rev no: v.2 date:dec/11/2002 page: 1 of 4 3.0x1.0 mm smd chip led lamp notes: 1. all dimensions are in millimeters (inches). 2. tolerance is 0.15(0.006") unless otherwise noted. 3. specifications are subject to change without notice. features ! 3.0mmx1.0mm smt led, 2.0mm thickness. ! low power consumption. ! wide viewing angle. ! ideal for backlight and indica tor. ! various colors and lens types a vailable. ! package : 2000pcs / reel. package dimensions description the hyper red source color devices are made with dh ingaalp on gaas substrate light emitting diode. 55 commerce way woburn, ma 01801 (781) 935 - 4442 (781) 938 - 5867 www.gilway .com ghb-1 104r-r
rev no: v.2 date:dec/11/2002 page: 2 of 4 electrical / optical characteristics at t a =25 c absolute maximum ratings at t a =25 c note: 1. 1/10 duty cycle, 0.1ms pulse width. selection guide note: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. art no. p. pp aaa r r r t t t n n n ooo . . p. art no pe ic de d d iii c c c e e de ic de ens typ le ll eee nnn sss ttt yyy ppp ee le v( m c d ) lens ty p i) i i vvv ( ( ( m m m ccc ddd ) ) i) iv (mcd iewing @2 0m a vg vv i i i eee w w w i i i nnn gg vg viewin angle in. m. m m iii n n n .. m. in m. yp t. tt yyy ppp . . t. typ ) y per red (i ng aalp hr aterc lea w0 50 2 1 120 ymbol sl ss yyy m m m bbb ooo l l sl ymbo sr aramete pr pp aaa r r r aaa m m m eee t t t eee r r pr aramete pe evic de d d eee vvv i i i ccc ee de evic d. yp t. tt yyy ppp . . t. yp t. ax m. m m aaa xxx . . m. ax ms nit us u u nnn i i i t t t ss us nit us est conditio n ts tt eee sss t t t c c c ooo nnn ddd i i i t t t i i i ooo nnn ss ts test conditio n peak eak wav elength pd yper re h0 4 6m ni f =20ma d ominate wav elength dd yper re h8 2 6m ni f =20ma 1/2 pectral line half- width sd yper re h7 2m ni f =20ma ce apacitanc cd yper re h5 4f pv f =0v;f=1mhz v f orward voltage fd yper re h9 . 15 . 2v i f =20ma i r everse curren t rd yper re h0 1a uv r =5 v arameter pr pp aaa r r r aaa m m m eee t t t eee r r pr paramete yper red hd h h yyy ppp eee r r r r r r eee dd hd yper re hs nit us u u nnn i i i t t t ss us unit power dissipation 70 1w m dc forward current 0 3a m peak forward curren t [1] 85 1a m rev erse volt age 5v operating/ storage t emperatu re -40 c t o +85 c GHB-1104R-R
rev no: v.2 date:dec/11/2002 page: 3 of 4
rev no: v.2 date:dec/11/2002 page: 4 of 4 recommended soldering pattern (units : mm) tape specifications (units : mm) smt reflow soldering instructions number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process.
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