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pc714vxnszxf series 1. recognized by ul1577 (double protection isolation), file no. e64380 (as model no. pc714v ) 2. approved by vde, din en60747-5-2 ( ? ) (as an option), file no. 40008189 (as model no. pc714v ) 3. package resin : ul flammability grade (94v-0) ( ? ) din en60747-5-2 : successor standard of din vde0884 features agency approvals/compliance 1. home appliances 2. programmable controllers 3. personal computer peripherals applications dip 6 pin general purpose photocoupler 1. 6 pin dip package 2. double transfer mold package (ideal for flow soldering) 3. high collector-emitter voltage (v ceo :80v) 4. high isolation voltage between input and output (v iso(rms) : 5.0kv) 5. lead-free and rohs directive compliant description pc714vxnszxf series contains an ired optically coupled to a phototransistor. it is packaged in a 6 pin dip. input-output isolation voltage(rms) is 5.0kv. collector-emitter voltage is 80v and ctr is 50% to 600% at input current of 5ma. 1 sheet no.: d2-a04102en date jun. 30. 2005 ?sharp corporation notice the content of data sheet is subject to change without prior notice. in the absence of confirmation by device specification sheets, sharp takes no responsibility for any defects that may occur in equipment using any sharp devices shown in catalogs, data books, etc. contact sharp in order to obtain the latest device specification sheets before usin g any sharp device. pc714vxnszxf series
internal connection diagram anode cathode nc emitter 1 1 2 3 4 collector 5 nc 6 2 6 5 3 4 plating material : sncu (cu : typ. 2%) product mass : approx. 0.36g product mass : approx. 0.36g 2 sheet no.: d2-a04102en outline dimensions (unit : mm) 1. through-hole [ex. pc714vxnszxf ] 2. through-hole (vde option) [ex. pc714vxyszxf ] 7.12 0.5 : 0 to 13? 7.62 0.3 epoxy resin 6.5 0.5 0.6 0.2 1.2 0.3 1 2 3 6 5 4 0.5 typ. 2.9 0.5 0.5 0.1 2.54 0.25 3.25 0.5 3.5 0.5 rank mark pc714v sharp mark "s" date code anode mark factory identification mark 7.12 0.3 : 0 to 13? 7.62 0.3 epoxy resin 6.5 0.5 0.6 0.2 1.2 0.3 1 2 3 6 5 4 0.5 typ. 2.9 0.5 0.5 0.1 2.54 0.25 3.25 0.5 3.5 0.5 rank mark 4 vde identification mark anode mark pc714v sharp mark "s" date code factory identification mark pc714vxnszxf series
date code (2 digit) a.d. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 mark a b c d e f h j k l m n mark p r s t u v w x a b c mark 1 2 3 4 5 6 7 8 9 o n d month january february march april may june july august september october november december a.d 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2nd digit month of production 1st digit year of production 3 repeats in a 20 year cycle sheet no.: d2-a04102en pc714vxnszxf series rank mark refer to the model line-up factory identification mark factory identification mark no mark country of origin japan indonesia china * this factory marking is for identification purpose only. please contact the local sharp sales reprsentative to see the actual status of the production.
sheet no.: d2-a04102en electro-optical characteristics parameter conditions forward voltage peak forward voltage reverse current terminal capacitance collector dark current transfer charac- teristics emitter-collector breakdown voltage current transfer ratio collector-emitter breakdown voltage collector-emitter saturation voltage isolation resistance cut-off frequency floating capacitance min. ? ? ? ? ? 6 2.5 ? 5 10 10 ? ? ? ? typ. 1.2 ? ? 30 ? ? ? ? 0.1 1 10 11 0.6 80 4 3 max. 1.4 3.0 10 250 100 ? ? 30.0 0.2 ? 1.0 ? 18 18 unit v v a v pf na v ma v ? khz pf s s symbol v f v fm i r c t i ceo bv ceo bv eco i c v ce (sat) f c c f t r t f r iso response time rise time fall time input output i f = 20ma i fm = 0.5a v r = 4v v = 0, f = 1khz v ce = 50v, i f = 0 i c = 0.1ma, i f = 0 i e = 10 a, i f = 0 i f = 5ma, v ce = 5v dc500v, 40 to 60%rh v ce = 2v, i c = 2ma, r l = 100 ? v ce = 5v, i c = 2ma, r l = 100 ? ? 3db v = 0, f = 1mhz i f = 20ma, i c = 1ma 80 (t a = 25?c) absolute maximum ratings (t a = 25?c) parameter symbol unit input forward current ma *1 peak forward current a power dissipation reverse voltage mw v output collector-emitter voltage v emitter-collector voltage v collector current ma collector power dissipation mw *2 isolation voltage operating temperature total power dissipation ?c mw storage temperature ?c *3 soldering temperature i f i fm p v r v ceo v eco i c p c v iso (rms) t opr p tot t stg t sol ?c *1 pulse width 100 s, duty ratio : 0.001 *2 40 to 60%rh, ac for 1minute, f=60hz *3 for 10s rating 50 1 70 6 80 6 50 150 ? 25 to + 100 170 ? 40 to + 125 260 5kv 4 pc714vxnszxf series
sheet no.: d2-a04102en model line-up 2.5 to 30.0 4.0 to 8.0 6.5 to 13.0 10.0 to 20.0 4.0 to 13.0 6.5 to 20.0 4.0 to 20.0 pc714v0nszxf pc714v1nszxf pc714v2nszxf pc714v3nszxf pc714v5nszxf PC714V6NSZXF pc714v8nszxf pc714v0yszxf pc714v1yszxf pc714v2yszxf pc714v3yszxf pc714v5yszxf pc714v6yszxf pc714v8yszxf rank mark with or without a b c a or b b or c a, b or c ?????? approved lead form package model no. din en60747-5-2 sleeve through-hole 50pcs/sleeve i c [ma] (i f = 5ma, v ce = 5v, t a = 25?c) 5 please contact a local sharp sales representative to inquire about production status. pc714vxnszxf series
sheet no.: d2-a04102en fig.5 peak forward current vs. duty ratio 50?c 25?c 0?c 0 0.5 1 1.5 2 2.5 3 3.5 forward voltage v f (v) forward current i f (ma) ? 25?c t a = 75?c 10 100 1 fig.3 collector power dissipation vs. ambient temperature 0 30 0 100 125 40 50 60 20 10 forward current i f (ma) -25 25 75 ambient temperature t a (?c) 50 55 fig.1 forward current vs. ambient temperature 6 fig.6 forward current vs. forward voltage duty ratio 0.01 0.1 1 10 1 peak forward current i fm (a) 10 ? 3 10 ? 2 10 ? 1 pulse width 100 s t a = 25?c 0 0 125 100 200 50 150 25 50 75 100 collector power dissipation p c (mw) ambient temperature t a (?c) ? 25 pc714vxnszxf series fig.2 diode power dissipation vs. ambient temperature fig.4 total power dissipation vs. ambient temperature diode power dissipation p (mw) 100 80 70 60 40 20 0 025 75 100 125 ? 25 ambient temperature t a (?c) 55 50 total power dissipation p tot (mw) ambient temperature t a (?c) 50 0 025507 5 100 125 ? 25 100 150 170 200 250
sheet no.: d2-a04102en 7 25 0 ? 25 50 75 10 ? 10 100 10 ? 9 10 ? 8 10 ? 7 10 ? 6 10 ? 5 10 ? 11 ambient temperature t a (?c) collector dark current i ceo (a) v ce = 50v fig.11 collector dark current vs. ambient temperature 100 0 50 150 0507 5 100 ? 25 25 ambient temperature t a (?c) relative current transfer ratio (%) i f = 5ma v ce = 5v fig.9 relative current transfer ratio vs. ambient temperature 0.02 0.04 0.06 0.08 0.1 0.12 0.14 020406 080 100 ambient temperature t a (?c) collector-emitter saturation voltage v ce (sat) (v) ? 25 i f = 20ma i c = 1ma fig.10 collector - emitter saturation voltage vs. ambient temperature 0.1 1 10 100 load resistance r l (k ? ) response time ( s) t d t s t f t r v ce = 2v i c = 2ma t a = 25?c 0.1 1 10 fig.12 response time vs. load resistance 0 200 1 40 80 120 160 180 140 100 60 20 10 forward current i f (ma) current transfer ratio ctr (%) v ce = 5v t a = 25?c fig.7 current transfer ratio vs. forward current 0 0 5 30 123456789 10 15 20 25 20ma 10ma 5ma collector current i c (ma) collector-emitter voltage v ce (v) i f = 30ma t a = 25?c p c (max.) fig.8 collector current vs. collector- emitter voltage pc714vxnszxf series
sheet no.: d2-a04102en 8 remarks : please be aware that all data in the graph are just for reference and not for guarantee. fig.15 test circuit for frequency response v cc r l output r d v ce please refer to the conditions in fig.14 pc714vxnszxf series fig.13 test circuit for response time 90% 10% output input r l input v cc r d t d t s t r t f output v ce please refer to the conditions in fig.12 ? 20 0 1 ? 10 100 10 voltage gain a v (db) frequency f (khz) r l = 10k ? 1k ? 100 ? v ce = 5v i c = 2ma t a =25?c fig.14 frequency response
sheet no.: d2-a04102en while operating at i f <1.0ma, ctr variation may increase. please make design considering this fact. this product is not designed against irradiation and incorporates non-coherent ired. degradation in general, the emission of the ired used in photocouplers will degrade over time. in the case of long term operation, please take the general ired degradation (50% degradation over 5 years) into the design consideration. ? for additional design assistance, please review our corresponding optoelectronic application notes. 9 design guide design considerations pc714vxnszxf series
sheet no.: d2-a04102en manufacturing guidelines soldering method flow soldering : due to sharp's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. flow soldering should be completed below 270?c and within 10s. preheating is within the bounds of 100 to 150?c and 30 to 80s. please don't solder more than twice. hand soldering hand soldering should be completed within 3s when the point of solder iron is below 400?c. please don't solder more than twice. other notices please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and pcb varies depending on the tooling and soldering conditions. 10 pc714vxnszxf series
sheet no.: d2-a04102en solvent cleaning: solvent temperature should be 45?c or below immersion time should be 3 minutes or less ultrasonic cleaning: the impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of pcb and mounting method of the device. therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. recommended solvent materials: ethyl alcohol, methyl alcohol and isopropyl alcohol in case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin. cleaning instructions this product shall not contain the following materials. and they are not used in the production process for this product. regulation substances : cfcs, halon, carbon tetrachloride, 1.1.1-trichloroethane (methylchloroform) specific brominated flame retardants such as the pbbos and pbbs are not used in this product at all. this product shall not contain the following materials banned in the rohs directive (2002/95/ec). ?ead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (pbb), polybrominated diphenyl ethers (pbde). presence of odc 11 pc714vxnszxf series
sheet no.: d2-a04102en package specification 12 12.0 6.7 5.8 10.8 520 2 pc714vxnszxf series sleeve package package materials sleeve : hips (with anti-static material) stopper : styrene-elastomer package method max. 50 pcs. of products shall be packaged in a sleeve. both ends shall be closed by tabbed and tabless stoppers. the product shall be arranged in the sleeve with its anode mark on the tabbed stopper side. max. 20 sleeves in one case. sleeve outline dimensions (unit : mm)
?the circuit application examples in this publication are provided to explain representative applications of sharp devices and are not intended to guarantee any circuit design or license any intellectual property rights. sharp takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of sharp's devices. ?contact sharp in order to obtain the latest device specification sheets before using any sharp device. sharp reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. manufacturing locations are also subject to change without notice. ?observe the following points when using any devices in this publication. sharp takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) the devices in this publication are designed for use in general electronic equipment designs such as: --- personal computers --- office automation equipment --- telecommunication equipment [terminal] --- test and measurement equipment --- industrial control --- audio visual equipment --- consumer electronics (ii) measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when sharp devices are used for or in connection with equipment that requires higher reliability such as: - -- transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- traffic signals --- gas leakage sensor breakers --- alarm equipment --- various safety devices, etc. (iii) sharp devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- space applications --- telecommunication equipment [trunk lines] --- nuclear power control equipment - -- medical and other life support equipment (e.g., scuba). ?if the sharp devices listed in this publication fall within the scope of strategic products described in the foreign exchange and foreign trade law of japan, it is necessary to obtain approval to export such sharp devices. ?this publication is the proprietary product of sharp and is copyrighted, with all rights reserved. under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of sharp. express written permission is also required before any use of this publication may be made by a third party. ?contact and consult with a sharp representative if there are any questions about the contents of this publication. 13 sheet no.: d2-a04102en important notices pc714vxnszxf series [e219]

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