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hexfet ? power mosfet 05/14/09 irf7754pbf absolute maximum ratings www.irf.com 1 thermal resistance parameter max. units v ds drain-source voltage -12 v i d @ t a = 25c continuous drain current, v gs @ -4.5v -5.5 i d @ t a = 70c continuous drain current, v gs @ -4.5v -4.4 a i dm pulsed drain current -22 p d @t a = 25c maximum power dissipation 1w p d @t a = 70c maximum power dissipation 0.64 w linear derating factor 0. 01 w/c v gs gate-to-source voltage 8 v t j , t stg junction and storage temperature range -55 to +150 c v dss r ds(on) max i d -12v 25m ? @v gs = -4.5v - 5.4a 34m ? @v gs = -2.5v - 4.6a 49m ? @v gs = -1.8v - 3.9a parameter max. units r ja maximum junction-to-ambient 125 c/w tssop-8 description ultra low on-resistance p-channel mosfet very small soic package low profile (< 1.2mm) available in tape & reel lead-free hexfet ? power mosfets from international rectifier utilize advanced processing techniques to achieve ex- tremely low on-resistance per silicon area. this benefit, combined with the ruggedized device design, that inter- national rectifier is well known for, provides thedesigner with an extremely efficient and reliable device for battery and load management. the tssop-8 package has 45% less footprint area than the standard so-8. this makes the tssop-8 an ideal device for applications where printed circuit board space is at a premium. the low profile (<1.2mm) allows it to fit easily into extremely thin environments such as portable electronics and pcmcia cards. pd-96020a 2 www.irf.com parameter min. typ. max. units conditions i s continuous source current mosfet symbol (body diode) showing the i sm pulsed source current integral reverse (body diode) p-n junction diode. v sd diode forward voltage ??? ??? -1.2 v t j = 25c, i s = -1.0a, v gs = 0v t rr reverse recovery time ??? 39 59 ns t j = 25c, i f = -1.0a q rr reverse recovery charge ??? 27 41 nc di/dt = -100a/s source-drain ratings and characteristics -22 -1.0 a electrical characteristics @ t j = 25c (unless otherwise specified) repetitive rating; pulse width limited by max. junction temperature. pulse width 400s duty cycle when mounted on 1 inch square copper board, t < 10 sec. s d g parameter min. typ. max. units conditions v (br)dss drain-to-source breakdown voltage -12 ??? ??? v v gs = 0v, i d = -250a ? v (br)dss / ? t j breakdown voltage temp. coefficient ??? 0.008 ??? v/c reference to 25c, i d = -1ma ??? ??? 25 v gs = -4.5v, i d = -5.4a ??? 34 v gs = -2.5v, i d = -4.6a ??? 49 v gs = -1.8v, i d = -3.9a v gs(th) gate threshold voltage -0.4 ??? -0.9 v v ds = v gs , i d = -250a g fs forward transconductance 16 ??? ??? s v ds = -10v, i d = -5.4a ??? ??? -1.0 v ds = -9.6v, v gs = 0v ??? ??? -25 v ds = -9.6v, v gs = 0v, t j = 70c gate-to-source forward leakage ??? ??? -100 v gs = -8v gate-to-source reverse leakage ??? ??? 100 v gs = 8v q g total gate charge ??? 22 ??? i d = -5.4a q gs gate-to-source charge ??? 3.9 ??? nc v ds = -6v q gd gate-to-drain ("miller") charge ??? 4.8 ??? v gs = -4.5v t d(on) turn-on delay time ??? 9.8 14.7 v dd = -6v, v gs = -4.5v t r rise time ??? 18 27 i d = -1.0a t d(off) turn-off delay time ??? 267 401 r d = 6 ? t f fall time ??? 191 287 r g = 6 ? c iss input capacitance ??? 1984 ??? v gs = 0v c oss output capacitance ??? 618 ??? pf v ds = -6v c rss reverse transfer capacitance ??? 385 ??? ? = 1.0mhz i gss a m ? r ds(on) static drain-to-source on-resistance i dss drain-to-source leakage current na ns www.irf.com 3 fig 4. normalized on-resistance vs. temperature fig 2. typical output characteristics fig 1. typical output characteristics fig 3. typical transfer characteristics -60 -40 -20 0 20 40 60 80 100 120 140 160 0.0 0.5 1.0 1.5 2.0 t , junction temperature ( c) r , drain-to-source on resistance (normalized) j ds(on) v = i = gs d -4.5v -5.5a 0.1 1 10 100 1.0 1.2 1.4 1.6 1.8 2.0 v = -10v 20s pulse width ds -v , gate-to-source voltage (v) -i , drain-to-source current (a) gs d t = 25 c j t = 150 c j 0.1 1 10 100 -v ds , drain-to-source voltage (v) 0.01 0.1 1 10 100 - i d , d r a i n - t o - s o u r c e c u r r e n t ( a ) -1.0v 20s pulse width tj = 25c vgs top -7.0v -5.0v -4.5v -2.5v -1.8v -1.5v -1.2v bottom -1.0v 0.1 1 10 10 0 -v ds , drain-to-source voltage (v) 0.1 1 10 100 - i d , d r a i n - t o - s o u r c e c u r r e n t ( a ) -1.0v 20s pulse width tj = 150c vgs top -7.0v -5.0v -4.5v -2.5v -1.8v -1.5v -1.2v bottom -1.0v 4 www.irf.com fig 8. maximum safe operating area fig 6. typical gate charge vs. gate-to-source voltage fig 5. typical capacitance vs. drain-to-source voltage fig 7. typical source-drain diode forward voltage 0 5 10 15 20 25 30 0 1 2 3 4 5 6 q , total gate charge (nc) -v , gate-to-source voltage (v) g gs i = d -5.4a v = -6v ds v = -9.6v ds 0.1 1 10 100 0.2 0.4 0.6 0.8 1.0 -v ,source-to-drain voltage (v) -i , reverse drain current (a) sd sd v = 0 v gs t = 25 c j t = 150 c j 1 10 100 0.1 1 10 100 operation in this area limited by r ds(on) single pulse t t = 150 c = 25 c j c -v , drain-to-source voltage (v) -i , drain current (a) i , drain current (a) ds d 1ms 10ms 1 10 100 -v ds , drain-to-source voltage (v) 0 400 800 1200 1600 2000 2400 2800 3200 c , c a p a c i t a n c e ( p f ) coss crss ciss v gs = 0v, f = 1 mhz c iss = c gs + c gd , c ds shorted c rss = c gd c oss = c ds + c gd www.irf.com 5 fig 11. maximum effective transient thermal impedance, junction-to-ambient fig 9. maximum drain current vs. case temperature 25 50 75 100 125 150 0.0 1.0 2.0 3.0 4.0 5.0 6.0 t , case temperature ( c) -i , drain current (a) c d 0.1 1 10 100 1000 0.0001 0.001 0.01 0.1 1 10 100 1000 notes: 1. duty factor d = t / t 2. peak t = p x z + t 1 2 j dm thja a p t t dm 1 2 t , rectangular pulse duration (sec) thermal response (z ) 1 thja 0.01 0.02 0.05 0.10 0.20 d = 0.50 single pulse (thermal response) 1 0.1 % + - v ds 90% 10% v gs t d(on) t r t d(off) t f fig 10b. switching time waveforms fig 10a. switching time test circuit 6 www.irf.com fig 13. typical on-resistance vs. drain current fig 12. typical on-resistance vs. gate voltage fig 14b. gate charge test circuit fig 14a. basic gate charge waveform q g q gs q gd v g charge 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 -v gs, gate -to -source voltage (v) 0.010 0.020 0.030 0.040 0.050 0.060 0.070 r d s ( o n ) , d r a i n - t o - s o u r c e o n r e s i s t a n c e ( ? ) i d = -5.5a d.u.t. v ds i d i g -3ma v gs .3 f 50k ? .2 f 12v current regulator same type as d.u.t. current sampling resistors + - 0.0 5.0 10.0 15.0 20.0 25.0 -id , drain current ( a ) 0 0.02 0.04 0.06 0.08 0.1 r d s ( o n ) , d r a i n - t o - s o u r c e o n r e s i s t a n c e ( ? ) v gs = -2.5v v gs = -1.8v v gs = -4.5v www.irf.com 7 fig 15. typical vgs(th) vs. junction temperature -75 -50 -25 0 25 50 75 100 125 150 t j , temperature ( c ) 0.2 0.4 0.6 0.8 1.0 - v g s ( t h ) ( v ) i d = -250a typical power vs. time 0.0001 0.0010 0.0100 0.1000 1.0000 10.0000 100.0000 time (sec) 0 100 200 300 p o w e r ( w ) 8 www.irf.com note: for the most current drawing please refer to ir website at http://www.irf.com/package/ !!! " " " " tssop8 package outline dimensions are shown in milimeters (inches) ! " www.irf.com 9 data and specifications subject to change without notice. this product has been designed and qualified for the consumer market. qualification standards can be found on ir?s web site. ir world headquarters: 233 kansas st., el segundo, california 90245, usa tel: (310) 252-7105 tac fax: (310) 252-7903 visit us at www.irf.com for sales contact information . 05/2009 tssop-8 tape and reel information !"# |
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