cystech electronics corp. spec. no. : c210sh issued date : 2012.09.13 revised date : page no. : 1/6 DI4005SH cystek product specification 1a general purpose rectifier DI4005SH features ? high current capability ? low power loss, high efficiency ? ultra high-speed switching ? low profile surface mounted package in order to minimize board space ? pb-free package mechanical data ?case : molded plastic, jedec sod-123. ? epoxy : ul94-v0 rated flame retardant ? terminals : plated terminals, so lderable per mil-std-202 method 208 ?polarity : indicated by cathode band ? mounting position : any ? weight : approx. 0.04 gram symbol outline DI4005SH 2 (anode) sod-123
cystech electronics corp. spec. no. : c210sh issued date : 2012.09.13 revised date : page no. : 2/6 DI4005SH cystek product specification absolute maximum ratings (t a =25 , unless otherwise noted) parameters conditions symbol min typ max units repetitive peak reverse voltage v rrm 500 v rms voltage v rms 350 v continuous reverse voltage v r 500 v forward rectified current single phase half wave, 60hz @t j =25 c i f(av) 1 a forward surge current 8.3ms single half sine-wave superimposed on rated load (jedec method) i fsm 10 a thermal resistance junction to ambient r ja 250 c/w storage temperature range tstg -55 150 c operating junction temperature range tj -55 150 c characteristics (t a =25 c, unless otherwise noted) characteristic symbol condition min. typ max. unit v r i r =100 a 500 - - v v f 1 i f =100ma - - 0.9 forward voltage v f 2 i f =1a - - 1.25 v i r v r =500v - - 100 na reverse leakage current i r v r =500v, t a =125c - - 10 a junction capacitance c j v r =1v, f=1mhz - 5 - pf ordering information device package shipping DI4005SH-0-t1-g sod-123 (pb-free lead plating an d halogen-free package) 3000 pcs / tape & reel
cystech electronics corp. spec. no. : c210sh issued date : 2012.09.13 revised date : page no. : 3/6 DI4005SH cystek product specification typical characteristics power derating curve 0 0.1 0.2 0.3 0.4 0.5 0.6 0 25 50 75 100 125 150 175 200 ambient temperature---t a () power dissipation(w) forward current vs forward voltage 1 10 100 1000 10000 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 forward voltage---v f (v) instantaneous forward current---i f (ma) pulse width=300s, 1% duty cycle 0 125 -40c 25c 75c reverse leakage current vs reverse voltage 0.01 0.1 1 10 100 1000 0 100 200 300 400 500 reverse voltage---v r (v) reverse leakage current---i r (na) tj=75 tj=25 tj=125 tj=-40c tj=0c junction capacitance vs reverse voltage 1 10 0.1 1 10 100 reverse voltage---v r (v) junction capacitance---c j (pf) tj=25, f=1.0mhz recommended soldering footprint
cystech electronics corp. spec. no. : c210sh issued date : 2012.09.13 revised date : page no. : 4/6 DI4005SH cystek product specification reel dimension carrier tape dimension
cystech electronics corp. spec. no. : c210sh issued date : 2012.09.13 revised date : page no. : 5/6 DI4005SH cystek product specification recommended wave soldering condition product peak temperature soldering time pb-free devices 260 +0/-5 c 5 +1/-1 seconds recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note : all temperatures refer to topside of t he package, measured on the package body surface.
cystech electronics corp. spec. no. : c210sh issued date : 2012.09.13 revised date : page no. : 6/6 DI4005SH cystek product specification sod-123 dimension marking: a5 2-lead sod-123 plastic surface mounted package cystek package code: sh style: pin 1.cathode 2.anode inches millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.102 0.110 2.600 2.800 d 0.018 0.026 0.450 0.650 b 0.059 0.067 1.500 1.700 e 0.140 0.152 3.550 3.850 c 0.041 0.049 1.050 1.250 notes: 1.controlling dimension : millimeters. 2.lead thickness specified per l/f drawing with solder plating. 3.if there is any question with pa cking specification or packing me thod, please contact your local cystek sales office. material: ? lead: pure tin plated. ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0. important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
|
