View MLX81205LLQAA000TU_7609904.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

mlx81205/07/10/15 product abstract page 1 of 18 rev 3.9 tfr / cpa 11-may-2012 features microcontroller: mlx16-fx risc cpu o 16 bit risc cpu with 20dmips and power-saving-modes o co-processor for fast multiplication and division o flash and eeprom memory with eec o in-circuit debug and emulation supported bus interfaces: o lin-interface with integrated lin transceiver suppo rting lin 2.x, certified lin protocol software provided by melexis o in-module-programming (flash and ee) via pin lin us ing a special melexis fast protocol o pwm-interface o full duplex spi, master/slave, double-buffered, spe ed programmable. dma access. flash and eeprom programming also possible via spi. trusense motor control technology o patented algorithms for sensor-less 3-phase sine an d trapezoidal motor control o phase voltage integration filter for bemf voltage s ensing at lowest speeds o position dependent phase inductance sensing via shu nt current measurements at stand still and low to medium speeds o support of star and delta based motor configuration s without the need for center star point o support of 3-phase switched reluctance motor contro l voltage regulator o direct powered from 12v board net with low voltage detection o operating voltage v s = 5v to 18v o internal voltage regulator with possibility to use external regulator transistor o very low standby current, < 30a in sleep mode, wak e-up possible via lin or local sources pre-driver o pre-driver (~25 w rdson) for all 3 n-fet half bridges with programma ble inter-lock-delay and slope control for optimal emc and thermal perfo rmance during power n-fet switching o monitoring of drain-source voltages of the n-fets periphery o 4 independent 16 bit timer modules with capture and compare, and additional software timer o 3 programmable 12 bit pwm units with programmable f requencies o 10 bit adc converter (2s conversion time) and dma access o on-chip temperature sensor with 10k accuracy o system-clock-independent fully integrated watchdog o 32 mhz 5% internal rc oscillator with pll o optional crystal oscillator o load dump and brown out interrupt function o integrated shunt current amplifier with programmabl e gain
mlx81205/07/10/15 product abstract page 2 of 18 rev 3.9 tfr / cpa 11-may-2012 applications the mlx81205/07/10/15 controls bldc motors via exte rnal fet transistors for: o oil-, water-, fuel-pumps o blowers, compressors o positioning actuators family concept mlx81205 mlx81207 mlx81210 mlx81215 flash memory [kbyte] 32 32 32 64 ram [kbyte] 4 4 8 8 eeprom [byte] 384 384 384 384 package qfn32 qfn48 tqfp ep 48 qfn48 tqfp ep 48 qfn48 tqfp ep 48 support of active high side reverse polarity protection no yes yes yes current shunt measurement possibility high side high side low side, high side low side, high side uart yes yes yes yes spi no yes yes yes support of sensor based bldc motor control no yes yes yes support of switched reluctance (sr) motor control no no no yes 5v regulator support for 5v external supplies (can support) no no yes yes bonded pins in package 32 37 48 48 pin compatibility mlx81210 and mlx81215 are pin c ompatible table 1 C family options
mlx81205/07/10/15 product abstract page 3 of 18 rev 3.9 tfr / cpa 11-may-2012 ordering information order code [1] temp. range package delivery remark mlx81205 llq-xaa-000-tu -40 - 150 c qfn32 5x5 tube mlx81205 llq-xaa-000-re -40 - 150 c qfn32 5x5 reel mlx81207 llq-xaa-000-tu -40 - 150 c qfn48 7x7 tube mlx81207 llq-xaa-000-re -40 - 150 c qfn48 7x7 reel mlx81207 lpf-xaa-000-tr -40 - 150 c tqfp ep 48 7x7 tray mlx81207 lpf-xaa-000-re -40 - 150 c tqfp ep 48 7x7 reel mlx81210 llq-xaa-000-tu -40 - 150 c qfn48 7x7 tube mlx81210 llq-xaa-000-re -40 - 150 c qfn48 7x7 reel mlx81210 lpf-xaa-000-tr -40 - 150 c tqfp ep 48 7x7 tray mlx81210 lpf-xaa-000-re -40 - 150 c tqfp ep 48 7x7 reel mlx81215 llq-xaa-000-tu -40 - 150 c qfn48 7x7 tube mlx81215 llq-xaa-000-re -40 - 150 c qfn48 7x7 reel mlx81215 lpf-xaa-000-tr -40 - 150 c tqfp ep 48 7x7 tray mlx81215 lpf-xaa-000-re -40 - 150 c tqfp ep 48 7x7 reel table 2 C ordering information [1] .see marking/order code.
mlx81205/07/10/15 product abstract page 4 of 18 rev 3.9 tfr / cpa 11-may-2012 contents 1. functional diagram ................................. ................................................... .................................... 5 2. pin description .................................... ................................................... ........................................... 6 3. electrical characteristics......................... ................................................... ............................ 7 3.1 o perating c onditions ................................................... ................................................... .............. 7 3.2 a bsolute m aximum r atings ................................................... ................................................... ...... 7 4. application examples............................... ................................................... ................................... 8 4.1 s ensor - less bldc m otor c ontrol on the lin-b us or via pwm-i nterface with reverse polarity protection and current sensing ................................................... .............................................. 8 4.2 s ensor - less bldc m otor c ontrol on the lin-b us or via pwm-i nterface with reverse polarity protection in the high side path ................................................... ............................................. 10 4.3 s ensor based bldc m otor c ontrol ................................................... ....................................... 11 4.4 s ensor - less bldc m otor c ontrol with absolute position sensing ....................................... 12 4.5 s ensor - less bldc m otor c ontrol via a can-b us -i nterface .................................................. 1 3 5. mechanical specification ........................... ................................................... ............................. 14 5.1 qfn ................................................ ................................................... ............................................. 14 5.1.1. qfn32 5x5 (32 leads)............................... ................................................... ............................................. 14 5.1.2. qfn48 7x7 (48 leads)............................... ................................................... ............................................. 14 5.2 tqfp ep 48 7 x 7 (48 leads ) .................................................. ................................................... ...... 15 6. marking/order code ................................. ................................................... ................................. 16 6.1 m arking mlx81205/07/10/15 .................................. ................................................... ................... 16 6.2 o rder c ode mlx81205/07/10/15 .................................. ................................................... ............ 16 7. assembly information............................... ................................................... ................................ 17 8. disclaimer......................................... ................................................... .............................................. 18
mlx81205/07/10/15 product abstract page 5 of 18 rev 3.9 tfr / cpa 11-may-2012 1. functional diagram vs vddd lin to vdda rtg gndd w hs2 cp2 ls2 v hs1 cp1 ls1 t vref clko iohv osc1 osc2 vbat_s1 vbat_s2 shw shv shu v5in v5r gnd_s1 gnd_s2 io2 io3 io4 io5 io6 io7 io8 io1 io9 u hs0 cp0 ls0 gnda gnddrv gndcap ti0 ti1 ...... ...... f main vs vref isensh isensl temp vbat_s1 vbat_s2 gnd_s1 gnd_s2 u v w t phaseint iohv io1 ... io9 spi f main adc figure 1 - block diagram black: common for all versions, blue: additional pins / functionality for mlx81207 , blue + red: additional pins / functionality for mlx8121 0 / mlx81215
mlx81205/07/10/15 product abstract page 6 of 18 rev 3.9 tfr / cpa 11-may-2012 2. pin description name type function mlx81205 mlx81207 mlx81210 mlx81215 vs p battery supply x x x x rtg o 3.3v external mos gate control x x x x vdda p 3.3v supply x x x x v5r p 5v regulator output for external nfet x x v5in i 5v regulator input x x vddd p 1.8v regulator output x x x x gndd gnd digital ground x x x x gndcap gnd digital ground x x x gnddrv gnd driver ground x x x x gnda gnd analog ground x x x x lin hvio connection to lin bus or pwm interface x x x x iohv hvio general purpose io pin x x x x ti0 i test input, debug interface x x x x ti1 i test input, debug interface x x x x to o test output, debug interface x x x x osc1 i quarz interface input x x x x osc2 o quarz interface ouput x x x x io1 lvio general purpose io pin (low voltage 3.3v) x x x x io2 lvio general purpose io pin (low voltage 3.3v) x x x x io3 lvio general purpose io pin (low voltage 3.3v) x x x io4 lvio general purpose io pin (low voltage 3.3v) x x x io5 lvio general purpose io pin (low voltage 3.3v) x x x io6 lvio general purpose io pin (low voltage 3.3v) x x io7 lvio general purpose io pin (low voltage 3.3v) x x io8 lvio general purpose io pin (low voltage 3.3v) x x io9 lvio general purpose io pin (low voltage 3.3v) x x clko hvo switchable 250khz clock output to vref level x x x shu hvi phase u input to bemf sensing blocks x x shv hvi phase v input to bemf sensing blocks x x shw hvi phase w input to bemf sensing blocks x x t hvi reference input to bemf sensing blocks x x x x vref p clamped 8v or 12v ref. voltage for bootstrap x x x x cp2 hvio high side bootstrap capacitor driver 2 x x x x hs2 hvio n-fet high side gate driver 2 x x x x w hvi phase w input to hs2 buffer and bemf sensing blocks x x x x ls2 hvo n-fet low side gate driver 2 x x x x cp1 hvio high side bootstrap capacitor driver 1 x x x x hs1 hvio n-fet high side gate driver 1 x x x x v hvi phase v input to hs1 buffer and bemf sensing blocks x x x x ls1 hvo n-fet low side gate driver 1 x x x x cp0 hvio high side bootstrap capacitor driver 0 x x x x hs0 hvio n-fet high side gate driver 0 x x x x u hvi phase u input to hs0 buffer and bemf sensing blocks x x x x ls0 hvo n-fet low side gate driver 0 x x x x vbat_s1 hvi vs high side input for current sensing x x x x vbat_s2 hvi vs low side input for current sensing x x x x
mlx81205/07/10/15 product abstract page 7 of 18 rev 3.9 tfr / cpa 11-may-2012 gnd_s1 lvi gnd high side input for current sensing x x gnd_s2 lvi gnd low side input for current sensing x x pin count 32 37 48 48 table 3 - pin description mlx81205 / mlx81207 / ml x81210 / mlx81215 3. electrical characteristics all voltages are referenced to ground (gnd). positi ve currents flow into the ic. the absolute maximum ratings given in the table below are limiting valu es that do not lead to a permanent damage of the de vice but exceeding any of these limits may do so. long term exposure to limiting values may affect the reliabil ity of the device. reliable operation of the mlx81205/07/1 0/15 is only specified within the limits shown in operating conditions. 3.1 operating conditions parameter symbol min max unit ic supply voltage v s 5 18 v operating ambient temperature t amb -40 +150 [1] c table 4 - operating conditions [1] target temperature specification after qualificati on. with temperature applications at ta>125c a red uction of chip internal power dissipation with external supply transistor is mand atory. the extended temperature range is only allow ed for a limited period of time, customers mission profile has to be agreed by mele xis as a mandatory part of the part submission warr ant. 3.2 absolute maximum ratings parameter symbol condition min max unit t = 2 min -0.3 28 ic supply voltage vs t < 500 ms 45 v maximum reverse current into any pin -10 +10 ma maximum sum of reverse currents into all pins +10 ma dc voltage on lvio pins, osc<2:1>, gnd_s<2:1> -0.3 vdda+0.3 v dc voltage on hv i/o pin, v5r pin -0.3 vs+0.3 v dc voltage on drivers supply pin vref -0.3 18 v dc voltage on drivers control pins (clko, ls<2:0>) -0.3 vref+0.3 v dc voltage on drivers cp<2:0>, hs<2:0> pins -0.3 vs + vref v dc voltage on phases related pins (u, v, w, shu, shv, shw, t, vbat_s<2:1>) -0.3 vs+1.5 v esd capability of pin lin esd bushb human body model, equivalent to discharge 100pf with 1.5k w , -6 +6 kv esd capability of any other pins esd hb human body model, equivalent to discharge 100pf with 1.5k w , -2 +2 kv maximum latchCup free current at any pin i latch -250 +250 ma junction temperature [1] t vj +155 c storage temperature t stg -55 +150 c rthjc qfn32 10 k / w rthjc qfn48 5 k / w rthjc tqfp48 rthjc 5.5 k / w table 5 - absolute maximum ratings
mlx81205/07/10/15 product abstract page 8 of 18 rev 3.9 tfr / cpa 11-may-2012 [1] target temperature specification after qualificati on. with temperature applications at ta>125c a red uction of chip internal power dissipation with external supply transistor is mand atory. the extended temperature range is only allow ed for a limited period of time, customers mission profile has to be agreed by mele xis as a mandatory part of the part submission warr ant. 4. application examples the following sections show typical application exa mples [1] . 4.1 sensor-less bldc motor control on the lin-bus o r via pwm-interface with reverse polarity protection and current sensing in the sample application of figure 2, the mlx81205 can realize the sensor-less driving of a bldc moto r via three external power n-fet half bridges with only a few external components. the high side n-fet drivi ng is done with a bootstrap output stage. reverse polarit y protection of the bridge is realized with an exte rnal power fet in the ground path. an external temperatu re sensor is connected to the 10 bit adc via pin io 1. the integrated watchdog with a dedicated separate r c-oscillator is monitoring application integrity. t he communication interface could be lin or a pwm inter face. the pin lin can also be used as wake-up sourc e and to program the flash memory. the motor currents are measured by a shunt resistor in the high side path. in case the current exceeds the programmed threshold, the bridge can be switched of f automatically and / or a software interrupt can b e generated. the motor current can also be measured b y the 10-bit adc converter. the patented melexis trusense technology combines t wo methods to determine the rotor position: - the measurement of the induced bemf voltage at me dium and high speeds. - the measurement of position dependent coil induct ance variations at stand-still and low speeds. as a result trusense allows operation of the motor in the widest dynamic speed range. the motor can be driven with block, trapezoidal or sine-wave current s. the motor start-up can be made independent of th e load conditions according to the application requir ements. in this example application the motor star point is not available. it is modeled with external resisto rs from the motor phases and connected to t input. alternativel y an artificial ic internal reference point can be chosen as shown in the block diagram of the mlx81205/07/10 /15. [1] the application examples are principal application schematics only. the details need to be worked out for each application schematic separately, depending on the application requir ements.
mlx81205/07/10/15 product abstract page 9 of 18 rev 3.9 tfr / cpa 11-may-2012 figure 2 - typical sensor-less bldc motor control a pplication example with mlx81205
mlx81205/07/10/15 product abstract page 10 of 18 rev 3.9 tfr / cpa 11-may-2012 4.2 sensor-less bldc motor control on the lin-bus o r via pwm-interface with reverse polarity protection in the high side path in the sample application of figure 3, the mlx81207 has been selected in order to benefit from the ext ernal high side reverse polarity protection possibility c ompared to the application shown in section 4.1. all other remarks from the previous application exa mple remain valid. figure 3 C typical sensor-less bldc motor control a pplication example with mlx81207
mlx81205/07/10/15 product abstract page 11 of 18 rev 3.9 tfr / cpa 11-may-2012 4.3 sensor based bldc motor control in the sample application of, figure 4, the mlx8120 7 can realize the driving of a bldc motor with thre e hall sensors. an external p-fet is used to derive the 3. 3v supply with a higher current capability in order to bring power consumption outside the mlx81207. vs mlx81207 gnda gndd vddd vref cp0 cp1 t cp2 ti0 ti1 to clko gnd vbat_s2 vbat_s1 ls0 hs0 u ls1 hs1 v vprot ls2 hs2 w vprot vhigh shunt vcchall gnd hall1 hall2 hall3 vdda rtg io2 io3 iohv lin / pwm lin io1 osc2 osc1 io5 vcc3 vbat vcc3 io4 gndcap gnddrv vcc3 u v w vprot figure 4 C typical sensor based bldc motor control application example with mlx81207
mlx81205/07/10/15 product abstract page 12 of 18 rev 3.9 tfr / cpa 11-may-2012 4.4 sensor-less bldc motor control with absolute po sition sensing in the sample application of figure 5, the mlx81210 is working with an absolute position sensor in ord er to measure the position of the gear shaft in throttle valve application systems or any other similar appl ications, where absolute precise position sensing is requeste d. figure 5 C typical sensor-less bldc motor control a pplication example with mlx81210 and triaxis? absolute position sensing
mlx81205/07/10/15 product abstract page 13 of 18 rev 3.9 tfr / cpa 11-may-2012 4.5 sensor-less bldc motor control via a can-bus-in terface in this sample application the mlx81215 can realize the sensor-less driving of a bldc motor via a can- bus interface. system wake-up on can-bus traffic is pos sible. the 5v and a 3.3v voltage supply needed for the can-bus, is generated via external n-fet control in order to limit the power dissipation in the packag e. the motor current can be monitored via shunt resist ors in the ground and battery path in case the appl ication requests a double side monitoring for security reas ons. application programming on module level via the can -bus is supported by the spi-interface. figure 6 C typical bldc motor control application e xample on the can-bus with mlx81215
mlx81205/07/10/15 product abstract page 14 of 18 rev 3.9 tfr / cpa 11-may-2012 5. mechanical specification 5.1 qfn figure 7 C qfn drawing 5.1.1. qfn32 5x5 (32 leads) symbol [1][2] a a1 a3 b d d2 e e2 e l n [3] nd [4] ne [4] 0.80 0.00 0.18 3.50 3.50 0.35 0.85 0.02 0.25 3.60 3.60 0.40 min qfn32 nom max 0,90 0.05 0.20 0.30 5.00 3.70 5.00 3.70 0.50 0.45 32 8 8 table 6 C qfn32 5x5 package dimensions 5.1.2. qfn48 7x7 (48 leads) symbol [1][2] a a1 a3 b d d2 e e2 e l n [3] nd [4] ne [4] 0.80 0 0.18 5.00 5.00 0.45 0.85 0.02 0.25 5.10 5.10 0.50 min qfn48 nom max 0.90 0.05 0.20 0.30 7.00 5.20 7.00 5.20 0.50 0.55 48 12 12 table 7 - qfn48 7x7 package dimensions [1] dimensions and tolerances conform to asme y14.5 m-1994 [2] all dimensions are in millimeters. all angels a re in degrees [3] n is the total number of terminals [4] nd and ne refer to the number of terminals on e ach d and e side respectively
mlx81205/07/10/15 product abstract page 15 of 18 rev 3.9 tfr / cpa 11-may-2012 5.2 tqfp ep 48 7x7 (48 leads) exposed pad need best possible contact to ground for exlectrical and thermal reasons figure 8 C tqfp ep 7x7 drawing a a1 a2 b b1 d d1 d2 e e1 e2 e l n ccc ddd min - 0.05 0.95 0.17 0.17 0.45 - - nom - - 1.00 0.22 0.20 0.60 - - max 1.20 0.15 1.05 0.27 0.23 9.00 7.00 4.00 9.00 7.00 4.00 0.50 0.75 48 0.08 0.08 table 8 C tqfp ep 7x7 package dimensions notes: 1. all dimensioning and tolerances conform to asme y14.5m-1994, ? 2. datum plane [-|-|-] located at mould parting lin e and coincident with lead, where lead exists, plas tic body at bottom of parting line. ? 3. datum [a-b] and [-d-] to be determined at center line between leads where leads exist, plastic body at datum plane [-|-|-] ? 4. to be determined at seating plane [-c-] ? 5. dimensions d1 and e1 do not include mould protru sion. dimensions d1 and e1 do not include mould pro trusion. allowable mould protrusion is 0.254 mm on d1 and e1 dimensions. 6. 'n' is the total number of terminals ? 7. these dimensions to be determined at datum plane [-|-|-] 8. package top dimensions are smaller than bottom d imensions and top of package will not overhang bott om of package. ? 9. dimension b does not include dam bar protrusion, allowable dam bar protrusion shall be 0.08mm total in excess of the "b" dimension at maximum material condition, dam bar ca n not be located on the lower radius of the foot. 10. controlling dimension millimeter. 11. maximum allowable die thickness to be assembled in this package family is 0.38mm 12. this outline conforms to jedec publication 95 r egistration ms-026, variation aba, abc & abd. ? 13. a1 is defined as the distance from the seating plane to the lowest point of the package body. ? 14. dimension d2 and e2 represent the size of the e xposed pad. the actual dimensions are specified ion the bonding diagram, and are independent from die size. 15. exposed pad shall be coplanar with bottom of pa ckage within 0.05.
mlx81205/07/10/15 product abstract page 16 of 18 rev 3.9 tfr / cpa 11-may-2012 6. marking/order code 6.1 marking mlx81205/07/10/15 1 ic version: 07/10 or 15 lot number firmware revision: characters [aa...zz] assembly date code: week number assembly date code: year silicon revision: character [a...z] lot number firmware revision: characters [aa...zz] assembly date code: week number assembly date code: year silicon revision: character [a...z] 1 6.2 order code mlx81205/07/10/15
mlx81205/07/10/15 product abstract page 17 of 18 rev 3.9 tfr / cpa 11-may-2012 7. assembly information this melexis device is classified and qualified reg arding soldering technology, solder ability and moi sture sensitivity level, as defined in this specification , according to following test methods: ipc/jedec j-std-020 moisture/reflow sensitivity classification for no h ermetic solid state surface mount devices (classification reflow profiles according to table 5-2) eia/jedec jesd22-a113 preconditioning of no hermetic surface mount device s prior to reliability testing (reflow profiles according to table 2) cecc00802 standard method for the specification of surface mo unting components (smds) of assessed quality eia/jedec jesd22-b106 resistance to soldering temperature for through-hol e mounted devices en60749-15 resistance to soldering temperature for through-hol e mounted devices mil 883 method 2003 / eia/jedec jesd22-b102 solder ability for all soldering technologies deviating from above mentioned standard conditions (regarding peak temperature, temperature gradient, temperature prof ile etc) additional classification and qualificatio n tests have to be agreed upon with melexis. the applicatio n of wave soldering for smds is allowed only after consulting melexis regarding assurance of adhesive strength between device and board. based on melexis commitment to environmental respon sibility, european legislation (directive on the restriction of the use of certain hazardous substan ces, rohs) and customer requests, melexis has insta lled a roadmap to qualify their package families for lea d free processes also. various lead free generic qualifications are running, current results on requ est. for more information on melexis lead free statement see quality page at our website: http://www.melexis.com/html/pdf/mlxleadfree-stateme nt.pdf
mlx81205/07/10/15 product abstract page 18 of 18 rev 3.9 tfr / cpa 11-may-2012 8. disclaimer the product abstract just provides an overview of t he described devices. please consult the complete product specification/datasheet in its latest revis ion for any detailed information. devices sold by melexis are covered by the warranty and patent indemnification provisions appearing in its term of sale. melexis makes no warranty, express, s tatutory, implied, or by description regarding the information set forth herein or regarding the freed om of the described devices from patent infringemen t. melexis reserves the right to change specifications and prices at any time and without notice. therefo re, prior to designing this product into a system, it i s necessary to check with melexis for current infor mation. this product is intended for use in normal commerci al applications. applications requiring extended temperature range, unusual environmental requiremen ts, or high reliability applications, such as milit ary, medical life-support or life-sustaining equipment a re specifically not recommended without additional processing by melexis for each application. the information furnished by melexis is believed to be correct and accurate. however, melexis shall no t be liable to recipient or any third party for any dama ges, including but not limited to personal injury, property damage, loss of profits, loss of use, interrupt of business or indirect, special incidental or consequ ential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the t echnical data herein. no obligation or liability to recipien t or any third party shall arise or flow out of mel exis rendering of technical or other services. ? melexis nv. all rights reserved for the latest version of this document, go to our website at www.melexis.com or for additional information contact melexis direc t: europe, africa, asia: america: phone: +32 1367 0495 phone: +1 248 306 5400 e-mail: sales_europe@melexis.com e-mail: sales_usa@melexis.com iso/ts16949 and iso14001 certified

▲Up To Search▲

Price & Availability of MLX81205LLQAA000TU

	To Download MLX81205LLQAA000TU Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .