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-0- specifications for nichia amber led model : NSPA310S nichia corporation nichia sts-da1-1100 http://
-1- 1.specifications ( 1) a bs ol ut e m a xi m um r a t i ngs ( t a = 2 5 c ) item sym bol absolute maximu m rating unit forward current i f 30 m a pulse forward current i fp 100 ma reverse voltage v r 5 v power dissipation p d 103 mw operating tem p erature t opr -30 ~ + 85 c storage tem p erature t stg -40 ~ +100 c soldering tem p erature t sld 265c for 10sec. i fp conditions : pulse width 10m sec. and duty 1/10 (2) initial electrical/optical characteristics (ta=25c) item sym bol condition typ. max. unit forward voltage v f i f =20[m a ] (3.1) 3.45 v reverse current i r v r = 5[v] - 50 a luminous intensity iv i f =20[ma] (6.7) - cd x - i f =20[ma] 0.560 - - chrom aticity coordinate y - i f =20[ma] 0.435 - - ? forward voltage measurem ent allowance is 0.05v. ? lum inous intensity value is traceable to the cie 127:2007-com p liant national standards. ? please refer to cie 1931 chrom aticity diagram . ( 3) r a nki ng ( t a = 25c ) item sym bol condition min. max. unit rank u 8.40 11.8 rank t 5.90 8.40 lum i nous intensity rank s iv i f =20[ma] 4.20 5.90 cd ? lum inous intensity measurem ent allow ance is 10%. c o l o r r a nk ( i f =20m a,ta=25c) rank l x 0.603 0.532 0.522 0.589 y 0.397 0.467 0.460 0.393 ? color coordinates measurem ent allow ance is 0.01. ? basically , a shipm ent shall consist of the led s of a com b ination of the above ranks. the percentage of each rank in the shipm ent shall be determ ined by nichia. 2.initial optical/electrical characteristics please refer to ?characteristics? on the following pages. 3.outline dimensions and materials please refer to ?outline dimensions? on the following page. nichia sts-da1-1100
-2- 4.packaging the leds are packed in cardboard boxes after packaging in anti-electrostatic bags. please refer to ?packing? on the following pages. the label on the m i nim u m packing unit shows ; part num b er, lot num b er, ranking, quantity in order to protect the leds from m echanical shock, we pack them in cardboard boxes for transportation. the leds m ay be dam aged if the boxes are dropped or receive a strong im pact against them , so precautions m u st be taken to prevent any dam age. the boxes are not water resistant and therefore m u st be kept away from water and m o isture. w h en the leds are transported, we recom m end that you use the sam e packing m ethod as nichia. 5.lot number the first six digits num ber shows lot number . the lot num ber is com posed of the following characters; {? - ??? { - year ( 9 for 2009, a for 2010 ) ? - month ( 1 for jan., 9 for sep., a for oct., b for nov. ) - nichia' s product num b er ??? - ranking by color coordinates, ranking by lum i nous intensity nichia sts-da1-1100
-3- 6.reliability (1) test items and results test item standard test method test conditions note num b er of dam a ged resistance to soldering heat jeita ed-4701 300 302 tsld=260 5c, 10sec. 3m m from the base of the epoxy bulb 1 tim e 0/50 tem p erature cy cle jeita ed-4701 100 105 -40c ~ 25c ~ 100c ~ 25c 30m in. 5m in. 30m in. 5m in. 100 cy cles 0/50 moisture resistance cy clic jeita ed-4701 200 203 25c ~ 65c ~ -10c 90% rh 24hrs./1cy cle 10 cy cles 0/50 term inal strength (bending test) jeita ed-4701 400 401 load 5n (0.5kgf) 0 ~ 90 ~ 0 bend 2 tim es no noticeable dam a ge 0/50 term inal strength (pull test) jeita ed-4701 400 401 load 10n (1kgf) 10 1 sec. no noticeable dam a ge 0/50 high tem p erature storage jeita ed-4701 200 201 ta=100c 1000hrs. 0/50 tem p erature hum idity storage jeita ed-4701 100 103 ta=60c, rh=90% 1000hrs. 0/50 low tem p erature storage jeita ed-4701 200 202 ta=-40c 1000hrs. 0/50 steady state operating life ta=25c, i f =30m a 1000hrs. 0/50 steady state operating life of high hum idity heat 60c, rh=90% , i f =20m a 500hrs. 0/50 steady state operating life of low tem p erature ta=-30c, i f =20m a 1000hrs. 0/50 (2) criteria for judging damage criteria for judgem ent item sym bol test conditions min. max. forward voltage v f i f =20ma - u.s.l.*) 1.1 reverse current i r v r =5v - u.s.l.*) 2.0 luminous intensity i v i f =20ma l.s.l.**) 0.7 - *) u.s.l. : upper standard level **) l.s.l. : lower standard level nichia sts-da1-1100
-4- 7.cautions the leds are devices which are m a terialized by com b ining blue leds and special phosphors. consequently, the color of the leds is changed a little by an operating current. care should be taken after due consideration when using leds. (1) lead form ing w h en form ing leads, the leads should be bent at a point at least 3m m from the base of the epoxy bulb. do not use the base of the leadfram e as a fulcrum during lead form ing. lead form ing should be done before soldering. do not apply any bending stress to the base of the lead. the stress to the base m ay dam age the led?s characteristics or it m ay break the leds. w h en m ounting the leds onto a printed circuit board, the holes on the circuit board should be exactly aligned with the leads of the leds. if the leds are m ounted with stress at the leads, it causes deterioration of the epoxy resin and this will degrade the leds. (2) storage the leds should be stored at 30c or less and 70% rh or less after being shipped from nichia and the storage life lim its are 3 m onths. if the leds are stored for 3 m onths or m o re, they can be stored for a year in a sealed container with a nitrogen atm o sphere and mo isture absorbent m aterial. the lead part may be affected by environm ents which contain corrosive substances. please avoid conditions which m a y cause the led to corrode, ta rnish or discolor. this corrosion or discoloration m a y cause difficulty during soldering operations. it is recom m e nded that the leds be used as soon as possible. please avoid rapid transitions in am bient tem perature, especially, in high hum idity environm ents where condensation can occur. (3) recom m ended circuit in designing a circuit, the current through each led m u st not exceed the absolute m axim u m rating specified for each led. it is recom m e nded to use circuit b which regulates the current flowing through each led. in the m eanwhile, when driving leds with a constant voltage in circuit a, the current through the leds m ay vary due to the variation in forward voltage (v f ) of the leds. in the worst case, some led m ay be subjected to stresses in excess of the absolute m axim u m rating. this product should be operated in forward bias. a driving circuit m u st be designed so that the product is not subjected to either forward or reverse voltage while it is off. in particular, if a reverse voltage is continuously applied to the product, such operation can cause m i gration resulting in led dam age. (a) (b) ... ... nichia sts-da1-1100
-5- (4) static electricity static electricity or surge voltage dam ages the leds. it is recom m ended that a wrist band or an anti-electrostatic glove be used when handling the leds. all devices, equipm ent and m achinery m u st be properly grounded. it is recom m ended that precautions be taken against surge voltage to the equipm ent that m ounts the leds. w h en inspecting the final products in which leds were assem b led, it is recom m ended to check whether the assem b led leds are dam aged by static electricity or not. it is easy to find static-dam aged leds by a light-on test or a vf test at a lower current (below 1m a is recom m ended). dam aged leds will show som e unusual characteristics such as the leak current rem arkably increases, the forward voltage becom e s lower, or the leds do not light at the low current. c r i t e r i a : ( v f > 2.0v at i f =0.5m a) (5) soldering conditions solder the led no closer than 3m m from the base of the epoxy bulb. soldering beyond the base of the tie bar is recom m ended. recom m ended soldering conditions d ip soldering h and soldering pre-heat pre-heat tim e solder bath tem p erature d ipping tim e d ipping position 120c max. 60 seconds max. 260c max. 10 seconds max. no lower than 3 m m from the base of the epoxy bulb. tem p erature soldering tim e position 350c max. 3 seconds max. no closer than 3 m m from the base of the epoxy bulb. although the recommended soldering conditions are specified in the above table, dip or hand soldering at the lowest possible tem p erature is desirable for the leds. a rapid-rate process is not recom m ended for cooling the leds down from the peak tem p erature. dip soldering should not be done m o re than one tim e. hand soldering should not be done m o re than one tim e. do not apply any stress to the lead particularly when heated. the leds m u st not be repositioned after soldering. after soldering the leds, the epoxy bulb should be protected from m echanical shock or vibration until the leds return to room tem p erature. direct soldering onto a pc board should be avoided. mechanical stress to the resin m ay be caused from warping of the pc board or from the clinching and cutting of the leadfram es. w h en it is absolutely necessary, the leds m ay be m ounted in this fashion but the custom er will assum e responsibility for any problem s. direct solderi ng should only be done after testing has confirm ed that no dam a ge, such as wire bond failure or resin dete rioration, will occur. nichia?s leds should not be soldered directly to double sided pc boards because the heat will deteriorate the epoxy resin. w h en it is necessary to clam p the leds to prevent soldering f ailure, it is im portant to m i nim i ze the m echanical stress on the leds. cut the led leadfram es at room tem p erature. cutting the leadfram es at high tem p eratures m ay cause failure of the leds. nichia sts-da1-1100
-6- (6) heat generation therm al design of the end product is of param ount im portance. please consider the heat generation of the led when m a king the system design. the coefficient of tem p erature increase per input electric power is affected by the therm al re sistance of the circuit board and density of led placem ent on the board, as well as other com ponents. it is necessary to avoid intense heat generation and operate within the m axim u m ratings given in this specification. the operating current should be decided after considering the am bient m axim u m tem p erature of leds. (7) cleaning it is recom m ended that isopropyl alcohol be used as a solvent for cleaning the leds. w h en using other solvents, it should be confirm ed beforehand whether the solvents will dissolve the resin or not. freon solvents should not be used to clean the leds because of worldwide regulations. do not clean the leds by the ultrasonic. w h en it is absolutely necessary, the influence of ultrasonic cleaning on the leds depends on factors such as ultrasonic power and the assem b led condition. before cleaning, a pre-test should be done to confirm whether any dam a ge to the leds will occur. (8) saf ety guideline f o r hum an eyes the international electrical com m i ssion (iec) published in 2006 iec 62471: 2006 photobiological safety of lamps and lamp systems which includes leds within its scope. meanwhile leds were rem oved from the scope of the iec 60825-1:2007 laser safety standard, the 2001 edition of which included led sources within its scope. however, keep in m i nd that som e countries and regions have adopted standards based on the iec laser safety standard iec 60825-1:2001 which includes leds within its scope. following iec 62471:2006, m ost of nichia leds can be classified as belonging to either exem pt group or risk group 1. optical characteristics of a led such as output power, spectrum and light distribution are factors that affect the risk group de term ination of the led. especially a high-power led, that em its light containing blue wavelengths, m a y be in risk group 2. great care should be taken when viewing directly th e led driven at high current or the led with optical instrum ents, which m ay greatly increase the hazard to your eyes. (9) others NSPA310S com p lies with rohs directive. if the leds are being used after being fixed into a case (container, box, etc...) the leds m u st not be m ounted so that the epoxy lens is pressed or glued onto a plastic (or m etal) board. flashing lights have been known to cause discom fort in people; you can prevent this by taking precautions during use. also, people should be cautious when using equipm ent that has had leds incorporated into it. these leds are designed and m anufactured for standard applications of traffic signals. it is recom m ended to consult with nichia in advance if these leds are used for other applications. the custom er shall not reverse engineer by disa ssem b ling or analysis of the leds without having prior written consent from nichia. w h en defective leds are found, the custom er shall inform nichia directly before disassem b ling or analysis. the form al specifications m u st be exchanged and signed by both parties before large volum e purchase begins. the appearance and specifications of the product m ay be m odified for im provem ent without notice. nichia sts-da1-1100
-7- ? color coordinates measurem ent allow ance is 0.01. ?? ic i ch r o m a t i c i t y di a g r a m l 0 0. 1 0. 2 0. 3 0. 4 0. 5 0. 6 0. 7 0. 8 0. 9 0 0 .1 0 .2 0 .3 0 .4 0 .5 0 . 6 0 . 7 0 .8 x y 460 47 0 480 49 0 500 51 0 52 0 53 0 54 0 550 56 0 57 0 58 0 590 60 0 61 0 62 0 63 0 nichia sts-da1-1100
057041 ?? ta () ambient temperature ta () tavf 2.0 2.5 3.0 3.5 4.0 4.5 5.0 -60 -30 0 30 60 90 120 ?? t a () ambient temperature ta () ??- ?R ambient temperature vs. forward voltage duty 10 100 1000 1 10 100 30 taiv 0.6 0.8 1.0 1.2 1.4 -60 -30 0 30 60 90 120 derating 0 10 20 30 40 50 0 30 60 90 120 (47,30) (85,8.5) ifiv 0 1 2 3 4 5 0 20 40 60 80 100 120 vfif 1 10 100 2.0 2.5 3.0 3.5 4.0 4.5 5.0 20 ?Rvf (v) forward voltage vf (v) ?R forward voltage vs. forward current ? ` ` ( ) duty ratio (%) ?`? `?S duty ratio vs. allowable forward current ?R vf (v) forw ard voltage vf (v) ta=25 ta=25 ta=25 (a.u.) relative luminosity (a.u.) ?(a.u.) relative luminosity(a.u.) - forward current vs. relative luminosity nspa310(s) ?/ ? characteristics model ? n o. nichia corporation ??I ( ) title 100309 - 8 - ??- ambient temperature vs. relative luminosity ?? t a () ambient temperature ta () ??- S a mb i ent t e mp er atur e vs. allowable forward current ifp (ma) forw ard c u rrent ifp (ma) ifp (ma) forward current ifp (ma) S ifp (ma) a llo w a b le fo rw a r d c u rrent i fp (ma ) S if ( ma ) a llo w ab l e fo rw ar d c u rrent i f ( ma ) 20ma i fp = i fp = 60ma i fp =5ma i fp = 20ma nichia sts-da1-1100
057051 spectrum 0.0 0.2 0.4 0.6 0.8 1.0 1.2 450 550 650 750 850 ifxy 0.425 0.430 0.435 0.440 0.445 0.550 0.555 0.560 0.565 0.570 ? directivity taxy 0.425 0.430 0.435 0.440 0.445 0.550 0.555 0.560 0.565 0.570 x - ? forward current vs. chromaticity coordinate y L (n m) wavelength (nm) k??? spectrum k? (a.u .) relative emission intensity (a. u . ) x ??- ? ambient temperature vs. chromaticity coordinate y directivity 90 80 70 60 50 40 30 20 10 -10 -20 -30 -40 -50 -60 -70 -80 -90 1 0.5 0 0.5 1 0 ta=25 nspa310(s) 100309 ?/ ? characteristics model ? n o. nichia corporation ??I ( ) title - 9 - ?(a.u .) relative luminosity (a. u . ) ? ra d i a t io n a n g l e 20ma i fp = ta=25 20ma i f = ta=25 20ma i fp = 1ma 20ma 100ma -30 0 25 50 85 nichia sts-da1-1100
nspa 310 s 10030905 7061 - 10 - 0 . 2 ? ?I () nic hia c or p or ation ti t l e no. ? out l i ne di m e ns i ons mm m odel un it g al lo w ? i t em ? resin ` ` leadframe ? ( ? w ) epoxy resin (over phosphor) | m at er ials y U ` ag p lat i ng i r o n s o lder - d ip ped le ads ( l ead- f r ee ) ? 1 (n o t e1 ) ` ? ? l e d ? ` ? ? ? Q H ? ? ? p le a s e n o t e t h at t he bar e ir o n s h o w i n g at t h e cut e nd o f t h e l ead f r ame ma y b e c o r r o ded un der cer t a in co n dit i o ns . l e d s h av e s o m e s har p e dg es a n d p o int s , p ar t icu lar ly lead f r a mes . p l e a se h a nd l e wi th c a r e so a s t o a v o i d i n j u r i es. ? 2 (n o t e2 ) ? ? ? ? ? n o no t iceab l e ex po s ur e o f bas e co a t f o r t he lead s w i t h s o l de r -d ip ped f i nis h e s . ?` ? d e ta i l of s top p e r 1 0.3 0. 3 3.5 1 (2) (2.5) 1.1 anode cathode 5.7 4.7 10.7 0.5 27.2 1 0.5 +0.1 -0.05 3.8 3max. not soldered 1.5max. 3.1 nichia sts-da1-1100
-11- ?`? cardboard box 3601352154t ?` cardboard ?` cardboard ? print ? d t h e q ua nt i t y i s p ri n t ed o n thi s ba g . ` ? cardboard box b 3601352154t ?` cardboard ca r d b o a r d b o x a ?` cardboard ? a n ti - e l ec t r o s ta t i c b a g ? ?d the q ua nti t y i s p r i nte d o n th i s b a g . ? p r i n t ? label ? label nxp xxxxxx 090 113 833 712 nxp xxxxxx 090113833722 1 8 ? ? one box contains 8 bags at maximum. 2 ? ? ? t he ca r d b o a rd bo x b c o nta i n s 2 c a r d b oar d b ox a at m ax i m u m . y? packing mo d e l t itle ? no . ? ? I ( ) n ich ia co rp o ra t io n y? packing mo d e l t itle ? no . ? ? I ( ) n ich ia co rp o ra t i o n nxpxxxxxx xxxx led n xp x xx xxx xxxx led ? ? a n ti -e l ect ro s t a t i c ba g N t h i s l a b el i s p l a c e d o n t h e ca r d b o a rd bo x b . n xp x xxx xx xx xx l e d n i c h i a ca u t i o n t o e l e c t r o s t at i c d am ag e ? nichia corporation 491 oka, kaminaka, anan, tokushima, japan rohs ty p e lo t q t y p c s x xxx xx - n xp x xx xx x xxx x l e d n i c h i a c a ut i o n t o ele c t r o st a t ic d a m a g e ? nic h i a c o r p o r a t i o n 4 9 1 ok a , k am in a k a, a n a n , t o k u s h i m a , j a p a n roh s ty p e lo t q t y p c s xx xx xx - typ e lo t q t y. p c s n ichia corporation 491 oka, kaminaka, anan, tokushima, japan roh s xx xxx x- ty p e lo t q t y . p c s ni c hia corporation 491 oka, kaminaka, anan, tokushima, japan rohs x xxx xx - nichia sts-da1-1100
-12- ? label ? an t i - e le c t r o s t a t ic b a g ?`? cardboard box 4251353554t ?` cardboard ?` cardboard ? print ? ?d th e q u a nti t y i s p ri nt ed o n thi s ba g . ` ? cardboard box b 4251353554t ?` cardboard c a r dbo a r d b o x a ?` cardboard ? a n ti - e l ec t r o s ta t i c b a g ? d th e qu a n t i t y i s pr i n t e d o n t h i s b a g. ? p r i n t nxp xxxxxx 090413833733 ? label nxp xxxxxx 090113833742 ? 4 the c a rd bo a r d b o x b co nt a i ns 4 cardboard box a at maximum. 1 2 0 o n e b o x c o nta i ns 2 0 ba g s a t m a x i m um . y ? pa c k i n g mo d e l t itle ? no . ? ? I ( ) n ich ia co rp o ra t io n y? packing mo d e l t itle ? no . ? ? I ( ) n ich ia co rp o ra t io n N t h i s l a b el i s pl a c e d o n t h e ca rdb o a r d bo x b . n x p xx xxx x xx xx l e d n i c h i a ca u t i o n t o e le c t r o st a t ic d a m a g e ? nichia corporation 491 oka, kaminaka, anan, tokushima, japan rohs ty p e lot q t y p c s xx xxx x- n x p xxx xx x xx xx l e d n i c h i a c a ut i o n t o el ec t r o s t a t i c d a m a g e ? nichia corporation 491 oka, kaminaka, anan, tokushima, japan rohs ty p e lo t q t y p c s xxx xx x- nx p x x x x x x xxxx led ty p e lo t q t y . p c s nichia corporation 491 oka, kaminaka, anan, tokushima, japan rohs xx xx xx- n x p xx xxx x xxx x led typ e lo t q ty. p c s nichia corporation 491 oka, kaminaka, anan, tokushima, japan rohs xxx xx x- nichia sts-da1-1100

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