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t b67h30 3 hg 2014- 03- 17 1 toshiba bicd integrated circuit silicon monolithic tb67h303 hg full bridge driver ic for dc motor the TB67H303HG is a full bridge driver ic for dc motor adopting mos in output transistor. high -p ower and high - efficient drive is possible by adopting dmos output driver with low - on resistance and pwm drive. features ? full bridge driver ic for dc motor ? ron ( upper + lower ) = 0. 2 ( typ. ) ? cw/ccw/short brake/stop functions ? standby function ? pwm control (direct pwm or cons tant - current pwm drive) ? output withstand voltage : v cc = 5 0 v ? output current : i out = 10.0 a ( absolute maximum ratings , peak ) i out = 8 .0 a ( operating range, maximum value ) ? package : h zip 25-p- 1.00f ? built - in input pull- down resistance : 1 00 k ( typ. ) ? output monitor pin ( monitor for tsd/isd ) : a lert 1 pin (i alert1 ( max ) = 1 ma) ? output monitor pin ( monitor for uvlo ) : alert2 pi n (i alert2 ( max ) = 1 ma) ? single power supply ? built - in thermal shutdown (tsd) circuit ? built - in under voltage lock out (uvlo) circuit ? built - in over - current detection (isd) circuit tb67h303 hg weight hzip25 - p - 1.00f: 7.7g ( typ. ) hzip25 - p - 1.00f
t b67h30 3 hg 2014- 03- 17 2 pin functions pin no. i/o symbol functional description remar k 1 output alert1 tsd / isd monitor pin pull - up by external resistance 2 D sgnd signal ground 3 input select select pin for constant - current pwm or direct pwm 4 D (test1) shipping inspection pin connect to sgnd 5 input vref voltage input for 100% current level 6 input vcc power supply 7 input stby standby pin h; start, l; standby 8 input in1 control input pin 1 9 input in2 control input pin 2 10 output out2b bch output 2 11 D rsb bch output current detection 12 output out1b bch output 1 13 D pgndb power gnd 14 output out2a ach output 2 15 D rsa ach outpu t current detection 16 output out1a ach output 1 17 D pgnda power gnd 18 D (test2) shipping inspection pin connect to sgnd 19 D (test3) shipping inspection pin connect to sgnd 20 input vcc power supply 21 D (test4) shipping inspection pin connect to sgnd 22 input pwm pwm signal input pin 23 D osc r esistor connection pin for internal oscillation setting 24 output vreg control side connection pin for power capacitor connecting capacitor to sgnd 25 output alert2 uvlo monitor pin pull - up by exte rnal resistance (test1), (test2), (test3 ) and (test4): shipping inspection pins. they must be connected to sgnd. input pins (in1, in2, pwm, stby, select) v dd 100 100k
t b67h30 3 hg 2014- 03- 17 3 block diagram stby in1 osc 1/ 3 tsd / isd / uvlo alert2 h- bridge d river a out1a out2a rsa h- bridge d river b out1b rsb v ref sgnd pgnd b 12 15 14 16 6, 20 1 24 7 8 9 22 17 2 pre - drive pre - drive 11 osc 10 in2 13 pgnda 23 5 vcc vreg reg(5v) 3 pwm input circuit select out2b alert1 25
t b67h30 3 hg 2014- 03- 17 4 f unctions i/o functio ns select = l (direct pwm mode) input output stby in1 in2 pwm out1 out2 mode h h h h l l short brake l h l h h l h cw/ccw l l l short brake h h l h h l ccw/cw l l l short brake h l l h off (hi - z) stop l l h/l h/l h off (hi - z) standby l select = h (constant - current pwm mode) input output s tby in1 in2 pwm out1 out2 mode h h h h l l short brake l h l h h l h constant - current pwm, cw (out2 out1) l l l short brake h h l h h l constant - current pwm, ccw ( out1 out2) l l l short brake h l l h off (hi - z) stop l l h/l h/l h off (hi - z) standby l
t b67h30 3 hg 2014- 03- 17 5 selection of direct pwm and constant - current pwm select = l: operating direct pwm, select = h: operating constant - current pwm (1) in cas e of direct pwm: ? rsa and rsb should be connected to pgnd each. ? vref should be connected to sgnd. (2) in case of constant - current pwm: ? connect rsa and rsb and then connect to the current detection resistance ( rnf ). ? configuration of output current is as follows; io = ( 1/3 vref ) rnf this system adopts peak current detection. average current is lower than setting current. set rnf and vref as follows; 0.055 rnf 0.25 , 0.3v vref 1.95v triangle wave is generated interna lly by cr oscillation by connecting external resistor to osc terminal. rosc should be from 30k to 120k . the relation of rosc and fchop is shown in below table and figure . the values of fchop of the below table are design guarantee values. they are not te sted for pre - shipment. rosc(k ) fchop(khz) min typ. max 30 - 60 - 51 - 40 - 120 - 20 -
t b67h30 3 hg 2014- 03- 17 6 direct pwm control the motor rotation speed is controllable by the pwm input sent through the pwm pin. it is also possible to con trol the motor rotation speed by sending in the pwm signal through not the pwm pin but the in1 and in2 pins. when the motor drive is controlled by the pwm input, the tb 67h303hg repeats operating in normal operation mode and short brake mode alternately. fo r preventing the shoot - through current in the output circuit caused by the upper and lower power transistors being turned on simultaneously, the dead time is internally generated at the time the upper and lower power transistors switches between on and off . this eliminates the need of inserting off time externally; thus the pwm control with synchronous rectification is enabled. note that inserting off time externally is not required on operation mode changes between cw and ccw, cw and short brake, and cw an d short brake because of the dead time generated internally. pwm on t5 v cc m gnd out1 v cc m gnd pwm off t3 out1 v cc m gnd pwm on t1 out1 v cc m gnd pwm on off t2 out1 v cc m gnd pwm off on t4 out1 rsgnd v cc output voltage waveform (out1) t1 t2 t3 t5 t4
t b67h30 3 hg 2014- 03- 17 7 constant - current pwm control c onstant - current pwm control mode is set when select =h . the TB67H303HG uses a peak current detection technique to keep the output curre nt constant by applying constant voltage through the vref pin. the ratio 40% of the fast decay mode is always fixed. charge - discharge cycles of pwm drive corresponds to 5 cycles of oscm. the current is decreasing in the last two osc cycles ; the fa st decay mode. the relation between the master clock frequency (fmclk), the oscm frequency (foscm) and the pwm frequency (fchop) is shown as follows: foscm = 1/20 fmclk fchop = 1/100 fmclk when rosc=51k , the master clock=4mhz, oscm=200khz, the frequency of pwm(fchop)=40khz . nf: point where output current reaches the setting current. mdt in the below figure indicates the point of mixed decay timming. osc m interna l waveform f chop nf 40 % fast decay mode mdt setting current setting current charge mode nf: reach setting current slow mode mixed decay timming fast mode current monitor (setting current > output current) charge mode
t b67h30 3 hg 2014- 03- 17 8 current waveform when settin g current is changed by changing vref in the constant - current pwm control mode ? mixed decay timming ? nf point ? output current of mixed decay mode > setting current it is charged instantaneously to confirm the current though output current is larger than setting current. nf nf osc m internal waveform i out f chop f chop setting current setting current 40 % fast decay mode mdt (mixed decay timming) change point of vref nf 40 % fast decay mode i out f chop f chop nf mdt (mixed decay timming) move to fast mode after charge setting current change point of vref nf nf i out f chop f chop f chop m dt (mixed decay timming) 40 % fast decay mode setting current setting current setting current change point of vref
t b67h30 3 hg 2014- 03- 17 9 thermal shut - down circuit (tsd) latch return tsd = 160c (typ.) (note) (1) when recovery signal is outputted after the temperature falls lower t han recovery temperature (90 c (typ.) in the below figure (note)). the operation returns by programming the stby as h l h shown in above figure or turning on power supply and turning on uvlo function. (2) when recovery signal is outputted before the temperature falls lower than the recovery temperature ( 90c (typ.) in below figure (note)). if stby is programmed h l h shown in the above figure before the temperature falls lower than the recovery temperature ( 90c (typ.) in the above figure (note)), the operation does not return. note: pre - shipment testing is not perform ed. stby = l: tsd is not enabled. 160 c (typ . ) output on output on stby input output state h l 90 c (typ.) alert 1 output h l 160 c (typ . ) h l 90 c (typ.) h l output off 0.2ms *: time of about 1.6 ms or more is necessary. correspond ing to 40 dividing frequency of f osc 0. 010 ms (typ.), 0.1 ms (max ) output state output on output off stby input alert 1 output junction temperature ( chip temperature) junction temperature ( chip temperature)
t b67h30 3 hg 2014- 03- 17 10 isd (over current detection) current that flows through output power mosfets are monitored individually. if over - current is detected in at least one of the eight output power mosfets, all output power mosfets are turned off. masking term of 1 s or more (typ. when rosc=51k ) (note) should be provided in order to protect detection error by noise. isd does not work during the masking term. the operation is not returned automatically. it is latched. this function is released by programming stby h lh. isd = 6.5 a (note) latch return the operation returns by programming stby h l h shown in the above figure or powering on the supply again to drive uvlo. note: pre - shipment testing is no t performed. stby = l: isd is not enabled. stby input h l alert 1 output h l 6.5a (typ.) 0.2ms dmos power transistor current dead band 1 s(typ.) output state output on output off output on *: time of about 1.6 ms or more is necessary. corresponding to 40 dividing frequency of f osc 0. 010 ms (typ.), 0.1 ms (max )
t b67h30 3 hg 2014- 03- 17 11 alert output (1) alert 1 (pin no. 1) alert 1 terminal outputs in detecting either tsd or isd. alert terminal is connected to power supply externally via pull - up resistance. spec. is shown below. v alert = 0.5v (max ) at 1ma applied voltage to pull - up resistance is up to 5.5 v. and conducted current is up to 1 ma. the voltage of 5 v is recommended to be provided by connecting the external pull - up resistance to vreg pin. (2 ) alert 2 ( pin no. 25) alert 2 terminal outputs in detecting uvlo. alert 2 terminal is connected to power supply external ly via pull - up resistance. spec. is shown below. v alert = 0.5v (max ) at 1ma when vcc falls to 6.0v (typ.) and uvlo is enabled, output turns off and alert 2 outputs low. in case vcc falls below 6.0v (typ.), alert 2 outputs hi - z (high impedance). the operation returns from standby mode when vcc rises 6.5v (typ.) or more. applied voltage to pull - up resistance is up to 5.5 v. and conducted current is up to 1 ma. the voltage of 5 v is r ecommended to be provided by connecting the external pull - up resistance to vreg pin. voltage pull - up of alert 1 and alert 2 pins ? it is recommended to pull- up the voltage to vreg pin. ? in case of pulling up the voltage of except 5 v (for instance, 3.3 v etc.), it is recommended to use other power supply (ex. 3.3 v) while vcc output s within the operation range. when vcc decrease s low er than the operation range and vreg decreases from 5 v to 0 v under the condition that other power supply is used to pull - up voltage, the current continues to conduct from other power supply to the ic inside through the diode shown in the figure. though this phenomenon does not cause destruction and malfunction of the ic, please consider the set design not to continue such a state for a long time. ? as for the pull- up resistance for mo and alert pins, please select large resistance enough for the conducting current so as not to exceed the standard value of 1 ma. please use the resistance of 30 k or more in case of applying 5 v, and 20 k or more in case of applying 3.3 v. tsd isd alert under tsd detection under isd detection low normal under isd detection under tsd detection normal normal normal z uvlo alert under uvlo detection low normal z (to vreg in the ic) ( to pull - up resistance )
t b67h30 3 hg 2014- 03- 17 12 absolute maximum ratings ( ta = 25c ) characteristic symbol rating unit power supply voltage vcc 50 v output current i o (peak) 10.0 (note 1) a drain current (alert1, alert2) i (alert1) 1 ma i (alert2) input voltage v in 6 v power dissipation p d 3.2 (note 2) w 40 (note 3) operating temperature t opr ? 30 to 85 c storage temperature t stg ? 55 to 150 c note 1: absolute maximum rating of output current per one channel is 5a, therefore, that of a parallel connection of two outputs on the outside of the ic is 10a. m ake sure that two outputs are connected in parallel on the outside of the ic and that o ne pair should be out1a and out1b and the other should be out2a and out2b. pay attention to wiring of the output terminals because there may be danger of current exceeding the absolute maximum rating 5a per 1 channel because of consentrating current at only one channel if there is a great lack of balance in the wiring length and so on between a phase side and b phase side about the parallel connection wiring of the output terminal s on the outside of the ic. no te 2: ta = 25c, no heat sink note 3: ta = 25c, with infinite heat sink the absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. do not exceed any of these absolute maximum ratings. exceedi ng the absolute maximum rating s may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. please use the ic within the specified operating ranges. operating range (ta = ? 30 to 85c) characteristic symbol test condition min typ. max unit power supply voltage vcc D 8.0 D 42 v output current i out D D D 8.0 a input voltage v in D 0 D 5.5 v v ref D 0.3 D 1.95 v pwm frequency (input in direct pwm drive) f pwm duty50% in1, in2, pwm D D 100 khz chopping frequency f chop in constant - current pwm mode refer to page 5. 20 40 60 khz note: same voltage should be applied to two vcc pins. the maximum current of the operating range can not be necessarily conducted depending on variou s conditions becaus e output current is limited by the power dissipation p d . make sure to avoid using the ic in the condition that would cause the temperature to exceed tj (avg.) = 107c . the power supply voltage of 42 v and the output current of 8 a* are the upper limit s of the operating range. therefore , make sure to have enough margins within th ese operating range s (derating design) by considering the power supply variation, the external resistance, and the electrical characteristics of the ic. if either of the voltage or current exceeds the upper limit s of the operating range , the ic may not operate normally. * 8 a: 4 a per one phase. t wo phases are connected in parallel .
t b67h30 3 hg 2014- 03- 17 13 electrical characteristics (ta = 25c , vcc = 24v) characteristic symbol test condit ion min typ. max unit input voltage high v in (h) in1, in2, pwm , stby, select 2.0 D 5.5 v low v in (l) ?0.2 D 0.8 input hysteresis voltage v h D 400 D mv input current i in (h) v in = 5.0 v D 50 75 a i in (l) v in = 0 v D D 1 vcc supply current icc 1 stop mode D 3.2 7 ma icc 2 cw/ccw mode D 3.2 7 icc 3 short brake mode D 3.2 7 icc 4 standby mode D 1.9 4 vref input circuit current limit voltage v nf vref = 3.0v (note 1) 0.9 1.0 1.1 v input current i in( v ref) vref = 3.0v (note 1) D D 1 a divider ratio v ref /v nf maximum current : 100% D 3 D D minimum pulse width tw pwmh in1, in2 , pwm 5.0 D D s tw pwml output residual voltage in logic part v ol alert1 i ol = 1 m a D D 0.5 v v ol alert2 internal constant voltage vreg standby mode, external capacitor c = 0.1 f 4.5 5.0 5.5 v chopping frequency ( constant - current pwm) f ch op rosc = 51k 28 40 52 k hz note 1: though vref of the test condition for pre - shipment is 3.0v, make sure to configure vref within the operating range which is written in page 12 in driving the motor. electrical characteristics (ta = 25c, vcc = 24v) characteristic symbol test condition min typ. max unit out pin output on resistor (note 1) (note 2) ron u +ron l i out = 4 a D 0.4 0.6 output transistor switching characteristics (note 1 ) t r v nf = 0 v, output open D 50 D ns t f D 500 D output leaka ge current (note 1 ) upper side i lh v cc = 50 v D D 5 a lower side i ll D D 5 note 1: the value is indicated per 1ch because pre - shipment testing is performed per 1ch. note 2: in using, typical value is 0.2 because two output pins are connected in p arallel.
t b67h30 3 hg 2014- 03- 17 14 measurement waveform v cc gnd t r t f 10% 90% 90% 10% figure 1 timing waveforms and names tw pwm in1 , in2 , pwm tw pwm tw pwm out 1b , out 2b out1a , out 2a , figure 2 timing waveforms and names
t b67h30 3 hg 2014- 03- 17 15 power dissipation tb67h303 hg p d C ta ambient temperatu re ta ( c) power dissipation p d (w) 25 0 150 0 80 75 40 100 20 60 50 125 infinite heat sink r j - c = 1 c /w heat sink ( r hs = 3.5 c /w) r j - c + r hs = 4.5 c /w ic only r j - a = 39c /w
t b67h30 3 hg 2014- 03- 17 16 application circuit (1) direct pwm ? set select l in direct pwm drive. ?r sa should be connected to pgnd a. rsb should be connected to pgndb . ? vref should be connected to sgnd . stby in1 pwm in2 osc 1/3 tsd / isd / uvlo alert2 h- bridge d river b out1b vref sgnd pgnd b pre - drive osc pgnda vcc vreg select mcu f use rsb + out2b 24 v 0.1 f 0.1 f 47 f alert 1 reg(5v) input circuit 51k h- bridge d river a out1a out2a pre - dr ive rsa
t b67h30 3 hg 2014- 03- 17 17 note 1: generally, some ics are highly sensitive to electrostatic discharge. when handling them, ensure that the environment is protected against electrostatic discharge. note 2: two outputs are connected in parallel on the outside of the ic. m ake sure that two outputs are connected in parallel on the outside of the ic and that one pair should be ou t1a and out1b and the other should be out2a and out2b. pay attention to wiring of the output terminals because there may be danger of current exceeding the absolute maximum rating 5a per 1 channel because of consentrating current at only one channel if the re is a great lack of balance in the wiring length and so on between a phase side and b phase side about the parallel connection wiring of the output terminal s on the outside of the ic. note 3: capacitors for the power supply lines should be connected as close to the ic as possible. note 4: pay attention for wire layout of pcb not to allow gnd line to have large common impedance. note 5: external capacitor connecting to vreg should be 0.1 f. pay attention for the wire between this capacitor and vreg terminal and the wire between this capacitor and sgnd not to be influenced by noise. note 6: the ic may not operate normally when large common impedance is existed in gnd line or the ic is eas ily influenced by noise. for example, if the ic operates continuously for a long time under the circumstance of large current and h igh voltage, the output according to the input control signal may be different from the i/o function table of this document. and so, the ic may not operate normally. to avoid this malfunction, make sure to conduct note.2 to note. 5 and evaluate the ic enough before using the ic. note 7 : as for a brush motor, the noise , which is generated from the brushes in the motor during the motor rotati o n, influences on the ic operation. for example, it may cause a malfunction of the isd circuit and then finally the ic may not work normally. in this case, connect a capacitor between the motor terminals in order to reduce the noise . t h e approp riate value of the capacitor depends on the magnitude of the noise and the inductance of the motor coil. please determine the value according to each actual equipment and condition. the connecting position of the capacitor should be conformed because the e ffect of the capacitor is different depending on the position of the capacitor which is near the ic or the motor.
t b67h30 3 hg 2014- 03- 17 18 (2) constant - current pwm ? set select h in constant - current pwm drive. ? connect rsa and rsb and then connect to the current detection resistance ( rnf ) shown in above figure. ? output current is set as follows; io = (1/3 vref) rnf rnf : 0.055 rnf 0.25 , vref: 0.3v vref 1.95v current detection resistance ( rnf ) should be layout to have same distance from rsa pin and rsb pi n and connected as close to the m as possible. stby in1 pwm in2 osc 1/3 tsd / isd / uvlo out1b vref sgnd pgndb pre - drive osc pgnda vcc select rsb + out2b 0.3v to 1.95 v 0.1 f 47 f input circuit h- bridge driver b rnf 51k out1a out2a pre - drive rsa alert2 vreg 0.1 f f use 24v alert1 mcu h- bridge driver a reg(5v)
t b67h30 3 hg 2014- 03- 17 19 note 1: generally, some ics are highly sensitive to electrostatic discharge. when handling them, ensure that the environment is protected against electrostatic discharge. note 2: two outputs are connected in parallel on the outside of the ic. m ake sure that two outputs are connected in parallel on the outside of the ic and that one pa ir should be out1a and out1b and the other should be out2a and out2b. pay attention to wiring of the output terminals because there may be danger of current exceeding the absolute maximum rating 5a per 1 channel because of consentrating current at only one channel if there is a great lack of balance in the wiring length and so on between a phase side and b phase side about the parallel connection wiring of the output terminal s on the outside of the ic. note 3: capacitors for the power supply lines should be connected as close to the ic as possible. note 4: current detection resistance (rnf) should be connected as close as the ic as possible. note 5: pay attention for wire layout of pcb not to allow gnd line to have large common impedance. note 6 : external ca pacitor connecting to vreg should be 0.1 f. pay attention for the wire between this capacitor and vreg terminal and the wire between this capacitor and sgnd not to be influenced by noise. note 7 : the ic may not operate normally when large common impedance is existed in gnd line or the ic is easily influenced by noise. for example, if the ic operates continuously for a long time under the circumstance of large current and high voltage, the output according to the input control signal may be different from th e i/o function table of this document. and so, the ic may not operate normally. to avoid this malfunction, make sure to conduct note.2 to note. 6 and evaluate the ic enough before using the ic. note 8 : as for a brush motor, the noise, which is generated fro m the brushes in the motor during the motor rotation, influences on the ic operation. for example, it may cause a malfunction of the isd circuit and then finally the ic may not work normally. in this case, connect a capacitor between the motor terminals in order to reduce the noise. t h e appropriate value of the capacitor depends on the magnitude of the noise and the inductance of the motor coil. please determine the value according to each actual equipment and condition. the connecting position of the capac itor should be conformed because the effect of the capacitor is different depending on the position of the capacitor which is near the ic or the motor.
t b67h30 3 hg 2014- 03- 17 20 package dimensions weight: 7.7 g (typ.) unit: mm note these dimensions are measured from the surface of the heat sink . note
t b67h30 3 hg 2014- 03- 17 21 not es on contents 1. block diagrams some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. 2. equivalent circuits the equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 3. timing charts timing charts may be simplified for explanatory purposes. 4. application circuits the application circuits shown in this document are provided for reference purposes only. thorough evaluatio n is required, especially at the mass production design stage. toshiba does not grant any license to any industrial property rights by providing these examples of application circuits. 5. test circuits components in the test circuits are used only to obta in and confirm the device characteristics. these components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment. ic usage considerations notes on handling of ics [1] the absolute maximum ratings o f a semiconductor device are a set of ratings that must not be exceeded, even for a moment. do not exceed any of these ratings. exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustio n. [2] use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or ic failure. the ic will fully break down when used under conditions that exceed its absolute maximum ratings, when the wir ing is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. to minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. [3] if your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power on or the negative current resulting from the back electromotive force at power off. ic breakdown may cause injury, smoke or ignition. use a stable power supply with ics with built - in protection functions. if the power supply is unstable, the protection function may not operate, causing ic breakdown. ic breakdown may cause injury, smoke or ignition. [4] do not insert devices in the wrong orientation or incorrectly. make sure that the positive and negative terminals of power supplies are connected properly. otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may r esult injury by explosion or combustion. in addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time.
t b67h30 3 hg 2014- 03- 17 22 points to remember on handling of ics (1) over current protection circuit over current protection circuits (referred to as current limiter circuits) do not necessarily protect ics under all circumstances. if the over current protection circuits operate against the over current, clear the over current status immediately. dependi ng on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the over current protection circuit to not operate properly or ic breakdown before operation. in addition, depending on the method of use and usage condition s, if over current continues to flow for a long time after operation, the ic may generate heat resulting in breakdown. (2) thermal shutdown circuit thermal shutdown circuits do not necessarily protect ics under all circumstances. if the thermal shutdown circuits operate against the over temperature, clear the heat generation status immediately. depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the thermal shutdown circuit to not operate properly or i c breakdown before operation. (3) heat radiation design in using an ic with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (t j ) a t any time and condition. these ics generate heat even during normal use. an inadequate ic heat radiation design can lead to decrease in ic life, deterioration of ic characteristics or ic breakdown. in addition, please design the device taking into conside rate the effect of ic heat radiation with peripheral components. (4) back - emf when a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motors power supply due to the effect of back - emf. if the current sink capability of the power supply is small, the devices motor power supply and out put pins might be exposed to conditions beyond absolute maximum ratings. to avoid this problem, take the effect of back - emf into consideration in system design. (5) s hort - circuiting between outputs, air contamination faults, faults due to improper groundi ng, short - circuiting between contiguous pins utmost care is necessary in the design of the power supply lines , gnd lines , and output lines since the ic may be destroyed by short - circuiting between outputs, air contamination faults, or faults due to imprope r grounding, or by short - circuiting between contiguous pins. the y may destroy not only the ic but also peripheral parts and may contribute to injuries for users. over current may continue to flow in the ic because of this destruction and cause smoke or ign ition of the ic. expect the volume of this over current and add an appropriate power supply fuse in order to minimize the effects of the over current. capacity of the fuse, fusing time, and the inserting position in the circuit should be configured suitabl y.
t b67h30 3 hg 2014- 03- 17 23 restrictions on product use ? toshiba corporation, and its subsidiaries and affiliates (collectively "toshiba"), reserve the right to make changes to the i nformation in this document, and related hardware, software and systems (collectively "product") without notice. ? this document and any information herein may not be reproduced without prior written permission from toshiba. even with toshiba's written permission, reproduction is permissible only if reproduction is without alteration/omission. ? thoug h toshiba works continually to improve product's quality and reliability, product can malfunction or fail. customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, softwar e and syst ems which minimize risk and avoid situations in which a malfunction or failure of product could cause loss of human life, bod ily injury or damage to property, including data loss or corruption. before customers use the product, create designs including t he product, or incorporate the product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant toshiba information, including without limitation, this document, the specifications, the data sheets and application notes for product and the precautions and conditions set forth in the "toshiba semiconductor reliability handbook" and (b) the instructions for the application with which the product will be used with or for. customers are solely responsible f or all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this produ ct in such design or applications; (b) evaluating and determining the applicability of any information cont ained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operat ing parameters for such designs and applications. toshiba assumes no liability for customers' product design or applications. ? product is neither intended nor warranted for use in equipments or systems that require extraordinarily high levels of quality and/or reliability, and/or a malfunction or failure of which may cause loss of human life, bod ily injury, serious property damage and/or serious public impact ( " unintended use " ). except for specific applications as expressly stated in this document, unintended use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or ex plosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance - related fields. if you use product for unintended use, toshiba assumes no liability for product. for details, please contact your toshiba sales representative. ? do not disassemble, analyze, reverse - engineer , alter, modify, translate or copy product, whether in whole or in part. ? product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited unde r any applicable laws or regulations. ? the information contained herein is presented only as guidance for product use. no responsibility is assumed by toshiba for any infringement of patents or any other intellectual property rights of third parties that may result from the use of product. n o license to any in tellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. ? absent a written signed agreement, except as provided in the relevant terms and conditions of sale for product, and to the maximum extent allowab le by law, toshiba (1) assumes no liability whatsoever, including without limitation, indirect, consequential, special, or incidental damages or loss, including without limitation, loss of profits, loss of opportunities, business interruption and loss of d ata, and (2) disclaims any and all express or implied warranties and conditions related to sale, use of product, or information, including warranties or conditions of merchantability, fitness for a particular purpose, accuracy of information, or noninfring ement. ? do not use or otherwise make available product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). product and related software and technology may be controlled under the applicable export laws and regulations including, without limitation, the japanese foreign exchange and foreign trade law and the u.s. export administration regulations. export and re - export of product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. ? please contact your toshiba sales representative fo r details as to environmental matters such as the rohs compatibility of product. please use product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled su bstances, including without limitation, the eu roh s directive. toshiba assumes no liability for damages or losse s occurring as a resul t of noncompliance w ith applicable laws and regulations.

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