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february 2010 doc id 16931 rev 1 1/14 14 LIS332AR mems motion sensor: 3-axis 2 g analog-output ultracompact accelerometer features single voltage supply operation 2 g full-scale high stability over temperature ratiometric output voltage power-down mode embedded self-test 10000 g high shock survivability ecopack ? rohs and ?green? compliant (see section 7 ) applications tilting applications free-fall detection gaming anti-theft systems inertial navigation and motion tracking description the LIS332AR is a miniaturized low-power 3-axis linear accelerometer belonging to the ?nano? family of st motion sensors. it includes a sensing element and an ic interface to provide an analog signal to the external world. the sensing element, capable of detecting the acceleration, is manufactured using a dedicated process developed by st to produce motion sensors and actuators in silicon. the ic interface is manufactured using a cmos process that allows the design of a dedicated circuit which is trimmed to better match the sensing element characteristics. the LIS332AR has a full-scale of 2 g , and is capable of measuring accelerations over a maximum bandwidth of 2.0 khz. the device bandwidth may be reduced by using external capacitors. the self-test c apability allows the user to check the functioning of the sensor in the final application. st is already in the field with several hundred million sensors which have received excellent acceptance from the market in terms of quality, reliability and performance. the LIS332AR is provided in a plastic land grid array (lga) package. several years ago st successfully pioneered the use of this package for accelerometers. today, st has the widest manufacturing capability and strongest expertise in the world for production of sensors in plastic lga packages. lga-16 (3x3x1.0mm) table 1. device summary order code temperature range [c] package packing LIS332AR -40 to +85 lga-16 tray LIS332ARtr -40 to +85 lga-16 tape and reel www.st.com
contents LIS332AR 2/14 doc id 16931 rev 1 contents 1 block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 pin connections and description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 mechanical and electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . 5 2.1 mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.2 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 4 terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4.1 sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4.2 zero-g level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4.3 self-test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4.4 output impedance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 5 functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 5.1 sensing element . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 5.2 ic interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 5.3 factory calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 6 application hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 6.1 soldering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 6.2 output response vs. orientation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 7 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 8 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
LIS332AR block diagram and pin description doc id 16931 rev 1 3/14 1 block diagram and pin description figure 1. block diagram 1.1 pin connections and description figure 2. pin connection 3( 3 ( 2outx 2outz 2%&%2%.#% 42)--).'#)2#5)4 #,/#+ 3( 2outy #(!2'% !-0,)&)% 2 $%-58 6out x 6out z 6out y 0$ 9 : 9 : 8 8 a 3%,&4%34 -58 0/7%2$/7. !-v "ottomview .# res .# 34 .# 6outy .# 6outz .# '. $ .# .# res 6d d 4opview $irectio nofthedetectable 9 8 : 0$ 6outx acceleratio ns !-v
block diagram and pin description LIS332AR 4/14 doc id 16931 rev 1 table 2. pin description pin # pin name function 1 nc internally not connected 2 res connect to vdd 3 nc internally not connected 4 st self-test (logic 0: normal mode; logic 1: self-test mode) 5 pd power-down (logic 0: normal mode; logic 1: power-down mode) 6 gnd 0 v supply 7 nc internally not connected 8 nc internally not connected 9 voutz output voltage z channel 10 nc internally not connected 11 vouty output voltage y channel 12 nc internally not connected 13 voutx output voltage x channel 14 nc internally not connected 15 res connect to vdd 16 vdd power supply
LIS332AR mechanical and electrical specifications doc id 16931 rev 1 5/14 2 mechanical and electrical specifications 2.1 mechanical characteristics @ vdd=3 v, t=25 c unless otherwise noted (a) . a. the product is factory calibrated at 3 v. t he operational power supply range is specified in table 4 . since the device is ratiometric, voff, so and vt parameters vary with supply voltage. table 3. mechanical characteristics symbol parameter test condition min. typ. (1) max. unit ar acceleration range (2) 2 g so sensitivity (3) 0.2*vdd ?5% 0.2*vdd 0.2*vdd + 5% v/g sodr sensitivity change vs. temperature delta from +25 c 0.01 %/c voff zero- g level (4) t=25 c vdd/2-6% vdd/2 vdd/2+6% v offdr zero- g level change vs. temperature delta from +25 c 0.2 mg/c nl non linearity (4) best fit straight line 0.5 % fs crossax cross-axis (5) 2 % an acceleration noise density vdd=3 v 100 g/ vt self-test output voltage change (6),(7) t=25 c vdd=3 v x axis 60 700 mv t=25 c vdd=3 v y axis 60 700 mv t=25 c vdd=3 v z axis 60 700 mv fres sensing element resonant frequency (8) all axes 2.0 khz top operating temperature range -40 +85 c wh product weight 30 mgram 1. typical specificat ions are not guaranteed 2. guaranteed by wafer level test and measurement of initial offset and sensitivity 3. zero- g level and sensitivity are ra tiometric to supply voltage 4. guaranteed by design 5. contribution to the measured output of an incl ination/acceleration along any perpendicular axis 6. ?self-test output voltage change? is defined as vout (vst=logic 1) -vout (vst=logic 0) 7. ?self-test output voltage change? varies cubically with supply voltage 8. minimum resonance frequency f res =2.0 khz. sensor bandwidth=1/(2* *32k ? *c load ), with c load >2.5 nf hz
mechanical and electrical specifications LIS332AR 6/14 doc id 16931 rev 1 2.2 electrical characteristics @ vdd=3 v, t=25 c unless otherwise noted (b) . b. the product is factory calibrated at 3 v. table 4. electrical characteristics symbol parameter test condition min. typ. (1) max. unit vdd supply voltage 2.16 3 3.6 v idd supply current mean value pd pin connected to gnd 0.3 ma iddpdn supply current in power-down mode pd pin connected to vdd 1 a vst vpd self-test input power-down input logic 0 level at vdd=3 v 0 0.2*vdd v logic 1 level at vdd=3 v 0.8*vdd vdd rout output impedance of voutx, vouty, voutz 32 k ? cload capacitive load drive for voutx, vouty, voutz (2) 2.5 nf to n turn-on time at exit from power-down mode c load in f 160*c load +0.3 ms to p operating temperature range -40 +85 c 1. typical specificat ions are not guaranteed 2. minimum resonance frequency f res =2.0 khz. device bandwidth=1/(2* *32k ? *c load ), with c load >2.5 nf
LIS332AR absolute maximum ratings doc id 16931 rev 1 7/14 3 absolute maximum ratings stresses above those listed as ?absolute ma ximum ratings? may cause permanent damage to the device. this is a stress rating only and functional operation of the device under these conditions is not implied. exposure to maximum rating conditions for extended periods may affect device reliability. note: supply voltage on any pin should never exceed 6.0 v. table 5. absolute maximum ratings symbol ratings maximum value unit vdd supply voltage -0.3 to 6 v vin input voltage on any control pin (pd, st) -0.3 to vdd +0.3 v a pow acceleration (any axis, powered, vdd=3 v) 3000 g for 0.5 ms 10000 g for 0.1 ms a unp acceleration (any axis, not powered) 3000 g for 0.5 ms 10000 g for 0.1 ms t stg storage temperature range -40 to +125 c esd electrostatic discharge protection 4 (hbm) kv 1.5 (cdm) kv 200 (mm) v this is a mechanical shock sensitive device, improper handling can cause permanent damage to the part this is an esd sensitive device, improper handling can cause permanent damage to the part
terminology LIS332AR 8/14 doc id 16931 rev 1 4 terminology 4.1 sensitivity sensitivity describes the gain of the sensor and can be determined by applying 1 g acceleration to it. because the sensor can measure dc accelerations, this can be done easily by pointing the selected axis towards the ground, noting the output value, rotating the sensor 180 degrees (pointing towards the sky) and noting the output value again. by doing so, a 1 g acceleration is applied to the sensor. subtracting the larger output value from the smaller one, and dividing the result by 2, produces the actual sensitivity of the sensor. this value changes very little over temperature (see sensitivity change vs. temperature) and over time. the sensitivity tolerance describes the range of sensitivities of a large number of sensors. 4.2 zero- g level zero- g level describes the actual output signal if there is no acceleration present. a sensor in a steady state on a hori zontal surface will measure 0 g on both the x and y axes, whereas the z axis will measure 1 g . ideally, the output for a 3 v powered sensor is vdd/2 = 1500 mv. a deviation from the ideal 0 g level (1500 mv, in this case) is called zero- g offset. offset is to some extent a result of stress to the mems sensor and therefore the offset can slightly change after mounting the sensor onto a printed circuit board or exposing it to extensive mechanical stress. offset changes little over temperature (see ?zero- g level change vs. temperature? in table 3: mechanical characteristics ). the zero- g level of an individual sensor is also very stable over its lifetime. the zero- g level tolerance describes the range of zero- g levels of a group of sensors. 4.3 self-test self-test (st) allows the checking of sensor functionality without moving it. the self-test function is off when the st pin is connected to gnd. when the st pin is tied to vdd, an actuation force is applied to the sensor, simulating a definite input acceleration. in this case, the sensor outputs exhibit a voltage change in their dc levels. when st is activated, the device output level is given by the algebraic sum of the signals produced by the acceleration acting on the sensor and by the electrostatic test-force. if the output signals change within the amplitude specified in table 3 , then the sensor is working properly and the parameters of the interface chip are within the defined specifications. 4.4 output impedance output impedance describes the resistor insi de the output stage of each channel. this resistor is part of a filter consisting of an external capacitor of at least 2.5 nf and the internal resistor. due to the resistor level, only small inexpensive external capacitors are needed to generate low corner frequencies. when interfacing with an adc, it is important to use high input impedance input circuitries to avoid measurement errors. note that the minimum load capacitance forms a corner frequency close to the resonant frequency of the sensor. in general, the smallest possible bandwidth for a particular application should be chosen to obtain the best results.
LIS332AR functionality doc id 16931 rev 1 9/14 5 functionality the LIS332AR is a 3-axis ultracompact, low-power, analog output accelerometer packaged in an lga package. the complete device includes a sensing element and an ic interface capable of taking information from the sensing element and providing an analog signal to the external world. 5.1 sensing element a proprietary process is used to create a surface micro-machined accelerometer. the technology allows the creation of suspended silicon structur es which are attached to the substrate at several points called ?anchors? and are free to move in the direction of the sensed acceleration. to be compatible with traditional packaging techniques, a cap is placed on top of the sensing element to prevent blocking of the moving parts during the moulding phase of plastic encapsulation. when an acceleration is applied to the sensor, the proof mass shifts from its nominal position, causing an imbalance in the capacit ive half-bridge. this imbalance is measured using charge integration in response to a voltage pulse applied to the sense capacitor. at steady state, the nominal value of the capacitors are a few pf, and when an acceleration is applied the maximum variation of the capacitive load is in the ff range. 5.2 ic interface the complete signal processing utilizes a fully differential structure, while the final stage converts the differential signal into a single-ended signal to be compatible with external applications. the first stage is a low-noise capacitive amplifier that implements a correlated double sampling (cds) at its output to cancel the offset and the 1/f noise. the signal produced is then sent to three different s&hs, one for each channel, and made available to the outside. all the analog parameters (output offset voltage and sensitivity) are ratiometric to the voltage supply. increasing or decreasing the voltage supply, the sensitivity and the offset increases or decreases linearly. this feature provides for cancellation of the error related to the voltage supply along an analog-to-digital conversion chain. 5.3 factory calibration the ic interface is factory-calibra ted for sensitivity (so) and zero- g level (voff). the trimming values are stored in the device in a non-volatile structure. any time the device is turned on, the trimming parameters are downloaded to the registers to be employed during normal operation. this allows the user to use the device without further calibration.
application hints LIS332AR 10/14 doc id 16931 rev 1 6 application hints figure 3. LIS332AR electrical connection power supply decoupling capacitors (100 nf ceramic or polyester + 10 f aluminum) should be placed as near as possible to the device (common design practice). the LIS332AR allows band limiting of voutx, vouty and voutz through the use of external capacitors. the recommended frequency range spans from dc up to 2.0 khz. capacitors must be added at the output pins to implement low-pass filtering for anti-aliasing and noise reduction. the equation for the cut-off frequency ( f t ) of the external filters is: taking into account that the internal filtering resistor (r out ) has a nominal value of 32 k ? , the equation for the external filter cut-off frequency may be simplified as follows: the tolerance of the internal resistor can vary 15% (typ) from its nominal value of 32 k ? ; thus the cut-off frequ ency will vary accordingly. a minimum capacitance of 2.5 nf for c load (x, y, z) is required. 0inindicator 6dd '.$ '.$ n& p & '.$ 4op view $irection ofthe detectable acceleration s 9 8 : $igitalsignals ,)3!2 topview 34 #loady 6outx #loadx /ptional 6outy #loadz 6outz 0$ !-v f t 1 2 r out c load xyz ,, () ?? -------------------------- ----------------------------- ----------------- = f t 5 f c load xyz ,, () ------------------------ -------------- - hz [] =
LIS332AR application hints doc id 16931 rev 1 11/14 6.1 soldering information the lga package is compliant with the ecopack ? , rohs and ?green? standard. it is qualified for soldering heat resist ance according to jedec j-std-020c. leave ?pin 1 indicator? unconnected during soldering. land pattern and soldering recommendations are available at www.st.com 6.2 output response vs. orientation figure 4. output response vs. orientation figure 4 refers to the LIS332AR powered at 3 v. table 6. filter capacitor selection, c load (x,y,z) cut-off frequency capacitor value 1 hz 5 f 10 hz 0.5 f 20 hz 250 nf 50 hz 100 nf 100 hz 50 nf 200 hz 25 nf 500 hz 10 nf earth?s surface x=1.5v (0g) y=1.5v (0g) z=0.9v (-1g) x=1.5v (0g) y=1.5v (0g) z=2.1v (+1g) top view x=1.5v (0g) y=2.1v (+1g) x=1.5v (0g) y=0.9v (-1g) x=0.9v (-1g) y=1.5v (0g) x=2.1v (+1g) y=1.5v (0g) z=1.5v (0g) z=1.5v (0g) z=1.5v (0g) z=1.5v (0g) to p bottom to p bottom
package information LIS332AR 12/14 doc id 16931 rev 1 7 package information in order to meet environmental requirements, st offers these devices in different grades of ecopack? packages, depending on their level of environmental compliance. ecopack? specifications, grade definitions and product status are available at: www.st.com. ecopack is an st trademark. figure 5. lga-16: mechanical data and package dimensions dimensions ref. mm inch min. typ. max. min. typ. max. a1 1.000 0.0 3 94 a2 0.7 8 50.0 3 09 a 3 0.200 0.0079 d1 2. 8 50 3 .000 3 .150 0.1122 0.11 8 1 0.1240 e1 2. 8 50 3 .000 3 .150 0.1122 0.11 8 1 0.1240 l1 1.000 1.060 0.0 3 94 0.0417 l2 2.000 2.060 0.07 8 70.0 8 11 n1 0.500 0.0197 n2 1.000 0.0 3 94 m 0.040 0.100 0.160 0.0016 0.00 3 9 0.006 3 p1 0. 8 75 0.0 3 44 p2 1.275 0.0502 t1 0.290 0. 3 50 0.410 0.0114 0.01 38 0.0161 t2 0.190 0.250 0. 3 10 0.0075 0.009 8 0.0122 d0.150 0.0059 k 0.050 0.0020 lga-16( 3 x 3 x1.0mm) land grid array packa g e outline and 79 83 2 3 1 mechanical data
LIS332AR revision history doc id 16931 rev 1 13/14 8 revision history table 7. document revision history date revision changes 02-feb-2010 1 initial release.
LIS332AR 14/14 doc id 16931 rev 1 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2010 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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