1. product profile 1.1 general description the IP4059CX5 is designed to protect several i/o pins of computer interfaces, such as universal serial bus (usb) 2.0, usb on-the-go (otg), ethernet, digit al visual interface (dvi) etc. the IP4059CX5 incorporates ultra-low capacity diodes to provide protection to downstream components from electrostatic discharge (esd) voltages as high as ? 8kv contact discharge according to the iec 61000-4-2 model. the device is fabricated using monolithic silic on technology and integr ates four ultra-low capacity esd protection diodes in a 0.5 mm pitch wafer-level chip-scale package (wlcsp) measuring 0.96 mm by 1.34 mm only. 1.2 features and benefits ? pb-free, rohs compliant and free of ha logen and antimony (dark green compliant) ? 4 ultra-low input capacity rail-to-rail esd protection diodes with c d =3.0pf ? integrated esd protection withstanding ? 8 kv contact discharge and ? 15 kv air discharge ? wlcsp with 0.5 mm pitch 1.3 applications general purpose electromagnetic interference (emi) and radio frequency interference (rfi) filtering and downstream esd protection for usb ports inside: ? cellular and personal communication system (pcs) mobile handsets ? pc peripherals and pcs ? cordless telephones ? wireless data and local area network (lan) systems ? personal digital assistants (pdas) ? digital cameras IP4059CX5 integrated usb 2.0 and us b otg esd protection to iec 61000-4-2 level 4 rev. 1 ? 15 september 2011 product data sheet
IP4059CX5 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 1 ? 15 september 2011 2 of 9 nxp semiconductors IP4059CX5 integrated usb 2.0 and usb otg esd protection 2. pinning information 3. ordering information 4. limiting values [1] device is qualified with > 200 pulses of ? 15 kv contact discharges each, according to the iec 61000-4-2 model and far exceeds the specified level 4 (8 kv contact discharge). table 1. pinning example of pin configuration for usb 2.0 ; other combinations for id, d+ and d ? in relation to pin a1, pin c1 and pin c2 are possible. pin symbol description simplified outline graphic symbol a1 d ? usb 2.0 differential pair c1 d+ b1 gnd ground a2 v bus power c2 id usb otg id pin 008aaa262 transparent top view, solder balls facing down bump a1 index area a b c b1 12 008aaa271 a1 c1 b1 c2 a2 table 2. ordering information type number package name description version IP4059CX5/lf wlcsp5 wafer level chip-size package; 5 bumps (2-1-2) IP4059CX5/lf table 3. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v cc supply voltage 0 5 v v i input voltage ? 0.5 v cc +0.5 v v esd electrostatic discharge voltage contact discharge [1] ? 15 +15 kv air discharge [1] ? 15 +15 kv iec 61000-4-2 level 4 contact discharge ? 8+8 kv air discharge ? 15 +15 kv t stg storage temperature ? 55 +150 ?c t reflow(peak) peak reflow temperature 10 s maximum - 260 ?c t amb ambient temperature ? 40 +85 ?c
IP4059CX5 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 1 ? 15 september 2011 3 of 9 nxp semiconductors IP4059CX5 integrated usb 2.0 and usb otg esd protection 5. characteristics [1] guaranteed by design. table 4. electrical characteristics t amb =25 ? c; unless otherwise specified. symbol parameter conditions min typ max unit c d diode capacitance pins a1, c1 and c2; v bias(dc) =0v; f=1mhz; v a2 =0v [1] -3.04.0pf i lr reverse leakage current v i = 3.0 v - - 100 na v br breakdown voltage i test =1ma 6- 9v v f forward voltage - 0.7 - v
IP4059CX5 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 1 ? 15 september 2011 4 of 9 nxp semiconductors IP4059CX5 integrated usb 2.0 and usb otg esd protection 6. package outline fig 1. package outline IP4059CX5/lf (wlcsp5) wlcsp5_2-1-2_r_po european projection wlcsp5: wafer level chip-size package; 5 bumps (2-1-2) detail x a a 2 a 1 x a b c e d 1 2 e 2 e 1 e b 1/2 e b1 bump a1 index area table 5. dimensions for figure 1 symbol min typ max unit a 0.61 0.65 0.69 mm a 1 0.22 0.24 0.26 mm a 2 0.39 0.41 0.43 mm b 0.27 0.32 0.37 mm d 0.91 0.96 1.01 mm e 1.29 1.34 1.39 mm e- 0 . 5 - m m e 1 - 0.435 - mm e 2 -0 . 8 7-m m
IP4059CX5 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 1 ? 15 september 2011 5 of 9 nxp semiconductors IP4059CX5 integrated usb 2.0 and usb otg esd protection 7. design and asse mbly recommendations 7.1 pcb design guidelines for optimum performance it is recommended to use a non-solder mask defined (nsmd), also known as a copper-defined design, incorporating laser-dr illed micro-vias connecting the ground pads to a buried ground-plane layer. this results in the lowest possible ground inductance and provides the best high frequency and esd performance. for this case, refer to ta b l e 6 for the recommended pcb design parameters. 7.2 pcb assembly guidelines for pb-free soldering table 6. recommended pcb design parameters parameter value or specification pcb pad diameter 275 ? m micro-via diameter 100 ? m (0.004 inch) solder mask aperture diameter 375 ? m copper thickness 20 ? m to 40 ? m copper finish auni pcb material fr4 table 7. assembly recommendations parameter value or specification solder screen aperture diameter 330 ? m solder screen thickness 100 ? m (0.004 inch) solder paste: pb-free snag (3 % to 4 %) cu (0.5 % to 0.9 %) solder to flux ratio 50 : 50 solder reflow profile see figure 2 the device is capable of withstanding at least three reflows with this profile. fig 2. pb-free solder reflow profile 001aai943 t reflow(peak) 250 230 217 t (c) cooling rate preheat t 1 t 5 t 4 t 3 t 2 t (s)
IP4059CX5 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 1 ? 15 september 2011 6 of 9 nxp semiconductors IP4059CX5 integrated usb 2.0 and usb otg esd protection 8. abbreviations 9. revision history table 8. characteristics symbol parameter conditions min typ max unit t reflow(peak) peak reflow temperature 230 - 260 ?c t 1 time 1 soak time 60 - 180 s t 2 time 2 time during t ? 250 ? c--30s t 3 time 3 time during t ? 230 ? c10-50s t 4 time 4 time during t > 217 ? c30-150s t 5 time 5 - - 540 s dt/dt rate of change of temperature cooling rate - - ? 6 ?c/s preheat 2.5 - 4.0 ?c/s table 9. abbreviations acronym description dvi digital visual interface emi electromagnet ic interference esd electrostatic discharge fr4 flame retard 4 iec international electrotechnical commission i/o input/output lan local area network nsmd non-solder mask defined otg on-the-go pcb printed-circuit board pcs personal communication system pda personal digital assistant rfi radio frequency interference rohs restriction of hazardous substances usb universal serial bus wlcsp wafer-level chip-scale package table 10. revision history document id release date data sheet status change notice supersedes IP4059CX5 v.1 20110915 product data sheet - -
IP4059CX5 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 1 ? 15 september 2011 7 of 9 nxp semiconductors IP4059CX5 integrated usb 2.0 and usb otg esd protection 10. legal information 10.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 10.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 10.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification.
IP4059CX5 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 1 ? 15 september 2011 8 of 9 nxp semiconductors IP4059CX5 integrated usb 2.0 and usb otg esd protection non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. 10.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 11. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors IP4059CX5 integrated usb 2.0 and usb otg esd protection ? nxp b.v. 2011. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 15 september 2011 document identifier: IP4059CX5 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 12. contents 1 product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 general description . . . . . . . . . . . . . . . . . . . . . 1 1.2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 design and assembly recommendations . . . . 5 7.1 pcb design guidelines . . . . . . . . . . . . . . . . . . . 5 7.2 pcb assembly guidelines for pb-free soldering 5 8 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 9 revision history . . . . . . . . . . . . . . . . . . . . . . . . . 6 10 legal information. . . . . . . . . . . . . . . . . . . . . . . . 7 10.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . . 7 10.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 10.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 10.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 11 contact information. . . . . . . . . . . . . . . . . . . . . . 8 12 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
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