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zigbit 900mhz wireless modules atzb -x0- 256 -4-0- cn datasheet features ? c ompact size ( 38.5 x 20.0mm ) ? high rx sensitivity ( - 103 dbm) ? outperforming link budget (up to +112db) ? up to + 9.0 dbm output power ? very low power consumption: ? 8.7 ma in rx mode (1) ? 34.8 ma in tx mode (1) ? 0.6 a in sleep mode (2) ? ample memory resources (256kb in - system, self - programmable flash memory, 4 kb eeprom, 16 kb sram) ? wide range of interfaces (both analog and digital) ? 4- wire spi, twi ? isp, jtag ? two analog comparator i nput ? uart, usart ? timer, pwm ? four adc lines ? external clock input, internal clock output ? up to 32 lines configurable as gpio ? preassigned atmel ? mac address that can be used on end product ? capability to use mac address into the internal eeprom ? ieee ? 802.15.4 compliant transceiver ? 900m hz ism band ? serial bootloader ? high performance low p ower atmel avr ? xmega ? 8- and 32 - bit microcontroller ? rapid desi gn- in with built - in chip antenna ? rf test point using ms - 147 rf connector ? small physical footprint and low profile for optimum fit in very small application boards ? mesh networking capability ? easy - to - use low cost development kit ? s ingle source of support for hw and sw ? worldwide license - free operation notes: 1. mcu is in active state with 3v supply, cpu clock @ 16mhz, rx rpc enabled (for rx current), phy_tx_pwr=0x0 (for tx current), all digital outputs pulled high. 2. controller sleep mode : sleep_mode_pwr_down . 42268b ? wireless ? 07 /2014
atzb - x0 - 256 -4-0- cn [ zigbit 900mhz wireless modules ] 42268b ? wireless ? 07/2014 2 table of contents 1. introduction ........................................................................................ 3 1.1 summary ........................................................................................................... 3 1.2 applications ....................................................................................................... 3 1.3 abbreviations and acronyms ............................................................................ 3 1.4 related documents ........................................................................................... 4 2. zigbit module overview ..................................................................... 5 2.1 overview ........................................................................................................... 5 3. specifications ..................................................................................... 7 3.1 electrical characteristics ................................................................................... 7 3.1.1 absolute maximum ratings ................................................................ 7 3. 1.2 power supply ...................................................................................... 7 3.1.3 rf characteristics .............................................................................. 8 3.1.4 atxmega256a3u microcontroller characteristics .............................. 9 3.1.5 module interfaces characteristics ....................................................... 9 3.2 physical/environmental characteristics and outline ......................................... 9 3.3 pin configuration ............................................................................................. 10 3.4 antenna orientation recommendation ........................................................... 11 3.5 mounting information ...................................................................................... 11 3.6 soldering profile .............................................................................................. 14 3.7 antenna reference designs ........................................................................... 14 4. schematics ...................................................................................... 15 4.1 handling instr uctions ....................................................................................... 20 4.2 general recommendations ............................................................................ 20 5. persistence memory ........................................................................ 21 6. ordering information ........................................................................ 22 7. agenc y certifications ....................................................................... 23 7.1 united states (fcc) ........................................................................................ 23 7.2 european union (etsi) ................................................................................... 23 7.3 in dustry canada (ic) compliance statements ................................................ 24 8. revision history ............................................................................... 25
atzb - x0 - 256 -4-0- cn [ zigbit 900mhz wireless modules ] 42268b ? wireless ? 07/2014 3 1. introduction 1.1 summary atzb - x0 - 256 -4-0-cn zigbit ? is an ultra- compact and low - power 900 mhz ieee 802.15.4/zigbee ? oem module from atmel. based on the innovative mixed - signal hardware platform from atmel, this module uses the at xmega256a3u [1] microcontroller and at86rf2 12b [5] 700/800/900m hz ism band transceiver. the radio transceiver provides high data rates from 20kb/s up to 1 mb/s, frame handling, outstanding receiver sensitivity and high transmit output power enabling a very robust wireless communication. the module is designed for wireless sensing, monitoring, control, data acquisition applications, to name a few. this zigbit module eliminates the need for costly and time- consuming rf development, and shortens time - to - market for wireless applications. the module has an ms - 147 rf connector that can be used as an rf test port. the built - in chip antenna is designed and tuned for the zigbit design to enable quick integration of the zigbit into any application. 1.2 applications the zigbit module is compatible with robust ieee 802.15.4/zigbee stack that supports a self - healing, self - organizing mesh network, while optimizing network traffic and minimizing power co nsumption. for detailed software support information, visit http://www.atmel.com/products/wireless . the applications include, but are not limited to: ? building automation and monitoring ? lighting controls ? wireless smoke - and co - detectors ? structural integrity monitoring ? hvac monitoring and control ? inventory management ? environmental monitoring ? security ? water metering ? industrial monitoring ? machinery condition and performance monitoring ? monitoring of plant system parameters such as temperature, pressure, flow, tank level, humidity, vibration, etc. ? automated meter reading (amr) 1.3 abbreviations and a cronyms adc analog - to - digital converter api application programming interface dc direct curren t dtr data terminal ready eeprom electrically erasable programmable read - only memory esd electrostatic discharge gpio general purpose input/output haf high frequency hvac heating, ventilating, and air conditioning
atzb - x0 - 256 -4-0- cn [ zigbit 900mhz wireless modules ] 42268b ? wireless ? 07/2014 4 hw hardware i 2 c inter - integrated circuit ieee institute of electrical and electronics engineers irq interrupt request ism industrial, scientific and medical radio band jtag digital interface for debugging of embedded device, also known as ieee 1149.1 standard interface mac medium access control la yer mcu microcontroller unit. in this document it also means the processor, which is the core of a zigbit module nre network layer oem original equipment manufacturer ota over - the - air upgrade pa power amplifier pcb printed circuit board per package error ratio ram random access memory rf radio frequency rpc reduced power consumption rts/cts request to send/ clear to send rx receiver sma surface mount assembly soc system on chip spi serial peripheral interface sw software ttm time - to - market tx transmitter u art universal asynchronous receiver/transmitter usart universal synchronous/asynchronous receiver/transmitter usb universal serial bus zigbee, zigbee pro wireless networking standards targeted at low - power applications 802.15.4 the ieee 802.15.4 - 2003 standard applicable to low - rate wireless personal area network 1.4 related d ocuments [1] atxmega256a3u datasheet in http://www.atmel.com/devices/atxmega256a3u.aspx?tab=documents . [2] ms - 147 series interface rf connector with switch, 3.9mm high, dc to 6ghz http://www.hirose.co.jp/cataloge_hp/e35801505.pdf . [3] ieee std 802.15.4 - 2003 ieee standard for information technology - pa rt 15.4 wireless medium access control (mac) and physical layer (phy) specifications for low - rate wireless personal area networks (lr - wpans) . [4] zigbee specification. zigbee document 053474r17, october 19, 2007 . [5] at86rf2 12b datasheet in http://www.atmel.com/devices/at86rf212b.aspx?tab=documents .
atzb - x0 - 256 -4-0- cn [ zigbit 900mhz wireless modules ] 42268b ? wireless ? 07/2014 5 2. zigbit module o verview 2.1 overview the atzb - x0 - 256 -4-0- cn zigbit is a compact, low - power, high sensitivity ieee 802.15.4/zigbee oem module. based on a solid combination of the latest atmel mcu wireless hardware platform, 900mhz ism band transceiver and atmel studio wireless composer - the zigbit offers an unmatched combination of superior radio performance, ultra - low power consumption and exceptional ease of integration. figure 2 - 1. atzb -x0- 256 -4-0-cn user i nterface d iagram this zigbit module contains the atmel at xmega a256a3u microcontroller and at86 rf212b 900mhz ism band transceiver for zigbee and ieee 802.15.4 [3] . the module features 256kb in - system self - programmable flash memory, 16kb sram and 4kb eeprom. the compact all - in - one board design of mcu and radio transceiver with very minimal components on the rf path to antenna dramatically improves the zigbits compact size, range performance on signal transmission and increases its sensitivity. this ensures stable connectivity within a larger coverage area, and helps develop applications on smaller footprint. the ms - 147 connector [2] can be used as an rf test port. zigbit module contains a complete rf/mcu design with all the necessary passive components included. the module can be easily mounted on a simple 2 - layer pcb with a minimum of required external connection. the zigbit module evaluation kit containing the zigbit extension board for the atmel xplained pro hw evaluation platform can be used to develop fw using the atmel studio and evaluate using the wireless composer. compared to a custom rf/mcu solution, a module - based solution offers considerable savings in development time and nre cost per unit during the hw/fw design, prototyping, and mass production phases of product development. all zigbits are preloaded with a bootloader when they are sold as modules, either in single units or t&r. depending on end -u ser design requirements, the zigbit can operate as a self - contained sensor node, where it would function as a single mcu, or it can be paired with a host processor driving the module over a serial interface.
atzb - x0 - 256 -4-0- cn [ zigbit 900mhz wireless modules ] 42268b ? wireless ? 07/2014 6 the mac stack running on the host processor can then control data transmission and manages module peripherals. thus very minimal firmware customization is required for successful module design - in. third - party sensors can then be connected directly to the module, thus expanding the existing set of peripheral interfaces. every zigbit module come pre loaded with atmel assigned 64 - bit mac address stored in the signature bytes of the device. this unique ieee mac address can be used as the mac address of the end product, so there is no need to buy a mac address separately for the product using the zigbit.
atzb - x0 - 256 -4-0- cn [ zigbit 900mhz wireless modules ] 42268b ? wireless ? 07/2014 7 3. specification s 3.1 electrical c haracteristics 3.1.1 absolute maximum r atings table 3 -1. absolute maximum r atings (1)(2) parameter minimum maximum voltage on any pin, except reset with respect to ground - 0.3v 3.6v (v dd max ) input rf level +10dbm current into v cc pins 200ma notes: 1. absolute maximum ratings are the values beyond which damage to the device may occur. under no circumstances must the absolute maximum ratings given in this table be violated. stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. this is a stress rating only. functional operation of the device at these or other conditions, beyond those indicated in the operational sections of this specification, is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2. attention! zigbit is an esd- sensitive device. precaution should be taken when handling the device in order to prevent permanent damage. 3.1.2 power supp ly table 3 -2. test c onditions (unless otherwise stated), v cc = 3v, t amb = 25 c parameter range unit supply voltage, v dd 1.8 to 3.6 v active current consumption: rx mode + max sensitivity 14.5 ma active current consumption: rx mode + least sensitivity 13.9 ma active current consumption: rx mode + max sensitivity, mcu sleep (2) 9.3 ma active current consumption: rx mode + least sensitivity, mcu sleep (2) 8.7 ma active current consumption: tx mode (1) C busy_tx C transmit state 34.8 ma current consumption: trx_off, mcu active 6.1 ma current consumption: trx_off, mcu sleep (2) 740 a sleep current consumption: trx sleep, mcu sleep (2) 0.6 a note 1: output tx power (when measuring consumption in tx mode) is + 9 dbm. note 2: a) all interfaces are set to the default state (see table 3 -8 atzb - x0 - 256 -4-0- cn pinout d escription ). b) jtag is not connected. c) cpu clock configured when doing this measurement C 16mhz for all modes except power save and power down modes . current consumption depends on multiple factors, including but not limited to, the board design and materials, protocol settings, network activity, eeprom read/write operations. it also depends on mcu load and/or peripherals used by an application.
atzb - x0 - 256 -4-0- cn [ zigbit 900mhz wireless modules ] 42268b ? wireless ? 07/2014 8 3.1.3 rf c haracteristics table 3 -3. rf c haracteristics (3 ) parameter condition range unit frequency band C fcc and industry canada (2) 902 C 928 m hz numbers of channels ( fcc and industry canada ) 10 channel spacing 2 mhz transmitter output power adjusted in 36 steps - 25 to +11 dbm receiver sensitivity per = 1% -103 dbm on - air data rate 20, up to 1000 kbps tx output/ rx input nominal impedance for balanced 50 range (1) open field, los, elevated 1120 m notes: 1. range measured is line of sight at 10ft elevation from ground at different combinations of orientation of transmitter and receiver, with special conditions were there is minimal or no rf interference from other sources. for best case orientation of the zigbits to a chieve maximum range, refer to s ection 3.4 . 2. appropriate fw (register selection) must be used for operating this zigbit in north america . 3. for detailed characteristics, refer to [2] . table 3 -4. tx power s ettings phy_tx_pwr 3:0 register value power register setting [dbm] output power [dbm] ( typical values at rf connector) c0 11 8.59 c1 10 8.14 80 9 7.43 82 8 5.85 83 7 4.97 84 6 4.1 40 5 3.58 86 4 2.12 00 3 1.4 01 2 0.42 02 1 - 0.93 03 0 - 2.09 04 -1 - 3.16 27 -2 - 4.29 91 -6 - 7.86 0d -10 - 12.27 15 -18 - 19.51 1d -25 - 26.82
atzb - x0 - 256 -4-0- cn [ zigbit 900mhz wireless modules ] 42268b ? wireless ? 07/2014 9 3.1.4 at xmega256a3u microcontroller c haracteristics table 3 -5. at xmega256a3u c haracteristics parameter range unit on - chip flash memory size 256k bytes on - chip ram size 16k bytes on - chip eeprom size 4k bytes operation frequency 16 mhz 3.1.5 module interfaces c haracteristics table 3 -6. module interfaces c haracteristics (1) parameters condition range unit uart maximum baud rate 115.2 kbps adc conversion time (latency) (res+2)/2+(gain !=0) res (resolution) = 8 or 12 5-8 clk adc cycles adc input resistance static load resistor of input signal 4.0 k adc reference voltage (v ref ) 1. 0 to av cc C 0.6 v adc input voltage 0 - av dd v twi maximum clock 400 khz gpio high level input voltage v cc = 2.7 - 3.6v 2 to v cc +0.3 v gpio low level input voltage v cc = 2.7 - 3.6v - 0.3 to 0.3 v dd v gpio high level output voltage v oh v cc = 3.0 - 3.6v 2.4 to 0.94 v cc v gpio low level output voltage v ol v cc = 3.0 - 3.6v 0.05 v cc typ. max . 0.4 v real - time oscillator frequency 32.768 khz note 1: for detailed characteristics, refer to [1] . 3.2 physical/environmental characteristics and o utline table 3 -7. physical characteristics parameters value comments size 38.5 x 20.0 mm operating temperature range - 40c to +85c - 40c to +85c operational
atzb - x0 - 256 -4-0- cn [ zigbit 900mhz wireless modules ] 42268b ? wireless ? 07/2014 10 3.3 pin configuration table 3 -8. atzb -x0- 256 -4-0- cn pinout d escription pin o ut pin descriptions function 1 avss analog ground 2 avss analog ground 3 devdd digital power input pin 4 devdd digital power input pin 5 rset/pdi_clock reset 6 pd4/ss spi 7 pd5/mosi/xck1 spi 8 pd6/miso/rxd1/d - spi 9 pd7/sck/txd1/d+ spi 10 pa5 gpio / adc / analog comp+ 11 pa4 gpio/adc/analog comp - 12 dvss digital ground 13 pd2/sync/async/oc0c/ uart 14 pd3/sync/txd0/oc0d uart 15 pd1/scl/int/oc0b usart 16 pdi_data pwm/tc 17 pa6 gpio/adc 18 pa7 gpio/adc 19 pb3 gpio/adc/dac1 20 pb2 gpio/adc/dac/intwkup 21 pf1/oc0b/int/xck0 int/pwm/gpio 22 pf2/oc0c/int/rxd0 int/pwm/gpio 23 pf3/oc0d/int/txd0 int/pwm/gpio 24 pb0/iaref/int adc ref 25 pa0/adc0/int adc/ gpio 26 pa1/adc1/int adc/ gpio 27 pa2/adc2/int adc/ gpio 28 pa3/adc3/int adc/ gpio 29 dvss digital ground 30 pb6/tck/int jtag 31 pb4/tms/int jtag 32 pb7/tdo/int jtag 33 pb5/tdi/int jtag 34 pe3/txd gpio/output counter 35 pe2/rxd wakeup int 36 pe1/xck twi/int/gpio 37 pe0 twi/int/gpio 38 pe5/oc1b/int gpio/tc 39 pe4/sync/oc1a master clock out put
atzb - x0 - 256 -4-0- cn [ zigbit 900mhz wireless modules ] 42268b ? wireless ? 07/2014 11 pin o ut pin descriptions function 40 pf0 gpio/timer 41 dvss digital ground 42 dvss digital ground note: txd, rxd of uart are crossed inside zigbit module. external uart devices connecting to zigbit module should follow straight connection for uart. uart_txd_external_device < - > uart_txd uart_rxd_external_device < - > uart_rxd 3.4 antenna orientation recommendation the antenna in this module is designed to provide the best possible los range in the direction indicated in this illustration. 3.5 mounting i nformation figure 3 -1 shows the pcb layout recommended for a zigbit module. neither via- holes nor wires are allowed on the pcb upper layer in the area occupied by the module. as a critical requirement, rf_gnd pins should be grounded via several via - holes to be located right next to the pins thus minimizing inductance and preventing both mismatch and losses. figure 3 - 1. atzb -x0- 256 -4-0-cn dimensions
atzb - x0 - 256 -4-0- cn [ zigbit 900mhz wireless modules ] 42268b ? wireless ? 07/2014 12 figure 3 - 2. atzb -x0- 256 -4-0-cn pinout figure 3 - 3. atzb -x0- 256 -4-0-cn foot print dimensions
atzb - x0 - 256 -4-0- cn [ zigbit 900mhz wireless modules ] 42268b ? wireless ? 07/2014 13 figure 3 - 4. atzb -x0- 256 -4-0- cn mounting information ( preferred p lacement) figure 3 - 5. atzb -x0- 25 6-4-0- cn mounting information (a lternative p lacement) the zigbits location and orientation on the carrier board is illustrated in the above pcb land pattern and mounting information drawing. the recommended placement of zigbit on carrier board needs to be accurately followed to ensure performance on the end application .
atzb - x0 - 256 -4-0- cn [ zigbit 900mhz wireless modules ] 42268b ? wireless ? 07/2014 14 3.6 soldering p rofile the j - std - 020c - compliant soldering profile is recommended according to table 3 -9 . table 3 -9. soldering profile (1) profile feature green package average ramp - up rate (217c to peak) 3c/s max . preheat temperature 175c 25c 180s max . temperature maintained above 217c 60s to 150s time within 5c of actual peak temperature 20s to 40s peak temperature range 260c ramp - down rate 6c/s max . time within 25c to peak temperature 8 minutes note: 1. the package is backward compatible with pb/sn soldering profile. 3.7 antenna reference d esigns multiple factors affect proper antenna match, hence, affecting the antenna pattern. the particular factors are the board material and thickness, shields, the material used for enclosure, the board neighborhood, and other components adjacent to antenna. following guidelines need to be followed when designing the base board for the zigbit. general recommendations: ? metal enclosure should not be used. using low profile enclosure might also affect antenna t uning. ? placing high profile components ne xt to antenna should be avoided ? having holes/vias punched around the periphery of the board eliminates parasitic radiation from the board edges also distorting antenna pattern ? zigbit module should not be placed next to consumer electronics which might interfere with zigbits rf band frequency the board design should prevent propagation of microwave field inside the board material. electromagnetic waves of high frequency may penetrate the board thus making the edges of the board radiate, which may distort the antenna pattern. to eliminate this effect, metalized and grounded holes/vias must be placed around the board's edges.
atzb - x0 - 256 -4-0- cn [ zigbit 900mhz wireless modules ] 42268b ? wireless ? 07/2014 15 4. s chematics the following schematic drawings for the atzb - x0 - 256 -4-0- cn are in the following order: ? top level schematics ? connector schematics ? atxmega256a3u schematics ? at86rf212b schematics
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1 1 2 2 3 3 4 4 5 5 6 6 7 7 8 8 d d c c b b a a a08-1567 xmega_212b_rf.schdoc 22 08-jul-14 4:02:24 pm atzb-x0-256-4-0-cn atmel india rmz millenia mgr road chennai page: of title: document number: revision: 5 date: ojs msk msk gnd gnd reset_n slp_tr clkm dig3 dig4 irq nsel mosi sclk miso dig2 dig1 gnd gnd l 3&%5xoh l 3&%5xoh an_vcc_3v3 vcc_3v3 dig4 2 avss 3 rfp 4 rfn 5 avss 6 dvss 7 /rst 8 dig1 9 dig2 10 slp_tr 11 dvss 12 dvdd 13 dvdd 14 devdd 15 dvss 16 clkm 17 dvss 18 sclk 19 miso 20 dvss 21 mosi 22 /sel 23 irq 24 xtal2 25 xtal1 26 avss 27 evdd 28 avdd 29 avss 30 avss 31 avss 32 dig3 1 pad 33 $75)%=8 8 gnd 50ohm 1 gnd 2 bal 3 bal 4 gnd 5 gnd 6 )%$ % gnd 5 5 5 5 x) & x) & x) & x) & s) & s) & s) & ) ) 5 5 5)b1 5)b3 feed point 1 nc 2 $7$ $ rf_in 1 rf_out 2 gnd 3 gnd 4 06 - gnd_rf gnd_rf gnd_rf gnd_rf gnd_rf gnd_rf gnd_rf gnd_rf 1 3 2 4 0+] q1 s) & gnd_rf gnd_rf irq nsel mosi sclk miso slp_tr reset_n dig2 trx_i/f 75;bq6(/ 75;b6&. 75;b026, 75;b0,62 75;bq567 75;b,54 75;b',* 6/3b75 &/.0 75;b,) clkm q+ / q+ / gnd_rf s) & 3odfhghfrxsolqjforvhu wr75; 3odfhghfrxsolqjforvhu wr75; s) s) 3odfh[wdoflufxlwforvhu wr75;,vrodwhiurp gljlwdovljqdov /d\rxw 0dlqwdlqwzrjurxqgsodqhvdqg wzrsrzhusodqhv
1 1 2 2 3 3 4 4 5 5 6 6 7 7 8 8 d d c c b b a a a08-1567 xmega_212b_connector.schdoc 24 08-jul-14 4:02:24 pm atzb-x0-256-4-0-cn atmel norway vestre rosten 79 n-7075 tiller norway page: of title: document number: revision: 5 date: ojs msk * 3$b$'&b,17 3%b7&.b,17 3%b7'2b,17 3%b7',b,17 3%b706b,17 3% 3% 3$ 3$b$'&b,17 3$b$'&b,17 3$b$'&b,17 3)b2&%b,17b;&. 3$ 3$ 3$ vcc_3v3 gnd gnd 3'b66 3'b026,b;&. 86%'b3 86%'b1 gnd vcc_3v3 gnd gnd gnd 3)b2&&b,17b5;' 3)b2&'b,17b7;' 3' 3' 3' 3' 63,,17(5)$&( 3$ 3$ 3$ 3$ 3$ 3$ $5() *3,2$'& 3% 3% *3,2$'&'$& 3) 3) 3) ,173:0*3,2 3$ 3$ *3,2$'&$1$/2*&203 3% 3% 3% 3% q567 -7$* 3'b66 3'b026,b;&. 86%'b1 86%'b3 3$b$'&b,17 3$b$'&b,17 3$b$'&b,17 3$b$'&b,17 3$ 3$ 3% 3% 3$ 3$ 3%b706b,17 3%b7',b,17 3%b7&.b,17 3%b7'2b,17 3)b2&%b,17b;&. 3)b2&&b,17b5;' 3)b2&'b,17b7;' gpio/adc/analogcomp gpio/adc/dac gpio/adc spi interface jtag int/pwm/gpio q567 q567 3%b$5()b,17 3%b$5()b,17 3(b6<1&b2&$ 3(b2&%b,17 3',b'$7$ 3) 1 2 3 4 (0,6klhog = gnd 1 gnd 2 vdd 3 vdd 4 rset/pdi_clock 5 pd4/ss 6 pd5/mosi/xck1 7 pd6/miso/rxd1/d- 8 pd7/sck/txd1/d+ 9 pa5 10 pa4 11 gnd 12 pd2/rxd0 13 pd3/txd0 14 pd1/xck0 15 pdi_data 16 pa6 17 pa7 18 pb3 19 pb2 20 pf1/oc0b/int/xck0 21 pf2/oc0c/int/rxd0 22 pf3/oc0d/int/txd0 23 pb0/iaref/int 24 pa0/adc0/int 25 pa1/adc1/int 26 pa2/adc2/int 27 pa3/adc3/int 28 pb6/tck/int 30 pb4/tms/int 31 pb7/tdo/int 32 pb5/tdi/int 33 pe3 34 pe2/async 35 pe1/scl 36 pe0/sda 37 pe5/oc1b/int 38 gnd 41 gnd 29 pe4/sync/oc1a 39 gnd 42 pf0 40 $7=%;&1 = 3( 3( 3( 3( 7:, 3(b6&/ 3(b$6<1& 3(b*3,2 twi 3(b6'$ 3' 3' 3' 8$5786$57 3'b;&. 3'b5;' 3'b7;' uart/usart 3(b6<1&b2&$ 3(b2&%b,17 3) 3',b'$7$ 3) 3', 3( 3( 3',*3,2 pdi/gpio 3'b;&. 3'b5;' 3'b7;' 3(b6'$ 3(b6&/ 3(b$6<1& 3(b*3,2
1 1 2 2 3 3 4 4 5 5 6 6 7 7 8 8 d d c c b b a a a08-1567 xmega_212b_mcu.schdoc 34 08-jul-14 4:02:24 pm atzb-x0-256-4-0-cn atmel india rmz millenia mgr road chennai page: of title: document number: revision: 5 date: ojs msk * vcc_3v3 gnd gnd gnd vcc_3v3 vcc_3v3 q567 3&b75;bq567 vcc_3v3 vcc_3v3 q567 gnd gnd gnd vcc_3v3 vcc_3v3 clkm l 3&%5xoh l 3&%5xoh 3(b6<1&b2&$ 3$ 3$ 3% 3% 3$ 3$ 3$b$'&b,17 3$b$'&b,17 3$b$'&b,17 3$b$'&b,17 3%b7&.b,17 3%b7'2b,17 3%b7',b,17 3%b706b,17 3'b66 3'b026,b;&. 3(b2&%b,17 3)b2&%b,17b;&. 3)b2&&b,17b5;' 3)b2&'b,17b7;' 3&b75;b',* 3&b75;b,54 3&b75;b6/3b75 3&b75;b63,b66 3&b75;b63,b6&. 3&b75;b63,b026, 3&b75;b63,b0,62 tosc1 tosc2 75;bq6(/ 75;b6&. 75;b026, 75;b0,62 75;bq567 75;b,54 75;b',* 6/3b75 &/.0 75;b,) 3&b75;b63,b66 3&b75;b63,b6&. trx_i/f 3&b75;b63,b026, 3&b75;b63,b0,62 3&b75;b',* 3&b75;b,54 3&b75;b6/3b75 3&b75;bq567 tosc1 tosc2 . 5 86%'b3 86%'b1 )&n+] ;& an_vcc_3v3 vcc_3v3 %/0%%61 / gnd gnd gnd gnd vcc_3v3 gnd gnd_rf %/0%%61 / gnd q & q & q & q & x)9 & gnd q & gnd q & gnd vcc_3v3 pa7(adca7/aca7) 5 pb0(adcb0/acb0/arefb) 6 pb1(adcb1/acb1) 7 pb2(adcb2/acb2/dacb0) 8 pb3(adcb3/acb3/dacb1) 9 pb4(adcb4/acb4/tms) 10 pc4(ss/oc1a/oc0cls) 20 pc5(xck1/mosi/oc1b/oc0chs) 21 pc6(rxd1/miso/oc0dls) 22 pc7(txd1/sck/oc0dhs) 23 pd1(xck0/oc0b) 27 pd0(oc0a) 26 pd3(txd0/oc0d) 29 pd4(ss/oc1a) 30 pd5(mosi/xck1/oc1b) 31 pd6(miso/rxd1/d-) 32 (d+/txd1/sck)pd7 33 gnd 24 vcc 25 (oc0a)pf0 46 (oc0b/xck0)pf1 47 (oc0c/rxd0)pf2 48 (oc0d/txd0)pf3 49 (oc0a)pf4 50 pf5 51 pf6 54 pf7 55 vcc 45 gnd 44 (aca2/adca2)pa2 64 (aca1/adca1)pa1 63 (arefa/aca0/adca0)pa0 62 avcc 61 gnd 60 (xtal1)pr1 59 (xtal2)pr0 58 pdi_clk/reset 57 pa3(adca3/aca3) 1 pa4(adca4/aca4) 2 pa5(adca5/aca5) 3 pa6(adca6/aca6) 4 pb5(adcb5/acb5/tdi) 11 pb6(adcb6/acb6/tck) 12 pb7(adcb7/acb7/tdo) 13 gnd 14 vcc 15 pc0(sda/oc0a/oc0als) 16 pc1(scl/xck0/oc0b/oc0ahs) 17 pc2(rxd0/oc0c/oc0bls) 18 pc3(txd0/oc0d/oc0bhs) 19 gnd 34 vcc 35 pd2(rxd0/oc0c) 28 (oc0a/sda)pe0 36 (oc0b/xck0/scl)pe1 37 (oc0c/rxd0)pe2 38 (oc0d/txd0)pe3 39 (oc1a)pe4 40 (oc1b)pe5 41 pe6 42 pe7 43 vcc 53 gnd 52 pdi_data 56 pad_gnd 65 $7[phjd$80+ 8 gnd 3) 3) 3) ,173:0*3,2 3% 3% 3% 3% q567 -7$* 3%b706b,17 3%b7',b,17 3%b7&.b,17 3%b7'2b,17 3)b2&%b,17b;&. 3)b2&&b,17b5;' 3)b2&'b,17b7;' jtag int/pwm/gpio 3' 3' 3' 3' 63,,17(5)$&( 3$ 3$ 3$ 3$ 3$ 3$ $5() *3,2$'& 3% 3% *3,2$'&'$& 3$ 3$ *3,2$'&$1$/2*&203 3'b66 3'b026,b;&. 86%'b1 86%'b3 3$b$'&b,17 3$b$'&b,17 3$b$'&b,17 3$b$'&b,17 3$ 3$ 3% 3% 3$ 3$ gpio/adc/analogcomp gpio/adc/dac gpio/adc spi interface q567 3%b$5()b,17 3%b$5()b,17 3) 3',b'$7$ clkm 3( 3( 3( 3( 7:, 3(b6&/ 3(b$6<1& 3(b*3,2 twi 3(b6'$ 3' 3' 3' 8$5786$57 3'b;&. 3'b5;' 3'b7;' uart/usart 3(b6<1&b2&$ 3(b2&%b,17 3) 3',b'$7$ 3) 3', 3( 3( 3',*3,2 pdi/gpio 3(b6'$ 3(b6&/ 3(b$6<1& 3(b*3,2 3'b;&. 3'b5;' 3'b7;' s) & s) & 3odfh[wdoflufxlwforvhu wr0&8,vrodwhiurp gljlwdovljqdov 3odfhghfrxsolqjforvhu wr0&8 3odfhx)forvhuwr 9fflqsxwiruprgxoh
atzb - x0 - 256 -4-0- cn [ zigbit 900mhz wireless modules ] 42268b ? wireless ? 07/2014 20 4.1 handling instructions the zigbit modules are fixed with an emi shield to ensure compliance to emission and immunity rules. this shield is galvanic and not air tight. so cleaning of the module with ipa / other similar agents is not advised. humidity protection coating (conformal) will cause deviated rf behavior and coating material being trapped inside emi shield. so thi s should be avoided. for products requiring conformal coating, it is advised to suitably mask the zigbit before applying the coating to rest of the zigbit carrier board. to protect zigbit from humidity, the housing of the product should ensure suitable ingress protection standards are complied with. the ms - 147 connector should never be exposed to varnish / similar conformal coating material which will affect electrical connection on the surfaces of connector. the in - built chip antenna has been tuned for the particular design . 4.2 general r ecommendations ? metal enclosure should not be used. using low profile enclosure might also affect antenna tuning . ? placing high profile components next to antenna should be avoided ? having holes/vias punched around the periphery of the board eliminates parasitic radiation from the board edges also distorting antenna pattern ? zigbit module should not be placed next to consumer electronics which might interfere with zigbit's rf frequency band
atzb - x0 - 256 -4-0- cn [ zigbit 900mhz wireless modules ] 42268b ? wireless ? 07/2014 21 5. persistence memory a dedicated memory space is allocated to store product specific information and called the persistence memory. the organization of the persistence memory is as follows: table 5 -1. persistence memory data size structure revision 2 bytes mac address (1) 8 bytes board information overall 49 bytes board information C pcba name 30 bytes board information C pcba serial number 10 bytes board information C pcba atmel part number 8 bytes board information C pcba revision 1 byte reserved 3 bytes xtal calibration value 1 byte reserved 7 bytes reserved 4 bytes crc 1 byte in atzb - x0 - 256 -4-0-cn , the persistence memory is stored in user signature row of atxmega256a3u m icrocontroller starting from address 0x0000. this section is not erased by chip erase and requires a dedicated erase command. the user signature row is a separate memory section that is fully accessible (read and write) from application software and external programmers. see section read user signature row / production signature row under section nvm flash commands in xmega au manual [1] for details in reading the user signature data from application software. note: 1. the mac address stored inside the mcu is a uniquely assigned id for each zigbit and owned by atmel. user of the zigbit application can use this unique mac id to address the zigbit in end - applications. the mac id can be read from the zigbit using the performance analyzer application that is supplied through atmel studio gallery extension.
atzb - x0 - 256 -4-0- cn [ zigbit 900mhz wireless modules ] 42268b ? wireless ? 07/2014 22 6. ordering information table 6 -1. ordering i nformation part number description atzb - x0 -256 -4-0-cn 900 mhz ieee802.15.4/zigbee oem module based on atxmega256a3u mcu and at86 rf212b transceiver with ms - 147 test connector and chip antenna, single unit atzb - x0 -256 -4-0-cn r 900 mhz ieee802.15.4/zigbee oem module based on atxmega256a3u mcu and at86 rf212b transceiver with ms - 147 test connector and chip antenna, tape & reel note: tape & r eel quantity: 200.
atzb - x0 - 256 -4-0- cn [ zigbit 900mhz wireless modules ] 42268b ? wireless ? 07/2014 23 7. agency certifications 7.1 united states (fcc) this equipment complies with part 15 of the fcc rules and regulations. to fulfill fcc certification requirements, an oem manufacturer must comply with the following regulations: 1. the atzb - x0 - 256 -4-0- cn modular transmitter must be labeled with its own fcc id number, and, if the fcc id is not visible when the module is installed inside another device, then the outside of the de vice into which the module is installed must also display a label referring to the enclosed module. this exterior label can use wording such as the following: important : contains fcc id: vw4a091745. this equipment complies with part 15 of the fcc rules. op eration is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation (fcc 15.19). the internal antenna used for this mobile transmitter must provide a separation distance of at least 20 cm from all persons and must not be collocated or operating in conjunction with any other antenna or transmitter. installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying rf exposure compliance. this device is approved as a mobile device with respect to rf exposure compliance, and may only be marketed to oem installers. use in portable exposure conditions (fcc 2.1093) requires separate equipment authorization. important : modifications not expressly approved by this company could void the user's authority to operate this equipment (fcc section 15.21). important : this equipment has been tested and found to comply with the limits for a class a digital device, pursuant to part 15 of the fcc rules. these limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. this equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense (fcc section 15.105). 7.2 european union (etsi) the atzb - x0 - 256 -3-0- c module has been certified for use in european union countries. if these modules are incorporated into a product, the manufacturer must ensure compliance of the final product to the european harmonized emc and lowvoltage/safety standards. a declaration of conformity must be issued for each of these standards and kept on file as described in annex ii of the r&tte directive.
atzb - x0 - 256 -4-0- cn [ zigbit 900mhz wireless modules ] 42268b ? wireless ? 07/2014 24 furthermore, the manufacturer must maintain a copy of the modules' documentation and ensure the final product does not exceed the specified power ratings, antenna specifications, and/or installation requirements as specified in the us er manual. if any of these specifications are exceeded in the final product, a submission must be made to a notified body for compliance testing to all required standards. important : the 'ce' marking must be affixed to a visible location on the oem product. the ce mark shall consist of the initials "ce" taking the following form: the ce marking must have a height of at least 5mm except where this is not possible on account of the nature of the apparatus. the ce marking must be affixed visibly, legibly, and indelibly. more detailed information about ce marking requirements you can find at "directive 1999/5/ec of the european parliament and of the council" on 9 march 1999 at section 12. 7.3 industry canada (ic) compliance s tatements this device complies with industry canada licence - exempt rss standard(s). operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. le prsent appareil est conforme aux cnr d'industrie canada applicables aux appareils radio exempts de licence. l'exploitation est autorise aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnem ent. this equipment complies with radio frequency exposure limits set forth by industry canada for an uncontrolled environment. this equipment should be installed and operated with minimum distance 20cm between the device and the user or bystanders. cet quipement est conforme aux limites d'exposition aux radiofrquences dfinies par industrie canada pour un environne ment non contr?l. cet quipement doit tre install et utilis avec un minimum de 20cm de distance entre le dispositif et l'utilisateur ou des tiers. caution: any changes or modifications not expressly approved by the party responsible for compliance could void the users authority to operate the equipment. the oem integrator is still responsible for testing their end - product for any additional compliance requirements required with this module installed (for example, digital device emissions, pc peripher al requirements, etc.). this module is labelled with its own ic id. if the ic id certification number is not visible while installed inside another device, then the device should display the label on it referring the enclosed module. in that case, the final end product must be labelled in a visible area with the following: contains transmitter module ic: 11019a - 091745 or contains ic: 11019a - 091745 ce module est tiquet avec son propre id ic. si le numro de certification ic id n'est pas visible lorsqu 'il est install l'intrieur d'un autre appareil, l'appareil doit afficher l'tiquette sur le module de rfrence ci - joint. dans ce cas, le produit final doit tre tiquet dans un endroit visible par le texte suivant: contains transmitter module ic: 11 019a - 091745 or contains ic: 11019a - 091745
atzb - x0 - 256 -4-0- cn [ zigbit 900mhz wireless modules ] 42268b ? wireless ? 07/2014 25 8. revision h istory doc. rev. date comments 42268b 07/2014 updated sc h ematics page s 16 to 19 42268a 04/2014 initial document release
atmel corporation 1600 technology drive san jose, ca 95110 usa tel: (+1)(408) 441 - 0311 fax: (+1)(408) 487 - 2600 www.atmel.com atmel asia limited unit 01 - 5 & 16, 19f bea tower, millennium city 5 418 kwun tong road kwun tong, kowloon hong kong tel: (+852) 2245 - 6100 fax: (+852) 2722 - 1369 atmel munich gmbh business campus parkring 4 d - 85748 garching b. munich germany tel: (+49) 89 - 31970 -0 fax: (+49) 89 - 3194621 atmel j apan g.k. 16f shin - osaki kangyo building 1 -6- 4 osaki , shinagawa-ku tokyo 141 - 0032 japan tel: (+81)(3) 6417 - 0300 fax: (+81)(3) 6417 - 0370 ? 201 4 atmel corporation. all rights reserved. / rev.: 42268b ? wireless ? 07 /2014 atmel ? , atmel logo and combinations thereof, avr ? , bitcloud ? , enabling unlimited possibilities ? , zigbit ? , xmega ? , and others are registered trademarks or trademarks of atmel corporation or its subsidiaries. other terms and product names may be trademarks of others. disclaimer: the information in this document is provided in connection with atmel products. no license, express or implied, b y estoppel or otherwise, to any intellectual prope rty right is granted by this document or in connection with the sale of atmel products. except as set forth in the atmel terms and conditions of sales loc ated on the atmel website, atmel assumes no liability whatsoever and disclaims any express, implied or statutory warranty relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or non - infringement. in no event shall atmel be liable for any direct, indirect, consequential, punitive, special or incidental damages (including, without limitation, damages for loss and profits, business interruption, or loss of information) arising out of the use or inability to use this document, even if atmel has been advised of the possibility of s uch damages. atmel makes no representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and products descriptions at any time without notice. atmel does no t make any commitment to update the information contained herein. unless specifically provided otherwise, atmel products are not suitable for, and shall not be used in, automotive applications. atmel products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life.

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