july 2010 doc id 5603 rev 7 1/9 9 smp30 trisil? for telecom equipment protection features bidirectional crowbar protection voltage range from 62 v to 270 v low capacitance from 10 pf to 20 pf typ.@ 50 v low leakage current: i r = 2 a max. holding current: i h = 150 ma min. repetitive peak pulse current: i pp = 30 a (10/1000 s) benefits trisils are not subject to ageing and provide a fail safe mode in short circuit for a better protection. this device can be used to help equipment meet various standards such as ul1950, iec950 / csa c22.2, ul1459 and fcc part 68. trisils have ul94 v0 approved resin. sma package is jedec registered (do-214ac). trisils are ul497b approved (file: e136224). applications telecommunication equipment such as: analog and digital line cards (xdsl, t1/e1, isdn...). terminals (phone, fax, modem...) and central office equipment. tm : trisil is a trademark of stmicroelectronics. figure 1. device configuration description the smp30 series has been designed to protect telecommunication equipment against lightning and transient induced by ac power lines. the package / die size ratio has been optimized by using the sma package. sma (jedec do-214ac) www.st.com
characteristics smp30 2/9 doc id 5603 rev 7 1 characteristics table 1. compliant with the following standards standard peak surge voltage (v) waveform voltage required peak current (a) current waveform minimum serial resistor to meet standard ( ) gr-1089 core first level 2500 1000 2/10 s 10/1000 s 500 100 2/10 s 10/1000 s 20 24 gr-1089 core second level 5000 2/10 s 500 2/10 s 40 gr-1089 core intra-building 1500 2/10 s 100 2/10 s 0 itu-t-k20/k21 6000 1500 10/700 s 150 37.5 5/310 s 110 0 itu-t-k20 (iec61000-4-2) 8000 15000 1/60 ns esd contact discharge esd air discharge 0 0 vde0433 4000 2000 10/700 s 100 50 5/310 s 60 10 vde0878 4000 2000 1.2/50 s 100 50 1/20 s 18 0 iec61000-4-5 4000 4000 10/700 s 1.2/50 s 100 100 5/310 s 8/20 s 60 18 fcc part 68, lightning surge type a 1500 800 10/160 s 10/560 s 200 100 10/160 s 10/560 s 26 15 fcc part 68, lightning surge type b 1000 9/720 s 25 5/320 s 0
smp30 characteristics doc id 5603 rev 7 3/9 table 2. absolute ratings (t amb = 25 c) symbol parameter value unit i pp repetitive peak pulse current 10/1000 s 8/20 s 10/560 s 5/310 s 10/160 s 1/20 s 2/10 s 30 70 35 40 45 70 100 a i fs fail-safe mode : maximum current (1) 8/20 s 2.5 ka i tsm non repetitive surge peak on -state current (sinusoidal) t = 0.2 s t = 1 s t = 2 s t = 15 mn 14 10.5 9 3 a i2t i2t value for using t = 16.6 ms t = 20 ms 5.7 4.9 a2s t stg storage temperature range -55 to + 150 c t j maximum junction temperature 150 c t l maximum lead temperature for soldering during 10 s. 260 c 1. in fail safe mode, the device acts as a short circuit. table 3. thermal resistances symbol parameter value unit r th(j-a) junction to ambient (with recommended footprint) 120 c/w r th(j-l) junction to leads 30 c/w table 4. electrical characteristics - definitions (t amb = 25 c) symbol parameter v rm stand-off voltage v br breakdown voltage v bo breakover voltage i rm leakage current i pp peak pulse current i bo breakover current i h holding current v r continuous reverse voltage i r leakage current at v r c capacitance
characteristics smp30 4/9 doc id 5603 rev 7 table 5. electrical characteristics - values (t amb = 25 c) types i rm @ v rm i r (1) @ v r dynamic v bo static v bo @ i bo i h c (2) c (3) max. max. max. max. max. min. typ. typ. a v a v v v ma ma pf pf smp30-62 2 56 5 62 85 82 800 150 20 40 SMP30-68 61 68 93 90 20 40 smp30-100 90 100 135 133 16 35 smp30-120 108 120 160 160 16 30 smp30-130 117 130 173 173 14 30 smp30-180 162 180 235 240 12 25 smp30-200 180 200 262 267 12 25 smp30-220 198 220 285 293 10 20 smp30-240 216 240 300 320 10 20 smp30-270 243 270 350 360 10 20 1. i r measured at v r guarantee v br min v r 2. v r = 50 v bias, v rms = 1 v, f = 1 mhz 3. v r = 2 v bias, v rms = 1 v, f = 1 mhz figure 2. pulse waveform figure 3. non repetitive surge peak on-state current versus overload duration 10 0 50 %i pp t t r p 0 t repetitive peak pulse current t r = rise time (s) t p = pulse duration time (s) 1e-2 1e-1 1e+0 1e+1 1e+2 1e+3 0 10 5 15 20 25 f=50hz t(s) i (a) tsm
smp30 characteristics doc id 5603 rev 7 5/9 figure 4. on-state voltage versus on-state current (typical values) figure 5. relative variation of holding current versus junction temperature 012345678910 1 2 5 10 20 50 v (v) t i (a) t tj=25c -40 -20 0 20 40 60 80 100 120 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 t (c) j i [t ] / i [t =25c] hj hj figure 6. relative variation of breakover voltage versus junction temperature figure 7. relative variation of leakage current versus reverse voltage applied (typical values) -40 -20 0 20 40 60 80 100 0.90 0.95 1.00 1.05 1.10 62 v 270 v v [t ] / v [t =25c] bo j bo j t (c) j 25 50 75 100 125 1 10 100 1000 2000 i [t ] / i [t =25c] rm j rm j v=v rrm t (c) j figure 8. variation of thermal impedance junction to ambient versus pulse duration figure 9. relative variation of junction capacitance versus reverse voltage applied (typical values) 1e-3 1e-2 1e-1 1e+0 1e+1 1e+2 5e+2 1e-1 1e+0 1e+1 1e+2 z (c/w) th(j-a) t (s) p printed circuit board fr4, copper thickness = 35 m, recommended pad layout 1 2 5 10 20 50 100 300 0.0 0.5 1.0 1.5 2.0 2.5 v (v) r c[v ] / c[v =50v] rr tj=25c f=1mhz vrms=1v
ordering information scheme smp30 6/9 doc id 5603 rev 7 2 ordering information scheme figure 10. ordering information scheme smp 30 - xxx trisil surface mount repetitive peak pulse current voltage 30 = 30 a 100 = 100 v
smp30 package mechanical data doc id 5603 rev 7 7/9 3 package mechanical data epoxy meets ul94, v0 lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 11. footprint (dimensions in mm) table 6. sma dimensions ref. dimensions millimeters inches min. max. min. max. a1 1.90 2.45 0.075 0.094 a2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.006 0.016 d 2.25 2.90 0.089 0.114 e 4.80 5.35 0.189 0.211 e1 3.95 4.60 0.156 0.181 l 0.75 1.50 0.030 0.059 e c l e1 d a1 a2 b 2.63 (0.103) 5.43 (0.214) 1.4 1.64 (0.064) 1.4 (0.055) (0.055)
ordering information smp30 8/9 doc id 5603 rev 7 4 ordering information 5 revision history table 7. ordering information order code marking package we ight base qty delivery mode smp30-62 qaa sma 0.06 g 5000 tape and reel SMP30-68 qab smp30-100 qac smp30-120 qad smp30-130 qae smp30-180 qaf smp30-200 qag smp30-220 qah smp30-240 qai smp30-270 qaj table 8. document revision history date revision changes november-2002 4b last update. 10-nov-2004 5 sma package dimensions update. reference a1 max. changed from 2.70mm (0.106 inch) to 2.03mm (0.080 inch). 13-dec-2004 6 figure 7 text legend corrected from ?... reverse voltage applied? to ?... junction capacitance?. 01-jul-2010 7 added ecopack statement. updated trademark statement. removed secti on on test circuits.
smp30 doc id 5603 rev 7 9/9 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2010 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com
|
