creat by art - glass passivated chip junction - excellent high temperature switching - ultrafast recovery time for high efficiency - soft recovery characteristics - halogen-free according to iec 61249-2-21 definition molding compound, ul flammability classification rating 94v-0 base p/n with suffix "g" on packing code - green compound (halogen-free) base p/n with prefix "h" on packing code - aec-q101 qualified terminal: matte tin plated leads, solderable per jesd22-b102 meet jesd 201 class 1a whisker test, with prefix "h" on packing code meet jesd 201 class 2 whisker test symbol uf1a uf1b uf1d UF1G uf1j uf1k uf1m unit v rrm 50 100 200 400 600 800 1000 v v rms 35 70 140 280 420 560 700 v v dc 50 100 200 400 600 800 1000 v i f(av) a trr ns cj pf t j o c t stg o c document number: ds_d1405072 version: f14 uf1a thru uf1m taiwan semiconductor glass passivated hi g h efficient rectifiers features - compliant to rohs directive 2011/65/eu and in accordance to weee 2002/96/ec mechanical data 30 maximum repetitive peak reverse voltage parameter case: do-204al (do-41) do-204al (do-41) weight: 0.33g (approximately) maximum ratings and electrical characterstics (t a =25 unless otherwise noted) a maximum instantaneous forward voltage (note 1) @ 1 a v f 1.0 v maximum rms voltage maximum dc blocking voltage maximum average forward rectified current 1 peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load i fsm maximum reverse current @ rated vr t j =25 t j =125 i r 5 a 150 maximum reverse recovery time (note 2) storage temperature range - 55 to +150 typical junction capacitance (note 3) typical thermal resistance r jl r ja 15 60 - 55 to +150 note 1: pulse test with pw=300 s, 1% duty cycle note 2: reverse recovery test conditions: i f =0.5a, i r =1.0a, i rr =0.25a note 3: measured at 1 mhz and applied reverse voltage of 4.0v d.c. - ldally suited for use in very high frequency switching power supplies, inverters and as free wheeling diodes 1.7 50 75 17 o c/w operating junction temperature range
creat by art part no. part no. uf1m uf1m uf1m (ta=25 unless otherwise noted) document number: ds_d1405072 versio o n: f14 uf1a thru uf1m taiwan semiconductor ordering information aec-q101 qualified packing code green compound code package packing do-41 3,000 / ammo box (52mm taping) r0 do-41 5,000 / 13" paper reel r1 do-41 5,000 / 13" paper reel (reverse) b0 do-41 1,000 / bulk packing note 1: "x" defines voltage from 50v (uf1a) to 1000v (uf1m) uf1x (note 1) prefix "h" a0 suffix "g" example preferred p/n aec-q101 qualified packing code green compound code description uf1m a0 a0 uf1m a0g a0 g green compound uf1mha0 h a0 aec-q101 qualified ratings and characteristics curves 0.0 0.5 1.0 10 30 50 70 90 110 130 150 average forward current (a) ambient temperature ( o c) fig.1- maximum forward current derating curve resistive or inductive load 0 5 10 15 20 25 30 1 10 100 peak forward surge current (a) number of cycles at 60 hz fig. 3- maximum non-repetitive peak forward surge current 8.3ms single half sine wave 0.01 0.1 1 10 100 1000 0 20406080100 instantaneous reverse current ( a) percent of rated peak reverse voltage (%) fig. 4- typical reverse characteristics uf1a-UF1G uf1j-uf1m tj=25 tj=100 tj=125 0.1 1 10 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 instantaneous forward current (a) forward voltage (v) fig. 2- typical forward characteristics uf1j-uf1m uf1a-UF1G pulse width=300 s 1% duty cycle
creat by art min max min max a 2.00 2.70 0.079 0.106 b 0.71 0.86 0.028 0.034 c 25.40 - 1.000 - d 4.20 5.20 0.165 0.205 e 25.40 - 1.000 - p/n = specific device code g = green compound yww = date code f = factory code document number: ds_d1405072 version: f14 marking diagram uf1a thru uf1m taiwan semiconductor package outline dimensions dim. unit (mm) unit (inch) 1 10 100 0.1 1 10 100 junction capacitance (pf) reverse voltage (v) fig. 5- typical junction capacitance f=1.0mhz vsig=50mvp-p uf1j-uf1m uf1a-UF1G
creat by art assumes no responsibility or liability for any errors inaccuracies. information contained herein is intended to provide a product description only. no license, express or implied,to any intellectual property rights is granted by this document. except as provided in tsc's terms and conditions of sale for such products, tsc assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of tsc products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. the products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify tsc for any damages resulting from such improper use or sale. document number: ds_d1405072 version: f14 uf1a thru uf1m taiwan semiconductor notice specifications of the products displayed herein are subject to change without notice. tsc or anyone on its behalf,
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