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| 1. general description the uja1162 is a ?self-supplied? high -speed can transceiver integrating an iso 11898-2/5 compliant hs-can transceiver and an internal 5 v can supply. the only supply input is a battery connection. the uj a1162 can be operated in a very low-current sleep mode with local and bus wake-up capability. 2. features and benefits 2.1 general ? self-supplied high-speed can transceiver ? iso 11898-2 and iso 11898-5 compliant ? autonomous bus biasing according to iso 11898-6 ? fully integrated 5 v supply (v buf ) for the can transmitter/receiver ? vio input allows for direct interfac ing with 3.3 v to 5 v microcontrollers ? bus connections are truly floating when power to pin bat is off 2.2 designed for automotive applications ? ? 8 kv electrostatic discharge (esd) protection, according to the human body model (hbm) on the can bus pins ? ? 6 kv esd protection, according to iec 61000-4-2 on the can bus pins and on pins bat and wake ? can bus pins short-circuit proof to ? 58 v ? battery and can bus pins are protected against automotive transients according to iso 7637-3 ? very low quiescent current in sleep mode ? leadless hvson14 package (3 mm ? 4.5 mm) with improved automated optical inspection (aoi) capability ? dark green product (halogen free and rest riction of hazardous substances (rohs) compliant) 2.3 integrated supply voltage for the can transceiver (v buf ) ? 5 v nominal output; ? 2 % accuracy ? undervoltage detection at 90 % of nominal value ? excellent response with a 4.7 ? f ceramic output load capacitor ? turned off in sleep mode uja1162 self-supplied high-speed can transceiver with sleep mode rev. 1 ? 26 september 2013 product data sheet
uja1162 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 26 september 2013 2 of 28 nxp semiconductors uja1162 self-supplied high-speed can transceiver with sleep mode 2.4 power management ? sleep mode featuring very low supply current ? remote wake-up capability via standard can wake-up pattern ? local wake-up capability via the wake pin ? entire node can be powered down via the inhibit output, inh 2.5 system control and diagnostic features ? mode control via slpn pin ? overtemperature shutdown ? transmit data (txd) dominant time-out function 3. ordering information table 1. ordering information type number package name description version UJA1162TK hvson14 plastic thermal enhanced very thin small outline package; no leads; 14 terminals; body 3 ? 4.5 ? 0.85 mm sot1086-2 uja1162 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 26 september 2013 3 of 28 nxp semiconductors uja1162 self-supplied high-speed can transceiver with sleep mode 4. block diagram fig 1. block diagram of uja1162 uja1162 015aaa300 hs-can canh canl txd rxd 13 12 4 1 gnd 2 slpn mode control 14 5 v hs-can supply (v buf ) buf 3 vio 5 can transmitter status cts 6 bat inh inh 7 10 wake wake-up 9 uja1162 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 26 september 2013 4 of 28 nxp semiconductors uja1162 self-supplied high-speed can transceiver with sleep mode 5. pinning information 5.1 pinning 5.2 pin description [1] hvson14 package die supply grou nd is connected to both the gnd pi n and the exposed center pad. the gnd pin must be soldered to board ground. for enhanc ed thermal and electrical performance, it is recommended to also solder the exposed center pad to board ground. fig 2. pin configuration diagram terminal 1 index area 015aaa302 uja1162 txd 1 gnd 2 3 rxd 4 5 cts 6 inh slpn canh canl i.c. bat wake i.c. 7 14 13 12 11 10 9 8 transparent top view buf vio table 2. pin description symbol pin description txd 1 transmit data input gnd 2 [1] ground buf 3 5 v transceiver supply voltage rxd 4 receive data output; reads out data from the bus lines vio 5 supply voltage for i/o level adaptor cts 6 can transmitter status inh 7 inhibit output for switching external voltage regulators i.c. 8 internally connected; should be left floating or connected to gnd wake 9 local wake-up input bat 10 battery supply voltage i.c. 11 internally connected; should be left floating or connected to gnd canl 12 low-level can bus line canh 13 high-level can bus line slpn 14 sleep mode control input (active low) uja1162 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 26 september 2013 5 of 28 nxp semiconductors uja1162 self-supplied high-speed can transceiver with sleep mode 6. functional description the uja1162 is a self-supplied high-speed can transceiver incorporating a 5 v can supply. a variety of fail-safe and diagnostic features offer enhanc ed system reliability and advanced power management. 6.1 system controller the system controller is a state machine that manages register configuration and controls the internal functions of the uja1162. uja1 162 operating modes and state transitions are illustrated in figure 3 . these modes are discussed in more detail in the following sections. 6.1.1 operating modes the uja1162 supports five operating modes: normal, standby, sleep, overtemp and off. 6.1.1.1 normal mode normal mode is the active operating mode. in this mode, the uja1162 is fully operational. normal mode can be selected from standby and sleep (via standby) modes by setting pin slpn high, provided v io >v uvd(vio) . the uja1162 exits normal mode: ? if the microcontroller selects standby mode by setting pin slpn low ? if the uja1162 detects an undervoltage on vio, causing the uja1162 to switch to standby mode ? if the chip temperature rises above t th(act)otp , causing the uja1162 to switch to overtemp mode ? if the battery supply voltage drops below v th(det)poff , causing the uja1162 to switch to off mode all pending wake-up events (power-on, can bus wake-up, local wake-up via the wake pin) are cleared when the uja1162 enters normal mode. uja1162 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 26 september 2013 6 of 28 nxp semiconductors uja1162 self-supplied high-speed can transceiver with sleep mode 6.1.1.2 standby mode standby mode is a transitional mode betwee n normal and sleep modes. the transceiver is unable to transmit or receive data in standby mode, but pin inh is active. the receiver monitors bus activity for a wake-up request in standby mode. the bus pins are biased at gnd level (via r i(cm) ) when the bus is inactive for t > t to(silence) and at approximately 2.5 v when there is activity on the bus (autonomous biasing). wake-up can be triggered remotely via a standard wake-up pattern on the can bus (see section 6.3.2 ) or locally via the wake pin. pin rxd is forced low when a bus or local wake-up event is detected. the uja1162 switches to standby mode: ? from normal mode if pin slpn goes low or and undervoltage is detected on vio ? from sleep mode in the event of a local or remote wake-up event or if slpn = high (with a valid voltage on vio) (1) slpn = high is only possible in sleep mode if a valid v io supply voltage is connected fig 3. uja1162 system controller state diagram 1 2 5 0 $ / 6 7 $ 1 ' % < d d d 6 / 3 1 + , * + 2 5 z d n h x s h y h q w 6 / ( ( 3 q r r y h u w h p s h u d w x u h h y h q w 2 9 ( 5 7 ( 0 3 s r z h u r q 2 ) ) i u r p d q \ p r g h 9 % $ 7 x q g h u y r o w d j h h y h q w r y h u w h p s h u d w x u h h y h q w 6 / 3 1 / 2 : 2 5 9 , 2 9 x y g 9 , 2 6 / 3 1 + , * + 9 , 2 ! 9 x y g 9 , 2 6 / 3 1 / 2 : i r u w ! w v o h h s q r z d n h x s s h q g l q j 9 , 2 ! 9 x y g 9 , 2 2 5 9 , 2 9 x y g 9 , 2 i r u w ! w x y 9 , 2 uja1162 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 26 september 2013 7 of 28 nxp semiconductors uja1162 self-supplied high-speed can transceiver with sleep mode 6.1.1.3 sleep mode sleep mode is the uja1162?s power saving mode. in sleep mode, the transceiver behaves like in standby mode with the exception that pin inh is set floating. voltage regulators controlled by this pin will be s witched off, and the current into pin bat will be reduced to a minimum. a high level on slpn (provided a valid voltage is present on vio), a local wake-up via the wake pin or a remote can bus wake-up will cause the uja1162 to wake up from sleep mode and switch to standby mode. pin rxd is forced low when a local wake-up via wake or a remote bu s wake-up is detected. the uja1162 can be set to sleep mode by holding pin slpn low for t > t sleep (provided there are no wake-up events pending). if one or more wake-up events is pending, the uja1162 will remain in standby mode. the uja1162 mu st be switched to normal mode to clear pending wake-up events. the uja1162 will also be forc ed to sleep mode if an undervoltage la sting longer than t d(uvd-slp) is detected on vio (v io uja1162 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 26 september 2013 9 of 28 nxp semiconductors uja1162 self-supplied high-speed can transceiver with sleep mode is no activity on the bus for t > t to(silence) (can offline mode). this is useful when the node is disabled due to a malfunction in the micr ocontroller. the transceiver ensures that the can bus is correctly biased to avoid distur bing ongoing communication between other nodes. the autonomous can bias voltage is derived directly from v bat . 6.3.1 can operating modes the integrated can transceiver supports three operating modes: active, offline and offline bias (see figure 5 ). the can transceiver operating mode depends on the uja1162 operating mode and the output voltage on pin buf. 6.3.1.1 can active mode in can active mode, the transceiver can transmit and receive data via canh and canl. the differential receiver converts the analog data on the bus lines into digital data, which is output on pin rxd. the transmitter conv erts digital data generated by the can controller (input on pin txd) into analog signals suitable for transmission over the canh and canl bus lines. the can transceiver is in active mode when: ? the uja1162 is in normal mode (slpn = 1) and ? v buf > v uvd(buf) and ? v io > v uvd(vio) in can active mode, the can bias voltage is derived from v buf . if v buf falls below v uvd(buf) , the uja1162 exits can active mode and enters can offline bias mode with autonomous can voltage biasing via pin bat. if pin txd is low when the transceiver swit ches to can active mode (uja1162 in normal mode; v buf and v io ok), the transmitter and receiv er will remain disabled until txd goes high. this prevents network traffic being blocked for t to(dom)txd (i.e. while the txd dominant time-out timer is running; see section 6.7.1 ) every time the transceiver enters active mode, if the txd pin is clamped permanently low. 6.3.1.2 can offline and offline bias modes in can offline mode, the transceiver monitors the can bus for a wake-up event. canh and canl are biased to gnd. can offline bias mode is the same as can offline mode, with the exception that the can bus is biased to 2.5 v. this mode is activa ted automatically when activity is detected on the can bus while the transceiver is in can offline mode. the tran sceiver will return to can offline mode if the can bus is silent (no can bus edges) for longer than t to(silence) . the can transceiver will switch from can ac tive mode to can offline bias mode if: ? the uja1162 switches to standby/sleep mode while the can bus had been inactive for less than t to(silence) or ? v buf < v uvd(buf) or v io < v uvd(vio) the can transceiver will switch directly from can active mode to can offline mode if: ? the uja1162 switches to standby/sleep mode after the can bus had been inactive for more than t to(silence) uja1162 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 26 september 2013 10 of 28 nxp semiconductors uja1162 self-supplied high-speed can transceiver with sleep mode the can transceiver switches from can of fline bias mode to can offline mode: ? when the uja1162 is in standby/sleep mode and ? no activity has been detected on the bus for t > t to(silence) the can transceiver switches from can off line mode to can offline bias mode if: ? a wake-up event is detected on the can bus or ? the uja1162 switches to normal mode while v buf < v uvd(buf) or v io < v uvd(vio) 6.3.1.3 can off the can transceiver is switched off comple tely with the bus lines floating when: ? the uja1162 switches to off or overtemp mode or ? v bat falls below the can receiver undervoltage detection threshold, v uvd(can) it will be switched on again on ente ring can offline mode when v bat rises above the undervoltage release threshold and the uja1162 is no longer in off/overtemp mode. 6.3.2 can standard wake-up the uja1162 monitors the bus for a wake-up pattern when the can transceiver is in offline mode. a filter at the receiver input prevents unwanted wake-up events occurring due to automotive transients or emi. a dominant-recessive-dominant wake-up pattern must be transmitted on the can bus within the wake-up timeout time (t to(wake) ) to pass the wake-up filter and trigger a wake-up event (see figure 4 ; note that additional pulses may occur between the recessive/dominant phases). the recessive and dominant phases must last at least t wake(busrec) and t wake(busdom) , respectively. pin rxd is driven low when a valid can wake-up pattern is detected on the bus. fig 4. can wake-up timing t dom t wake(busdom) recessive t rec t wake(busrec) t dom t wake(busdom) dominant dominant 015aaa267 t wake < t to(wake) can wake-up uja1162 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 26 september 2013 11 of 28 nxp semiconductors uja1162 self-supplied high-speed can transceiver with sleep mode 6.4 wake pin in standby and sleep modes, a local wake-up event is triggered by a low-to-high or a high-to-low transition on the wake pin. in app lications that don?t ma ke use of the local wake-up facility, the wake pin should be c onnected to gnd for opt imal emi performance. 6.5 vio supply pin pin vio should be connected to the microcontrolle r supply voltage. this will cause the signal levels on txd, rxd, slpn and cts to be adjusted to the i/o levels of the microcontroller, enabling direct interfacing without the need for glue logic. fig 5. can transceiver state machine & $ 1 $ f w l y h d d d w u d q v p l w w h u r i i u h f h l y h u r i i 5 ; ' z d n h x s + , * + & $ 1 + & $ 1 / w h u p l q d w h g w r 9 i u r p 9 % $ 7 & $ 1 2 i i o l q h % l d v w u d q v p l w w h u r i i u h f h l y h u r i i 5 ; ' z d n h x s + , * + & $ 1 + & $ 1 / w h u p l q d w h g w r * 1 ' & $ 1 2 i i o l q h w u d q v p l w w h u r i i u h f h l y h u r i i 5 ; ' z d n h x s + , * + & $ 1 + & $ 1 / i o r d w l q j & $ 1 2 i i o h d y l q j 2 i i 2 y h u w h p s i u r p d o o p r g h v > w w w r v l o h q f h 6 w d q g e \ 6 o h h s @ 2 5 9 % 8 ) 9 x y g % 8 ) 2 5 9 , 2 9 x y g 9 , 2 w ! w w r v l o h q f h 6 w d q g e \ 6 o h h s & $ 1 z d n h x s 2 5 1 r u p d o 9 % 8 ) 9 x y g % 8 ) 2 5 9 , 2 9 x y g 9 , 2 w u d q v p l w w h u r q u h f h l y h u r q 5 ; ' e l w v w u h d p & $ 1 + & $ 1 / w h u p l q d w h g w r 9 % 8 ) 9 w ! w w r v l o h q f h 6 w d q g e \ 6 o h h s 1 r u p d o 9 % 8 ) ! 9 x y g % 8 ) 9 , 2 ! 9 x y g 9 , 2 1 r u p d o 9 % 8 ) ! 9 x y g % 8 ) 9 , 2 ! 9 x y g 9 , 2 2 i i 2 5 2 y h u w h p s 2 5 9 % $ 7 9 x y g & $ 1 uja1162 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 26 september 2013 12 of 28 nxp semiconductors uja1162 self-supplied high-speed can transceiver with sleep mode 6.6 can transmit status pin (cts) pin cts is driven high to indicate to the mi crocontroller that the transmitter is fully enabled and data can be tr ansmitted via the txd pin. pin cts is actively driven low: ? while the transmitter is starti ng up (e.g. during a transition from standby to normal mode) or ? if pin txd is clamped low for t > t to(dom)txd or ? if an undervoltage is detected on vio or buf 6.7 can fail-safe features 6.7.1 txd dominant timeout a txd dominant time-out timer is starte d when pin txd is forced low while the transceiver is in can active mode. if the lo w state on pin txd persists for longer than the txd dominant time-out time (t to(dom)txd ), the transmitter is disabled, releasing the bus lines to recessive state. this function prev ents a hardware and/or software application failure from driving the bus lines to a permanent dominant state (blocking all network traffic). the txd dominant time-out timer is reset when pin txd goes high. the txd dominant time-out time also defines the minimum possible bit rate of 15 kbit/s. 6.7.2 pull-up on txd pin pin txd has an internal pull-up (towards v io ) to ensure a safe defined recessive driver state in case the pin is left floating. 6.7.3 pull-down on slpn pin pin slpn has an internal pull-down (to gnd) to ensure the uja1162 switches to sleep mode if slpn is left floating. 6.7.4 loss of power at pin bat a loss of power at pin bat has no impact on the bus lines or on the microcontroller. no reverse currents flow from the bus. uja1162 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 26 september 2013 13 of 28 nxp semiconductors uja1162 self-supplied high-speed can transceiver with sleep mode 7. limiting values [1] when the device is not powered up, i buf(max) = 25 ma. [2] verified by an external test house to ensure pins can withst and iso 7637 part 2 automotive transient test pulses 1, 2a, 3a a nd 3b. [3] esd performance according to iec 61000-4-2 (150 pf, 330 ? ) has been verified by an external test house; the result was equal to or better than ? 6 kv. [4] human body model (hbm): according to aec-q100-002 (100 pf, 1.5 k ? ). [5] pins buf, vio and bat connected to gnd, emulating the application circuit. [6] machine model (mm): according to aec-q100-003 (200 pf, 0.75 ? h, 10 ? ). [7] charged device model (cdm): according to aec-q100-011 (field induced charge; 4 pf). [8] in accordance with iec 60747-1. an alternative def inition of virtual junction temperature is: t vj =t amb +p ? r th(j-a) , where r th(j-a) is a fixed value used in the calculation of t vj . the rating for t vj limits the allowable combinations of power dissipation (p) and ambient temperature (t amb ). table 4. limiting values in accordance with the absolute ma ximum rating system (iec 60134). symbol parameter conditions min max unit v x voltage on pin x dc value pins buf [1] , vio ? 0.2 +6 v pins txd, rxd, slpn, cts ? 0.2 v io +0.2 v pins wake, inh ? 18 +40 v pin bat ? 0.2 +40 v pins canh and canl with respect to any other pin ? 58 +58 v v (canh-canl) voltage between pin canh and pin canl ? 40 +40 v v trt transient voltage on pins bat: via reverse polarity diode and capacitor to ground canl, canh, wake: coupling via 1 nf capacitors [2] ? 150 +100 v v esd electrostatic discharge voltage iec 61000-4-2 [3] on pins canh and canl; pin bat with capacitor; pin wake wi th 10 nf capacitor and 10 k ? resistor ? 6+6 kv hbm [4] on pins canh, canl [5] ? 8+8 kv on pins bat, wake ? 4+4 kv on any other pin ? 2+2 kv mm [6] on any pin ? 100 +100 v cdm [7] on corner pins ? 750 +750 v on any other pin ? 500 +500 v t vj virtual junction temperature [8] ? 40 +150 ?c t stg storage temperature ? 55 +175 ?c uja1162 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 26 september 2013 14 of 28 nxp semiconductors uja1162 self-supplied high-speed can transceiver with sleep mode 8. thermal characteristics [1] according to jedec jesd51-2, jesd51-5 and jesd51-7 at natu ral convection on 2s2p board. board with two inner copper layers (thickness: 35 ? m) and thermal via array under the exposed pad connect ed to the first inner copper layer (thickness: 70 ? m). 9. static characteristics table 5. thermal characteristics symbol parameter conditions typ unit r th(vj-a) thermal resistance from virtual junction to ambient [1] 60 k/w table 6. static characteristics t vj = ? 40 ? c to +150 ? c; v bat =4.5v to 28v; v io = 2.85 v to 5.5 v; r (canh-canl) =60 ? ; all voltages are defined with respect to ground; positive currents flow into the ic; typical values are given at v bat = 13 v; unless otherwise specified. symbol parameter conditions min typ max unit supply; pin bat v th(det)pon power-on detection threshold voltage v bat rising 4.2 - 4.55 v v th(det)poff power-off detection threshold voltage v bat falling 2.8 - 3 v v uvr(can) can undervoltage recovery voltage v bat rising 4.5 - 5 v v uvd(can) can undervoltage detection voltage v bat falling 4.2 - 4.55 v i bat battery supply current standby mode; can offline mode; ? 40 ?c < t vj <+85 ?c; v bat = 7 v to 18 v -5881 ? a sleep mode; can offline mode; ? 40 ? c < t vj <+85 ?c; v bat = 7 v to 18 v -4462 ? a additional current in can offline bias mode; ? 40 ?c < t vj <85 ?c -4663 ? a normal mode; can active mode; can recessive; v txd =v io -47 . 5m a normal mode; can active mode; can dominant; v txd =0 v -4667ma voltage source; pin buf v o output voltage v bat = 5.5 v to 18 v 4.9 5 5.1 v v uvd undervoltage detection voltage 4.5 - 4.75 v i o(sc) short-circuit output current ? 300 - ? 150 ma supply; pin vio v uvd undervoltage detection voltage 2.7 - 2.85 v i i(vio) input current on pin vio standby/normal mode; ? 40 ? c < t vj <85 ? c -7 . 11 1 ? a sleep mode; ? 40 ? c < t vj <85 ? c -5.99.5 ? a uja1162 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 26 september 2013 15 of 28 nxp semiconductors uja1162 self-supplied high-speed can transceiver with sleep mode sleep mode control input; pin slpn v th(sw) switching threshold voltage 0.25v io -0.75v io v r pd pull-down resistance 40 60 80 k ? inhibit output: pin inh v o output voltage i inh = ? 180 ? av bat ? 0.8 - v bat v r pd pull-down resistance sleep mode 3 4 5 m ? can transmit data input; pin txd v th(sw) switching threshold voltage 0.25v io -0.75v io v r pu pull-up resistance 40 60 80 k ? can transmitter status; pin cts i oh high-level output current v cts =v io ? 0.4 v; transmitter on -- ? 4ma i ol low-level output current v cts =0.4v; transmitter off 4 --ma can receive data output; pin rxd v oh high-level output voltage i oh = ? 4ma v io ? 0.4--v v ol low-level output voltage i ol = 4 ma - - 0.4 v r pu pull-up resistance can offline mode 40 60 80 k ? local wake input; pin wake v th(sw)r rising switching threshold voltage 2.8 - 4.1 v v th(sw)f falling switching threshold voltage 2.4 - 3.75 v v hys(i) input hysteresis voltage 250 - 800 mv i i input current t vj = ? 40 ? c to +85 ? c--1 . 5 ? a high-speed can bus lines; pins canh and canl v o(dom) dominant output voltage can active mode; v txd = 0 v; v bat > 5.5 v pin canh 2.75 3.5 4.5 v pin canl 0.5 1.5 2.25 v v txsym transmitter voltage symmetry v txsym = v canh +v canl ; f txd = 250 khz; c split =4.7nf [1] [2] 0.9v buf -1.1v buf v v dom(tx)sym transmitter dominant voltage symmetry v dom(tx)sym = v buf ? v canh ? v canl ; v bat > 5.5 v ? 400 - +400 mv v o(dif)bus bus differential output voltage can active mode (dominant); v txd = 0 v; v bat > 5.5 v r (canh-canl) = 45 ? to 65 ? ; 1.5 - 3.0 v can active mode (recessive); can offline mode; v txd = v io ; r (canh-canl) = no load; v bat > 5.5 v; t vj < 150 ?c ? 50 - +50 mv table 6. static characteristics ?continued t vj = ? 40 ? c to +150 ? c; v bat =4.5v to 28v; v io = 2.85 v to 5.5 v; r (canh-canl) =60 ? ; all voltages are defined with respect to ground; positive currents flow into the ic; typical values are given at v bat = 13 v; unless otherwise specified. symbol parameter conditions min typ max unit uja1162 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 26 september 2013 16 of 28 nxp semiconductors uja1162 self-supplied high-speed can transceiver with sleep mode [1] not tested in production; guaranteed by design. [2] the test circuit used to measure the bus output voltage symmetry (which includes c split ) is shown in figure 9 . v o(rec) recessive output voltage can active mode; v txd = v io ; v bat > 5.5 v; r (canh-canl) = no load 20.5v buf 3v can offline mode; v bat > 5.5 v; r (canh-canl) = no load ? 0.1 - +0.1 v can offline bias mode; r (canh-canl) = no load 22.53v i o(dom) dominant output current can active mode; v bat > 5.5 v; v txd =0v pin canh; v canh =0v ? 50--ma pin canl; v canl =5v - - 52 ma i o(rec) recessive output current v canl = v canh = ? 27 v to +32 v; v txd = v io ? 3-+3ma v th(rx)dif differential receiver threshold voltage can active mode; v canl = v canh = ? 12 v to +12 v; v bat > 5.5 v 0.5 0.7 0.9 v can offline mode; v canl = v canh = ? 12 v to +12 v; v bat > 5.5 v 0.4 0.7 1.15 v v hys(rx)dif differential receiver hysteresis voltage can active mode; v canl = v canh = ? 12 v to +12 v; v bat > 5.5 v 50 200 400 mv r i(cm) common-mode input resistance 9 15 28 k ? ? r i input resistance deviation ? 1-+1% r i(dif) differential input resistance 19 30 52 k ? c i(cm) common-mode input capacitance [1] --2 0p f c i(dif) differential input capacitance [1] --1 0p f i li input leakage current v bat = v buf =0v or v bat = v buf = shorted to ground via 47 k ? ; v canh = v canl =5v ? 5-+5 ? a temperature protection t th(act)otp overtemperature protection activation threshold temperature 167 177 187 ?c t th(rel)otp overtemperature protection release threshold temperature 127 137 147 ?c table 6. static characteristics ?continued t vj = ? 40 ? c to +150 ? c; v bat =4.5v to 28v; v io = 2.85 v to 5.5 v; r (canh-canl) =60 ? ; all voltages are defined with respect to ground; positive currents flow into the ic; typical values are given at v bat = 13 v; unless otherwise specified. symbol parameter conditions min typ max unit uja1162 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 26 september 2013 17 of 28 nxp semiconductors uja1162 self-supplied high-speed can transceiver with sleep mode 10. dynamic characteristics table 7. dynamic characteristics t vj = ? 40 ? c to +150 ? c; v bat =4.5v to 28v; v io = 2.85 v to 5.5 v; r (canh-canl) =60 ? ; c (canh-canl) = 100 pf; all voltages are defined with respect to ground; positive currents flow into the ic; typical values are given at v bat = 13 v; unless otherwise specified. symbol parameter conditions min typ max unit voltage sources; pins buf and vio t startup start-up time from v bat exceeding the power-on detection threshold until v buf > 90 % undervoltage threshold -2.84.7ms t d(uvd) undervoltage detection delay time 6 - 39 ? s t d(uvd-sleep) delay time from undervoltage detection to sleep mode from undervoltage detection on vio until uja1162 forced to sleep mode 200 - 400 ms mode control: pin slpn t fltr(sleep) sleep filter time 2.5 - 13.5 ? s t d(sleep) sleep delay time minimum low time to trigger a transition to sleep mode 21 - 36 ? s pin wake t det(wake) wake-up detection time 7 - 42 ? s can transceiver timi ng; pins canh, canl, txd and rxd t d(txd-rxd) delay time from txd to rxd 50 % v txd to 50 % v rxd ; c rxd = 15 pf; f txd = 250 khz - - 255 ns t d(txd-busdom) delay time from txd to bus dominant - 80 - ns t d(txd-busrec) delay time from txd to bus recessive - 80 - ns t d(busdom-rxd) delay time from bus dominant to rxd c rxd = 15 pf - 105 - ns t d(busrec-rxd) delay time from bus recessive to rxd c rxd = 15 pf - 120 - ns t wake(busdom) bus dominant wake-up time first pulse (after first recessive) for wake-up on pins canh and canl; can offline mode 0.5 - 3.0 ? s second pulse for wake-up on pins canh and canl 0.5 - 3.0 ? s t wake(busrec) bus recessive wake-up time first pulse for wake-up on pins canh and canl; can offline mode 0.5 - 3.0 ? s second pulse (after first dominant) for wake-up on pins canh and canl 0.5 - 3.0 ? s t to(wake) wake-up time-out time between first and second dominant pulses; can offline mode 570 - 1200 ? s t to(dom)txd txd dominant time-out time can active mode; v txd = 0 v 2.7 - 3.3 ms uja1162 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 26 september 2013 18 of 28 nxp semiconductors uja1162 self-supplied high-speed can transceiver with sleep mode t to(silence) bus silence time-out time recess ive time measurement started in all can modes; r l = 120 ? 0.95 - 1.17 s t d(busact-bias) delay time from bus active to bias - - 200 ? s t startup(can) can start-up time when switching to active mode (cts = 1) - - 220 ? s table 7. dynamic characteristics ?continued t vj = ? 40 ? c to +150 ? c; v bat =4.5v to 28v; v io = 2.85 v to 5.5 v; r (canh-canl) =60 ? ; c (canh-canl) = 100 pf; all voltages are defined with respect to ground; positive currents flow into the ic; typical values are given at v bat = 13 v; unless otherwise specified. symbol parameter conditions min typ max unit fig 6. can transceiver timing diagram & $ 1 + & $ 1 / w g 7 ; ' e x v g r p 7 ; ' 9 2 g l i e x v 5 ; ' + , * + + , * + / 2 : / 2 : g r p l q d q w u h f h v v l y h 9 9 w g e x v g r p 5 ; ' w g 7 ; ' e x v u h f w g e x v u h f 5 ; ' w g 7 ; ' 5 ; ' w g 7 ; ' 5 ; ' d d d uja1162 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 26 september 2013 19 of 28 nxp semiconductors uja1162 self-supplied high-speed can transceiver with sleep mode 11. application information 11.1 application diagram (1) actual capacitance value must be a least 1.76 ? f with 5 v dc offset (recommended capacitor value is 4.7 ? f) (2) for bus line end nodes, r t = 60 ? in order to support the ?split terminat ion concept?. for sub- nodes, an optional ?weak? termination of e.g. r t = 1.3 k ? can be used, if required by the oem. fig 7. typical application using the uja1162 6 / 3 1 d d d 8 - $ * 1 ' 9 , 2 0 , & 5 2 & 2 1 7 5 2 / / ( 5 5 ; ' 5 ; ' 7 ; ' 7 ; ' & 7 6 v w d q g d u g ? & s r u w v 9 & & , 1 + & $ 1 + & $ 1 / % $ 7 : $ . ( % $ 7 , 1 + 9 9 6 6 ? ) q ) n h j q ) 5 7 5 7 % 8 ) uja1162 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 26 september 2013 20 of 28 nxp semiconductors uja1162 self-supplied high-speed can transceiver with sleep mode 12. test information 12.1 quality information this product has been qualified in accordance with the automotive electronics council (aec) standard q100 - failure mechanism based stress test qualification for integrated circuits , and is suitable for use in automotive applications. fig 8. timing test circuit for can transceiver fig 9. test circuit for measuring transceiver driver symmetry 8 - $ % $ 7 & $ 1 / & $ 1 + 7 ; ' 5 / 5 ; ' s ) * 1 ' s ) d d d d d d & $ 1 + & $ 1 / 8 - $ q ) 7 ; ' 5 ; ' * 1 ' % $ 7 i n + ] & 6 3 / , 7 uja1162 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 26 september 2013 21 of 28 nxp semiconductors uja1162 self-supplied high-speed can transceiver with sleep mode 13. package outline fig 10. package outline sot1086-2 (hvson14) references outline version european projection issue date iec jedec jeita sot1086-2 - - - mo-229 - - - sot1086-2 10-07-14 10-07-15 unit mm max nom min 1.00 0.85 0.80 0.05 0.03 0.00 0.2 4.6 4.5 4.4 4.25 4.20 4.15 3.1 3.0 2.9 0.65 3.9 0.45 0.40 0.35 0.1 a dimensions hvson14: plastic, thermal enhanced very thin small outline package; no leads; 14 terminals; body 3 x 4.5 x 0.85 mm sot1086-2 a 1 b 0.35 0.32 0.29 cdd h ee h 1.65 1.60 1.55 ee 1 k 0.35 0.30 0.25 lv 0.1 w 0.05 y 0.05 y 1 0 2.5 5 mm scale b a terminal 1 index area d e x detail x a c a 1 c y c y 1 ac b v c w b terminal 1 index area e 1 e d h e h l k 1 14 7 8 uja1162 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 26 september 2013 22 of 28 nxp semiconductors uja1162 self-supplied high-speed can transceiver with sleep mode 14. handling information all input and output pins are protected ag ainst electrostatic discharge (esd) under normal handling. when handling ensure that the appropriate precautions are taken as described in jesd625-a or equivalent standards. 15. soldering of smd packages this text provides a very brief insight into a complex technology. a more in-depth account of soldering ics can be found in application note an10365 ?surface mount reflow soldering description? . 15.1 introduction to soldering soldering is one of the most common methods through which packages are attached to printed circuit boards (pcbs), to form electr ical circuits. the soldered joint provides both the mechanical and the electrical connection. th ere is no single sold ering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mount devices (smds) are mixed on one printed wiring board; however, it is not suitable for fine pitch smds. reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 15.2 wave and reflow soldering wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. the wave soldering process is suitable for the following: ? through-hole components ? leaded or leadless smds, which are glued to the surface of the printed circuit board not all smds can be wave soldered. packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. also, leaded smds with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased pr obability of bridging. the reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. leaded packages, packages with solder balls, and leadless packages are all reflow solderable. key characteristics in both wave and reflow soldering are: ? board specifications, in cluding the board finish , solder masks and vias ? package footprints, including solder thieves and orientation ? the moisture sensitivit y level of the packages ? package placement ? inspection and repair ? lead-free soldering versus snpb soldering 15.3 wave soldering key characteristics in wave soldering are: uja1162 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 26 september 2013 23 of 28 nxp semiconductors uja1162 self-supplied high-speed can transceiver with sleep mode ? process issues, such as application of adhe sive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave ? solder bath specifications, including temperature and impurities 15.4 reflow soldering key characteristics in reflow soldering are: ? lead-free versus snpb solderi ng; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see figure 11 ) than a snpb process, thus reducing the process window ? solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board ? reflow temperature profile; this profile includ es preheat, reflow (in which the board is heated to the peak temperature) and cooling down. it is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). in addition, the peak temperature must be low enough that the packages and/or boards are not damaged. the peak temperature of the package depends on package thickness and volume and is classified in accordance with ta b l e 8 and 9 moisture sensitivity precautions, as indicat ed on the packing, must be respected at all times. studies have shown that small packages reach higher temperatures during reflow soldering, see figure 11 . table 8. snpb eutectic process (from j-std-020d) package thickness (mm) package reflow temperature ( ?c) volume (mm 3 ) < 350 ? 350 < 2.5 235 220 ? 2.5 220 220 table 9. lead-free process (from j-std-020d) package thickness (mm) package reflow temperature ( ?c) volume (mm 3 ) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 uja1162 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 26 september 2013 24 of 28 nxp semiconductors uja1162 self-supplied high-speed can transceiver with sleep mode for further information on temperature profiles, refer to application note an10365 ?surface mount reflow soldering description? . 16. soldering of hvson packages section 15 contains a brief introduction to the te chniques most commonly used to solder surface mounted devices (smd). a more detailed discussion on soldering hvson leadless package ics can found in the following application notes: ? an10365 ?surface mount reflow soldering description? ? an10366 ?hvqfn application information? msl: moisture sensitivity level fig 11. temperature profiles for large and small components 001aac844 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = msl limit, damage level peak temperature uja1162 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 26 september 2013 25 of 28 nxp semiconductors uja1162 self-supplied high-speed can transceiver with sleep mode 17. revision history table 10. revision history document id release date data sheet status change notice supersedes uja1162 v.1 20130926 product data sheet - - uja1162 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 26 september 2013 26 of 28 nxp semiconductors uja1162 self-supplied high-speed can transceiver with sleep mode 18. legal information 18.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 18.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 18.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such info rmation. nxp semiconductors takes no responsibility for the content in this document if provided by an information source outside of nxp semiconductors. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use in automotive applications ? this nxp semiconductors product has been qualified for use in automotive applications. unless otherwise agreed in writing, the product is not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors and its suppliers accept no liability for inclusion and/or use of nxp semiconducto rs products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification. uja1162 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 26 september 2013 27 of 28 nxp semiconductors uja1162 self-supplied high-speed can transceiver with sleep mode no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any licens e under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regu lations. export might require a prior authorization from competent authorities. translations ? a non-english (translated) version of a document is for reference only. the english version shall prevail in case of any discrepancy between the translated and english versions. 18.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 19. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com nxp semiconductors uja1162 self-supplied high-speed can transceiver with sleep mode ? nxp b.v. 2013. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 26 september 2013 document identifier: uja1162 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 20. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 2.1 general . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2.2 designed for automotive applications. . . . . . . . 1 2.3 integrated supply voltage for the can transceiver (v buf ) . . . . . . . . . . . . . . . . . . . . . . . 1 2.4 power management . . . . . . . . . . . . . . . . . . . . . 2 2.5 system control and diagnost ic features . . . . . . 2 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5 pinning information . . . . . . . . . . . . . . . . . . . . . . 4 5.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 5.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 functional description . . . . . . . . . . . . . . . . . . . 5 6.1 system controller . . . . . . . . . . . . . . . . . . . . . . . 5 6.1.1 operating modes . . . . . . . . . . . . . . . . . . . . . . . 5 6.1.1.1 normal mode . . . . . . . . . . . . . . . . . . . . . . . . . . 5 6.1.1.2 standby mode. . . . . . . . . . . . . . . . . . . . . . . . . . 6 6.1.1.3 sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 6.1.1.4 off mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 6.1.1.5 overtemp mode . . . . . . . . . . . . . . . . . . . . . . . . 7 6.1.1.6 hardware characterization for the uja1162 operating modes . . . . . . . . . . . . . . . . . . . . . . . . 8 6.1.2 mode control via pin slpn . . . . . . . . . . . . . . . . 8 6.2 power supplies . . . . . . . . . . . . . . . . . . . . . . . . . 8 6.2.1 battery supply voltage (v bat ) . . . . . . . . . . . . . . 8 6.2.2 can supply voltage (v buf ) . . . . . . . . . . . . . . . . 8 6.3 high-speed can transceiver . . . . . . . . . . . . . . 8 6.3.1 can operating modes . . . . . . . . . . . . . . . . . . . 9 6.3.1.1 can active mode . . . . . . . . . . . . . . . . . . . . . . . 9 6.3.1.2 can offline and offline bias modes. . . . . . . . . 9 6.3.1.3 can off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 6.3.2 can standard wake-up. . . . . . . . . . . . . . . . . . 10 6.4 wake pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 6.5 vio supply pin . . . . . . . . . . . . . . . . . . . . . . . . 11 6.6 can transmit status pin (cts) . . . . . . . . . . . . 12 6.7 can fail-safe features . . . . . . . . . . . . . . . . . . 12 6.7.1 txd dominant timeout . . . . . . . . . . . . . . . . . . 12 6.7.2 pull-up on txd pin . . . . . . . . . . . . . . . . . . . . . 12 6.7.3 pull-down on slpn pin. . . . . . . . . . . . . . . . . . 12 6.7.4 loss of power at pin bat . . . . . . . . . . . . . . . . 12 7 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 13 8 thermal characteristics . . . . . . . . . . . . . . . . . 14 9 static characteristics. . . . . . . . . . . . . . . . . . . . 14 10 dynamic characteristics . . . . . . . . . . . . . . . . . 17 11 application information. . . . . . . . . . . . . . . . . . 19 11.1 application diagram . . . . . . . . . . . . . . . . . . . . 19 12 test information . . . . . . . . . . . . . . . . . . . . . . . 20 12.1 quality information . . . . . . . . . . . . . . . . . . . . . 20 13 package outline. . . . . . . . . . . . . . . . . . . . . . . . 21 14 handling information . . . . . . . . . . . . . . . . . . . 22 15 soldering of smd packages . . . . . . . . . . . . . . 22 15.1 introduction to soldering. . . . . . . . . . . . . . . . . 22 15.2 wave and reflow soldering. . . . . . . . . . . . . . . 22 15.3 wave soldering . . . . . . . . . . . . . . . . . . . . . . . 22 15.4 reflow soldering . . . . . . . . . . . . . . . . . . . . . . 23 16 soldering of hvson packages . . . . . . . . . . . 24 17 revision history . . . . . . . . . . . . . . . . . . . . . . . 25 18 legal information . . . . . . . . . . . . . . . . . . . . . . 26 18.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 26 18.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 18.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 26 18.4 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 27 19 contact information . . . . . . . . . . . . . . . . . . . . 27 20 contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 |
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