cmxx precision optical performance blue and green data sheet description this high intensity blue and green leds are based on the most efcient and cost efective ingan material tech - nology. this led lamps is untinted and non-difused, t- 1 ? packages incorporating second-generation optics producing well defned spatial radiation patterns at specifc viewing cone angles. these lamps are made with an advanced optical grade epoxy, ofering superior temperature and moisture re - sistance in outdoor signal and sign applications. the package epoxy contains both uv-a and uv-b inhibitors to reduce the efects of long term exposure to direct sunlight. notes: 1. measured just above fange. 2. all dimensions are in millimeters (inches). 3. epoxy meniscus may extend about 1mm (0.040) down the leads. package dimensions features ? well defned spatial radiation pattern ? high luminous output ? untinted, non-difused ? viewing angle: 15o, 23o and 30o ? standof or non-standof leads ? superior resistance to moisture applications ? trafc signals ? commercial outdoor advertising ? front panel backlighting ? front panel indicator caution: ingan devices are class 1c hbm esd sensitive per jedec standard. please observe appropriate precautions during handling and processing. refer to avago application note an 1142 for details. 1 . 1 4 0 . 2 0 ( 0 . 0 4 5 0 . 0 0 8 ) 5 . 8 0 0 . 2 0 ( 0 . 2 2 8 0 . 0 0 8 ) 5 . 0 0 0 . 2 0 ( 0 . 1 9 7 0 . 0 0 8 ) 3 1 . 6 0 ( 1 . 2 4 4 ) m i n . 0 . 7 0 ( 0 . 0 2 8 ) m a x . 1 . 0 0 ( 0 . 0 3 9 ) m i n . 8 . 7 1 0 . 2 0 ( 0 . 3 4 3 0 . 0 0 8 ) 2 . 5 4 0 . 3 8 ( 0 . 1 0 0 0 . 0 1 5 ) 0 . 5 0 0 . 1 0 ( 0 . 0 2 0 0 . 0 0 4 ) s q . t y p . c a t h o d e l e a d d 1 . 5 0 0 . 1 5 ( 0 . 0 5 9 0 . 0 0 6 ) p a c k a g e d i m e n s i o n b 1 . 1 4 0 . 2 0 ( 0 . 0 4 5 0 . 0 0 8 ) 5 . 8 0 0 . 2 0 ( 0 . 2 2 8 0 . 0 0 8 ) 5 . 0 0 0 . 2 0 ( 0 . 1 9 7 0 . 0 0 8 ) 3 1 . 6 0 ( 1 . 2 4 4 ) m i n . 0 . 7 0 ( 0 . 0 2 8 ) m a x . 1 . 0 0 ( 0 . 0 3 9 ) m i n . 8 . 7 1 0 . 2 0 ( 0 . 3 4 3 0 . 0 0 8 ) 2 . 5 4 0 . 3 8 ( 0 . 1 0 0 0 . 0 1 5 ) 0 . 5 0 0 . 1 0 ( 0 . 0 2 0 0 . 0 0 4 ) s q . t y p . 2 . 3 5 ( 0 . 0 9 3 ) m a x . p a c k a g e d i m e n s i o n a h l m p - c x 2 5 d = 1 2 . 5 2 0 . 2 5 ( 0 . 4 9 3 0 . 0 1 0 ) h l m p - c x 1 4 d = 1 2 . 6 0 . 2 5 ( 0 . 4 9 6 0 . 0 1 0 ) h l m p - c x 3 5 d = 1 1 . 9 6 0 . 2 5 ( 0 . 4 7 1 0 . 0 1 0 ) c a t h o d e l e a d c a t h o d e f l a t c a t h o d e f l a t
device selection guide part number color typical viewing angle, 2?? ? degree ? ? ? ? degree? ? ? degree? intensity ?mcd? at 20 ma leads with stand-ofs min. max. hlmp-cb13-ux0xx blue 15o 3200 9300 no hlmp-cb14-ux0xx blue 15o 3200 9300 yes hlmp-cb22-sv0xx blue 23o 1900 5500 no hlmp-cb25-sv0xx blue 23o 1900 5500 yes hlmp-cb34-ru0xx blue 30o 1500 4200 no hlmp-cb35-ru0xx blue 30o 1500 4200 yes hlmp-cm13-z30xx green 15o 12000 35000 no hlmp-cm14-z30xx green 15o 12000 35000 yes hlmp-cm22-x10xx green 23o 7200 21000 no hlmp-cm25-x10xx green 23o 7200 21000 yes hlmp-cm34-x10xx green 30o 7200 21000 no hlmp-cm35-x10xx green 30o 7200 21000 yes notes: 1. tolerance for luminous intensity measurement is 15% 2. the optical axis is closely aligned with the package mechanical axis. 3. led light output is bright enough to cause injuries to the eyes. precautions must be taken to prevent looking directly at the led without proper safety equipment. 4. 21/2 is the of-axis angle where the luminous intensity is ? the on axis intensity. part numbering system note: please refer to ab 5337 for complete information on part numbering system. p a c k a g i n g o p t i o n d d : a m m o p a c k s c o l o r b i n s e l e c t i o n 0 : f u l l d i s t r i b u t i o n m a x i m u m i n t e n s i t y b i n r e f e r t o d e v i c e s e l e c t i o n g u i d e m i n i m u m i n t e n s i t y b i n r e f e r t o d e v i c e s e l e c t i o n g u i d e v i e w i n g a n g l e 1 3 : 1 5 o w i t h o u t s t a n d o f f 1 4 : 1 5 o w i t h s t a n d o f f 2 2 : 2 3 o w i t h o u t s t a n d o f f 2 5 : 2 3 o w i t h s t a n d o f f 3 4 : 3 0 o w i t h o u t s t a n d o f f 3 5 : 3 0 o w i t h s t a n d o f f c o l o r b : b l u e 4 7 0 n m m : g r e e n 5 2 5 n m p a c k a g e c : 5 m m r o u n d l a m p s h l m p - x x x x - x x x x x
absolute maximum rating ? t a = 25?c ? ?c ? c ? parameters value unit dc forward current [1] 30 ma peak pulsed forward current [2] 100 ma power dissipation 116 mw led junction temperature 110 c operating temperature range -40 to +85 c storage temperature range -40 to +100 c notes: 1. derate linearly as shown in fgure 2. 2. duty factor 10%, frequency 1khz. electrical/optical characteristics ? t a = 25 ? c ? parameters symbol blue and green units test condition min typ max forward voltage v f 2.8 3.2 3.8 v i f = 20 ma reverse voltage [1] v r 5.0 v i r = 10 a thermal resistance r j-pin 240 c/w led junction to cathode lead dominant wavelength [2] blue green d 460 520 470 525 480 540 nm i f = 20 ma peak wavelength blue green peak 464 516 nm peak of wavelength of spectral distribu - tion at i f = 20 ma spectral half width blue green 1/2 22 35 wavelength width at spectral distribu - tion 1/2 power point at i f = 20 ma luminous efcacy [3] blue green v 78 545 lm/w emitted luminous power/emitted radiant power luminous flux blue blue green green v 830 3500 mlm if = 20ma luminous efciency [4] blue blue green green h 13 56 lm/w luminous flux/electrical power at i f = 20ma notes: 1. the reverse voltage of the product is equivalent to the forward voltage of the protective chip at i r = 10 a 2. the dominant wavelength d is derived from the chromaticy diagram and represents the color pf the lamp. 3. the radiant intensity, ie in watts/steradian, may be found from the equation ie = iv/ v , where iv is the luminous intensity in candelas and v is the luminous efcacy in lumens/watt. 4. v i f x v f where v is the emitted luminous fux, i f is electrical forward current and v f is the forward voltage.
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 380 430 480 530 580 630 680 730 780 wavelength - nm relative intensity blue green 0 5 10 15 20 25 30 35 0 20 40 60 80 100 t a - ambient temperature - c if max. - maximum forward current - ma 0 5 10 15 20 25 30 35 0 1 2 3 4 forward voltage - v forward current - m -4 -2 0 2 4 6 8 10 12 14 16 0 5 10 15 20 25 30 35 forward current - ma dominant wavelength - nm green blue 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 0 5 10 15 20 25 30 35 dc forward current - ma relative luminous intensity (normalized at 20 ma) figure 1. relative intensity vs. wavelength figure 2. forward current vs. ambient temperature figure 3. forward current vs. forward voltage figure 4. relative dominant wavelength vs. dc forward current figure 5. relative intensity vs. dc forward current
0 0 . 1 0 . 2 0 . 3 0 . 4 0 . 5 0 . 6 0 . 7 0 . 8 0 . 9 1 - 9 0 - 6 0 - 3 0 0 3 0 6 0 9 0 a n g u l a r d i s p l a c e m e n t - d e g r e e s r e l a t i v e i n t e n s i t y 0 0 . 1 0 . 2 0 . 3 0 . 4 0 . 5 0 . 6 0 . 7 0 . 8 0 . 9 1 - 9 0 - 6 0 - 3 0 0 3 0 6 0 9 0 a n g u l a r d i s p l a c e m e n t - d e g r e e s r e l a t i v e i n t e n s i t y 0 0 . 1 0 . 2 0 . 3 0 . 4 0 . 5 0 . 6 0 . 7 0 . 8 0 . 9 1 0 3 0 6 0 9 0 1 2 0 1 5 0 1 8 0 a n g u l a r d i s p l a c e m e n t - d e g r e e s r e l a t i v e i n t e n s i t y figure 6. spatial radiation pattern for 15 lamps figure 7. spatial radiation pattern for 23 lamps figure 8. spatial radiation pattern for 30 lamps note: all bin categories are established for classifcation of products. products may not be available in all bin categories. please contact your avago representative for further information
0 . 1 1 1 0 - 4 0 - 2 0 0 2 0 4 0 6 0 8 0 10 0 12 0 t j - junction temperature- c relative light output (normalized at tj = 25c) g r ee n b l u e relative light output vs. junction temperature green color bin table bin min dom max dom xmin ymin xmax ymax 1 520.0 524.0 0.0743 0.8338 0.1856 0.6556 0.1650 0.6586 0.1060 0.8292 2 524.0 528.0 0.1060 0.8292 0.2068 0.6463 0.1856 0.6556 0.1387 0.8148 3 528.0 532.0 0.1387 0.8148 0.2273 0.6344 0.2068 0.6463 0.1702 0.7965 4 532.0 536.0 0.1702 0.7965 0.2469 0.6213 0.2273 0.6344 0.2003 0.7764 5 536.0 540.0 0.2003 0.7764 0.2659 0.6070 0.2469 0.6213 0.2296 0.7543 tolerance for each bin limit is 0.5nm blue color bin table bin min dom max dom xmin ymin xmax ymax 1 460.0 464.0 0.1440 0.0297 0.1766 0.0966 0.1818 0.0904 0.1374 0.0374 2 464.0 468.0 0.1374 0.0374 0.1699 0.1062 0.1766 0.0966 0.1291 0.0495 3 468.0 472.0 0.1291 0.0495 0.1616 0.1209 0.1699 0.1062 0.1187 0.0671 4 472.0 476.0 0.1187 0.0671 0.1517 0.1423 0.1616 0.1209 0.1063 0.0945 5 476.0 480.0 0.1063 0.0945 0.1397 0.1728 0.1517 0.1423 0.0913 0.1327 tolerance for each bin limit is 0.5nm intensity bin limit table bin intensity ?mcd? at 20 ma min max r 1500 1900 s 1900 2500 t 2500 3200 u 3200 4200 v 4200 5500 w 5500 7200 x 7200 9300 y 9300 12000 z 12000 16000 1 16000 21000 2 21000 27000 3 27000 35000 tolerance for each bin limit is +/- 15%
precautions: lead forming: ? the leads of an led lamp may be preformed or cut to length prior to insertion and soldering on pc board. ? for better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. ? if manual lead cutting is necessary, cut the leads after the soldering process. the solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into led package. this is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. soldering and handling: ? care must be taken during pcb assembly and soldering process to prevent damage to the led component. ? led component may be efectively hand soldered to pcb. however, it is only recommended under unavoidable circumstances such as rework. the closest manual soldering distance of the soldering heat source (soldering irons tip) to the body is 1.59mm. soldering the led using soldering iron tip closer than 1.59mm might damage the led. note: 1. pcb with diferent size and design (component density) will have diferent heat mass (heat capacity). this might cause a change in temperature experienced by the board if same wave soldering setting is used. so, it is recommended to re-calibrate the soldering profle again before loading a new type of pcb. avago technologies led confguration 1.59mm ? esd precaution must be properly applied on the soldering station and personnel to prevent esd damage to the led component that is esd sensitive. do refer to avago application note an 1142 for details. the soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. ? recommended soldering condition: wave soldering [1, 2] manual solder dipping pre-heat temperature 105 c max. - preheat time 60 sec max - peak temperature 250 c max. 260 c max. dwell time 3 sec max. 5 sec max note: 1) above conditions refers to measurement with thermocouple mounted at the bottom of pcb. 2) it is recommended to use only bottom preheaters in order to reduce thermal stress experienced by led. ? wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. customer is advised to perform daily check on the soldering profle to ensure that it is always conforming to recommended soldering conditions. note: electrical connection between bottom surface of led die and the lead frame is achieved through conductive paste. ? any alignment fxture that is being applied during wave soldering should be loosely ftted and should not apply weight or force on led. non metal material is recommended as it will absorb less heat during wave soldering process. ? at elevated temperature, led is more susceptible to mechanical stress. therefore, pcb must allowed to cool down to room temperature prior to handling, which includes removal of alignment fxture or pallet. ? if pcb board contains both through hole (th) led and other surface mount components, it is recommended that surface mount components be soldered on the top side of the pcb. if surface mount need to be on the bottom side, these components should be soldered using refow soldering prior to insertion the th led. ? recommended pc board plated through holes (pth) size for led component leads. led component lead size diagonal plated through hole diameter 0.45 x 0.45 mm (0.018x 0.018 inch) 0.636 mm (0.025 inch) 0.98 to 1.08 mm (0.039 to 0.043 inch) 0.50 x 0.50 mm (0.020x 0.020 inch) 0.707 mm (0.028 inch) 1.05 to 1.15 mm (0.041 to 0.045 inch) ? over-sizing the pth can lead to twisted led after clinching. on the other hand under sizing the pth can cause difculty inserting the th led. refer to application note 5334 for more information about soldering and handling of high brightness th led lamps. alingap device cathode ingan device andoe
example of wave soldering temperature profle for th led ammo packs drawing 0 10 20 30 40 50 60 70 80 90 100 250 200 150 100 50 time (minutes) preheat turbulent wave laminar wave hot air knife recommended solder: sn63 (leaded solder alloy) sac305 (lead free solder alloy) flux: rosin flux solder bath temperature: 245 c 5c (maximum peak temperature = 250c) dwell time: 1.5 sec - 3.0 sec (maximum = 3sec) note: allow for board to be sufficiently cooled to room temperature before exerting mechanical force. temperature (c) a a 12.701.00 0.500.0394 20.501.00 0.8070.039 18.000.50 0.70870.0197 9.1250.625 0.35930.0246 12.700.30 0.500.0118 0.700.20 0.02760.0079 6.351.30 0.250.0512 ? 4.000.20typ. 0.15750.008 cathode view a-a note: the ammo-packs drawing is applicable for packaging option -dd & -zz and regardless standof or non-standof.
packaging box for ammo packs label on this side of box from left side of box adhesive tape must be ? facing upwards. anode lead leaves the box first. note: for ingan device, the ammo pack packaging box contain esd logo packaging label (i) avago mother label: (available on packaging box of ammo pack and shipping box) ( 1 p ) i t e m : p a r t n u m b e r ( 1 t ) l o t : l o t n u m b e r l p n : ( 9 d ) m f g d a t e : m a n u f a c t u r i n g d a t e ( p ) c u s t o m e r i t e m : ( v ) v e n d o r i d : d e p t i d : m a d e i n : c o u n t r y o f o r i g i n ( q ) q t y : q u a n t i t y c a t : i n t e n s i t y b i n b i n : r e f e r t o b e l o w i n f o r m a t i o n ( 9 d ) d a t e c o d e : d a t e c o d e s t a n d a r d l a b e l l s 0 0 0 2 r o h s c o m p l i a n t e 3 m a x t e m p 2 5 0 c ( 1 p ) p a r t # : p a r t n u m b e r ( 1 t ) l o t # : l o t n u m b e r ( 9 d ) m f g d a t e : m a n u f a c t u r i n g d a t e c / o : c o u n t r y o f o r i g i n c u s t o m e r p / n : s u p p l i e r c o d e : q u a n t i t y : p a c k i n g q u a n t i t y c a t : i n t e n s i t y b i n b i n : r e f e r t o b e l o w i n f o r m a t i o n d a t e c o d e : d a t e c o d e r o h s c o m p l i a n t e 3 m a x t e m p 2 5 0 c l a m p s b a b y l a b e l
disclaimer: avagos products and software are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, main - tenance or direct operation of a nuclear facility or for use in medical devices or applications. customer is solely responsible, and waives all rights to make claims against avago or its sup - pliers, for all loss, damage, expense or liability in connection with such use. acronyms and defnition: bin: (i) color bin only or vf bin only (applicable for part number with color bins but without vf bin or part number with vf bins and no color bin) or (ii) color bin incorporated with vf bin (applicable for part number that have both color bin and vf bin) (ii) avago baby label (only available on bulk packaging) example: (i) color bin only or vf bin only bin: 2 (represent color bin 2 only) bin: vb (represent vf bin vb only) (ii) color bin incorporate with vf bin bin: 2vb vb: vf bin vb 2: color bin 2 only ( 1 p ) i t e m : p a r t n u m b e r ( 1 t ) l o t : l o t n u m b e r l p n : ( 9 d ) m f g d a t e : m a n u f a c t u r i n g d a t e ( p ) c u s t o m e r i t e m : ( v ) v e n d o r i d : d e p t i d : m a d e i n : c o u n t r y o f o r i g i n ( q ) q t y : q u a n t i t y c a t : i n t e n s i t y b i n b i n : r e f e r t o b e l o w i n f o r m a t i o n ( 9 d ) d a t e c o d e : d a t e c o d e s t a n d a r d l a b e l l s 0 0 0 2 r o h s c o m p l i a n t e 3 m a x t e m p 2 5 0 c ( 1 p ) p a r t # : p a r t n u m b e r ( 1 t ) l o t # : l o t n u m b e r ( 9 d ) m f g d a t e : m a n u f a c t u r i n g d a t e c / o : c o u n t r y o f o r i g i n c u s t o m e r p / n : s u p p l i e r c o d e : q u a n t i t y : p a c k i n g q u a n t i t y c a t : i n t e n s i t y b i n b i n : r e f e r t o b e l o w i n f o r m a t i o n d a t e c o d e : d a t e c o d e r o h s c o m p l i a n t e 3 m a x t e m p 2 5 0 c l a m p s b a b y l a b e l for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 00-00 avago technologies. all rights reserved. av0 -0 en - november 1, 00
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