View BK32164L121-T_7777958.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

notice_e-01 notice for taiyo yuden products y please read this notice before using the taiyo yuden products. reminders product information in this catalog is as of october 2010. all of the contents speci?ed herein are subject to change with out notice due to technical improvements, etc. therefore, please check for the latest information carefully be - fore p r actical application or usage of the products. pl e ase note that taiyo yuden co., ltd. shall not be responsible for any defects in products or equipment incorpo - rat i ng such products, which are caused under the conditions other than those speci?ed in this catalog or individual spe c i?cation. please contact taiyo yuden co., ltd. for further details of product speci?cations as the individual speci?cation is ava i lable. please conduct validation and veri?cation of products in actual condition of mounting and operating environment befo r e commercial shipment of the equipment. a l l electronic components or functional modules listed in this catalog are developed, designed and intended for use i n general electronics equipment.(for av, office automation, household, office supply, information service, tel e communications, (s u ch as mobile phone or pc) etc.). before incorporating the components or devices into any equipment in the ?eld such as transportation,( automotive control, train control, ship control), transportation signal, dis a ster prevention, medical, public information network (telephone exchange, base station) etc. which may have dir e ct in?uence to harm or injure a human body, please contact taiyo yuden co., ltd. for more detail in advance. do n ot incorporate the products into any equipment in ?elds such as aerospace, aviation, nuclear control, subma - rin e s ystem, military, etc. where higher safety and reliability are especially required. in a ddition, even electronic components or functional modules that are used for the general electronic equipment, if t h e equipment or the electric circuit require high safety or reliability function or performances, a suf?cient reliabil - ity e valuation check for safety shall be performed before commercial shipment and moreover, due consideration to ins t all a protective circuit is strongly recommended at customer's design stage. t h e contents of this catalog are applicable to the products which are purchased from our sales of?ces or distribu - tor s ( so called ? tai y o yuden ? s of?cial sales channel ? ). it is only applicable to the products purchased from any of taiyo yuden ? s of? c ial sales channel. please note that taiyo yuden co., ltd. shall have no responsibility for any controversies or disputes that may oc - cur i n connection with a third party's intellectual property rights and other related rights arising from your usage of pro d ucts in this catalog. taiyo yuden co., ltd. grants no license for such rights. c a ution for export ce r tain items in this catalog may require speci?c procedures for export according to ? for e ign exchange and for - eign trade control law ? of j apan, ? u.s. export administration regulations ? , and other applicable regulations. should you have any question or inquiry on this matter, please contact our sales staff.
100 mlci09_e-01 features ordering code external dimensions/standard quantity available materials applications this catalog contains the typical speci?cation only due to the limitation of space. when you consider the purchase of our products, please check our speci?cation. for details of each product (characteristics graph, reliability information, precautions for use, and so on), see our web site (http://www.ty-top.com/) or cd catalogs. ? internal code standard products blank space ? external dimension l w mm 20 1 0 0804 2. 0 1 .0 3216 1206 3. 2 1 .6 ? nominal impedance ? example 601 600 102 1000 ? type bk multilayer ferrite chip beads b k 3 2 1 6 4 s 6 0 1 t ? ? ? ? ? ? ? packaging t tape & reel ? material 4w refer to impedance curv es for material dif f erence 4s 4m 4l type material l w t e1 e2 p standard quantity pcs pa p er tape embossed tap e b k2010 0804 4w, 4s, 4m, 4l 2.0 0 . 15 1.0 0.15 0.45 0.05 0.25 0.15 ` 0.1 0.25 0.15 0.5 0.1 4000 ` 0.079 0.006 0.039 0.006 0.018 0.002 0.010 0.006 ` 0.004 0.010 0.006 0.020 0.004 bk3216 1206 4w, 4s, 4m, 4l 3 .2 0 . 2 1.6 0.2 0.8 0.1 0.35 0.2 0.3 0.2 0.8 0.1 ` 4000 0.126 0.008 0.063 0.008 0.031 0.004 0.014 0.008 0.012 0.008 0.031 0.004 unit mm inch 1 4w241 2 4w121 3 4w680 500 250 0 1 2 3 4w type 5 5 2000 1000 0 4s type 1 4s601 2 4s431 3 4s241 4 4s121 1 2 3 4 2000 1000 0 4s type 1 4s102 2 4s601 3 4s471 4 4s301 5 4s241 6 4s121 7 4s600 7 1 2 3 4 5 6 bk2010 bk3216 ? available in a wide range of frequency characteristics and impedance val u es providing excellent suppression of various noise. ? 4 li ne action in one chip is available for mounting with higher density and e f ?ciency. ? hea t generation and crosstalk b e tween adjacent circuits are minimized. ? radiated noise suppression in note-pc, lcd module and other por - tab l e equipment. ? radi ated noise suppression in interfaces and harness connecting part s. multilayer ferrite chip bead array ( bk array series ) reflow operating temp. ? 55 125
ferrite products 101 mlci09_e-01 part numbers this catalog contains the typical speci?cation only due to the limitation of space. when you consider the purchase of our products, please check our speci?cation. for details of each product (characteristics graph, reliability information, precautions for use, and so on), see our web site (http://www.ty-top.com/) or cd catalogs. ordering code ehs environmental hazardous substances impedance ? 25 me a suring frequency mh z d c resistance ? max. ra t ed current ma m ax. bk 2 010 4w680 rohs 68 100 0.35 100 bk2010 4w121 rohs 120 0.40 bk2010 4w241 rohs 240 0.50 bk2010 4s121 rohs 120 0.30 bk2010 4s241 rohs 240 0.45 bk2010 4s431 rohs 430 0.55 bk2010 4s601 rohs 600 0.70 bk2010 4m121 rohs 120 0.30 bk2010 4m241 rohs 240 0.45 bk2010 4m431 rohs 430 0.55 bk2010 4m601 rohs 600 0.70 bk2010 4m102 rohs 1000 0.80 bk2010 4l050 rohs 5 0.10 bk2010 4l100 rohs 10 0.15 bk2010 4l220 rohs 22 0.20 bk2010 4l330 rohs 33 0.30 bk2010 4l470 rohs 47 0.40 bk2010 4l680 rohs 68 0.50 bk2010 4l121 rohs 120 0.70 bk2010 4l181 rohs 180 0.90 bk2010 bk3216 ordering code ehs environmental hazardous substances impedance ? 25 me a suring frequency mh z d c resistance ? max. ra t ed current ma m ax. bk 3 216 4w121 rohs 120 100 0.15 100 bk3216 4w241 rohs 240 0.25 100 bk3216 4w431 rohs 430 0.35 100 bk3216 4w601 rohs 600 0.40 100 bk3216 4s600 rohs 60 0.18 200 bk3216 4s121 rohs 120 0.18 200 bk3216 4s241 rohs 240 0.30 200 bk3216 4s301 rohs 300 0.40 200 bk3216 4s471 rohs 470 0.40 200 bk3216 4s601 rohs 600 0.45 200 bk3216 4s102 rohs 1000 0.68 100 bk3216 4m121 rohs 120 0.20 150 bk3216 4m241 rohs 240 0.35 150 bk3216 4m301 rohs 300 0.45 150 bk3216 4m471 rohs 470 0.50 150 bk3216 4m601 rohs 600 0.60 100 bk3216 4m102 rohs 1000 0.80 100 bk3216 4l680 rohs 68 0.35 200 bk3216 4l121 rohs 120 0.55 200 bk3216 4l181 rohs 180 0.65 150 bk3216 4l241 rohs 240 0.75 150
102 mlci09_e-01 electrical characteristics this catalog contains the typical speci?cation only due to the limitation of space. when you consider the purchase of our products, please check our speci?cation. for details of each product (characteristics graph, reliability information, precautions for use, and so on), see our web site (http://www.ty-top.com/) or cd catalogs. 250 500 bk2010 4w241 bk2010 4w680 bk2010 4w121 500 400 300 200 100 bk2010 4s121 500 400 300 200 100 bk2010 4s241 250 500 bk2010 4m121 1000 800 600 400 200 bk2010 4s601 1000 2000 bk2010 4m102 bk2010 4l050 50 11 0 100 1000 10000 100 bk2010 4m601 1000 2000 bk2010 4m241 bk2010 4l100 50 11 0 100 1000 10000 100 1000 800 600 400 200 bk2010 4s431 bk2010 4m431 bk2010 4l220 100 11 0 100 1000 10000 200 bk2010 bk2010 4l330 250 11 0 100 1000 10000 500 bk2010 4l470 250 11 0 100 1000 10000 500
ferrite products 103 mlci09_e-01 electrical characteristics this catalog contains the typical speci?cation only due to the limitation of space. when you consider the purchase of our products, please check our speci?cation. for details of each product (characteristics graph, reliability information, precautions for use, and so on), see our web site (http://www.ty-top.com/) or cd catalogs. bk3216
mlci0109_reli-prp1 mlci0109_reli_e-01 packaging this catalog contains the typical speci?cation only due to the limitation of space. when you consider the purchase of our products, please check our speci?cation. for details of each product (characteristics graph, reliability information, precautions for use, and so on), see our web site (http://www.ty-top.com/) or cd catalogs. ? tape & reel packaging minimum quan tity taping material ? paper tape (0.315 inches wide) taping dimensions unit : mm inch to next page type thickness mm inch st a ndard quantity pcs p a per tape emb o ssed tape ck16 08 0603 0. 8 4 000 ` 0.031 ck2125 0805 0. 8 5 4000 ` 0.033 1.25 ` 2000 0.049 cks2125 080 5 0 .85 4000 ` 0.033 1.25 ` 2000 0.049 ckp2012 080 5 0 .9 ` 3000 0.035 ckp2016 080 6 0 .9 ` 3000 0.035 ckp2520 100 8 0 .7 ` 3000 0.028 0.9 ` 3000 0.035 1.1 ` 2000 0.043 nm2012 0805 0.9 ` 3000 0.035 nm2520 1008 1.1 ` 2000 0.043 lk1005 0402 0. 5 1 0000 ` 0.020 lk1608 0603 0. 8 4 000 ` 0.031 lk2125 0805 0. 8 5 4000 ` 0.033 1.25 ` 2000 0.049 hk0603 0201 0. 3 1 5000 ` 0.012 hk1005 0402 0. 5 1 0000 ` 0.020 hk1608 0603 0. 8 4 000 ` 0.031 hk2125 0805 0. 8 5 ` 4000 0.033 1.0 ` 3000 0.039 hkq0603s 020 1 0 .3 15000 ` 0.012 aq105 0402 0. 5 1 0000 ` 0.020 bk0402 01005 0.2 20000 ` 0.008 bk0603 0201 0. 3 1 5000 ` 0.012 bk1005 0402 0. 5 1 0000 ` 0.020 bk1608 0603 0. 8 4 000 ` 0.031 bk2125 0805 0. 8 5 4000 ` 0.033 1.25 ` 2000 0.049 bk2010 0804 0. 4 5 4000 ` 0.018 bk3216 1206 0. 8 ` 4 000 0.031 bkp0603 020 1 0 .3 15000 ` 0.012 bkp1005 040 2 0 .5 10000 ` 0.020 bkp1608 060 3 0 .8 4000 ` 0.031 bkp2125 080 5 0 .85 4000 ` 0.033 c k 16 0 8 c k 212 5 c k s 212 5 l k 10 0 5 l k 16 0 8 l k 212 5 h k 0 6 0 3 h k 10 0 5 h k 16 0 8 h k q 0 6 0 3 a q 10 5 b k 0 4 0 2 b k 0 6 0 3 b k 10 0 5 b k 16 0 8 b k 212 5 b k 2 010 b k p 0 6 0 3 b k p 10 0 5 b k p 16 0 8 b k p 212 5 c k 212 5 c k s 212 5 c k p 2 012 c k p 2 016 c k p 2 5 2 0 n m 2 012 n m 2 5 2 0 l k 212 5 h k 212 5 b k 212 5 b k 3 216 type thickness mm inch chip cavity insertion pit c h tape thickness a b f t ck1608 0603 0. 8 0.031 1.0 0.2 0.039 0.008 1.8 0.2 0.071 0.008 4.0 0.1 0.157 0.004 1.1 0.043max ck2125 0805 0.85 0.033 1.5 0.2 0.059 0.008 2.3 0.2 0.091 0.008 4.0 0.1 0.157 0.004 1.1 0.043max cks2125 0805 0.85 0.033 1.5 0.2 0.059 0.008 2.3 0.2 0.091 0.008 4.0 0.1 0.157 0.004 1.1 0.043max lk1005 0402 0.5 0.020 0.65 0.1 0.026 0.004 1.15 0.1 0.045 0.004 2.0 0.05 0.079 0.002 0.8 0.031max lk1608 0603 0.8 0.031 1.0 0.2 0.039 0.008 1.8 0.2 0.071 0.008 4.0 0.1 0.157 0.004 1.1 0.043max lk2125 0805 0.85 0.033 1.5 0.2 0.059 0.008 2.3 0.2 0.091 0.008 4.0 0.1 0.157 0.004 1.1 0.043max hk0603 0201 0.3 0.012 0.40 0.06 0.016 0.002 0.70 0.06 0.028 0.002 2.0 0.05 0.079 0.002 0.45 0.018max hk1005 0402 0.5 0.020 0.65 0.1 0.026 0.004 1.15 0.1 0.045 0.004 2.0 0.05 0.079 0.002 0.8 0.031max hk1608 0603 0.8 0.031 1.0 0.2 0.039 0.008 1.8 0.2 0.071 0.008 4.0 0.1 0.157 0.004 1.1 0.043max hkq0603s 0201 0.3 0.012 0.40 0.06 0.016 0.002 0.70 0.06 0.028 0.002 2.0 0.05 0.079 0.002 0.45 0.018max aq105 0402 0.5 0.020 0.75 0.1 0.030 0.004 1.15 0.1 0.045 0.004 2.0 0.05 0.079 0.002 0.8 0.031max bk0402 01005 0.2 0.008 0.25 0.04 0.010 0.002 0.45 0.04 0.018 0.002 2.0 0.05 0.079 0.002 0.36 0. 014max bk0603 0201 0.3 0.012 0.40 0.06 0.016 0.002 0.70 0.06 0.028 0.002 2.0 0.05 0.079 0.002 0.45 0.018max
mlci0109_reli-prp2 mlci0109_reli_e-01 packaging this catalog contains the typical speci?cation only due to the limitation of space. when you consider the purchase of our products, please check our speci?cation. for details of each product (characteristics graph, reliability information, precautions for use, and so on), see our web site (http://www.ty-top.com/) or cd catalogs. unit : mm inch ? embossed tape (0.315 inches wide) leader and blank portion 160mm or more 6.3inches or more direction of tape feed 100mm or more 3.94inches or more 400mm ore more 15.7inches or more reel size 2.0 ? 0.5 0.079 ? 0.031 13.0 ? 0.2 0.512 ? 0.020 top tape strength the top tape requires a peel-off force of 0.1 0.7n in the direction of the arrow as illustrated below. type thickness mm inch chip cavity insertion pit c h tape thickness a b f t bk1005 0402 0. 5 0.020 0.65 0.1 0.026 0.004 1.15 0.1 0.045 0.004 2.0 0.05 0.079 0.002 0.8 0.031max bk1608 0603 0.8 0.031 1.0 0.2 0.039 0.008 1.8 0.2 0.071 0.008 4.0 0.1 0.157 0.004 1.1 0.043max bk2125 0805 0.85 0.033 1.5 0.2 0.059 0.008 2.3 0.2 0.091 0.008 4.0 0.1 0.157 0.004 1.1 0.043max bk2010 0804 0.45 0.018 1.2 0.1 0.047 0.004 2.17 0.1 0.085 0.004 4.0 0.1 0.157 0.004 0.8 0.031max bkp0603 0201 0.3 0.012 0.40 0.06 0.016 0.002 0.70 0.06 0.028 0.002 2.0 0.05 0.079 0.002 0.45 0.018max bkp1005 0402 0.5 0.020 0.65 0.1 0.026 0.004 1.15 0.1 0.045 0.004 2.0 0.05 0.079 0.002 0.8 0.031max bkp1608 0603 0.8 0.031 1.0 0.2 0.039 0.008 1.8 0.2 0.071 0.008 4.0 0.1 0.157 0.004 1.1 0.043max bkp2125 0805 0.85 0.033 1.5 0.2 0.059 0.008 2.3 0.2 0.091 0.008 4.0 0.1 0.157 0.004 1.1 0.043max unit : mm inch type thickness mm inch chip cavity insertion pit c h tape thic kness a b f k t ck2125 0805 1.25 0.049 1.5 0.2 0.059 0.008 2.3 0.2 0.091 0.008 4.0 0.1 0.157 0.004 2.0 0.079 0.3 0.012 cks2125 0805 1.25 0.049 1.5 0.2 0.059 0.008 2.3 0.2 0.091 0.008 4.0 0.1 0.157 0.004 2.0 0.079 0.3 0.012 ckp2012 0805 0.9 0.035 1.55 0.2 0.061 0.008 2.3 0.2 0.091 0.008 4.0 0.1 0.157 0.004 1.3 0.051 0.3 0.012 ckp2016 0806 0.9 0.035 1.8 0.1 0.071 0.004 2.2 0.1 0.087 0.004 4.0 0.1 0.157 0.004 1.3 0.051 0.25 0.01 ckp2520 1008 0.7 0.028 2.3 0.1 0.091 0.004 2.8 0.1 0.110 0.004 4.0 0.1 0.157 0.004 1.4 0.055 0.3 0.012 0.9 0.035 1.4 0.055 1.1 0.043 1.7 0.067 nm2012 0805 0.9 0.035 1.55 0.2 0.061 0.008 2.3 0.2 0.091 0.008 4.0 0.1 0.157 0.004 1.3 0.051 0.3 0.012 nm2520 1008 1.1 0.043 2.3 0.1 0.091 0.004 2.8 0.1 0.110 0.004 4.0 0.1 0.157 0.004 1.7 0.067 0.3 0.012 lk2125 0805 1.25 0.049 1.5 0.2 0.059 0.008 2.3 0.2 0.091 0.008 4.0 0.1 0.157 0.004 2.0 0.079 0.3 0.012 hk2125 0805 0.85 0.033 1.5 0.2 0.059 0.008 2.3 0.2 0.091 0.008 4.0 0.1 0.157 0.004 1.5 0.059 0.3 0.012 1.0 0.039 2.0 0.079 bk2125 0805 1.25 0.049 1.5 0.2 0.059 0.008 2.3 0.2 0.091 0.008 4.0 0.1 0.157 0.004 2.0 0.079 0.3 0.012 bk3216 1206 0.8 0.031 1.9 0.1 0.075 0.004 3.5 0.1 0.138 0.004 4.0 0.1 0.157 0.004 1.4 0.055 0.3 0.012
mlci0109_reli-prp3 mlci0109_reli_e-01 reliability data this catalog contains the typical speci?cation only due to the limitation of space. when you consider the purchase of our products, please check our speci?cation. for details of each product (characteristics graph, reliability information, precautions for use, and so on), see our web site (http://www.ty-top.com/) or cd catalogs. multilayer chip inductors and beads 1. operating temperature range bk0402 55 125 bk0603 bk1005 bk1608 bk2125 array bk2010 bk3216 bkp0603 55 85 bkp1005 bkp1608 bkp2125 ck1608 40 85 ck2125 cks2125 ckp2012 ckp2016 ckp2520 nm2012 nm2520 lk1005 lk1608 lk2125 hk0603 55 125 hk1005 hk1608 40 85 hk2125 hkq0603s 55 125 aq105 2. storage temperature range bk0402 55 125 bk0603 bk1005 bk1608 bk2125 array bk2010 bk3216 bkp0603 55 85 bkp1005 bkp1608 bkp2125 ck1608 40 85 ck2125 cks2125 ckp2012 ckp2016 ckp2520 nm2012 nm2520 lk1005 lk1608 lk2125 hk0603 55 125 hk1005 hk1608 40 85 hk2125 hkq0603s 55 125 aq105
mlci0109_reli-prp4 mlci0109_reli_e-01 reliability data this catalog contains the typical speci?cation only due to the limitation of space. when you consider the purchase of our products, please check our speci?cation. for details of each product (characteristics graph, reliability information, precautions for use, and so on), see our web site (http://www.ty-top.com/) or cd catalogs. multilayer chip inductors and beads 3. rated current bk0402 240 540ma dc bk0 603 100 500ma b k 1005 120 1000ma b k 1608 150 1500ma b k 2125 200 1200ma a r ray bk2010 100ma bk3 2 16 100 200ma b k p0603 1.0a bkp 1 005 800 2000ma dc bk p 1608 1.0 3.0a bkp 2 125 1.5 4.0a ck1 6 08 50 60ma dc ck2 1 25 60 500ma dc ck s 2125 110 280ma dc ck p 2012 0.7 1.2a dc ckp 2 016 0.9 1.6a dc ckp 2 520 1.1 1.8a dc nm2 0 12 0.8 1.5a dc nm2 5 20 0.9 1.1a dc lk1 0 05 20 25ma dc lk1 6 08 1 150ma dc lk2 1 25 5 300ma dc hk0 6 03 60 470ma dc hk 1 005 110 300ma dc hk 1 608 150 300ma dc hk 2 125 300ma dc hkq 0 603s 130 600ma dc aq 1 05 280 710ma dc de?nition of rated current ? in the ck, cks and bk series, the rated current is the value of current at which the temperature of the element is increased within 20 . ? in the b k series p type and ck series p type, nm series the rated current is the value of current at which the temperature of the element is increased within 40 . ? in the l k,hk,hkq,and aq series, the rated current is either the dc value at which the internal l value is decreased within 5% with the application of dc bias, or the value of current at whi ch the temperature of the element is increased within 20 . 4. impedance bk0402 10 120 25% b k0603 10 600 25 % b k1005 10 1800 25 % b k1608 22 2500 25 % b k2125 15 2500 25 % a rray bk2010 5 1000 25 % b k3216 68 1000 25 % b kp0603 22 33 25 % b kp1005 10 220 25 % b kp1608 33 470 25 % b kp2125 33 330 25 % c k1608 ck2125 cks2125 ckp2012 ckp2016 ckp2520 nm2012 nm2520 lk1005 lk1608 lk2125 hk0603 hk1005 hk1608 hk2125 hkq0603s aq105 test methods and remarks bk0 4 02 series mea s uring frequency 100 1 m hz measuring equipment hp4 9 91a or its equivalent measuring jig 161 9 6d or its equivalent bk0603 series, bkp0603 series mea s uring frequency 100 1 m hz measuring equipment hp4 2 91a or its equivalent measuring jig 161 9 3a or its equivalent bk1005 series, bkp1005 series mea s uring frequency 100 1 m hz measuring equipment hp4 2 91a or its equivalent measuring jig 161 9 2a or its equivalent , 16193a or its equivalent bk1608 ? 2125 ser i es, bkp1608 ? 2125 series measuring frequency 100 1 m hz measuring equipment hp4 2 91a or its equivalent , hp4195a or its equivalent measuring jig 160 9 2a or its equivalent or 16192a or its equivalent /hw bk2010 ? 3216 ser i es measuring frequency 100 1 m hz measuring equipment hp4 2 91a or its equivalent , hp4195a or its equivalent measuring jig 161 9 2a or its equivalent
mlci0109_reli-prp5 mlci0109_reli_e-01 reliability data this catalog contains the typical speci?cation only due to the limitation of space. when you consider the purchase of our products, please check our speci?cation. for details of each product (characteristics graph, reliability information, precautions for use, and so on), see our web site (http://www.ty-top.com/) or cd catalogs. multilayer chip inductors and beads 5. inductance bk0402 bk0603 bk1005 bk1608 bk2125 array bk2010 bk3216 bkp0603 bkp1005 bkp1608 bkp2125 ck1608 4.7 10.0 h 20% ck2125 0.1 10.0 h 20% cks2125 1.0 10.0 h 20% ckp2012 0.47 4.7 h 20% ckp2016 0.47 4.7 h 20% ckp2520 0.47 4.7 h 20% nm2012 0.82 1.0 h 20% nm2520 1.0 2.2 h 20% lk1005 0.12 2.2 h 10% q 0. 1 2 2.2 h 30% lk1608 0.047 33.0 h 20% 0. 1 0 12.0 h 10% q 0.12 2.2 h 30% lk2125 0.047 33.0 h 20% 0. 1 0 12.0 h 10% q 0.12 2.2 h 30% hk0603 1.0 6.2nh 0.3nh 6. 8 1 00nh 5% hk1005 1.0 6.2nh 0.3nh 6. 8 2 70nh 5% hk1608 1.0 5.6nh 0.3nh 6. 8 4 70nh 5% hk2125 1.5 5.6nh 0.3nh 6. 8 4 70nh 5% hkq0603s 0.6 6.2nh 0 . 3nh 6.8 22nh 5% aq105 1.0 6.2nh 0.3nh 6. 8 1 5nh 5% test methods and remarks ck se r ies mea s uring frequency 2 to 4m h z ck1608 measuring frequency 2 to 25 m hz ck2125 measuring frequency 2 to 10 m hz cks2125 lk series mea s uring frequency 10 to 2 5 mhz lk1005 measuring frequency 1 to 50 m hz lk1608 measuring frequency 0.4 t o 5 0mhz lk2125 ckp series, nm series mea s uring frequency 1mh z ckp2012, ckp2016, ckp2520, nm2012 ? nm2520 measuring equipment, jig ? hp 4 194a 16085b 16092a or its equivalent ? hp4195a 41951 16092a or it s e quivalent ? hp4294a 16192a or it s e quivalent ? hp4291a 16193a or it s e quivalent /lk1005 ? hp4285a 42841a 42842c 42851 61100 ckp 2 012 ? ckp2016 ? ckp2520 ? nm2012 ? nm2520 measuring current ? 1m a r ms 0.047 to 4.7 h ? 0.1ma rms 5.6 to 33 h hk hkq aq series me a suring frequency 100 m hz hk0603 ? hk1005 ? aq105 measuring frequency 50/ 1 00mhz hk1608 ? hk2125 measuring frequency 500 m hz hkq0603s measuring equipment, jig ? hp 4 291a 16197a or its equivalent /hk0603 ? aq105 ? hp4291a 16193a or it s e quivalent /hk1005 ? e4991a 16197a or it s e quivalent /hkq0603s ? hp4291a 16092 in-house mad e j ig or its equivalent /hk1608 ? hk2125
mlci0109_reli-prp6 mlci0109_reli_e-01 reliability data this catalog contains the typical speci?cation only due to the limitation of space. when you consider the purchase of our products, please check our speci?cation. for details of each product (characteristics graph, reliability information, precautions for use, and so on), see our web site (http://www.ty-top.com/) or cd catalogs. multilayer chip inductors and beads 6. q bk0402 bk0603 bk1005 bk1608 bk2125 array bk2010 bk3216 bkp0603 bkp1005 bkp1608 bkp2125 ck1608 20 min. ck2 1 25 15 20 min. cks 2 125 ckp2012 ckp2016 ckp2520 nm2012 nm2520 lk1005 10 20 min. lk1 6 08 10 35 min. lk2 1 25 15 50 min. hk0 6 03 4 5 min. hk1 0 05 8 min. hk1608 8 12 min. hk2 1 25 10 18 min. hkq 0 603s 10 13 min. aq1 0 5 8 min. test methods and remarks ck se r ies mea s uring frequency 2 to 4m h z ck1608 measuring frequency 2 to 25 m hz ck2125 lk series mea s uring frequency 10 to 2 5 mhz lk1005 measuring frequency 1 to 50 m hz lk1608 measuring frequency 0.4 t o 5 0mhz lk2125 measuring equipment, jig ? hp 4 194a 16085b 16092a or its equivalent ? hp4195a 41951 16092a or it s e quivalent ? hp4294a 16192a or it s e quivalent ? hp4291a 16193a or it s e quivalent /lk1005 measuring current ? 1m a r ms 0.047 to 4.7 h ? 0.1ma rms 5.6 to 33 h hk hkq aq series me a suring frequency 100 m hz hk0603 ? hk1005 ? aq105 measuring frequency 50/ 1 00mhz hk1608 ? hk2125 measuring frequency 500 m hz hkq0603s measuring equipment, jig ? hp 4 291a 16197a or its equivalent /hk0603 ? aq105 ? hp4291a 16193a or it s e quivalent /hk1005 ? e4991a 16197a or it s e quivalent /hkq0603s ? hp4291a 16092a in- h ouse made jig or its equivalent /hk1608 ? hk2125 7. dc resistance bk0402 0.10 0.53 max. b k0603 0.065 1.50 max . b k1005 0.03 0.80 max . b k1608 0.05 1.10 max . b k2125 0.05 0.75 max . a rray bk2010 0.10 0.90 max . b k3216 0.15 0.80 max . b kp0603 0.065 0.070 max . b kp1005 0.030 0.20 max . b kp1608 0.025 0.18 max . b kp2125 0.020 0.075 max . c k1608 0.45 0.85 30% c k 2125 0.16 0.65 m a x. cks2125 0.09 0.40 typ . 0 .12 0.52 max . c kp2012 0.10 0.28 max . c kp2016 0.08 0.20 max . c kp2520 0.05 0.16 max . n m2012 0.10 0.19 max . n m2520 0.13 0.22 max . l k1005 0.41 1.16 max . l k1608 0.2 2.2 max . l k2125 0.1 1.1 max . h k0603 0.11 3.74 max . h k1005 0.08 4.8 max . h k1608 0.05 2.6 max . h k2125 0.10 1.5 max . h kq0603s 0.06 1.29 m a x. aq105 0.07 0.45 max . t est methods and remarks mea s uring equipment voa c -7412 made by iwasaki tsushinki voac-7512 made by iwasaki tsushinki
mlci0109_reli-prp7 mlci0109_reli_e-01 reliability data this catalog contains the typical speci?cation only due to the limitation of space. when you consider the purchase of our products, please check our speci?cation. for details of each product (characteristics graph, reliability information, precautions for use, and so on), see our web site (http://www.ty-top.com/) or cd catalogs. multilayer chip inductors and beads 8. self resonance frequency srf bk0402 bk0603 bk1005 bk1608 bk2125 array bk2010 bk3216 bkp0603 bkp1005 bkp1608 bkp2125 ck1608 17 25mhz min . c k2125 24 235mhz min . c ks2125 ckp2012 ckp2016 ckp2520 nm2012 nm2520 lk1005 40 180mhz min . l k1608 9 260mhz min . l k2125 13 320mhz min . h k0603 900 10000mhz min . h k1005 400 10000mhz min . h k1608 300 10000mhz min . h k2125 200 4000mhz min . h kq0603s 1900 10000mh min . a q105 2300 10000mhz min . t est methods and remarks lk se r ies mea s uring equipment hp4 1 95a or its equivalent measuring jig 419 5 1 16092a or its equivalent hk hkq aq series me a suring equipment hp8 7 19c or its equivalent ? hp8753d or its equivalent /hk2125 9. temperature characteristic bk0402 bk0603 bk1005 bk1608 bk2125 array bk2010 bk3216 bkp0603 bkp1005 bkp1608 bkp2125 ck1608 ck2125 cks2125 ckp2012 ckp2016 ckp2520 nm2012 nm2520 lk1005 lk1608 lk2125 hk0603 inductance cha n ge within 10 hk1005 hk1608 hk2125 hkq0603s aq105 test methods and remarks hk hkq aq series t e m perature range 30 to 85 reference temperature 20
mlci0109_reli-prp8 mlci0109_reli_e-01 reliability data this catalog contains the typical speci?cation only due to the limitation of space. when you consider the purchase of our products, please check our speci?cation. for details of each product (characteristics graph, reliability information, precautions for use, and so on), see our web site (http://www.ty-top.com/) or cd catalogs. multilayer chip inductors and beads 10. resistance to flexure of substrate bk0402 no mechanical damage. bk0603 bk1005 bk1608 bk2125 array bk2010 bk3216 bkp0603 bkp1005 bkp1608 bkp2125 ck1608 ck2125 cks2125 ckp2012 ckp2016 ckp2520 nm2012 nm2520 lk1005 lk1608 lk2125 hk0603 hk1005 hk1608 hk2125 hkq0603s aq105 te st methods and remarks warp 2mm bk series without 0402size, bkp, ck, cks, ckp , nm, lk, hk, hkq, aq series 1mm bk0402 series t esting boar d glass epoxy-resin substrate thickness 0.8mm 11. solderability bk0402 at least 75 of te rminal electrode is covered by new solder. bk0603 bk1005 bk1608 bk2125 array bk2010 bk3216 bkp0603 bkp1005 bkp1608 bkp2125 ck1608 at least 75 of t e rminal electrode is covered by new solder. ck2125 cks2125 ckp2012 ckp2016 ckp2520 nm2012 nm2520 lk1005 lk1608 lk2125 hk0603 hk1005 hk1608 hk2125 hkq0603s aq105 test methods and remarks sol d er temperature 230 5 d u ration 4 1 sec .
mlci0109_reli-prp9 mlci0109_reli_e-01 reliability data this catalog contains the typical speci?cation only due to the limitation of space. when you consider the purchase of our products, please check our speci?cation. for details of each product (characteristics graph, reliability information, precautions for use, and so on), see our web site (http://www.ty-top.com/) or cd catalogs. multilayer chip inductors and beads 12. resistance to soldering bk0402 appearance no sig n i?cant abnormality. impedance cha n ge within 30 bk0603 bk1005 bk1608 bk2125 array bk2010 bk3216 bkp0603 bkp1005 bkp1608 bkp2125 ck1608 no mechanical damage. rem a ining terminal electrode 70 m i n. inductance chan ge r10 4r7 wi t hin 10 6r8 100 wi t hin 15 cks2125 wi t hin 20 ckp2012 ckp 2 016 ckp2520 nm2012 nm2520 within 30 ck2125 cks2125 ckp2012 ckp2016 ckp2520 nm2012 nm2520 lk1005 no mechanical damage. remaining terminal electrode 70 mi n. inductance change within 15 lk1608 no mechanical damage. rem a ining terminal electrode 70 m i n. inductance change 47n 4r7 within 10 5r6 330 within 15 lk2125 hk0603 no mechanical damage. rem a ining terminal electrode 70 m i n. inductance chan ge within 5 hk10 05 hk1608 hk2125 hkq0603s aq105 test methods and remarks sol d er temperature 260 5 d u ration 10 0.5 sec . p reheating temperature 150 t o 1 80 preheating time 3 min . f lux immersion int o m ethanol solution with colophony for 3 to 5 sec. recovery 2 to 3 hr s o f recovery under the standard condition after the test. see note 1 13. thermal shock bk0402 appearance no sig n i?cant abnormality. impedance cha n ge within 30 bk0603 bk1005 bk1608 bk2125 array bk2010 bk3216 bkp0603 bkp1005 bkp1608 bkp2125 ck1608 no mechanical damage. ind u ctance cha n ge within 20 q change within 30 inductance cha n ge within 20 cks2125 ck2125 cks2125 ckp2012 no mechanical damage. inductance change wit h in 30 ckp2016 ckp2520 nm2012 nm2520 lk1005 no mechanical damage. ind u ctance cha n ge within 10 q change within 30 lk1608 lk2125 hk0603 no mechanical damage. ind u ctance cha n ge within 10 q change within 20 hk1005 hk1608 hk2125 hkq0603s aq105 test methods and remarks con d itions for 1 c y cle step 1 minimum operating temperature 0 3 30 3 min. step 2 room temperature 2 to 3 min. st e p 3 maximum operating temperature 3 0 30 3 min. step 4 room temperature 2 to 3 min. nu m ber of cycles 5 rec o very 2 to 3 hr s o f recovery under the standard condition after the test. see note 1 (note 1) when there are questions concerning mesurement result measurement shall be made after 48 2 hrs of recovery under the standard condition.
mlci0109_reli-prp10 mlci0109_reli_e-01 reliability data this catalog contains the typical speci?cation only due to the limitation of space. when you consider the purchase of our products, please check our speci?cation. for details of each product (characteristics graph, reliability information, precautions for use, and so on), see our web site (http://www.ty-top.com/) or cd catalogs. multilayer chip inductors and beads 14. damp heat steady state bk0402 appearance no sig n i?cant abnormality. impedance cha n ge within 30 bk0603 bk1005 bk1608 bk2125 array bk2010 bk3216 bkp0603 bkp1005 bkp1608 bkp2125 ck1608 no mechanical damage. ind u ctance cha n ge within 20 q change within 30 ck2125 cks2125 inductance cha n ge within 20 ckp2012 no mechanical damage. inductance change wit h in 30 ckp2016 ckp2520 nm2012 nm2520 lk1005 no mechanical damage. ind u ctance cha n ge within 10 q change within 30 lk1608 lk2125 no mechanical damage. inductance change wit h in 20 q change within 30 hk0603 no mechanical damage. ind u ctance cha n ge within 10 q change within 20 hk1005 hk1608 hk2125 hkq0603s aq105 test methods and remarks bk se r ies tem p erature 40 2 humidity 90 to 95 r h d uration 500 24 0 hrs recovery 2 to 3 hr s o f recovery under the standard condition after the removal from test chamber. see note 1 lk ck c k s ckp nm hk hkq aq series temperature 40 2 lk c k cks ckp nm series 60 2 hk h k q aq series humidity 90 to 95 r h d uration 500 12 hrs r e covery 2 to 3 hr s o f recovery under the standard condition after the removal from test chamber. see note 1
mlci0109_reli-prp11 mlci0109_reli_e-01 reliability data this catalog contains the typical speci?cation only due to the limitation of space. when you consider the purchase of our products, please check our speci?cation. for details of each product (characteristics graph, reliability information, precautions for use, and so on), see our web site (http://www.ty-top.com/) or cd catalogs. multilayer chip inductors and beads 15. loading under damp heat bk0402 appearance no sig n i?cant abnormality. impedance cha n ge within 30 bk0603 bk1005 bk1608 bk2125 array bk2010 bk3216 bkp0603 bkp1005 bkp1608 bkp2125 ck1608 no mechanical damage. ind u ctance cha n ge within 20 q change within 30 ck2125 cks2125 no mechanical damage. inductance change wit h in 20 ckp2012 no mechanical damage. inductance change wit h in 30 ckp2016 ckp2520 nm2012 nm2520 lk1005 no mechanical damage. inductance change wit h in 10 q change within 30 lk1608 no mechanical damage. ind u ctance cha n ge 0.047 to 12.0 h within 10 15.0 to 33.0 h within 15 q change within 30 lk2125 no mechanical damage. inductance change wit h in 20 q change within 30 hk0603 no mechanical damage. ind u ctance cha n ge within 10 q change within 20 hk1005 hk1608 hk2125 hkq0603s aq105 test methods and remarks bk se r ies tem p erature 40 2 humidity 90 to 95 r h a pplied current rat e d current duration 500 24 0 hrs recovery 2 to 3 hr s o f recovery under the standard condition after the removal from test chamber. see note 1 lk ck c k s ckp nm hk hkq aq series temperature 40 2 lk c k cks ckp nm series 60 2 hk h k q aq series humidity 90 to 95 r h a pplied current rat e d current duration 500 12 hrs r e covery 2 to 3 hr s o f recovery under the standard condition after the removal from test chamber. see note 1 note on standard condition: "standard condition" referred to herein is de?ned as follows: 5 to 35 of te mperature, 45 to 85% relative humidity, and 86 to 106kpa of air pressure. when there are questions concerning measurement results: in ord er to provide correlation data, the test shall be conducted under condition of 20 2 of te mperature, 60 to 70% relative humidity, and 86 to 106kpa of air pressure. unless otherwise speci?ed, all the tests are conducted under the "standard condition." (not e 1) measurement shall be made after 48 2 hrs of r ecovery under the standard condition.
mlci0109_reli-prp12 mlci0109_reli_e-01 reliability data this catalog contains the typical speci?cation only due to the limitation of space. when you consider the purchase of our products, please check our speci?cation. for details of each product (characteristics graph, reliability information, precautions for use, and so on), see our web site (http://www.ty-top.com/) or cd catalogs. multilayer chip inductors and beads 16. loading at high temperature bk0402 appearance no sig n i?cant abnormality impedance cha n ge within 30 bk0603 bk1005 bk1608 bk2125 array bk2010 bk3216 bkp0603 bkp1005 bkp1608 bkp2125 ck1608 no mechanical damage. ind u ctance cha n ge within 20 q change within 30 ck2125 cks2125 no mechanical damage. inductance change wit h in 20 ckp2012 no mechanical damage. inductance change wit h in 30 ckp2016 ckp2520 nm2012 nm2520 lk1005 no mechanical damage. inductance change wit h in 10 q change within 30 lk1608 no mechanical damage. ind u ctance cha n ge 0.047 to 12.0 h within 10 15.0 to 33.0 h within 15 q change within 30 lk2125 no mechanical damage. inductance change wit h in 20 q change within 30 hk0603 no mechanical damage. ind u ctance cha n ge within 10 q change within 20 hk1005 hk1608 hk2125 hkq0603s aq105 test methods and remarks bk se r ies tem p erature 125 3 applied current rat e d current duration 500 24 0 hrs recovery 2 to 3 hr s o f recovery under the standard condition after the removal from test chamber. see note 1 lk ck c k s ckp nm hk hkq aq bkp series temperature 85 2 lk c k cks ckp nm bkp series 85 2 hk1 6 08 2125 85 2 hk1 0 05, aq105 operating temperature range 55 to 85 125 2 hk0 6 03, hk1005, hkq0603s, aq105 operating temperature range 55 to 125 applied current rat e d current duration 500 12 hrs r e covery 2 to 3 hr s o f recovery under the standard condition after the test. see note 1 note on standard condition: "standard condition" referred to herein is de?ned as follows: 5 to 35 of te mperature, 45 to 85% relative humidity, and 86 to 106kpa of air pressure. when there are questions concerning measurement results: in or der to provide correlation data, the test shall be conducted under condition of 20 2 of temperature, 60 to 70% relative humidity, and 86 to 106kpa of air pressure. unless other - wise speci?ed, all the tests are conducted under the "standard condition." (not e 1) measurement shall be made after 48 2 hrs of r ecovery under the standard condition.
mlci0109_reli-prp13 mlci0109_reli_e-01 precautions this catalog contains the typical speci?cation only due to the limitation of space. when you consider the purchase of our products, please check our speci?cation. for details of each product (characteristics graph, reliability information, precautions for use, and so on), see our web site (http://www.ty-top.com/) or cd catalogs. precautions on the use of multilayer chip inductors, multilayer chip inductors for high frequency, multilayer ferrite chip beads 1. circuit design precautions veri?cation of op e rating environment, electrical rating and performance 1. a malfunction in medical equipment, spacecraft, nuclear reactors, etc. may cause serious harm to human life or have severe social rami?cations. as s uch, any inductors to be used in such equipment may require higher safety and/or reliability considerations and should be clearly differentiated from com p onents use d i n general purpose applications. operating cur r ent veri?cation of rated current 1. the operating current for inductors must always be lower than their rated values. 2. d o not apply current in excess of the rated value because the inductance may be reduced due to the magnetic saturation effect. 2. pcb design precautions pattern con?gurations de s ign of land-patterns 1. when inductors are mounted on a pcb, the size of land patterns and the amount of solder used si z e of ?llet can directly affect inductor performance. therefore, the following items must be carefully considered in the design of solder land patterns: 1 the amount of solder applied can affect the ability of chips to withstand mechanical stresses which may lead to breaking or cracking. therefore, when des igning land-patterns it is necessary to consider the appropriate size and con?guration of the solder pads which in turn determines the amount of sol d er necessary to form the ?llets. 2 wh e n mo r e than one part is jointly soldered onto the same land or pad, the pad must be designed so that each component's soldering point is separated by solder-resist. 3 the larger size of land patterns and amount of solder, the smaller q value after mounting on pcb. it makes higher the q value to design land patterns sm a ller than terminal electrode of chips. pat t ern con?gurations in d uctor layout on panelized breakaway pc boards 1. after inductors have been mounted on the boards, chips can be subjected to mechanical stresses in subsequent manufacturing processes pc b cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering the re?ow soldered boards etc. for t his reason, planning pattern con?gurations and t h e position of smd inductors should be carefully performed to minimize stress. technical cons ider - ations pattern con?gurations de s ign of land-patterns 1. the following diagrams and tables show some examples of recommended patterns to prevent excessive solder amounts la r ger ?llets which extend above the component end terminations . exa m ples of improper pattern designs are also shown. 1 recommended land dimensions for a typical chip inductor land patterns for pcbs recommended land dimensions for wave-soldering recommended land dimensions for re?ow-soldering type 1608 2125 3216 size l 1.6 2.0 3.2 w 0.8 1.25 1.6 a 0.8 1.0 1.0 1.4 1.8 2.5 b 0.5 0.8 0.8 1.5 0.8 1.7 c 0.6 0.8 0.9 1.2 1.2 1.6 unit mm type 0402 0603 1005 105 1608 2012 2125 2016 3216 2520 size l 0.4 0.6 1.0 1.0 1.6 2.0 2.0 2.0 3.2 2.5 w 0.2 0.3 0.5 0.6 0.8 1.25 1.25 1.6 1.6 2.0 a 0.15 0.25 0.20 0.30 0.45 0.55 0.50 0.55 0.8 1.0 0.8 1.2 0.8 1.2 0.8 1.2 1.8 2.5 1.0 1.4 b 0.10 0.20 0.20 0.30 0.40 0.50 0.30 0.40 0.6 0.8 0.8 1.2 0.8 1.2 0.8 1.2 0.6 1.5 0.6 1.0 c 0.15 0.30 0.25 0.40 0.45 0.55 0.60 0.70 0.6 0.8 0.9 1.6 0.9 1.6 1.2 2.0 1.2 2.0 1.8 2.2 unit mm excess solder can affect the ability of chips to withstand mechanical stresses. therefore, please take proper precautions when designing land-patterns. recommended lan d d imension for re?ow-soldering type 3216 2010 size l 3.2 2.0 w 1.6 1.0 a 0.7 0.9 0.5 0.6 b 0.8 1.0 0.5 0.6 c 0.4 0.5 0.2 0.3 d 0.8 0.5 unit mm 2 examples of good and bad solder application item not recommended recommended mixed mounting of smd and leaded components component placement close to the chassis hand-soldering of leaded components near mounted components horizontal component placement to next page
mlci0109_reli-prp14 mlci0109_reli_e-01 precautions this catalog contains the typical speci?cation only due to the limitation of space. when you consider the purchase of our products, please check our speci?cation. for details of each product (characteristics graph, reliability information, precautions for use, and so on), see our web site (http://www.ty-top.com/) or cd catalogs. precautions on the use of multilayer chip inductors, multilayer chip inductors for high frequency, multilayer ferrite chip beads 3. considerations for automatic placement precautions adjustment of mo u nting machine 1. excessive impact load should not be imposed on the inductors when mounting onto the pc boards. 2. t he maintenance and inspection of the mounter should be conducted periodically. sel e ction of ad h esives 1. mounting inductors with adhesives in preliminary assembly, before the soldering stage, may lead to degraded inductor characteristics unless the following fac t ors are appropriately checked; the size of land patterns, type of adhesive, amount applied, hardening temperature and hardening period. therefore, it is imp e rative to consult the manufacturer of the adhesives on proper usage and amounts of adhesive to use. tec h nical con s ider - ations adjustment of mo u nting machine 1. if the lower limit of the pick-up nozzle is low, too much force may be imposed on the inductors, causing damage. to avoid this, the following points should be con s idered bef o re lowering the pick-up nozzle: 1 the lower limit of the pick-up nozzle should be adjusted to the surface level of the pc board after correcting for de?ection of the board. 2 t h e pic k -up pressure should be adjusted between 1 and 3n static loads. 3 to reduce the amount of de?ection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins should be used under the pc bo a rd. the following diagrams show some typical examples of good pick-up nozzle placement: item improper method proper method single-sided mounting double-sided mounting 2. as the alignment pin wears out, adjustment of the nozzle height can cause chipping or cracking of the inductors because of mechanical impact on the inductors. to avoid this, the monitoring of the width between the alignment pin in the stopped position, and maintenance, inspection and replacement of the pin should be conducted periodically. sel e ction of adh esives 1. some adhesives may cause reduced insulation resistance. the difference between the shrinkage percentage of the adhesive and that of the inductors may res u lt in stresses on the inductors and lead to cracking. moreover, too little or too much adhesive applied to the board may adversely affect component pla c ement, so th e f ollowing precautions should be noted in the application of adhesives. 1 required adhesive characteristics a . the adhesive should be strong enough to hold parts on the board during the mounting & solder process. b. t he adhesive should have suf?cient strength at high temperatures. c. t he adhesive should have good coating and thickness consistency. d. t he adhesive should be used during its prescribed shelf life. e. t he adhesive should harden rapidly. f. t he adhesive must not be contaminated. g. t he adhesive should have excellent insulation characteristics. h. t he adhesive should not be toxic and have no emission of toxic gasses. 2 wh e n us i ng adhesives to mount inductors on a pcb, inappropriate amounts of adhesive on the board may adversely affect component placement. too little adhesive may cause the inductors to fall off the board during the solder process. too much adhesive may cause defective soldering due excessive ?ow o f a dhesive on to the land or solder pad. rec o mmended conditions figure 0805 case sizes as examples a 0.3mm min b 100 120 m c area with no adhesive 2. pcb design technical consider - ations pattern con?gurations in d uctor layout on panelized breakaway pc boards 1-1. the following are examples of good and bad inductor layout; smd inductors should be located to minimize any possible mechanical stresses from board war p o r de?ection. item not recommended recommended de?ection of the board 1-2. to layout the inductors for the breakaway pc board, it should be noted that the amount of mechanical stresses given will vary depending on inductor layout. an example below should be counted for better design. 1-3. when breaking pc boards along their perforations, the amount of mechanical stress on the inductors can vary according to the method used. the following methods are listed in order from least stressful to most stressful: push-back, slit, v-grooving, and perforation. thus, any ideal smd inductor layout must also consider the pcb splitting procedure.
mlci0109_reli-prp15 mlci0109_reli_e-01 precautions this catalog contains the typical speci?cation only due to the limitation of space. when you consider the purchase of our products, please check our speci?cation. for details of each product (characteristics graph, reliability information, precautions for use, and so on), see our web site (http://www.ty-top.com/) or cd catalogs. precautions on the use of multilayer chip inductors, multilayer chip inductors for high frequency, multilayer ferrite chip beads 4. soldering precautions selection of fl u x 1. since ?ux may have a signi?cant effect on the performance of inductors, it is necessary to verify the following conditions prior to use; 1 flux used should be with less than or equal to 0.1 wt% c h lorine conversion method of halogenated content. flux having a strong acidity content should not be applied. 2 wh e n sol d ering inductors on the board, the amount of ?ux applied should be controlled at the optimum level. 3 when using water-soluble ?ux, special care should be taken to properly clean the boards. so l dering 1. temperature, time, amount of solder, etc. are speci?ed in accordance with the following recommended conditions, and please contact us about peak tem- and p lease contact us about peak tem - pera ture when you use lead-free paste. tec h nical con s ider - ations selection of fl u x 1-1. when too much halogenated substance ch l orine, etc. content is used to activate the ?ux, or highly acidic ?ux is used, an excessive amount of residue after soldering may lead to corrosion of the terminal electrodes or degradation of insulation resistance on the surface of the inductor. 1- 2 . flux is used to increase solderability in ?ow soldering, but if too much is applied, a large amount of ?ux gas may be emitted and may detrimentally affect sol d erability. to mi n imize the amount of ?ux applied, it is recommended to use a ?ux-bubbling system. 1-3. since the residue of water-soluble ?ux is easily dissolved by water content in the air, the residue on the surface of inductor in high humidity conditions may cau s e a degradation of insulation resistance and therefore affect the reliability of the components. the cleaning methods and the capability of the machines use d s hould also be considered carefully when selecting water-soluble ?ux. sol d ering 1-1. preheating when soldering he a ting: ch i p inductor components should be preheated to within 100 to 130 of the soldering. cooling: the temperature difference between the components and c l eaning process should not be greater than 100 . chip in d uctors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling. therefore, the soldering process must be conducted with a great care so as to prevent malfunction of the components due to excessive thermal shock. re c ommended cond itions for soldering re?ow soldering t e mperature pro ? le peak 260? max 10 sec max pb free soldering pb free soldering pb free soldering peak 260? max 10 sec max t ceramic chip components should be preheated to within 100 to 130? of the soldering. t assured to be re?ow soldering for 2 times. t ceramic chip components should be preheated to within 100 to 130? of the soldering. t assured to be wave soldering for 1 time. t except for re?ow soldering type. t?) t190? 3216type max , ? )? 130? 3225 type ming t it is recommended to use 20w soldering iron and the tip is 1 or less. t the soldering iron should not directly touch the components. t assured to be soldering iron for 1 time. note: the above pro?les are the maximum allowable soldering condition, therefore these pro?les are not always recommended. temperature ? 300 200 100 0 temperature ? 300 200 100 0 temperature ? 400 300 200 100 0 preheating 150? 60 sec min gradually cooling gradually cooling gradually cooling heating above 230? 40 sec max preheating 150? 120 sec min 350? max 3 sec max 60 sec min ?) caution 1. the ideal condition is to have solder mass ?llet controlled to 1/2 to 1/3 of the thickness of the inductor, as shown below: 2. because excessive dwell times can detrimentally affect solderability, soldering duration should be kept as close to recommended times as possible. wave soldering temperature pro ? le peak 260? max 10 sec max pb free soldering pb free soldering pb free soldering peak 260? max 10 sec max t ceramic chip components should be preheated to within 100 to 130? of the soldering. t assured to be re?ow soldering for 2 times. t ceramic chip components should be preheated to within 100 to 130? of the soldering. t assured to be wave soldering for 1 time. t except for re?ow soldering type. t?) t190? 3216type max , ? )? 130? 3225 type ming t it is recommended to use 20w soldering iron and the tip is 1 or less. t the soldering iron should not directly touch the components. t assured to be soldering iron for 1 time. note: the above pro?les are the maximum allowable soldering condition, therefore these pro?les are not always recommended. temperature ? 300 200 100 0 temperature ? 300 200 100 0 temperature ? 400 300 200 100 0 preheating 150? 60 sec min gradually cooling gradually cooling gradually cooling heating above 230? 40 sec max preheating 150? 120 sec min 350? max 3 sec max 60 sec min ?) caution 1. make sure the inductors are preheated suf?ciently. 2. the temperature difference between the inductor and melted solder should not be greater than 100 to 130 . 3. c ooling after soldering should be as gradual as possible. 4. w ave soldering must not be applied to the inductors designated as for re?ow soldering only. h and soldering t e mperature pro ? le peak 260? max 10 sec max pb free soldering pb free soldering pb free soldering peak 260? max 10 sec max t ceramic chip components should be preheated to within 100 to 130? of the soldering. t assured to be re?ow soldering for 2 times. t ceramic chip components should be preheated to within 100 to 130? of the soldering. t assured to be wave soldering for 1 time. t except for re?ow soldering type. t?) t190? 3216type max , ? )? 130? 3225 type ming t it is recommended to use 20w soldering iron and the tip is 1 or less. t the soldering iron should not directly touch the components. t assured to be soldering iron for 1 time. note: the above pro?les are the maximum allowable soldering condition, therefore these pro?les are not always recommended. temperature ? 300 200 100 0 temperature ? 300 200 100 0 temperature ? 400 300 200 100 0 preheating 150? 60 sec min gradually cooling gradually cooling gradually cooling heating above 230? 40 sec max preheating 150? 120 sec min 350? max 3 sec max 60 sec min ?) caution 1. use a 20w soldering iron with a maximum tip diameter of 1.0 mm. 2. the soldering iron should not directly touch the inductor.
mlci0109_reli-prp16 mlci0109_reli_e-01 precautions this catalog contains the typical speci?cation only due to the limitation of space. when you consider the purchase of our products, please check our speci?cation. for details of each product (characteristics graph, reliability information, precautions for use, and so on), see our web site (http://www.ty-top.com/) or cd catalogs. 5. cleaning precautions cleaning con d itions 1. when cleaning the pc board after the inductors are all mounted, select the appropriate cleaning solution according to the type of ?ux used and purpose of the c l eaning e. g . to remove soldering ?ux or other materials from the production process. 2. cleaning conditions should be determined after verifying, through a test run, that the cleaning process does not affect the inductor's characteristics. tec h nical con s ider - ations cleaning con d itions 1. the use of inappropriate solutions can cause foreign substances such as ?ux residue to adhere to the inductor, resulting in a degradation of the inductor's ele c trical properties es p ecially insulation resistance . 2. inappropriate cleaning conditions in s uf?cient or excessive cleaning may detrimentally affect the performance of the inductors. 1 excessive cleaning a . in the case of ultrasonic cleaning, too much power output can cause excessive vibration of the pc board which may lead to the cracking of the inductor or th e s oldered portion, or decrease the terminal electrodes' strength. thus the following conditions should be carefully checked; ult r asonic out p ut below 20w/ ? ultrasonic fre q uency below 40khz ultrasonic was h ing period 5 min. or less 6. post cleaning processes precautions application of re s in coatings, moldings, etc. to the pcb and components. 1. with some type of resins a decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while left under normal sto r age conditions resulting in the deterioration of the inductor's performance. 2. w hen a resin's hardening temperature is higher than the inductor's operating temperature, the stresses generated by the excess heat may lead to inductor dam a ge or destruction. 3. s tress caused by a resin's temperature generated expansion and contraction may damage inductors. th e u se of such resins, molding materials etc. is not recommended. precautions on the use of multilayer chip inductors, multilayer chip inductors for high frequency, multilayer ferrite chip beads 7. handling precautions breakaway pc bo a rds splitting along perforations 1. when splitting the pc board after mounting inductors and other components, care is required so as not to give any stresses of de?ection or twisting to the boa r d. 2. board separation should not be done manually, but by using the appropriate devices. gen e ral handling precautions 1. a lways wear static control bands to protect against esd. 2. ke ep the inductors away from all magnets and magnetic objects. 3. u se non-magnetic tweezers when handling inductors. 4. a ny devices used with the inductors so l dering irons, measuring instruments should be properly grounded. 5. keep bare hands and metal products i.e ., m etal desk away from chip electrodes or conductive areas that lead to chip electrodes. 6. keep inductors away from items that generate magnetic ?elds such as speakers or coils. mec h anical con s iderations 1. be careful not to subject the inductors to excessive mechanical shocks. 1 if inductors are dropped on the ?oor or a hard surface they should not be used. 2 w h en han d ling the mounted boards, be careful that the mounted components do not come in contact with or bump against other boards or components. 8. storage conditions precautions storage 1. to maintain the solderability of terminal electrodes and to keep the packaging material in good condition, care must be taken to control temperature and hum i dity in the storage area. humidity should especially be kept as low as possible. re c ommended con d itions ambient tem p erature below 40 humidity bel o w 70% rh the ambient temperature must be kept below 30 . ev e n under ideal storage conditions inductor electrode solderability decreases as time passes, so inductors should be used within 6 months from the time of delivery. *t h e packaging material should be kept where no chlorine or sulfur exists in the air. tec h nical con s ider - ations storage 1. if the parts are stocked in a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes and d eterioration of taping/packaging materials may take place. for this reason, components should be used within 6 months from the time of delivery. if exce e ding the above period, please check solderability before using the inductors.

▲Up To Search▲

Price & Availability of BK32164L121-T

	To Download BK32164L121-T Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .