cystech electronics corp. spec. no. : c303s3n issued date : 2010.09.17 revised date : 2010.10.21 page no. : 1/6 DAN202S6R cystek product specification switching diode DAN202S6R features ? fast switching speed. ? ultra small surface mount package ? high conductance ? pb-free package equivalent circuit outline applications ? for general purpose switching applications. ordering information device package shipping marking DAN202S6R sot-363 (pb-free) 3000 pcs / tape & reel kja sot-363r DAN202S6R a anode c cathode
cystech electronics corp. spec. no. : c303s3n issued date : 2010.09.17 revised date : 2010.10.21 page no. : 2/6 DAN202S6R cystek product specification absolute maximum ratings @t a =25 parameters symbol min max unit repetitive peak reverse voltage v rrm - 110 v continuous reverse voltage v r - 100 v average rectified forward current (single) i o - 150 ma repetitive peak forward current i fm 300 ma non-repetitive peak forward current @square wave, tj=125 prior to surge t=1 s t=1ms t=1s i fsm - - - 4 1 0.5 a a a total power dissipation( note 1 ) ptot 200 mw operating junction temperature range t j -55 +150 c storage temperature range t stg -65 +150 c note 1: device mounted on an fr-4 pcb. electrical characteristics @ tj=25 unless otherwise specified parameters symbol conditions min typ. max unit reverse breakdown voltage v r(br) i r =100 a forward voltage v f i f =1ma i f =10ma i f =50ma i f =150ma - - 715 855 1 1.25 mv mv v v reverse current i r v r =25v v r =100v - - 30 2.5 na a diode capacitance cd v r =0v, f=1mhz - - 2 pf reverse recovery time trr when switched from i f =10ma to i r =10ma,r l =100? , measured at i r =1ma - - 4 ns thermal characteristics symbol parameter conditions value unit rth, j-a thermal resistance from junction to ambient note 1 625 /w note 1: device mounted on an fr-4 pcb.
cystech electronics corp. spec. no. : c303s3n issued date : 2010.09.17 revised date : 2010.10.21 page no. : 3/6 DAN202S6R cystek product specification typical characteristics
cystech electronics corp. spec. no. : c303s3n issued date : 2010.09.17 revised date : 2010.10.21 page no. : 4/6 DAN202S6R cystek product specification reel dimension carrier tape dimension
cystech electronics corp. spec. no. : c303s3n issued date : 2010.09.17 revised date : 2010.10.21 page no. : 5/6 DAN202S6R cystek product specification recommended wave soldering condition product peak temperature soldering time pb-free devices 260 +0/-5 c 5 +1/-1 seconds recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note : all temperatures refer to topside of t he package, measured on the package body surface.
cystech electronics corp. spec. no. : c303s3n issued date : 2010.09.17 revised date : 2010.10.21 page no. : 6/6 DAN202S6R cystek product specification sot-363r dimension *:typical inches marking: kja 6-lead sot-363r plastic surface mounted package cystek package code: s6r style: pin 1. anode1 (a1) pin 2. anode1 (a1) pin 3. cathode2 (c2) pin 4. anode2 (a2) pin 5. anode2 (a2) pin 6. cathode1 ( c1 ) millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.035 0.043 0.900 1.100 e1 2.150 2.450 0.085 0.096 a1 0.000 0.004 0.000 0.100 e 0.026* 0.650* a2 0.035 0.049 0.900 1.000 e1 0.047 0.055 1.200 1.400 b 0.006 0.014 0.150 0.350 l 0.021 ref 0.525 ref c 0.080 0.150 0.003 0.006 l1 0.010 0.018 0.260 0.460 d 2.000 2.200 0.079 0.087 0 8 0 8 e 1.150 1.350 0.045 0.053 notes : 1 .controlling dimension : millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material : ? lead : pure tin plated. ? mold compound : epoxy resin family, flammability solid burning class:ul94v-0. important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
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