- patented trench mos barrier schottky technology - excellent high temperature stability - low forward voltage - lower power loss/ high efficiency - high forward surge capability - ideal for automated placement - halogen-free according to iec 61249-2-21 definition symbol unit v rrm v i f(av) a i f = 5a i f = 7.5a i f = 15a i f = 5a i f = 7.5a i f = 15a t j = 25c ua t j = 125c ma v dc v r jc o c/w t j o c t stg o c document number ds_d1309033 version:a13 -0.40 - -0.31 - 0.48 0.56 - marking code 15u50 maximum instantaneous forward voltage per diode (note 1) t j = 25c min typ max v f - t j = 125c storage temperature range - 40 to + 150 note1 : pulse test with pulse width=300 s, 1% duty cycle maximum dc reverse voltage 35 typical thermal resistance per diode 11 operating temperature range - 40 to + 150 maximum instantaneous reverse current per diode at rated reverse voltage i r - 140 2000 - 60 140 - a -0.37 - 0.44 0.50 v -0.26 50 maximum average forward rectified current 15 peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load per diode i fsm 200 maximum repetitive peak reverse voltage case to-277a(smpc) maximum ratings and electrical characteristics(t a =25 o c unless otherwise noted) param eter TSP15U50S molding compound, ul flammability classification rating 94v-0 base p/n with suffix "g" on packing code - halogen-free, rohs compliant terminal matte tin plated leads, solderable per jesd22-b102 meet jesd 201 class 1a whisker test polarity indicated by cathode band weight 0.095 gram (approximately) trench mos barrier schottky rectifier TSP15U50S taiwan semiconductor features mechanical data - moisture sensitivity level : level 1, per j-std-020 - compliant to rohs directive 2011/65/eu and in accordance to weee 2002/96/ec to-277a(smpc)
part no. note : for smpc: packing code (whole series with green compound) part no. TSP15U50S (t a =25 o c unless otherwise noted) document number ds_d1309033 version:a13 packing code ordering information green compound preferred p/n packing code green compound code description packing TSP15U50S s1 suffix "g" green compound code TSP15U50S taiwan semiconductor package smpc 1500/ 7" plastic reel example ratings and chatacteristics curves 6000/ 13" plastic reel TSP15U50S s1g s1 g s2 smpc 0.0001 0.001 0.01 0.1 1 10 100 10 20 30 40 50 60 70 80 90 100 t j =25 o c t j =100 o c t j =125 o c 100 1000 10000 0.1 1 10 100 f=1.0mhz v sig =50mv p-p 0.01 0.1 1 10 100 0 0.2 0.4 0.6 0.8 t j =25 o c t j =125 o c t j =150 o c t j =100 o c fig. 2 typical forward characteristics 0 5 10 15 20 0 25 50 75 100 125 150 with heatsink 30mm x 30mm 4 oz. pad pcb fig.1 forward current derating curve average forward current (a) instantaneous forward current (a) capacitance (pf) instantaneous reverse current (ma) fig. 4 typical junction capacitance fig. 3 typical reverse characteristics case temperature ( o c) forward voltage (v) reverse voltage (v) percent of rated peak reverse voltage.(%)
min max min max a 5.650 5.750 0.222 0.226 b 6.350 6.650 0.250 0.262 c 4.550 4.650 0.179 0.183 d 3.540 3.840 0.139 0.151 e 4.235 4.535 0.167 0.179 f 1.850 2.150 0.073 0.085 g 3.170 3.470 0.125 0.137 h 1.043 1.343 0.041 0.053 i 1.000 1.300 0.039 0.051 j 1.930 2.230 0.076 0.088 k 0.175 0.325 0.007 0.013 l 1.000 1.200 0.039 0.047 symbol a b c d e f p/n = marking code yw = date code f = factory code document number ds_d1309033 version:a13 4.72 1.4 1.27 6.8 1.04 TSP15U50S taiwan semiconductor package outline dimensions suggested pad layout marking diagram dim. unit(mm) unit(inch) unit(mm) 4.8
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