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tlp708 2012-07-27 1 toshiba 11-5j1 weight: 0.26 g (t y p .) 4.580.25 4.0 +0.25 ? 0.20 9.70.3 6.80.25 0.40.1 1.270.2 1.250.25 7.620.25 3.65 +0.15 ? 0.25 0.25 1 2 3 6 5 4 11-5j1 ? 0.05 +0.10 unit: mm tlp708 toshiba photocoupler gaa ? as led & photo-ic tlp708,TLP708F factory automation (fa) home electrical appliances operates at high ambient temperatures up to 125 c the toshiba tlp708 consists of a gaa ?as light emitting diode and an integrated high-gain, high-speed photodetector. the tl p708 is housed in the sdip6 package. compared to the standard dip8 package, tlp708 is smaller in size, yet comes with international safety standards under a reinfo rced isolation category. as such, it is possible to reduce the mounting footprint for a pplications that require certifications for safety standards. the photodetector has an open-collector output stage, and an internal faraday shield that provides a guaranteed common-m ode transient immunity of 15 kv/ s. as tlp708 is also able to operate up to 125 , it is suitable for use in applications like industrial equipments where it is nece ssary to operate under high ambient temperatures. TLP708F is of a long creepage distance and clearance distance type. z input threshold current : i fhl = 5ma (max) z switching time (t phl /t plh ): 75ns (max) z data transfer rate: 15 mbd (typ.) z guaranteed performance over temperature: -40 to 125 z power supply voltage: 4.5 to 5.5v z common mode transient immunity: 15 kv / s (min) z isolation voltage: 5000v rms (min) z construction mechanical rating z ul recognized: ul1577, file no. e67349 z cul recognized: csa component acceptance service no.5a, file no. e67349 z vde-approved: option (d4) en60747-5-2 (note) note: when an en60747-5-2 approved type is needed, please designate the option (d4).option (d4) type pin configuration (top view) 7.62 mm pitch tlp708 type 10.16 mm pitch TLP708F type creepage distance clearance distance insulation thickness 7.0 mm (min) 7.0 mm (min) 0.4 mm (min) 8.0 mm (min) 8.0 mm (min) 0.4 mm (min) 1:anode 2:n.c. 3:cathode 4:gnd 5:v o (output) 6:v cc weight: 0.26 g (t y p .) toshiba 11-5j101 0.25 ? 0.05 +0.10 4.580.25 0.40.1 1 2 3 6.80.25 1.270.2 3.65 +0.15 ? 0.25 6 5 4 11.70.3 3.9 +0.25 ? 0.15 0.750.25 7.620.25 11-5j101 unit: mm TLP708F v cc gnd shield 1 3 4 5 6 2
tlp708,TLP708F 2012-08-07 2 schematic absolute maximum ratings (ta = 25 ) characteristics symbol rating unit forward current (ta < 110 ) i f 25 ma forward current derating (ta 110 ) i f / -0.67 ma/ pulse forward current (note 1) (ta < 110 ) i fp 50 ma pulse forward current derating (ta 110 ) i fp / -1.34 ma/ reverse voltage v r 5 v input power dissipation (ta < 110 ) p d 40 mw led input power dissipation derating (ta 110 ) p d / -1.0 mw/ output current (ta 125 ) i o 25 ma output voltage v o 6 v supply voltage v cc 6 v output power dissipation (ta < 110 ) p o 80 mw detector output power dissipation derating (ta 110 ) p o / -2.0 mw/ operating temperature range t opr ? 40 to 125 storage temperature range t stg ? 55 to 150 lead solder temperature (10s) t sol 260 isolation voltage (note 2) bv s 5000 v rms note: using continuously under heavy loads (e.g. an application of high temperature/ current/voltage and a significant change in temperature, etc.) may cause this product to decrease in reli ability significantly even if th e operating conditions (i.e. opera ting temperature/current/voltage, etc.) are within the absolute maximum ratings. please design the appropriate reliability upon reviewi ng the toshiba semiconductor reliability handbook (?handling precautions?/?derating concept and methods ?) and individual reliability data (i.e. reliability test report and estimated failur e rate, etc) note 1: pulse width 1ms, duty=50% note 2: r.h. 60%, ta = 25 , ac 1 min this device is regarded as a tw o-terminal device: pins 1, 2 and 3 are shorted together, and pins 4, 5 and 6 are shorted together. input output h l l h note: a 0.1 f b yp ass ca p acitor must be connected between p ins 6 and 4. truth table gnd 6 4 shield 3 1 5 v cc v o i cc i f i o
tlp708,TLP708F 2012-08-07 3 recommended operating condition characteristics symbol min. typ. max. unit ?l? level input voltage v fl 0 D 0.8 v ?h? level input current i fh 7.5 D 15 ma supply voltage* v cc 4.5 D 5.5 v operating temperature range t opr -40 D 125 * this item denotes operating ranges, not meaning of recommended operating conditions. electrical characteristics (unless otherwise specifi ed, t a = -40 to 125 , v cc = 4.5 to 5.5v) characteristic symbol test circuit test conditions min. typ.* max. unit input forward current v f D i f = 10 ma, ta = 25 1.40 1.57 1.80 v temperature coefficient of forward voltage v f / ta D i f = 10 ma D ? 1.8 D mv/ input reverse current i r D v r = 5 v, ta = 25 D D 10 a input capacitance c t D v f = 0 v, f = 1 mhz, ta = 25 D 60 D pf v f = 0.8 v, v o = 5.5 v D 250 ?h? level output current i oh 1 v f = 0.8 v, v o = 5.5 v ta = 25 D 0.5 10 a ?l? level output voltage v ol 2 i f = 10 ma i ol = 13 ma (sink) D 0.3 0.6 v input threshold current i fhl D i ol = 13 ma (sink) v o < 0.6 v D 1.5 5.0 ma ?h? level supply current i cch 3 i f = 0 ma D 1.5 5.0 ma ?l? level supply current i ccl 4 i f = 10 ma D 1.4 5.0 ma * all typical values are at ta=25 c, v cc =5v unless otherwise specified. isolation characteristics (ta = 25c) characteristic symbol test conditions min. typ. max. unit capacitance input to output c s v s = 0v , f = 1mhz (note 2) D 0.8 D pf isolation resistance r s r.h. 60%,v s = 500v (note 2) 110 12 10 14 D ac,1 minute 5000 D D v rms ac,1 second,in oil D 10000 D isolation voltage bv s dc,1 minute,in oil D 10000 D v dc note: recommended operating conditions are gi ven as a design guideline to obtain ex pected performance of the device. in addition, each item is an independent guideli ne. in developing designs using this product, please confirm the specified characteristics shown in this document.
tlp708,TLP708F 2012-08-07 4 switching characteristics (unless otherwise specified , t a = -40 to 125c, v cc = 4.5 to 5.5 v) characteristic symbol te s t circuit test conditions min. typ.* max. unit propagation delay time to logic low output t phl i f =0 7.5ma ? 35 75 ns propagation delay time to logic high output t plh i f =7.50ma r l =350 c l =15pf (note 4) ? 35 75 ns switching time dispersion between on and off |t phl - t plh | ? 12 35 ns propagation delay skew (note 5) t psk i f =0 ?7.5ma r l =350 c l =15pf (note 4) -50 ? 50 ns output fall time 90-10% t f i f =0 7.5ma ? 6 ? ns output rise time 1090% t r 5 i f =7.50ma r l =350 c l =15pf (note 4) ? 18 ? ns common mode transient immunity at high level output cm h v cm =1000vp-p , i f =0ma, v cc =5v , ta=25 + 15 ? ? kv/ s common mode transient immunity at low level output cm l 6 vcm=1000vp-p , if=10ma, v cc =5v , ta=25 - 15 ? ? kv/ s *all typical values are at ta=25 note 3 : a ceramic capacitor (0.1 f) should be connected from pin 6 (v cc ) to pin 4 (gnd) to stabilize t he operation of the high gain linear amplifier. failure to provide the bypass may impair t he switching property. the total lead length between the capacitor and coupler should not exceed 1 cm. note 4 : f=5mhz, duty=50%, input current t r =t f =4.5ns, c l is approximately 15pf which includes probe and ig/stray wiring capacitance. note 5: propagation delay skew is defined as the difference bet ween the largest and smallest propagation delay times (i.e. t phl or t plh ) of multiple samples. evaluations of these samples are conducted under identical test conditions (supply voltage, input current, temperature, etc). test circuit 1: i oh test circuit test circuit 2: v ol test circuit test circuit 3: i ccl test circuit test circuit 4: i cch test circuit a v cc 0.1 f i cch shield 1 2 3 6 5 4 i f a v cc 0.1 f i ccl shield 1 2 3 6 5 4 0.1 f v ol v cc v i o i f shield 1 2 3 6 5 4 0.1 f shield v f v cc i oh a v o 1 2 3 6 5 4
tlp708,TLP708F 2012-08-07 5 test circuit 5: t phl , t plh test circuit test circuit 6: common-mode tr ansient immunit y test circuit v o v ol t plh t phl 1.5 v 50% t f t r 90% 10% i f 0.1 f r in =100 ? *c l =15pf *c l =15pf r l =350? i f =7.5ma(p.g.) (f=5mhz , duty=50%, t r =t f =4.5ns) i f monitor v o p. g. shield c l includes probe and stray capacitance. p.g.: pulse generator v cc 1 2 3 6 5 4 v cm 10% 90% 1000 v ? sw b : i f =0 ma ? sw a : i f =10 ma 0.8 v 2v v o t r t f cm l cm h sw b v cc v cm v o 0.1 f i f a r l =350 )( )(800 s t r v h cm = )( )(800 s t f v l cm ?= 1 2 3 6 5 4
tlp708,TLP708F 2012-08-07 6 v cc = 5 v i f = 10 ma t a = 125c 100c 80c 50c 25c 0c ? 20c ? 40c this curve shows the maximum limit to the input forward current. v cc = 5 v t a = 25c output voltage v o (v) low-level output voltage v ol (v) input forward current i f (ma) i f ? v f i f ? t a input forward voltage v f (v) ambient temperature t a (c) input forward current i f (ma) v ol ? t a ambient temperature t a (c) v o ? i f input forward current i f (ma) i o = 16 ma i o = 12.8 ma i o = 9.6 ma i o = 6.4 ma r l = 4 k r l = 1 k r l = 350 v cc = 5 v ambient temperature t a (c) threshold input current (h/l) i fhl (ma) r l = 350 r l = 1 k r l = 4 k i fhl ? t a v cc = 5 v i cch : i f = 0 ma i ccl : i f = 10 ma i ccl high-level /low-level supply current i cch /i ccl (ma) i cch , i ccl ? t a ambient temperature t a (c) i cch
tlp708,TLP708F 2012-08-07 7 pulse width distortion |t phl ? t plh | (ns) v cc = 5 v t a = 25c v cc = 5 v t a = 25c t plh , t phl ? i f |t phl ? t plh | ? i f input forward current i f (ma) input forward current i f (ma) pulse width distortion |t phl ? t plh | (ns) t plh: r l = 350 t plh: r l = 1 k t plh: r l = 4 k t phl: r l = 350 r l = 1 k r l = 4 k t plh: r l = 350 t plh: r l = 1 k t plh: r l = 4 k note: the above characteristics curves are presented for reference only and not guaranteed by production test, unless otherwise noted. v cc = 5 v i f = 7.5 ma t plh: r l = 350 v cc = 5 v i f = 7.5 ma t plh , t phl ? t a |t phl ? t plh | ? t a ambient temperature t a (c) ambient temperature t a (c) t plh: r l = 1 k t plh: r l = 4 k t phl: r l = 350 r l = 1 k r l = 4 k r l = 4 k r l = 1 k r l = 350 propagation delay time t plh , t phl (ns) propagation delay time t plh , t phl (ns)
tlp708,TLP708F 2012-08-07 8 precautions of surface mounting type photocoupler soldering & general storage (1) precautions for soldering 1) when using soldering reflow z an example of a temperature profile when sn-pb eutectic solder is used: z an example of a temperature profile when lead(pb)-free solder is used: z reflow soldering should be performed no more than twice. z the mounting should be completed with the interval fr om the first to the last mountings being 2 weeks. 2) when using soldering flow (applicable to both eutectic sol der and lead (pb)-free solder) z apply preheating of 150 ? c for 60 to 120 seconds. z mounting condition of 260 ? c or less within 10 seconds is recommended. z flow soldering should be performed no more than once. 3) when using soldering iron (applicable to both eutectic solder and lead(pb)-free solder) z complete soldering within 10 seconds for lead temperature not exceeding 260 ? c or within 3 seconds not exceeding 350 ? c. z heating by soldering iron should be performed no more than once per lead. ( c ) ( c )
tlp708,TLP708F 2012-08-07 9 (2) precautions for general storage 1) do not store devices in places where they will be exposed to moisture or direct sunlight. 2) during transportation or storage of devices, follow the cautions indicated on the carton box. 3) the storage area temperature should be kept within a temperature range of 5 ? c to 35 ? c, and the relative humidity should be maintained between 45% and 75%. 4) do not store devices in the presence of harmful (especially corrosive) gases , or under dusty conditions. 5) use storage areas where there is minimal temperature fluctuation. the solderability of the leads will be degraded as rapid temperature changes can cause c ondensation to form on the stored devices, resulting in lead oxidation or corrosion. 6) when repacking devices, us e anti-static containers. 7) do not apply any external force or load di rectly to devices when they are in storage. 8) if devices have been stored for more than two years, it is recommended that their solderability be tested before they are used even if the above precautions have been followed.
tlp708,TLP708F 2012-08-07 10 specifications for embossed-tape packing (tp) for sdip6 type photocoupler 1. applicable package package name product type sdip6 photocouplers 2. product naming system type of package used for shipment is denoted by a symbol suffix after a product number. the method of classification is as below. (example) tlp708 (tp, f) [[g]]/rohs compatible (note 6) tape type device name 3. tape dimensions 3.1 orientation of devices in relation to direction of tape movement device orientation in the recesses is as shown in figure 1. figure 1 device orientation 3.2 tape packing quantity: 1500 devices per reel 3.3 empty device recesses are as shown in table 1. table 1 empty device recesses item standard remarks occurrences of 2 or more successive empty device recesses 0 within any given 40-mm section of tape, not including leader and trailer single empty device recesses 6 devices (max) per reel not including leader and trailer 3.4 start and end of tape: the start of the tape has 30 or more empty holes. the end of the tape has 30 or more empty holes and two empty turns as a cover tape. tape feed
tlp708,TLP708F 2012-08-07 11 3.5 tape specification (1) tape material: plastic (pro tection against electrostatics) (2) dimensions: the tape di mensions are as shown in figure 2 and table 2. figure 2 tape forms table 2 tape dimension unit: mm unless otherwise specified: 0.1 symbol dimension remark a 10.4 ? b 5.1 ? d 7.5 center line of indented square hole and sprocket hole e 1.75 distance between tape edge and hole center f 12.0 cumulative error (max) per 10 feed holes g 4.0 cumulative error (max) per 10 feed holes k 0 4.1 internal space + 0.1 ? 0.3 + 0.1 ? 0.3 1.6 0.1 2.0 0.1 a d b e fg 16.0 0.3 1.5 +0.1 ?0 0.4 0.05 4.55 0.2 k 0
tlp708 / TLP708F 2012-08-07 12 3.6 reel (1) material: plastic (2) dimensions: the reel dimensions are as shown in figure 3 and table 3. figure 3 reel forms 4. packing either one reel or five reels of photoc ouplers are packed in a shipping carton. 5. label indication the carton bears a label indicating the product number, the symb ol representing classification of standard, the quantity, the lot number and the toshiba company name. 6. ordering method when placing an order, please specify the product number, the ctr rank, the tape type and the quantity as shown in the following example. (example) tlp708 (tp, f) 1500 pcs quantity (must be a multiple of 1500) [[g]]/rohs compatible (note 6) tape type device name note 6 :please contact your toshiba sales representative for details as to environmental matters such as the rohs compatibility of product. rohs is the directive 2002/95/ec of the european parliament and of the council of 27 january 2003 on the restriction of the use of certain hazardous substances in electric al and electronics equipment. symbol dimension a 380 2 b 80 1 c 13 0.5 e 2.0 0.5 u 4.0 0.5 w1 17.5 0.5 w2 21.5 1.0 e w1 w2 a b c 4 table 3 reel dimension unit: mm
tlp708 / TLP708F 2012-08-07 13 restrictions on product use ? toshiba corporation, and its subsidiaries and affiliates (collect ively "toshiba"), reserve the right to make changes to the in formation in this document, and related hardware, software and systems (collectively "product") without notice. ? this document and any information herein may not be reproduc ed without prior written permission from toshiba. even with toshiba's written permission, reproduc tion is permissible only if reproduction is without alteration/omission. ? though toshiba works continually to improve product's quality and reliability, product can malfunction or fail. customers are responsible for complying with safety standards and for prov iding adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a ma lfunction or failure of product could cause loss of human life, b odily injury or damage to property, including data loss or corruption. before customers use the product, create designs including the product, or incorporate the product into their own applications, cu stomers must also refer to and comply with (a) the latest versions of all relevant toshiba information, including without limitation, this document, the specifications, the data sheets and application notes for product and the precautions and condi tions set forth in the "toshiba semiconductor reliability handbook" and (b) the instructions for the application with which the product will be us ed with or for. customers are solely responsible for all aspe cts of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this product in such design or applications; (b) eval uating and determining the applicability of any info rmation contained in this document, or in c harts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operatin g parameters for such designs and applications. toshiba assumes no liability for customers' product design or applications. ? product is neither intended nor warranted fo r use in equipments or systems that require extraordinarily high levels of quality and/or reliability, and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage and/or serious public impact ( " unintended use " ). except for specific appl ications as expressly stated in this document, unintended use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used f or automobiles, trains, ships and other transportation, traffic si gnaling equipment, equipment used to control combustions or expl osions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. if you use product for unintended use, toshiba assumes no liability for product. for details, please contact your toshiba sales representative. ? do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy product, whether in whole or in part. ? product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. ? the information contained herein is pres ented only as guidance for product use. no re sponsibility is assumed by toshiba for an y infringement of patents or any other intellectual property rights of third parties that may result from the use of product. no license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. ? absent a written signed agreement, except as provid ed in the relevant terms and conditions of sale for product, and to the maximum extent allowable by law, toshiba (1) assumes no liability whatsoever, including without limitation, indirect, co nse quential, special, or incidental damages or loss, including without limitation, loss of profit s, loss of opportunities, business interruption and loss of data, and (2) disclaims any and all express or implied warranties and conditions related to sale, use of product, or information, including warranties or conditions of merchantability, fitness for a particular purpose, accuracy of information, or noninfringement. ? gaas (gallium arsenide) is used in product. gaas is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose gaas in product. ? do not use or otherwise make available product or related so ftware or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or m anufacturing of nuclear, chemical , or biological weapons or missi le technology products (mass destruction w eapons). product and related software and technology may be controlled under the applicable export laws and regulations including, without limitat ion, the japanese foreign exchange and foreign trade law and t he u.s. export administration regulations. export and re-export of pr oduct or related software or technology are strictly prohibit ed except in compliance with all appl icable export laws and regulations. ? please contact your toshiba sales representative for details as to environmental matters such as the rohs compatibility of pro duct. please use product in compliance with all applicable laws and regula tions that regulate the inclusion or use of controlled subs tances, including without limitation, the eu rohs directive. toshiba assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations.

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