specification NT-SM02BD-8723BS-12 wf+ bt+ fm combo module ieee 802.11 b/g/n 2.4ghz 1t1r wifi with bluetooth2.1/3.0/4.0, and fm controller with sdio interface, and hs-uart mixed interface ieee 802.11 b/g/n 2.4ghz 1t1r wifi with bluetooth2.1/3.0/4.0, and fm controller with sdio interface, and hs-uart mixed interface ieee 802.11 b/g/n 2.4ghz 1t1r wifi with bluetooth2.1/3.0/4.0, and fm controller with sdio interface, and hs-uart mixed interface ieee 802.11 b/g/n 2.4ghz 1t1r wifi with bluetooth2.1/3.0/4.0, and fm controller with sdio interface, and hs-uart mixed interface ieee 802.11 b/g/n 2.4ghz 1t1r wifi with bluetooth2.1/3.0/4.0, and fm controller with sdio interface, and hs-uart mixed interface ieee 802.11 b/g/n 2.4ghz 1t1r wifi with bluetooth2.1/3.0/4.0, and fm controller with sdio interface, and hs-uart mixed interface version 1.0 version 1.0 version 1.0
product description sm02bd is a small size and low profile of w f+bt+fm combo module with lga (land-grid array) footprint, board size is 12mm*12mm with module height of 2mm. it can be easily manufactured on smt process and highly suit able for tablet pc, ultra book, mobile device and consumer products. it provides gspi/sdio interface for wifi to connect with host processor and high speed uart in terface for bt. it also has a pcm interface for audio data transmission with direct link to external audio codec via bt controller. the wifi throughput can go up to 150mbps in theory by using 1x1 802.11n b/g/n mimo technology and bluetooth can support bt2.1+edr/bt3.0 and bt4.0. sm02bd uses realtek rtl8723bs, a highly inte grated wifi/bt single module based on advanced coms process. rtl8723bs integr ates whole wifi/bt function blocks into a chip, such as sdio/uart, mac, bb, afe, rfe, pa, eeprom and ldo/swr, except fewer passive components remained on pcb. product features ? operate at ism frequency bands (2.4ghz) ? gspi/sdio for wifi and uart for bluetooth ? ieee standards support: ieee 802.11b, ieee 802.11g, ieee 802.11n, ieee 802.11d, ieee802.11e, ieee 802.11h, ieee 802.11i ? fully qualified for bluetooth 2.1 + edr specification including both 2mbps and 3mbps modulation mode ? fully qualified for bluetooth 3.0 ? fully qualified for bluetooth 4.0 dual mode ? full ?speed bluetooth operation with piconet and scatternet support. ? enterprise level security which can apply wpa/wpa2 certification for wifi. ? wifi 1 transmitter and 1 receiver allow data rates supporting up to 150 mbps downstream and 150 mbps upstream phy rates ? for wifi/bt, it uses fixed path for wifi and bt, which means one antenna assigned for wifi and the other is assigned for bt. ? support bluetooth adaptive power management mechanism ? full-featured software utility for ea sy configuration and management ? rohs compliance ? low halogen compliance
diagram recommended reflow profile referred to ipc/jedec standard. peak temperature : <250c number of times : 2 times
product specifications main chipset wifi: ieee 802.11b, ieee 802.11g, ieee 802.11n, ieee 802.11d, ieee 802.11e, ieee 802.11h, ieee 802.11i standards bt: v2.1+edr/bt v3.0/bt v3.0+hs/bt v4.0 bus interface wifi: gspi/sdio bt: uart data rate 802.11b: 11, 5.5, 2, 1 mbps 802.11g: 54, 48, 36, 24, 18, 12, 9, 6 mbps 802.11n: mcs 0 to 7 for ht20mhz mcs 0 to 7 for ht40mhz bt: 1 mbps for basic rate 2,3 mbps for enhanced data rate 6,9,12,18,24,36,48,54 mbps for high speed media access control wifi: csma/ca with ack bt: afh, time division modulation techniques 802.11b: cck, dqpsk, dbpsk 802.11g: 64 qam, 16 qam, qpsk, bpsk 802.11n: 64 qam, 16 qam, qpsk, bpsk bt: 8dpsk, /4 dqpsk, gfsk network architecture wifi: ad-hoc mode (peer-to-peer ) infrastructure mode software ap wifi direct bt: pico net scatter net wifi: wifi: os supported linux/android frequency range 2.400ghz ~ 2.4835 ghz operating channel wifi 2.4ghz: 11: (ch. 1-11) ? united states 13: (ch. 1-13) ? europe 14: (ch. 1-14) ? japan bt 2.4ghz: ch. 0 ~78 operating voltage 3.3 v 9% i/o supply voltage 802.11b@11mbps 16dbm 802.11g@6mbps 15dbm 802.11g@54mbps 14dbm 802.11n 13dbm (mcs 0_ht20) 13dbm (mcs 7_ht20) 12dbm (mcs 0_ht40) 12dbm (mcs 7_ht40) transmit output power ? 1x1 (tolerance:1.5dbm) bt: max +10dbm 802.11b@11mbps -82dbm 802.11g@54mbps -71dbm 802.11n -67dbm (mcs 7_ht20) -64dbm (mcs 7_ht40) receiver sensitivity bt: -89dbm@1mbps, -90dbm@2mbps, -83dbm@3mbps security wifi : wpa, wpa-psk, wpa2, wpa2-psk, wep 64bit & 128bit, ieee 802.11x, ieee 802.11i bt: simple paring power consumption (3.3v) (typical) wifi only tx mode: (conituous mode) 85ma(mcs7/bw40/13dbm) rx mode: (conituous mode) 75ma(mcs7/bw40/-60dbm) associated idle with dtim=1 2.1ma unassociated idle: 0.1ma rf disable mode: 0.1ma bt : inquiry & page scan: 0.9 ma acl no traffic: 7.5ma sco hv3: 15ma rtl8723bs (wifi/bt/fm single chips) module name storage temperature -55-+120 ambient operating temperature junction temperature 0-70 0-125 main chipset module name storage temperature -55-+120 junction temperature 0-70 0-125 nt-sm02bs-8723bs-12 nt-sm02bs-8723bs-12 nt-sm02bs-8723bs-12
mechanical length width height dimensions (mm) 12 (tolerance: 0.2mm) 12 (tolerance: 0.2mm) 1.6 (tolerance: 0.2mm) module pocture
11 nc nc 12 wl_dsi shared with gpio9 this pin can ex ternally shutdown the rtl8723bs wlan function when bt_disn is pulled low. when this pin deasserted, sdio interface will be disabled. this pin can also support the wlan ra dio-off function with host interface remaining connected. 13 wl_host_wake wlan to wake-up host 14 sdio_data_2 sdio data line 2 15 sdio_data_3 sdio data line 3 16 sdio_cmd sdio command line 17 sdio_clk 18 sdio_data_0 sdio data line 0 19 sdio_data_1 sdio data line 1 20 gnd grond 21 nc nc 22 vdd_io 3.3v0.1v 23 nc nc 24 susclk_in shared with gpio6. external 32k or rtc clock input with 1.8v ~ 3.3v swing. this clock source is configured by bt and wl fw, respectively. 25 pcm_dout pcm data output 26 pcm_clk pcm clock 27 pcm_din pcm data input 28 pcm_sync pcm sync signal 29 nc nc 30 26mhz_in reference clock input 26mhz active crystals (or if pin10/11 input ,pin30 nc ) 31 gnd grond 32 nc nc 33 gnd grond 34 bt_dis# general purpose input/output pin 35 nc nc 36 gnd grond 37 nc nc 38 nc nc 39 nc nc 40 nc nc 41 gnd grond 42 uart_out host data output 43 uart_in host data input 44 uart_cts host_cts pin function description 1 gnd grond 2 wifi/bt_ant 3 nc nc 4 nc nc 5 nc nc 6 bt_wake host wake-up bluetooth device 7 bt_host_wake bluetooth device to wake-up host 8 nc nc 9 vabt 3.3v0.1v(main power voltage source input) 10 nc nc pin description pin description pin description rf i/o port sdio clk line
wifi\bt rf circuit reference pictures ? :1. ??????????? . 2. ? rf ? 50 ??? 90 ???? 15mm. note: the rf part layout must do 50 ? impedance. can't get the line go 90 can't get the line longer than 15 mm. sdio interface circuit reference pictures fm interface circuit reference pictures
wireless module before the smt note: 1.when customers open stencil must be sure the hole bigger to the wireless module plate, please press 1 to 1 and 0.7 mm is widened to open outward, the thickness of 0.12 mm. 2.can't get the wifi module bare hands when needs,must we wear the gloves and static ring. 3.the furnace temperature according to the size of the customer the mainboard ,generally like to stick on a tablet standard temperature of 250 + - 5,can do 260 + - 5. storage and use wifi module control should pay attention to the following matters: 1. module of the storage life of vacuum packaging 1-1.storage life 12 months. storage conditions:<40 . relative humidity:<90%r.h. 1-2.after this bag is opened , devices that will be subjected to infrared reflow, vapor-phase reflow, or equivalent processing must be : 1-3. check the humidity card :stored at 20%rh.if : Q 30%~40%(pink)or greater than 40%(red). labeling module has moisture absorption. mounthed within 168 hours at factory conditions of: t 30% Q 60%r.h. Q once opened, the workshop the preservation of life for 168 hours. 1-4.if baking is required,devices may be baked for: modules must be to remove module moisture problem. baking temperature: 125 , 8 hours. after baking, put proper amount of desiccant to seal packages. 1-5.module vacuum packing 2000 pcs per disc. 2.module reel packaging items as follows. 2-1.storage life 12 months. storage conditions:<40 . relative humidity:<90%r.h. 2-2.module apart packing after 168 hours to launch patch need to bake, to remove the module hygroscopic, baking temperature conditions 125 8hours. 2-3.reel packing 2000 pcs or 1000 pcs per disc. 3.module pallet packaging items as follows 3-1. storage life 3 months. storage conditions:<40 . relative humidity:<90%r.h. 3-2.module if not used within 48 hours, before launch the need for baking, baking temperature: 125 , 8 hours. 3-3.pallet packaging each plate is 100 pcs to 1000 pcs or 2000 pcs shipment. wifi ?????? 1. ????? wifi ????? 1 1 0.7mm ? 0.12mm. 2. ? wifi ???????? . 3. ?????????? ? 250+-5 ? 260+-5 wifi ?p??? 1. ????? 1-1. ? 12 F?? <40 ?? <90%r.h. 1-2. ?? smt ???? 1-3. ????? 30% ? 30%~40%( ?? ? 40% ???? . ???? 30% Q 60%r.h Q ???? 168 ? . 1-4. ? 168 ????VV ?oV???? . V? 125 8 ? . V????? . 1-5. ???? 2000pcs ???? <1> 2. ??? 2-1. ? 12 F?? <40 ?? <90%r.h. 2-2. ???? 168 ????oV??? ??V? 125 8 ? 2-3. ????? 2000pcs ? 1000pcs. 3. ??? 3-1. ? 3 F?? <40 ?? <90%r.h. 3-2. ? 48 ???????VV? 125 8 ? 3-3. ???? 100pcs 1000pcs 2000pcs .
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