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cystech electronics corp. spec. no. : c305a3 issued date : 2014.02.17 revised date : 2014.03.11 page no. : 1/8 BTA9012A3 cystek product specification general purpose pnp epitaxial planar transistor BTA9012A3 description ? the BTA9012A3 is designed for using in driver stage of af amplifier and general purpose amplification. ? large i c , i c max .= -0.6a ? low v ce(sat) , typically -0.09v at i c /i b = -100ma / -10ma. ideal for low-voltage operation ? pb-free lead plating and halogen-free package . symbol outline BTA9012A3 to-92 ordering information device package shipping BTA9012A3-0-tb-g to-92 (pb-free lead plating and halogen-free package) 2000 pcs / tape & box BTA9012A3-0-bk-g to-92 (pb-free lead plating and halogen-free package) 1000 pcs/ bag, 10 bags/box, 10boxes/carton b base c collector e emitte r e b c environment friendly grade : s for rohs compliant products, g for rohs compliant and green compound products packing spec, tb :2000 pcs/tape & box; bk: 1000 pcs / bag, 10 bags/box, 10 boxes/carton product rank, zero for no rank products product name
cystech electronics corp. spec. no. : c305a3 issued date : 2014.02.17 revised date : 2014.03.11 page no. : 2/8 BTA9012A3 cystek product specification absolute maximum ratings (ta=25 c) parameter symbol limits unit collector-base voltage v cbo -80 v collector-emitter voltage v ceo -60 v emitter-base voltage v ebo -7 v collector current i c -0.6 a power dissipation pd 625 mw thermal resistance, junction to ambient r ja 200 c/w junction temperature tj 150 c storage temperature tstg -55~+150 c characteristics (ta=25 c) symbol min. typ. max. unit test conditions bv cbo -80 - - v i c =-100 a bv ceo -60 - - v i c =-1ma bv ebo -7 - - v i e =-100 a i cbo - - -0.1 a v cb =-80v, i e =0 i ebo - - -0.1 a v eb =-7v, i c =0 *v ce(sat) - -0.09 -0.2 v i c =-100ma, i b =-10ma *v be(sat) - -0.83 -1.2 v i c =-100ma, i b =-10ma *v be(on) - -0.76 -1.0 v v ce =-1v, i c =-100ma h fe 1 144 - 246 - v ce =-1v, i c =-50ma h fe 2 20 - - - v ce =-1v, i c =-500ma f t 200 - - mhz v ce =-10v, i c =-20ma, f=100mhz cob - 4.5 8.5 pf v cb =-10v, f=1mhz *pulse test: pulse width 380 s, duty cycle 2% cystech electronics corp. spec. no. : c305a3 issued date : 2014.02.17 revised date : 2014.03.11 page no. : 3/8 BTA9012A3 cystek product specification typical characteristics emitter grounded output characteristics 0 0.02 0.04 0.06 0.08 0.1 0.12 0.14 0.16 0.18 0123456 -vce, collector-to-emitter voltage(v) -ic, collector current(a) 200ua 300ua 400ua 500ua 1ma -ib=100u a emitter grounded output characteristics 0 0.1 0.2 0.3 0.4 0.5 0.6 0123456 -vce, collector-to-emitter voltage(v) -ic, collector current(a) 1ma 1.5ma 2ma 2.5ma 5ma -ib=500u a emitter grounded output characteristics 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0123456 -vce, collector-to-emitter voltage(v) -ic, collector current(a) 4ma 6ma 10ma 20ma -ib=2ma emitter grounded output characteristics 0 0.2 0.4 0.6 0.8 1 1.2 0123456 -vce, collector-to-emitter voltage(v) -ic, collector current(a) 10ma 20ma 25ma 50ma -ib=5m a current gain vs collector current 10 100 1000 1 10 100 1000 -ic, collector current(ma) hfe, current gain tj=25c tj=75c tj=125c -vce=1v tj=0c tj=-40c current gain vs collector current 10 100 1000 1 10 100 1000 -ic, collector current(ma) hfe, current gain tj=25c tj=75c tj=125c -vce=2v tj=0c tj=-40c cystech electronics corp. spec. no. : c305a3 issued date : 2014.02.17 revised date : 2014.03.11 page no. : 4/8 BTA9012A3 cystek product specification typical characteristics(cont.) current gain vs collector current 10 100 1000 1 10 100 1000 -ic, collector current(ma) hfe, current gain tj=25c tj=75c tj=125c vce=10v tj=0c tj=-40c saturation voltage vs collector current 10 100 1000 1 10 100 1000 -ic, collector current(ma) -vcesat, saturation voltage(mv) 125c 75c 25c 0c -40c vcesat@ic=10ib saturation voltage vs collector current 10 100 1000 1 10 100 1000 -ic, collector current(ma) -vcesat, saturation voltage(mv) 125c 75c 25c 0c -40c vcesat@ic=20ib saturation voltage vs collector current 10 100 1000 1 10 100 1000 -ic, collector current(ma) -vcesat, saturation voltage(mv) 125c 75c 25c 0c -40c vcesat@ic=50ib saturation voltage vs collector current 100 1000 10000 1 10 100 1000 -ic, collector current(ma) -vbesat,saturation voltage(mv) vbesat@ic=10ib -40c 0c 25c 75c 125c saturation voltage vs collector current 100 1000 10000 1 10 100 1000 -ic, collector current(ma) -vbesat, saturation voltage(mv) vbesat@ic=20ib -40c 0c 25c 75c 125c cystech electronics corp. spec. no. : c305a3 issued date : 2014.02.17 revised date : 2014.03.11 page no. : 5/8 BTA9012A3 cystek product specification typical characteristics(cont.) on voltage vs collector current 100 1000 10000 1 10 100 1000 -ic, collector current(ma) -vbeon, on voltage(mv) vbeon@vce=-1v -40c 0c 25c 75c 125c capacitance vs reverse-biased voltage 1 10 100 0.1 1 10 100 -vr, reverse-biased voltage(v) capacitance(pf) cib cob transition frequency vs collector current 10 100 1000 1 10 100 -ic, collector current(ma) ft, transition frequency(mhz) -vce=20v power derating curve 0 100 200 300 400 500 600 700 0 50 100 150 200 ta, ambient temperature() pd, power dissipation(mw) cystech electronics corp. spec. no. : c305a3 issued date : 2014.02.17 revised date : 2014.03.11 page no. : 6/8 BTA9012A3 cystek product specification to-92 taping outline millimeters dim item min. max. a component body height 4.33 4.83 d tape feed diameter 3.80 4.20 d1 lead diameter h2a h2a h2 h2 d2 a h w w1 h3 h4 h1 l1 l p2 p p1 f1 f2 d1 d t2 t t1 0.36 0.53 d2 component body diameter 4.33 4.83 f1,f2 component lead pitch 2.40 2.90 f1,f2 f1-f2 - 0.3 h height of seating plane 15.50 16.50 h1 feed hole location 8.50 9.50 h2 front to rear deflection - 1 h2a deflection left or right - 1 h3 component height - 27 h4 feed hole to bottom of component - 21 l lead length after component removal - 11 l1 lead wire enclosure 2.50 - p feed hole pitch 12.50 12.90 p1 center of seating plane location 5.95 6.75 p2 4 feed hole pitch 50.30 51.30 t over all tape thickness - 0.55 t1 total taped package thickness - 1.42 t2 carrier tape thickness 0.36 0.68 w tape width 17.50 19.00 w1 adhesive tape width 5.00 7.00 - 20 pcs pitch 253 255 cystech electronics corp. spec. no. : c305a3 issued date : 2014.02.17 revised date : 2014.03.11 page no. : 7/8 BTA9012A3 cystek product specification recommended wave soldering condition product peak temperature soldering time pb-free devices 5 +1/-1 seconds 260 +0/-5 c recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note : all temperatures refer to topside of the package, measured on the package body surface. cystech electronics corp. spec. no. : c305a3 issued date : 2014.02.17 revised date : 2014.03.11 page no. : 8/8 BTA9012A3 cystek product specification to-92 dimension *: typical inches millimeters inches millimeters a9012 marking: dim m i n . m a x . m i n . m a x . dim m i n . m a x . m i n . m a x . a 0 . 1 7 0 4 0 . 1 9 0 2 4 . 3 3 4 . 8 3 g 0.0142 0 . 0 2 2 0 0 . 3 6 0 . 5 6 b 0 . 1 7 0 4 0 . 1 9 0 2 4 . 3 3 4 . 8 3 h - * 0 . 1 0 0 0 - * 2.54 c 0 . 5 0 0 0 - 1 2 . 7 0 - i - * 0 . 0 5 0 0 - * 1.27 d 0 . 0 1 4 2 0 . 0 2 2 0 0 . 3 6 0 . 5 6 1 - * 5 - * 5 e - * 0 . 0 5 0 0 - * 1.27 2 - * 2 - * 2 f 0 . 1 3 2 3 0 . 1 4 8 0 3 . 3 6 3 . 7 6 3 - * 2 - * 2 notes: 1.contr o lling dimension: millimeter s. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question w i th p a cking spec ification or p a cking method, please cont act y our local cy s t ek sales of fice. material: ? lead: pure tin plated. ? mold compound: epox y resin family , flammability solid burning class: ul94v -0. important notice: ? all rights are reserved. reproduction in w hole or in part is prohibited w i thout the prior w r itten approval of cy stek. ? cy stek reserves the right to make changes to its products w i thout notice. ? cy stek semiconductor products are not warranted to be suitab le for use in life-support applications, or systems. ? cy stek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance . 3 1 a 2 d b c i 1 e f 3 g h 2 date code s t yle: pin 1.emitter 2.base 3.collector 3-lead t o -92 plastic package cy s t ek p a cka g e code: a 3 |
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