n i chia st s-da1- 2773a nichia corporation specifications for red led NSPR346LS r o hs co mp lia nt http://
n i chia st s-da1- 2773a 1 specifica t ions (1) ab sol u te maxi mum r a ti ngs item symbol absolute maximum rating unit f o rw ard current i f 50 ma pulse f o rw ard current i fp 150 ma r evers e v o lta g e v r 5 v po w e r d i s s i p a t i o n p d 127 mw oper ati n g t e m p er ature t op r - 30~85 c stor age t e mper ature t st g - 40~100 c jun c t i on t e mp er ature t j 100 c * abs o l u te maxi mum r a t i ngs at t a =25c. * i fp co ndit io n s wi th pu ls e wi dth 1 0 m s an d dut y cycl e 10%. ( 2 ) in it ial e l ect r ical/ o pt i cal c h ar acterist ics ite m symbol condition typ unit f orward voltage v f i f =20ma 2.2 v r everse current i r v r =5v - a lum inous intensity i v i f =20ma - cd x - i f =20ma 0.700 - chromaticit y c oordinate y - i f =20ma 0.299 - * char acteristics at t a =25c . * lum i nous int e nsit y v a lue as pe r cie 127: 2007 s t andar d . * chrom a t i ci t y coordi nate s as pe r cie 1931 chrom a ti cit y chart .
n i chia st s-da1- 2773a 2 ranks item rank min max unit forward voltage - 1. 80 2. 55 v reverse current - - 5 0 a v12 1. 82 1.98 v11 1. 67 1.82 u 22 1. 53 1.67 u 21 1. 40 1.53 u 12 1. 28 1.40 luminous intensity u 11 1. 18 1.28 cd color r a nks r a nk r8na rank r8nb x 0. 6680 0. 6598 0. 6915 0. 7010 x 0. 6742 0. 6680 0. 7010 0.7080 y 0. 3020 0. 3106 0. 3083 0. 2990 y 0. 2958 0. 3020 0. 2990 0.2920 * r a nking at t a =25c. * f o rw ard v o l t age t o le r a nce: 0. 05v * luminous i n te ns it y t o ler a nce : 10% * chromaticity coordi nat e t o ler a nc e: 0 .01 * led s from the abo v e r a nk s wil l b e shi p p e d. the r a nk combinat ion r a t i o per sh ipmen t will be d e cided by nichia .
n i chia st s-da1- 2773a 3 chroma ticity d i agram 660 670 65 0 605 60 0 61 0 61 5 62 0 62 5 630 635 640 r8 n a r8 n b 0.20 0.25 0.30 0.35 0.40 0 .60 0.65 0.7 0 0 .75 0.80 x y
n i chia st s-da1- 2773a 4 outline dimensions sts- da7- 4436 nspr 346ls no . ( g unit : mm) t h is produc t co m p li es wi th ro hs d i re cti v e. u ? ro hs ? m ?? * ( g un it : m m, to le r a n c e : 0. 2) ???`? lead standoff 1 0.3 0.3 ? led ? ? ` ? ?Q H ? ? ? ` ? ? ? * th e t i e b a r c u t - en d su rface e x h i bits expo sed iron base meta l. ca re mu s t be ta ken to hand l e the leds, as it may co ntain sha r p parts su ch as le ad , an d can cau s e in ju ry. ? ? ? 346 ` u ? ?? ? u ? v S ? ? O? H ? ? * c a re m u s t b e ta k e n to de si gn l e d s h a p e - re la te d pa rts a n d to ol s as the l e ns s h a p e vari es by pa rt n um b er, e v en am o ng the sa m e 346 seri es produc t s . * ?? ? ? ? ? ? n o noticeable exposur e of b a se metal of the lead with a sold er -d ip ped finish. ? item ?| resin materials ? lens color `??`| lead frame materials | weight description ?? epoxy resin ? ( ? ) red(with diffuser) + y? + U?`?? ag-plated and lead-free solder-plated iron 0.16g(typ) 3 3.9 26.3 1 (2) (2.5) anode cathode 1.1 7 1.5 m ax n o t s old e r e d 0.5 +0.1 -0.05 9.8 0. 5 1
n ichia st s-da1- 2773a 5 soldering ? r e co mm end e d hand so lde r ing cond it ion t e m p er a t ure 350c max solder ing t i m e 3sec max position n o closer tha n 2m m from the ba se of t h e len s . ? r e co mmend e d dip sold ering conditio n pre- heat 120c max pre-h e at ti me 60sec max solder bath t e mper a t ure 260c max d i pp ing time 10sec max dipping position n o closer tha n 2m m from the ba se of t h e len s . * solder th e l e d no clo s er t h an 2mm fro m t h e bas e of th e len s . soldering b e yond th e bas e of the ti e bar is re com m e n d e d. * d i p so lder in g/han d sold ering mu st not b e performed more than o n ce. * care should be tak e n to a v oid cooling a t a r apid r a te an d ens u re t h e p e ak te mper a t u r e r a mps down slow ly . * when sold ering, do not ap ply str e ss to t h e lead fr a m e w h i l e t h e l e d is hot. * when using a pick and p l a c e mach in e, ch oose an appro p riate nozzle f or this product. * after sold eri n g, t h e l e d po si tion mu st not be correc t ed . * after sold ering, n o mecha n ica l shock or vibr atio n sho u ld be applied to led len s u n t i l t h e l e d s c ool d o wn to room tem p er ature. * in order to a v oid damag e on the lens d u ring cutting and cl inching the leads, it is no t recommend e d to solder th e le ds directly on cu sto m er pc b withou t an y gap betw een th e lens and the boa r d. if it is u n a v oidable, custo m er is adv ised to ch eck wh eth e r such so lder ing will no t ca u s e wir e breaka ge or len s da mage. d i rect soldering to dou b le-sid ed pcbs mu st be a v o i ded due to a n in cre a sed effe ct of heat o n th e l e n s . * when it is ne ce ssary to cla m p t h e le ds t o prevent sold ering fa il ure , it is impor t a n t to mi ni m i ze the me cha n i c al stre ss on the led s . * cut th e le d lead fr ames at room temper a t ure. cu tting the lead fr ames at hig h t e mp e r ature may cau s e fai l ur e of th e le ds . * consider fa ctors suc h as t h e dip sold eri n g te mper at ure, hand so lder in g te mper at ure, etc . wh en c h o osing th e sol d e r . * when fl ux is used, i t should be a ha log e n free flux . ensu re tha t th e ma nufac tur i ng pr oces s i s not d e sign ed i n a ma nner where the f l ux wil l co me in conta c t w i t h t h e le ds .
n ichia st s-da1- 2773a 6 p a ckaging - bulk l a be l a ttac h ed to the bo x ? l abel p r inted on the bag sts-da7-0001c n x xxxxxx no . ro h s nxxxxxxx xxxx led * *** *** rr r pc s typ e ra n k qty. nichia corporation 491 oka, kaminaka, anan, tokushima, japan rohs n x xx xx xx ** *** ** xx xx led ca u t i o n t o elec t r os ta ti c d a m a g e ? ? ni c h ia c o r p o r at i o n 4 9 1 o k a, k a m i n a k a , anan , t o k u sh i m a , j a pan ty pe lo t qty pc s y m xx xx - r r r anti-electrostatic bag ? ni chi a led a n ti -el e c t r o s t a t i c ba gs a r e pa ck ed i n c a r d b o a r d bo x e s w i th corru gated p a r t itio ns. ? K? ` for de t a il s, se e " l ot n um b e r in g code " in th i s docu me n t . * ? ?? ? i f no t provided, i t wi ll not be indic a ted o n the l abel . ******* is t h e cus t o m er part num ber. O * ******* ? ?? pro d ucts are packed in an anti-electr o static bag. t h ey a r e ship ped in card boa r d bo xes to protect th em f r o m external fo rces during transpo r ta tio n . ?` ? ? ? y ? ? ? ? * ? \ H ? y ? B ? y * ? Q H n ? ? u? p ? ? ? * * u? ? ? n g o??` y d o not expo se to wate r. t h e bo x i s not wate r-res i sta n t. u s ing the o r igi n a l pa cka g e m a teria l or equiva le n t in trans i t is rec om m e nded. d o not drop o r e x po s e the box to e x terna l forc es as i t m a y dam a g e the pro d uc ts .
n ichia st s-da1- 2773a 7 l o t numbering c o de lot numb er is presented by using th e following alpha n u m er ic cod e . ymxxxx - r r r y - y e a r year y 2009 9 2010 a 2011 b 2012 c 2013 d 2014 e m - m o n t h month m month m 1 1 7 7 2 2 8 8 3 3 9 9 4 4 10 a 5 5 11 b 6 6 12 c xxxx -n ichia's product n u m b er rrr - r ank i ng by color c oordinat e s , r a nking by lu mi nous in te ns i t y
n ichia st s-da1- 2773a 8 dera ting characteristics s t s -d a 7- 033 9b no . n x p r 346 x s de r a t i n g 1 0 20 40 60 80 10 0 02 0 4 0 6 0 8 0 1 0 0 1 2 0 (40, 50.0) (85 , 12.5) du t y 10 10 0 10 00 1 10 100 50 15 0 S all owa bl e f orwar d c urr ent ( m a) ? - S am b i e n t t e mp e r a t u r e v s a l lo wa ble f o r w a r d c u r r e n t S allowable forward curr ent(ma) ? a m b i en t t e m p er atu r e( c) ? ` ` d u ty r a ti o ( % ) ` ` - S d u ty r a ti o v s a l l o w a bl e f o r w a r d c u r r e n t t a = 25 c
n ichia st s-da1- 2773a 9 optical characteristics ns p r 3 4 6 l s n o . s t s -d a 7 -44 1 3 sp e c t r u m 0.0 0. 2 0. 4 0. 6 0. 8 1. 0 450 500 55 0 600 6 50 7 00 7 5 0 re l a ti v e l u m i n o s i ty ( a . u . ) di r e c t iv i t y 1 90 80 70 60 50 40 30 20 10 0 -1 0 -2 0 -3 0 -4 0 -5 0 -6 0 -7 0 -8 0 -9 0 k sp e c t r um k r e l a ti v e e m i s s i o n i n ten s i t y ( a. u . ) L wa v e l e n g th ( n m ) ? d ir e c t iv it y ? r a di a t i o n a n gl e x-x y-y 10 .500.5 1 20m a i f = t a =2 5 c * ?? a l l ch a r act e r i st i c s sh ow n a r e f o r r e f e re n c e on l y a n d ar e n o t g u ara n t e e d . 20m a i fp = t a =2 5 c y y xx
n ichia st s-da1- 2773a 10 for w a r d cur r e n t char acteris t ics / tempera t ure characteristics ns p r 3 4 6 l s s t s -d a 7-44 14 no . tavf 1. 0 1. 5 2. 0 2. 5 3. 0 3. 5 4. 0 4. 5 - 60 - 4 0 - 20 0 2 0 4 0 60 80 100 1 2 0 ta i v 0. 6 0. 8 1. 0 1. 2 1. 4 - 60 - 4 0 - 2 0 0 2 0 40 6 0 80 100 12 0 vf i f 1 10 10 0 100 0 1 . 01 . 5 2 . 02 . 53 . 03 . 54 . 0 4 . 5 20 15 0 rel a ti ve l u m i n o s i t y ( a . u . ) ? - am b i e n t te m p e r a t u r e v s r e l a ti v e l u m i n o s i ty fo r ward curren t( m a) ifiv 0 2 4 6 8 10 0 5 0 100 1 50 20 0 re l a ti v e l u m i n o s i t y ( a . u . ) - fo r w a r d c u r r e n t v s r e l a ti v e lu m i n o s i ty f o rw ar d c u rre nt ( m a ) R- fo r w a r d v o l t a g e v s fo r w a r d c u r r e n t ? - R amb i e n t t e mp e r a t u r e v s fo r w a r d v o l t a g e ?R forwar d v o lt a g e( v ) R f o r w ard voltage(v) ?? ambient t e m p erature ( c ) ?? a m b i en t t emperature(c) i fp = 20ma i fp = 60ma i fp = 5ma t a =2 5 c * ?? a l l c h ar ac t e r i s t i c s s h o w n a r e f o r r e f e r e n c e o n l y a n d a r e n o t g u ar a n t eed . t a =25c i fp = 20m a
n ichia st s-da1- 2773a 11 for w a r d cur r e n t char acteris t ics / tempera t ure characteristics no . nspr3 46ls sts-da7-4415 if d 616 619 622 625 628 631 634 1 1 0 1 00 10 00 ta d 61 6 61 9 62 2 62 5 62 8 63 1 63 4 - 60 - 40 - 20 0 2 0 40 6 0 80 1 00 1 20 20m a i fp = - L fo r w a r d c u r r e n t v s d o m i na nt w a v e l e ng t h fo rw a r d c u rre nt ( m a ) ? - L amb i e n t t e mp e r a t u r e v s d o m i na nt w a v e l e ng t h d o m i na nt w a v e l e ngt h ( n m ) L d o m i na nt w a v e l e n g t h ( n m ) L ?? a m b i en t t e m p er atu r e( c ) taxy 0. 2 8 0. 2 9 0. 3 0 0. 3 1 0. 3 2 0. 3 3 0 . 6 8 0. 69 0. 70 0 . 7 1 0 . 72 0. 73 -30c(621nm) 0c(623 nm) 25c(62 5nm) 85 c ( 6 2 9 nm ) x y ? ?- ? ( L) am b i e n t t e m p e r a t u r e v s c h r o m a ti c i ty co o r d i n a te ( d) * ?? a l l ch a r act e r i st i c s sh ow n a r e f o r r e f e re n c e on l y a n d ar e n o t g u ara n t e e d . t a =2 5 c 20 m a i fp =
n ichia st s-da1- 2773a 12 reliability (1) t e s t s a n d r e sults te s t reference standard test conditions te s t duration failure criteria # units failed/tested resistance to soldering heat j e it a ed- 4701 300 30 2 t sl d =2605c, 10s ec , 1d i p , 2mm from th e base of th e l e n s #1 0/ 50 temperature cycle j e it a ed- 4701 100 10 5 - 40c( 30mi n )~25c( 5mi n )~ 100c( 30m i n )~25c( 5mi n ) 100c y c l e s #1 0/ 50 moisture resistance (cyclic) j e it a ed- 4701 200 20 3 25c~65c~-10c, 90% r h , 24hr per cy cle 10c y c l e s #1 0/ 50 te r m i n a l b e n d strength j e it a ed- 4701 400 40 1 5n , 0~90~0 bend , 2bending c y cl es #1 0/ 50 terminal pull strength j e it a ed- 4701 400 40 1 10n , 101s ec #1 0/ 50 high temperature storage j e it a ed- 4701 200 20 1 t a =100c 1000hours #1 0/ 50 temperature humidity storage j e it a ed- 4701 100 10 3 t a =60c, r h =90% 1000hours #1 0/ 50 low temperature storage j e it a ed- 4701 200 20 2 t a =- 40c 1000hours #1 0/ 50 room temperature oper ating lif e t a =25 , i f =50m a 1000hours #1 0/ 50 temperature humidity oper ating lif e 60c, r h =90 % , i f =20m a 500hours #1 0/ 50 low temperature operating life t a =- 30c, i f =20m a 1000hours #1 0/ 50 no tes: measuremen ts ar e perf ormed after allowi ng t h e l e d s to re turn to room te mp er at ure. ( 2 ) f a ilu re c r it eria criteria # items conditions failure criteria forward voltage(v f ) i f =20ma >u.s.l.1.1 luminous intensity(i v ) i f =20ma u.s.l.2.0 u . s.l . : up pe r specif ica t ion lim i t l.s . l. : lower spe c if ica t io n limit
n ichia st s-da1- 2773a 13 ca u t ion s (1) lead f o rmi n g when forming lead s, th e leads shou ld be bent at a poin t at lease 3 m m from the ba se of the epoxy b u lb. d o not use the ba se of the leadfr a me as a fulcr u m d u ring lead for m in g. lead formin g shou ld be do ne before sold ering . d o not ap ply an y bending stress to th e b a se of th e lead . the stre ss t o the ba se may damage the led' s char ac te rist i cs or i t may break the l e ds . when moun tin g th e produ c t on to a prin ted cir c u i t board, th e via - ho les on th e board shou ld be exa c tly a l ig ned with th e l e a d pit c h of th e product . if th e led s are moun ted w i th str e ss at th e leads, it caus es d e ter i o r ation of th e e p oxy r esin and this w i ll degr ade th e l e ds. (2) stor age shel f li fe of the prod ucts in unopened bag i s 3 m ont h s (max.) a t <30c and 70% rh fr om th e delivery date. if the she l f l i fe exc eed s 3 mon t hs or more, t h e l e ds ne ed to be stored in a s e al ed co nta i ner with s i l i ca g e l de si cca nt s t o ensur e t h e i r she l f l i fe w i l l n ot exce ed 1 year . when t h e le ad is expo sed t o a corrosive e n vironm en t, th e pla t ed surface ma y tar n ish whic h ma y r e sult in a reduction in the so lder abilit y . t h er e is a portio n of the lead un der th e bo tto m s u rface of th e res i n tha t i s not so lder-p lat e d, th i s s urfac e m a y a l s o t a r n i s h . t o avoid conden sat i on , th e pr oduc ts mu st no t be s t ore d in t h e area s where te mper a t ure a n d hu m i di t y flu c t u at e g r eat l y . do not stor e th e le ds in a dus t y en viron m en t . d o not expo se the leds to di rect s u n l ig ht and/or an e n vironme n t w h er e th e te mp er at ure i s hi gher t h an normal room temp er atur e.
n ichia st s-da1- 2773a 14 (3) di recti o ns for use when de sig n ing a cir c u i t , t h e c u rren t thro ugh ea ch le d mu st no t exc e ed th e abso lu t e maxi mu m r a tin g . oper ating a t a co nstan t cu rrent p e r le d is reco mmen ded. in case of o p er ating at a c onsta nt vo ltag e, c i rcu i t b is r e commende d . if the leds are oper ated w i th con s ta nt voltag e us ing c i r c ui t a, th e curr ent throug h t h e leds may v a ry due to t h e v a riat ion in f orw ard v oltage ch ar acteristics of the leds. (a) ... (b) .. . this product sho u l d b e oper ated using forw ard curre n t . ensu re t h at th e produc t i s no t subj ec ted to either forw a r d or reverse voltag e wh il e i t is no t i n us e. i n parti c u l ar , su bject i ng it to c o nti nuou s reve rse volt age may cause migr a t io n , wh i c h may cau s e damage to t h e led d i e . when used i n d i sp la ys tha t are no t used for a l o ng tim e , the m a i n po wer supp l y sho u l d be switched off for safet y . it is recom m en ded to ope r ate the le ds at a current gr eater t h an 10% of the sorting current to stabilize the le d char acter i stic s. care mu st b e taken to en s u re th at t h e re verse vol t age wil l no t exce ed the ab sol u t e maxi mu m r a t i ng when us ing the l ed s wi th matr ix drive . ens u re t h at exces s ive volta g es s u c h as l i g h tn ing surge s are not app l i e d to th e le ds . aging is recommend e d for dete ct ing man u fact uri n g and asse mb ly defe cts . in par t i c u l ar , en sure tha t exces s ive curr ent and/or v o lta g e is not app l ied to the le ds. this ag ing sh ould be condu c ted i n en v i ron m en ts w h er e w a ter cond en s a tion d o e s n o t o c c u r . th is product can be used in both indoor a n d outdoor applicati o ns; however , w h en the le ds are us ed in t h e fo llow i ng environm en t s, incorpor ate suffi ci en t m e as ures in to th e di splay to pr even t debr is , wat e r/mo is ture a n d gases that will adversel y affect the product. - w h e r e w a t e r v a p o r i s a b u n d a n t - w h e r e w a t e r c o n d e n s a t i o n i s l i k e l y t o o c c u r - w h e r e w a t e r i s l i k e l y t o s p l a s h o n t o t h e l e d s - w h e r e f r o s t i s l i k e l y t o f o r m o n the surfac e of the l e d s ( e .g . freezer , i c e skatin g rink , e t c. ) - w h e r e d u s t , d i r t , d e b r i s , l o o s e m e t a l l i c m a t e rials an d/or gases that w i ll adve rse l y affec t t h e produc t are presen t w h en t h i s p r o d uct is us ed f o r display s t h at wi ll b e i n s t al led o u ts ide , t h e lead s o f th e led s sho u ld b e cover ed w i t h si li co ne r esi n to a v oi d exposure to outd oor en vi ronm e n ts . if t h e s i l i c one res i n is ap pli e d to t h e lea d s un ti l i t rea c hes the le d le ns, except not high enoug h to caus e an adve rse effe ct on th e opti ca l char a c ter i s t i c s , t h e led le ns w i l l a b sorb le ss moi s tur e . cho o s e a si l i co n e r es i n tha t is suf f ic ien t t o pr event wa te r / mo is tur e p en etr at io n and sa lt da mage . r e du ci ng di r e ct sun l igh t w i l l be ab le to e x tend th e l i f e ( e x a mp le : us in g a lo uver ) . in ar eas w h er e h y dr o g e n s ulf id e, w hi c h is a sulf ide - bas e d gas, is pr e s e nt ( e .g . ho t sp r i ngs a nd vo lca nic ar eas ) , and where s a lt is ab undan t (e.g . coa s ta l a r eas) , t h e life may be s h orte ned. when power i s applied for t h e f i rst ti me a f t e r install a ti on, t h e dis p l a y shoul d not be p o wered at 100% w a t t a g e si nce the l e d s m a y ha v e a b sorbed m o isture. before nor m al us e of th is disp lay , op er at e t h e d i sp lay a t approxima t e l y 20% w a tt a ge f o r an init ial ti me per i o d . if the d i sp lay uni ts w i l l be rent ed, thos e uni ts shou ld be sel e c t ed caref u l l y to en sur e t h at t h e d i sp lay as a whol e will appear the sam e co lo r and br igh t n e s s . if the d i sp lay uni ts are loa d ed onto a n d/ or tr ansport e d by ship , th e da mp en v i ronm e n t on t h e ve ss el w i l l ca use co nden sat i on ; the disp lay units should be packaged to p r event mois t u r e absorpt i on . if a disp lay tha t has b een , o r is be ing , us ed is r e lo cat e d , it is po ss ibl e t hat degr ada t io n o f the l e d h a s o c c ur r e d. w h en tr ansp orting th is d i s p lay , provide s u ffic i e n t prot ec ti on for t h e l e ds in add i t i on to th e mo is tur e -proof packag ing for t h e di s p la y . wh e n th is di s p l a y is re in st alle d, e n s u r e t o f o llo w t h e i n s t al lat i o n in str u ct io ns f o r en v i r o nme n t s and u s e. (4) handl i n g precau ti ons do not hand le t h e l e ds wi t h bare hand s a s it w i ll contam ina t e t h e l ed s u rface and may affect t h e op ti cal char ac ter i st ic s: it mig h t cau s e t h e le d to be deform ed a n d/or t h e w i re to break, w h i c h will c a us e t h e le d not to il l u m i na te . the lead co uld a l so ca us e an inj u ry . dropping th e produc t ma y cause damage. do not sta c k asse mb led p c bs tog e t h er . f a il ure to comp l y can cau s e th e res i n port io n of the produ c t to be cut, ch ip ped, delaminated and/or defor m ed . it ma y cause w i re to break, l e ad ing to catas t roph ic f a il ures .
n i chia st s-da1- 2773a 15 (5) desi gn consi d er ati o n pcb warpag e after moun ti ng th e produc t s on to a pc b c a n cau s e the p a ckage to br ea k. the led s h ould be p l ac ed in a w a y to m i ni mize t h e s t re ss on the l e d s due to pc b bo w and twis t. the positi o n and ori e nta t i o n of the leds affect how much m e cha n i c al stre ss i s exerte d on the led s plac ed near th e score l i n e s . the led s h ould be p l ac ed in a w a y to mi ni mize t h e s t re ss on the l e d s due to board f l ex ing. board separ a tion mu st b e performed us in g spec ia l j i g s , no t u s in g hand s. (6) t h ermal manageme nt proper th er mal manage m e nt is a n i m po r t an t when designing prod uc ts with le ds . le d di e t e mp er at ure i s affec t ed by pcb ther mal r e sistan ce and le d spa c ing on th e boar d. pl eas e de sig n produc ts in a w a y that t h e l ed d i e t e mperature does not exceed th e max i mu m j unc t i on t e mper a t ure ( t j ). drive curre nt s h oul d be d e ter m ined for t h e s u rround ing ambi en t te mp er ature (t a ) to dis s ipa t e the h e at from the pr oduct . (7) cl eani ng the leds shoul d no t be cl eaned w i th w a ter , benz i n e, a n d / or thi n ner . if r e quir ed, iso p r o py l a l co h o l (ip a ) s ho ul d be use d . ot he r solven ts may caus e pre m at ure fai l ure to t h e le ds due to the d a mage to th e r e si n port ion . t h e effe ct s o f s u ch so lve n t s s h o u ld b e ver i f i ed pr io r to u se . in additio n , the use of c f c s su ch as freo n is heavi l y re gula ted . when du st and/or dir t adh e res to th e le ds , soak a cloth with isoprop y l alco hol (ip a ), then squeeze i t b e fore wiping the led s . ul tr ason ic cl eani ng is no t recom m e nde d s i nc e i t ma y have adverse eff e ct s on t h e l e ds depending on the ultr ason ic power a n d h o w led is assembled. if ultr asoni c clea ni ng mu s t be use d , t h e c u sto m er is adv i se d to mak e sure th e le ds w i ll not b e da ma ged prior to cleaning . (8) ey e saf e t y in 2006, t h e interna t i o nal el ec t r i c a l comm is si on (iec ) publi s hed iec 62471: 200 6 phot obi o l o gic a l s a fet y of l a m p s and lamp sy stem s, wh ic h a dded le ds in it s scop e . on t h e ot her hand, t h e iec 60825- 1: 20 07 l a s e r s a f e t y s t andard r e mo v e d leds from it s sc ope. however , pl ease b e advi se d that some co untr i es and regions ha v e ado p ted stand a rds bas e d on t h e iec l a s e r safet y s t a n dard iec 60825- 1: 20 112001, whi c h s t ill i n cl udes leds i n i t s sc op e. most of n i chi a 's leds ca n be cl a s si fied as bel o ng ing in to either the ex empt group or risk group 1. high-power led s , tha t e m i t l i gh t con t ai ni ng blu e wavel e ngth s, may be cla s s i fi ed as ri sk group 2 . please pro c eed wi th cau t io n whe n view in g direc t ly an y leds dri v en at hi gh current, o r vi ewing led s with opt i ca l inst ru me nt s w h ic h may great l y in crea se t h e damage s to your eyes . view ing a f l ashi ng l i gh t m a y caus e eye d i s c omfort . w h e n in co r p o r ati n g the l e d in to yo ur pr o d uct , please be careful to a v oid adverse eff e c t s on the hu man body caus ed by ligh t s t i m u l a t ion. (9) ot hers the led s d e scr ibed in th is brochure ar e i n te nded to be used for ordi na ry elec tron ic e q uip m e n t (su c h as offic e eq ui pme n t , commun i cat i ons equ i pm en t, mea s ure m e n t in str ume n t s and hous eho l d applia nc es ). co nsult n i c hia' s sal e s staf f in adv a n c e f o r inf o r m a t io n o n th e appl ica t i o ns i n wh ich e x cept io na l qua l it y and r eliab i l i t y ar e r eq u ir ed , par t icu l ar ly when the f a il ur e o r malf u n c t io n o f the le ds m a y dir ec t ly j eo p ar dize lif e o r health (s uc h as for airpl a n e s, a e rospa c e , sub m ers i b l e re peat ers, nuc le ar reactor co ntrol system , a u tom o bil e s, tr affic contr o l equ i p m en t, l i fe s u pport sy s t e m s and safe ty devic e s ) . the c u s t om er sha ll not reverse eng i ne er by disas s e m bl i n g or analys i s of the le ds wi t h out ha v i ng pr i o r writt e n co ns ent f r o m nich ia . w h en def e c t iv e le ds ar e f o u n d, t h e c u s t o m er sha ll inf o r m ni ch ia dir e c t ly bef o r e di sas s e m bl ing o r ana l y s is . the sp ecification s and app e ar ance of th i s product may c h ange w i t h ou t noti ce ; nich ia doe s not guar an te e the cont en ts of thi s sp ec ifi c at i o n. bo th t h e c u sto m er a n d n i ch ia will agr e e o n th e o f f i c i al s p ec if ic at io ns o f suppl ie d pr o d uct s bef o r e th e vo lum e pr o d u c t i o n o f a pr o g r a m begi ns .
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