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| Datasheet File OCR Text: |
| headquarters riverside ca www.bourns.com page 1 of 1 casrn: cas registry number is a registered trademark of the american chemical society material declaration sheet no. construction element(subpart) homogeneous material material weight [ mg ] homogeneous material \ substances casrn if applicable materials mass % material mass % of total unit wt. subpart mass of total wt. (%) 1 s emiconductor device silicon chip 7.84 doped silicon 7440 - 21 - 3 100 5. 53 5.53 copper 7440 - 50 - 8 95.645 41.61 iron 7439 - 89 - 6 2.185 0.95 tin 7440 - 31 - 5 0.034 0.01 zinc 7440 - 66 - 6 0.135 0.06 2 lead frame copper alloy with silver plating 61.68 silver (plating) 7440 - 22 - 4 2.0 0.87 43.5 3 bond wire gold wi re 0.26 gold 7440 - 57 - 5 100 0.18 0.18 di - ester resin proprietary 3 0.05 5 functionalized ester proprietary 7 0.13 polymeric compound proprietary 3 0.05 5 4 die attach adhesive 2.56 silver 7440 - 22 - 4 87 1.57 1.81 silica fused 60676 - 86 - 0 90.5 41.27 epoxy resin proprietary 4.7 2.14 phenolic resin proprietary 4.7 2.14 5 mold compound (ha logen - free) epoxy resin 64.66 carbon black 1333 - 86 - 4 0.1 0.05 45.6 6 matte tin plating matte tin 4.79 tin 7440 - 31 - 5 100 3.38 3 .38 total weight 141.79 this document was updated on: january 12, 2010 important remarks: 1. it is the responsibility of the user to verify they are accessing the latest version. material number p 8 50 - u 18 0 - w h product line tbu compliance date january - 2008 rohs compliant yes msl 3
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